SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUPPORT PIECE FORMATION LAMINATE FILM AND MANUFACTURING METHOD THEREFOR

Abstract

A semiconductor device according to the present disclosure has a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed around the first chip, on the substrate, and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip, in which the support piece contains a cured product of a thermosetting resin composition, or includes a layer containing a cured product of a thermosetting resin composition, and a resin layer or a metal layer.

Claims

1. A manufacturing method for a semiconductor device having a dolmen structure, the semiconductor device comprising: a substrate; a first chip disposed on the substrate; a plurality of support pieces disposed around the first chip on the substrate; and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip, the method comprising processes of: (A) preparing a laminate film comprising a base material film, an adhesive layer, and a support piece formation film in order; (B) forming the support pieces on a surface of the adhesive layer by singulating the support piece formation film; (C) picking up a support piece from the adhesive layer; (D) disposing the first chip on a substrate; (E) disposing the plurality of support pieces around the first chip or around a region in which the first chip is to be disposed on the substrate; (F) preparing an adhesive piece-attached chip comprising the second chip and a bonding adhesive piece provided on one surface of the second chip; and (G) constructing the dolmen structure by disposing the adhesive piece-attached chip on surfaces of the plurality of support pieces, wherein the support piece formation film is one of a film comprising a thermosetting resin layer; a film comprising a layer in which at least a part of a thermosetting resin layer is cured; a multi-layer film comprising a thermosetting resin layer and a resin layer having a rigidity higher than a rigidity of the thermosetting resin layer; and a multi-layer film comprising a thermosetting resin layer and a metal layer having a rigidity higher than a rigidity of the thermosetting resin layer.

2. The manufacturing method for a semiconductor device according to claim 1, wherein the adhesive layer is an ultraviolet-curable adhesive layer, and wherein the method further comprises a process of irradiating the adhesive layer with an ultraviolet ray between the process (B) and the process (C).

3. The manufacturing method for a semiconductor device according to claim 1, further comprising a process of heating the support piece formation film or the support piece before the process (G).

4. A semiconductor device having a dolmen structure, the semiconductor device comprising: a substrate; a first chip disposed on the substrate; a plurality of support pieces disposed around the first chip on the substrate; and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip, wherein a support piece comprises a cured product of a thermosetting resin composition; the support piece comprises a layer comprising a cured product of a thermosetting resin composition and a resin layer; or the support piece comprises a layer comprising a cured product of a thermosetting resin composition and a metal layer.

5. The semiconductor device according to claim 4, wherein the first chip is apart from the second chip.

6. The semiconductor device according to claim 4, further comprising a bonding adhesive piece that is provided on one surface of the second chip and is interposed between the second chip and the plurality of support pieces.

7. The semiconductor device according to claim 6, wherein the first chip is apart from the bonding adhesive piece.

8. The semiconductor device according to claim 4, further comprising a bonding adhesive piece provided to cover at least a region of the second chip facing the first chip, wherein the first chip is apart from the bonding adhesive piece.

9. The semiconductor device according to claim 8, wherein the bonding adhesive piece continuously extends to a circumferential edge of the second chip from the region of the second chip and is interposed between the second chip and the plurality of support pieces.

10. The semiconductor device according to claim 6, wherein the first chip is in contact with the bonding adhesive piece.

11. The semiconductor device according to claim 10, wherein the bonding adhesive piece covers a region of the second chip facing the first chip, continuously extends to a circumferential edge of the second chip from the region of the second chip, and is interposed between the second chip and the plurality of support pieces.

12. A support piece formation laminate film used in a manufacturing process of a semiconductor device having a dolmen structure, the semiconductor device comprising: a substrate; a first chip disposed on the substrate; a plurality of support pieces disposed around the first chip on the substrate; and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip, the film comprising, in order: a base material film; an adhesive layer; and a support piece formation film, wherein the support piece formation film is one of a film comprising a thermosetting resin layer; a film comprising a layer in which at least a part of a thermosetting resin layer is cured; a multi-layer film comprising a thermosetting resin layer and a resin layer having a rigidity higher than a rigidity of the thermosetting resin layer; and a multi-layer film comprising a thermosetting resin layer and a metal layer having a rigidity higher than a rigidity of the thermosetting resin layer.

13. The support piece formation laminate film according to claim 12, wherein a thickness of the support piece formation film is 5 to 180 μm.

14. The support piece formation laminate film according to claim 12, wherein the adhesive layer is a pressure-sensitive adhesive layer or an ultraviolet-curable adhesive layer.

15. The support piece formation laminate film according to claim 12, wherein the thermosetting resin layer contains an epoxy resin.

16. The support piece formation laminate film according to claim 12, wherein the thermosetting resin layer contains an elastomer.

17. The support piece formation laminate film according to claim 12, wherein the resin layer is a polyimide layer.

18. The support piece formation laminate film according to claim 12, wherein the metal layer is a copper layer or an aluminum layer.

19-20. (canceled)

Description

BRIEF DESCRIPTION OF DRAWINGS

[0038] FIG. 1 is a sectional view schematically illustrating a first embodiment of a semiconductor device according to the present disclosure.

[0039] FIG. 2A and FIG. 2B are plan views schematically illustrating an example of a positional relationship between a first chip and a plurality of support pieces.

[0040] FIG. 3A is a plan view schematically illustrating one embodiment of a support piece formation laminate film, and FIG. 3B is a sectional view taken along line b-b of FIG. 3A.

[0041] FIG. 4 is a sectional view schematically illustrating a process of bonding an adhesive layer and a support piece formation film.

[0042] FIG. 5A to FIG. 5D are sectional views schematically illustrating a preparation procedure of a support piece.

[0043] FIG. 6 is a sectional view schematically illustrating a state in which a plurality of support pieces are disposed around a first chip, on a substrate.

[0044] FIG. 7 is a sectional view schematically illustrating an example of an adhesive piece-attached chip.

[0045] FIG. 8 is a sectional view schematically illustrating a dolmen structure formed on a substrate.

[0046] FIG. 9 is a sectional view schematically illustrating a second embodiment of the semiconductor device according to the present disclosure.

[0047] FIG. 10A and FIG. 10B are sectional views schematically illustrating other embodiments of the support piece formation laminate film, respectively.

DESCRIPTION OF EMBODIMENTS

[0048] Hereinafter, embodiments of the present disclosure will be described in detail, with reference to the drawings. However, the present invention is not limited to the following embodiments. Note that, herein, a “(meth)acrylic acid” indicates an acrylic acid or a methacrylic acid, and “(meth)acrylate” indicates acrylate or methacrylate corresponding thereto. “A or B” may include either A or B, or may include both of A and B.

[0049] Herein, the term of “layer” also includes a structure having a shape formed on the entire surface and a structure having a shape formed on a part of the surface when seen in the plan view. In addition, herein, the term of “process” includes not only an independent process, but also a process that is not clearly distinguishable from other processes insofar as a desired function of the process is attained. In addition, a numerical range represented by using “to” indicates a range including numerical values described before and after “to” as a minimum value and a maximum value, respectively.

[0050] Herein, in a case where there are a plurality of substances corresponding to each component in a composition, the content of each component in the composition indicates the total amount of the plurality of substances in the composition, unless otherwise noted. In addition, exemplified materials may be independently used, or two or more types thereof may be used by being combined, unless otherwise noted. In addition, in numerical ranges described in stages herein, an upper limit value or a lower limit value of a numerical range in one stage may be replaced with an upper limit value or a lower limit value of a numerical range in another stage. In addition, in a numerical range described herein, an upper limit value or a lower limit value of the numerical range may be replaced with values described in Examples.

First Embodiment

[0051] (Semiconductor Device)

[0052] FIG. 1 is a sectional view schematically illustrating a semiconductor device according to this embodiment. A semiconductor device 100 illustrated in this drawing includes a substrate 10, a chip T1 (a first chip) disposed on the surface of the substrate 10, a plurality of support pieces Dc disposed around the chip T1, on the surface of the substrate 10, a chip T2 (a second chip) disposed above the chip T1, a bonding adhesive piece Tc interposed between the chip T2 and the plurality of support pieces Dc, chips T3 and T4 laminated on the chip T2, a plurality of wires w electrically connecting an electrode (not illustrated) on the surface of the substrate 10 and the chips T1 to T4, respectively, and a sealing material 50 filled in a gap between the chip T1 and the chip T2, or the like.

[0053] In this embodiment, the plurality of support pieces Dc, the chip T2, and the bonding adhesive piece Tc positioned between the support piece Dc and the chip T2 configure a dolmen structure on the substrate 10. The chip T1 is apart from the bonding adhesive piece Tc. By suitably setting the thickness of the support piece Dc, a space for the wire w connecting an upper surface of the chip T1 and the substrate 10 can be ensured. Since the chip T1 is apart from the bonding adhesive piece Tc, short circuit of the wire w due to a contact between an upper portion of the wire w connected to the chip T1 and the chip T2 can be prevented. In addition, since it is not necessary that the wire is embedded in the bonding adhesive piece Tc that is in contact with the chip T2, there is an advantage that the bonding adhesive piece Tc can be thinned.

[0054] As illustrated in FIG. 1, the bonding adhesive piece Tc between the chip T1 and the chip T2 covers a region R of the chip T2 facing the chip T1 and continuously extends to the circumferential edge side of the chip T2 from the region R. That is, one bonding adhesive piece Tc covers the region R of the chip T2 and adheres the chip T2 and the plurality of support pieces to each other by being interposed therebetween. Note that, in FIG. 1, an aspect is illustrated in which the bonding adhesive piece Tc is provided to cover the entire one surface (a lower surface) of the chip T2. However, since the bonding adhesive piece Tc can be contracted in a manufacturing procedure of the semiconductor device 100, the bonding adhesive piece Tc may substantially cover the entire one surface (the lower surface) of the chip T2, and for example, there may be a portion that is not covered with the bonding adhesive piece Tc in a part of the circumferential edge of the chip T2. In FIG. 1, the lower surface of the chip T2 corresponds to a back surface of a chip. Recently, concavities and convexities are commonly for lied on the back surface of the chip. Since substantially the entire back surface of the chip T2 is covered with the bonding adhesive piece Tc, the occurrence of a crack or a split on the chip T2 can be suppressed.

[0055] The substrate 10 may be an organic substrate, or may be a metal substrate such as a lead frame. The thickness of substrate 10, for example, is 90 to 300 μm, and may be 90 to 210 μm, from the viewpoint of suppressing the warpage of the semiconductor device 100.

[0056] The chip T1, for example, is a controller chip, and is adhered to the substrate 10 by a bonding adhesive piece T1c and is electrically connected to the substrate 10 by the wire w. The shape of the chip T1 in the planar view, for example, is a quadrangular shape (a square shape or a rectangular shape). The length of one side of the chip T1, for example, is less than or equal to 5 mm, and may be 2 to 5 mm or 1 to 5 mm. The thickness of the chip T1, for example, is 10 to 150 μm, and may be 20 to 100 μm.

[0057] The chip T2, for example, is a memory chip, and is adhered onto the support piece Dc via the bonding adhesive piece Tc. The chip T2 has a size larger than that of the chip T1, in the planar view. The shape of the chip T2 in the planar view, for example, is a quadrangular shape (a square shape or a rectangular shape). The length of one side of the chip T2, for example, is less than or equal to 20 mm, and may be 4 to 20 mm or 4 to 12 mm. The thickness of the chip T2, for example, is 10 to 170 μm, and may be 20 to 120 μm. Note that, the chips T3 and T4, for example, are a memory chip, and are adhered onto the chip T2 via the bonding adhesive piece Tc. The length of one side of the chips T3 and T4 may be identical to that of the chip T2, and the thickness of the chips T3 and T4 may also be identical to that of the chip T2.

[0058] The support piece Dc serves in the role of a spacer for forming a space around the chip T1. The support piece Dc contains a cured product of a thermosetting resin composition. Note that, as illustrated in FIG. 2A, two support pieces Dc (Shape: a rectangular shape) may be disposed in separated positions on both sides of the chip T1, or as illustrated in FIG. 2B, one support piece Dc (Shape: a square shape, a total of 4) may be disposed in each position corresponding to the corner of the chip T1. The length of one side of the support piece Dc in the planar view, for example, is less than or equal to 20 mm, and may be 1 to 20 mm or 1 to 12 mm. The thickness (the height) of the support piece Dc, for example, is 10 to 180 μm, and may be 20 to 120 μm.

[0059] (Preparation Method for Support Piece)

[0060] An example of a preparation method for a support piece will be described. Note that, the support piece Dc illustrated in FIG. 1 is in a state after the thermosetting resin composition is cured. On the other hand, the support piece Da is in a state before the thermosetting resin composition is completely cured (for example, refer to FIG. 5B).

[0061] First, a support piece formation laminate film 20 (hereinafter, may be referred to as a “laminate film 20”) illustrated in FIG. 3A and FIG. 3B is prepared. The laminate film 20 includes a base material film 1, an adhesive layer 2, and a support piece for nation film D. The base material film 1, for example, is a polyethylene terephthalate film (a PET film). The adhesive layer 2 is formed into a circular shape by punching or the like (refer to FIG. 3A). The adhesive layer 2 contains an ultraviolet-curable adhesive agent. That is, the adhesive layer 2 has properties of decreasing adhesiveness by being irradiated with an ultraviolet ray. The support piece formation film D is formed into a circular shape by punching or the like, and has a diameter smaller than that of the adhesive layer 2 (refer to FIG. 3A). The support piece formation film D contains a thermosetting resin composition.

[0062] The thermosetting resin composition configuring the support piece formation film D can be in a semi-cured (a B-stage) state, and then, in a completely cured product (a C-stage) state by the subsequent curing treatment. The thermosetting resin composition contains an epoxy resin, a curing agent, and an elastomer (for example, an acrylic resin), and as necessary, further contains an inorganic filler, a curing accelerator, and the like. The details of the thermosetting resin composition configuring the support piece formation film D will be described below.

[0063] The laminate film 20, for example, can be prepared by bonding a first laminate film including the base material film 1 and the adhesive layer 2 on the surface of the base material film 1, and a second laminate film including a cover film 3 and the support piece formation film D on the surface of the cover film 3 (refer to FIG. 4). The first laminate film is obtained through a process of forming the adhesive layer on the surface of the base material film 1 by coating, and a process of processing the adhesive layer into a predetermined shape (for example, a circular shape) by punching or the like. The second laminate film is obtained through a process of forming the support piece formation film on the surface of the cover film 3 (for example, a PET film or a polyethylene film) by coating, and a process of processing the support piece formation film into a predetermined shape (for example, a circular shape) by punching or the like. When the laminate film 20 is used, the cover film 3 is peeled off at a suitable timing.

[0064] As illustrated in FIG. 5A, a dicing ring DR is pasted to the laminate film 20. That is, the dicing ring DR is pasted to the adhesive layer 2 of the laminate film 20 such that the support piece formation film D is disposed inside the dicing ring DR. The support piece formation film D is singulated by dicing (refer to FIG. 5B). Accordingly, a plurality of support pieces Da are obtained from the support piece formation film D. After that, the adhesive layer 2 is irradiated with an ultraviolet ray to decrease an adhesive force between the adhesive layer 2 and the support piece Da. After the irradiation with an ultraviolet ray, as illustrated in FIG. 5C, the support pieces Da are separated from each other by the expansion of the base material film 1. As illustrated in FIG. 5D, the support piece Da is thrust up by a thrust-up jig 42 such that the support piece Da is peeled off from the adhesive layer 2 and the support piece Da is picked up by being sucked with a suction collet 44. Note that, a curing reaction of a thermosetting resin may be advanced by heating the support piece formation film D before dicing or the support piece Da before pickup. Since the support piece Da is suitably cured at the time of being picked up, excellent pickup properties can be attained. It is preferable that a cutout for singulation is formed to the outer edge of the support piece formation film D. The diameter of the support piece formation film D, for example, may be 300 to 310 mm or 300 to 305 mm. The shape of the support piece formation film D in the planar view is not limited to a circular shape illustrated in FIG. 3A, and may be a quadrangular shape (a square shape or a rectangular shape).

[0065] (Manufacturing Method for Semiconductor Device)

[0066] A manufacturing method for the semiconductor device 100 will be described. A manufacturing method according to this embodiment includes the following processes (A) to (H):

[0067] (A) preparing the laminate film 20 (refer to FIG. 4);

[0068] (B) forming the support pieces Da on the surface of the adhesive layer 2 by singulating the support piece formation film D (refer to FIG. 5B);

[0069] (C) picking up the support piece Da from the adhesive layer 2 (refer to FIG. 5D);

[0070] (D) disposing the first chip T1 on the substrate 10;

[0071] (E) disposing a plurality of support pieces Da around the first chip T1, on the substrate 10 (refer to FIG. 6);

[0072] (F) preparing an adhesive piece-attached chip T2a including a second chip T2, and a bonding adhesive piece Ta provided on one surface of the second chip T2 (refer to FIG. 7);

[0073] (G) constructing a dolmen structure by disposing the adhesive piece-attached chip T2a on the surfaces of the plurality of support pieces Dc (refer to FIG. 8); and

[0074] (H) sealing the gap between the chip T1 and the chip T2, or the like, with the sealing material 50 (refer to FIG. 1).

[0075] The processes (A) to (C) are a process for preparing the plurality of support pieces Da, which have already been described. The processes (D) to (H) are a process for constructing the dolmen structure on the substrate 10 by using the plurality of support pieces Da. Hereinafter, the processes (D) to (H) will be described with reference to FIGS. 6 to 8.

[0076] [Process (D)]

[0077] The process (D) is a process of disposing the first chip T1 on the substrate 10. For example, first, the chip T1 is disposed in a predetermined position on the substrate 10 via the bonding adhesive layer T1c. After that, the chip T1 is electrically connected to the substrate 10 by the wire w. The process (D) may be a process performed before the process (E), or may be a process performed before the process (A), between the process (A) and the process (B), between the process (B) and the process (C), or between the process (C) and the process (E).

[0078] [Process (E)]

[0079] The process (E) is a process of disposing the plurality of support pieces Da around the first chip T1, on the substrate 10. Through this process, a structural body 30 illustrated in FIG. 6 is prepared. The structural body 30 includes the substrate 10, and the chip T1 and the plurality of support pieces Da disposed on the surface of the substrate 10. The support piece Da may be disposed by a compression treatment. It is preferable that the compression treatment, for example, is performed in a condition of 80 to 180° C. and 0.01 to 0.50 MPa, for 0.5 to 3.0 seconds. Note that, the support piece Da may become the support piece Dc by being completely cured at a time point of the process (E), or may not be completely cured at the time point. It is preferable that the support piece Da becomes the support piece Dc by being completely cured at a time point before the process (G) starts.

[0080] [Process (F)]

[0081] The process (F) is a process of preparing the adhesive piece-attached chip T2a illustrated in FIG. 7. The adhesive piece-attached chip T2a includes the chip T2, and the bonding adhesive piece Ta provided on one surface of the chip T2. The adhesive piece-attached chip T2a, for example, can be obtained by using a semiconductor wafer and a dicing/die-bonding integrated film through a dicing process and a pickup process.

[0082] [Process (G)]

[0083] The process (G) is a process of disposing the adhesive piece-attached chip T2a above the chip T1 such that the bonding adhesive piece Ta is in contact with the upper surfaces of the plurality of support pieces Dc. Specifically, the chip T2 is compressed against the upper surface of the support piece Dc via the bonding adhesive piece Ta. It is preferable that such a compression treatment, for example, is performed in a condition of 80 to 180° C. and 0.01 to 0.50 MPa, for 0.5 to 3.0 seconds. Next, the bonding adhesive piece Ta is cured by heating. It is preferable that such a curing treatment, for example, is performed in a condition of 60 to 175° C. and 0.01 to 1.0 MPa, for longer than or equal to 5 minutes. Accordingly, the bonding adhesive piece Ta is cured to be the bonding adhesive piece Tc. Through this process, the dolmen structure is constructed on the substrate 10 (refer to FIG. 8). Since the chip T1 is apart from the adhesive piece-attached chip T2a, the short circuit of the wire w due to the contact between the upper portion of the wire w and the chip T2 can be prevented. In addition, since it is not necessary that the wire is embedded in the bonding adhesive piece Ta that is in contact with the chip T2, there is an advantage that the bonding adhesive piece Ta can be thinned.

[0084] The chip T3 is disposed on the chip T2 via a bonding adhesive piece, and the chip T4 is disposed on the chip T3 via a bonding adhesive piece, before the process (H) and after the process (G). The bonding adhesive piece may contain the same thermosetting resin composition as that of the bonding adhesive piece Ta described above, and becomes the bonding adhesive piece Tc by heating and curing (refer to FIG. 1). On the other hand, each of the chips T2, T3, and T4 is electrically connected to the substrate 10 by the wire w. Note that, the number of chips to be laminated above the chip T1 is not limited to 3 described in this embodiment, and may be suitably set.

[0085] [Process (H)]

[0086] The process (H) is a process of sealing the gap between the chip T1 and the chip T2, or the like, with the sealing material 50. Through this process, the semiconductor device 100 illustrated in FIG. 1 is completed.

[0087] (Thermosetting Resin Composition Configuring Support Piece Formation Film)

[0088] As described above, the thermosetting resin composition configuring the support piece formation film D contains the epoxy resin, the curing agent, and the elastomer, and as necessary, further contains the inorganic filler, the curing accelerator, and the like. According to the studies of the present inventors, it is preferable that the support piece Da and the support piece Dc after curing have the following properties:

[0089] Property 1: when the support piece Da is thermally compressed in a predetermined position of the substrate 10, a position shift is less likely to occur (a melt viscosity of the support piece Da at 120° C., for example, is 4300 to 50000 Pa.Math.s or 5000 to 40000 Pa.Math.s);

[0090] Property 2: in the semiconductor device 100, the support piece Dc exhibits stress relieving properties (the thermosetting resin composition contains the elastomer (a rubber component));

[0091] Property 3: adhesion strength with respect to the bonding adhesive piece Tc of the adhesive piece-attached chip is sufficiently high (die shear strength of the support piece Dc with respect to the bonding adhesive piece Tc, for example, is 2.0 to 7.0 Mpa or 3.0 to 6.0 Mpa);

[0092] Property 4: a contraction rate associated with curing is sufficiently small;

[0093] Property 5: the visibility of the support piece Da by a camera is excellent in the pickup process (the thermosetting resin composition, for example, contains a colorant); and

[0094] Property 6: the support piece Dc has sufficient mechanical strength.

[0095] [Epoxy Resin]

[0096] The epoxy resin is not particularly limited insofar as having an adhesion function by curing. A difunctional epoxy resin such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a bisphenol S type epoxy resin, a novolac type epoxy resin such as a phenol novolac type epoxy resin and a cresol novolac type epoxy resin, and the like can be used. In addition, generally known epoxy resins such as a polyfunctional epoxy resin, a glycidyl amine type epoxy resin, a heterocyclic ring-containing epoxy resin, or an alicyclic epoxy resin can be applied. One type of the epoxy resins may be independently used, or two or more types thereof may be used together.

[0097] [Curing Agent]

[0098] Examples of the curing agent include a phenolic resin, an ester compound, aromatic amine, aliphatic amine, and an acid anhydride.

[0099] Among them, the phenolic resin is preferable from the viewpoint of attaining high die shear strength. Examples of a commercially available product of the phenolic resin include LF-4871 (Product Name, a BPA novolac type phenolic resin), manufactured by DIC Corporation, HE-100C-30 (Product Name, a phenyl aralkyl type phenolic resin), manufactured by AIR WATER INC., PHENOLITE KA and TD series, manufactured by DIC Corporation, Milex XLC-series and XL series (for example, Milex XLC-LL), manufactured by Mitsui Chemicals, Inc., HE series (for example, HE100C-30), manufactured by AIR WATER INC., MEHC-7800 series (for example, MEHC-7800-4S), manufactured by MEIWA PLASTIC INDUSTRIES, LTD., and JDPP series, manufactured by JFE Chemical Corporation. One type of the curing agents may be independently used, or two or more types thereof may be used together.

[0100] In a compounding amount of the epoxy resin and the phenolic resin, an equivalent ratio of an epoxy equivalent and a hydroxyl group equivalent is preferably 0.6 to 1.5, is more preferably 0.7 to 1.4, and is even more preferably 0.8 to 1.3, from the viewpoint of attaining high die shear strength. By setting a compounding ratio to be in the range described above, both of curing properties and fluidity are easily attained to a sufficiently high level.

[0101] [Elastomer]

[0102] Examples of the elastomer include an acrylic resin, a polyester resin, a polyamide resin, a polyimide resin, a silicone resin, polybutadiene, acrylonitrile, epoxy-modified polybutadiene, maleic anhydride-modified polybutadiene, phenol-modified polybutadiene, and carboxy-modified acrylonitrile.

[0103] As the elastomer, an acrylic resin is preferable, and an acrylic resin such as an epoxy group-containing (meth)acrylic copolymer obtained by polymerizing a functional monomer having an epoxy group or a glycidyl group as a cross-linkable functional group, such as glycidyl acrylate or glycidyl methacrylate, is more preferable, from the viewpoint of attaining high die shear strength. Among the acrylic resins, an epoxy group-containing (meth)acrylic acid ester copolymer and epoxy group-containing acrylic rubber are preferable, and the epoxy group-containing acrylic rubber is more preferable. The epoxy group-containing acrylic rubber is rubber having an epoxy group that contains acrylic acid ester as a main component and mainly contains a copolymer such as butyl acrylate and acrylonitrile, and a copolymer such as ethyl acrylate and acrylonitrile, and the like. Note that, the acrylic resin may have not only the epoxy group but also a cross-linkable functional group such as alcoholic or phenolic hydroxyl group and carboxyl group.

[0104] Examples of a commercially available product of the acrylic resin include SG-70L, SG-708-6, WS-023 EK30, SG-280 EK23, and a SG-P3 solvent-changed product (Product Name, acrylic rubber, Weight Average Molecular Weight: 800000, Tg: 12° C., Solvent: cyclohexanone), manufactured by Nagase ChemteX Corporation, and the like.

[0105] A glass transition temperature (Tg) of the acrylic resin is preferably −50 to 50° C., and is more preferably −30 to 30° C., from the viewpoint of attaining high die shear strength. A weight average molecular weight (Mw) of the acrylic resin is preferably 100000 to 3000000, and is more preferably 500000 to 2000000, from the viewpoint of attaining high die shear strength. Here, Mw indicates a value that is measured by gel permeation chromatography (GPC) and is converted by using a calibration curve of standard polystyrene. Note that, there is a tendency that a highly elastic bonding adhesive piece can be formed by using the acrylic resin having a narrow molecular weight distribution.

[0106] The amount of acrylic resin contained in the thermosetting resin composition is preferably 10 to 200 parts by mass, and is more preferably 20 to 100 parts by mass, with respect to the total of 100 parts by mass of the epoxy resin and an epoxy resin curing agent, from the viewpoint of attaining high die shear strength.

[0107] [Inorganic Filler]

[0108] Examples of the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica, and amorphous silica. One type of the inorganic fillers may be independently used, or two or more types thereof may be used together.

[0109] An average particle diameter of the inorganic filler is preferably 0.005 μm to 1.0 μm, and is more preferably 0.05 to 0.5 μm, from the viewpoint of attaining high die shear strength. It is preferable that the surface of the inorganic filler is chemically modified, from the viewpoint of attaining high die shear strength. A silane coupling agent is suitable as a material for chemically modifying the surface. Examples of the type of functional group of the silane coupling agent include a vinyl group, an acryloyl group, an epoxy group, a mercapto group, an amino group, a diamino group, an alkoxy group, and an ethoxy group.

[0110] The content of the inorganic filler is preferably 20 to 200 parts by mass, and is more preferably 30 to 100 parts by mass, with respect to 100 parts by mass of resin components of the thermosetting resin composition, from the viewpoint of attaining high die shear strength.

[0111] [Curing Accelerator]

[0112] Examples of the curing accelerator include imidazoles and derivatives thereof, an organic phosphorus-based compound, secondary amines, tertiary amines, and a quaternary ammonium salt. An imidazole-based compound is preferable from the viewpoint of attaining high die shear strength. Examples of the imidazoles include 2-methyl imidazole, 1-benzyl-2-methyl imidazole, cyanoethyl-2-phenyl imidazole, 1-cyanoethyl-2-methyl imidazole, and the like. One type of the curing accelerators may be independently used, or two or more types thereof may be used together.

[0113] The content of the curing accelerator in the thermosetting resin composition is preferably 0.04 to 3 parts by mass, and is more preferably 0.04 to 0.2 parts by mass, with respect to the total of 100 parts by mass of the epoxy resin and the epoxy resin curing agent, from the viewpoint of attaining high die shear strength.

Second Embodiment

[0114] FIG. 9 is a sectional view schematically illustrating a semiconductor device according to a second embodiment. In the semiconductor device 100 according to the first embodiment, the chip T1 is apart from the bonding adhesive piece Tc, whereas in a semiconductor device 200 according to this embodiment, the chip T1 is in contact with the bonding adhesive piece Tc. That is, the bonding adhesive piece Tc is in contact with the upper surface of the chip T1 and the upper surface of the support piece Dc. For example, the position of the upper surface of the chip T1 can be coincident with the position of the upper surface of the support piece Dc by suitably setting the thickness of the support piece formation film D.

[0115] In the semiconductor device 200, the chip T1 is connected to the substrate 10 by flip chip connection but not wire bonding. Note that, even in a case where the chip T1 is connected to the substrate 10 by the wire bonding, the chip T1 can be in contact with the bonding adhesive piece Tc insofar as the wire w is embedded in the bonding adhesive piece Ta. The bonding adhesive piece Ta and the chip T2 configure the adhesive piece-attached chip T2a (refer to FIG. 8).

[0116] As illustrated in FIG. 9, the bonding adhesive piece Tc between the chip T1 and the chip T2 covers the region R of the chip T2 facing the chip T1 and continuously extends to the circumferential edge side of the chip T2 from the region R. Such one bonding adhesive piece Tc covers the region R of the chip T2 and adheres the chip T2 and the plurality of support pieces to each other by being interposed therebetween. In FIG. 9, the lower surface of the chip T2 corresponds to the back surface. As described above, recently, the concavities and convexities are commonly formed on the back surface of the chip. Since substantially the entire back surface of the chip T2 is covered with the bonding adhesive piece Tc, even in a case where the upper surface of the chip T1 is in contact with the bonding adhesive piece Tc, the occurrence of a crack or a split on the chip T2 can be suppressed.

[0117] As described above, the embodiments of the present disclosure have been described in detail, but the present invention is not limited to the embodiments described above. For example, in the embodiments described above, the laminate film 20 including the ultraviolet-curable adhesive layer 2 has been exemplified, but the adhesive layer 2 may be a pressure-sensitive adhesive layer.

[0118] In the embodiments described above, as illustrated in FIG. 3B, the support piece formation laminate film 20 including the support piece formation film D including the thermosetting resin layer has been exemplified, but the support piece formation laminate film may include a multi-layer film including a thermosetting resin layer, and a resin layer or a metal layer having rigidity higher than that of the thermosetting resin layer. A support piece formation laminate film 20A illustrated in FIG. 10A includes a two-layer film D2 (a support piece formation film) including a thermosetting resin layer 5, and a resin layer 6 having rigidity higher than that of the thermosetting resin layer 5. That is, in the support piece formation laminate film 20A, the thermosetting resin layer 5 is disposed between the adhesive layer 2 and the resin layer 6 that is the outermost surface. Note that, the thermosetting resin layer 5 contains the thermosetting resin composition configuring the support piece formation film D according to the first embodiment. The thickness of the resin layer 6, for example, is 5 to 100 μm, and may be 10 to 90 μm or 20 to 80 μm. The resin layer 6, for example, is a polyimide layer. The thermosetting resin layer 5 contains a material different from that of the resin layer 6.

[0119] A ratio of the thickness of the thermosetting resin layer 5 to the thickness of the two-layer film D2 is preferably 0.1 to 0.8, is more preferably 0.2 to 0.7, and is even more preferably 0.2 to 0.6. In a case where the ratio is greater than or equal to 0.1, bonding adhesive pieces 5p and 5c are capable of serving in the role thereof (for example, the support of the chip T2 and the prevention of a position shift of a resin piece 6p) more highly. On the other hand, in a case where the ratio is less than or equal to 0.8, the resin piece 6p has a sufficient thickness such that the resin piece 6p serves in the role of a spring plate, and more excellent pickup properties can be attained (refer to FIG. 5D). From such a viewpoint, the thickness of the resin layer 6, for example, is 20 to 80 μm, and may be 20 to 60 μm. The thickness of the thermosetting resin layer 5, for example, is 5 to 120 μm, and may be 10 to 60 μm.

[0120] A support piece formation laminate film 20B illustrated in FIG. 10B includes a three-layer film D3 (a support piece formation film) including the resin layer 6 having rigidity higher than that of the thermosetting resin layer, and two thermosetting resin layers 5 interposing the resin layer 6 therebetween. In the support piece formation laminate film 20B, the three-layer film D3 is disposed on the surface of the adhesive layer 2. The thermosetting resin layer 5 contains a material different from that of the resin layer 6.

[0121] Since the support piece formation laminate films 20A and 20B include the resin layer 6 having rigidity higher than that of the thermosetting resin layer 5, excellent pickup properties can be attained without performing a thermal curing treatment with respect to the thermosetting resin layer 5 after being singulated by dicing. In the support piece formation laminate films 20A and 20B, a metal layer having rigidity higher than that of the thermosetting resin layer (for example, a copper layer or an aluminum layer) may be adopted instead of the resin layer 6. The thickness of the metal layer, for example, is 5 to 100 μm, and may be 10 to 90 μm or 20 to 80 μm. Since the support piece formation laminate films 20A and 20B include the metal layer, in addition to excellent pickup properties, excellent visibility of the support piece can be attained in the pickup process by optical contrast between a resin material and a metal material.

[0122] A ratio of total thickness of two thermosetting resin layers 5 and 5 to the thickness of the three-layer film D3 is preferably 0.1 to 0.9, is more preferably 0.2 to 0.8, and is even more preferably 0.2 to 0.7. By setting the ratio to be in the range described above, the pickup properties can be attained in a manufacturing procedure of the support piece (refer to FIG. 5D). That is, in a case where the ratio is greater than or equal to 0.1, even when the metal layer is adopted instead of the resin layer 6, a decrease in the pickup properties of the support piece due to the intrusion of the edge of a metal piece (obtained by singulating the metal layer) into the adhesive layer 2 can be more highly suppressed.

[0123] On the other hand, in a case where the ratio is less than or equal to 0.9, a resin piece (obtained by singulating the resin layer 6) or the metal piece has a sufficient thickness to serve in the role of a spring plate, and more excellent pickup properties can be attained. From such a viewpoint, the thickness of the resin layer 6 or the metal layer, for example, is 10 to 80 μm, and may be 20 to 60 μm. The thickness of the thermosetting resin layer 5 (one layer), for example, is 5 to 120 μm, and may be 10 to 60 μm.

[0124] As with the films D2 and D3 described above, by the support piece formation film including a plurality of layers containing materials different from each other, the functions can be assigned to each of the layers, and the film can be highly functionalized. By singulating the film having such a multi-layer structure, the support piece Da more suitable for the dolmen structure can be prepared.

[0125] The support piece formation laminate film 20A, for example, can be manufactured through the following processes of:

[0126] preparing a laminate film including the base material film 1, the adhesive layer 2, and the thermosetting resin layer 5, in this order; and

[0127] bonding the resin layer 6 or the metal layer having rigidity higher than that of the thermosetting resin layer 5 to the surface of the laminate film described above.

EXAMPLES

[0128] Hereinafter, the present disclosure will be described by Examples, but the present invention is not limited to these Examples.

[0129] (Preparation of Varnish A)

[0130] A varnish A for a support piece formation film was prepared by using the following materials: [0131] Epoxy Resin 1: YDCN-700-10: (Product Name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., a cresol novolac type epoxy resin, a solid at 25° C.) 5.4 parts by mass; [0132] Epoxy Resin 2: YDF-8170C: (Product Name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., a liquid bisphenol F type epoxy resin, a liquid at 25° C.) 16.2 parts by mass; [0133] Phenolic Resin (Curing Agent): LF-4871: (Product Name, manufactured by DIC Corporation, a SPA novolac type phenolic resin) 13.3 parts by mass; [0134] Inorganic Filler: SC2050-HLG: (Product Name, manufactured by Admatechs Company Limited, a silica filler dispersion liquid, an average particle diameter of 0.50 μm) 49.8 parts by mass; [0135] Elastomer: a SG-P3 solvent-changed product: (Product Name, manufactured by Nagase ChemteX Corporation, acrylic rubber, Weight Average Molecular Weight: 800000, Tg: 12° C., Solvent: cyclohexanone) 14.9 parts by mass; [0136] Coupling Agent 1: A-189: (Product Name, manufactured by GE Toshiba Silicones Co., Ltd., γ-mercaptopropyl trimethoxy silane) 0.1 parts by mass; [0137] Coupling Agent 2: A-1160: (Product Name, manufactured by GE Toshiba Silicones Co., Ltd., γ-ureidopropyl triethoxy silane) 0.3 parts by mass; [0138] Curing Accelerator: CUREZOL 2PZ-CN: (Product Name, manufactured by SHIKOKU CHEMICALS CORPORATION, 1-cyanoethyl-2-phenyl imidazole) 0.05 parts by mass; and [0139] Solvent: cyclohexane.

[0140] (Preparation of Varnish B)

[0141] A varnish B for a support piece formation film was prepared by using the following materials: [0142] Epoxy Resin: YDCN-700-10: (Product Name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., a cresol novolac type epoxy resin, a solid at 25° C.) 13.2 parts by mass; [0143] Phenolic Resin (Curing Agent): HE-100C-30: (Product Name, manufactured by AIR WATER INC., a phenyl aralkyl type phenolic resin) 11.0 parts by mass; [0144] Inorganic Filler: AEROSIL R972: (Product Name, manufactured by NIPPON AEROSIL CO., LTD., silica, an average particle diameter of 0.016 μm) 7.8 parts by mass; [0145] Elastomer: a SG-P3 solvent-changed product: (Product Name, manufactured by Nagase ChemteX Corporation, acrylic rubber, Weight Average Molecular Weight: 800000, Tg: 12° C., Solvent: cyclohexanone) 66.4 parts by mass; [0146] Coupling Agent 1: A-189: (Product Name, manufactured by GE Toshiba Silicones Co., Ltd., γ-mercaptopropyl trimethoxy silane) 0.4 parts by mass; [0147] Coupling Agent 2: A-1160: (Product Name, manufactured by GE Toshiba Silicones Co., Ltd., γ-ureidopropyl triethoxy silane) 1.15 parts by mass; [0148] Curing Accelerator: CUREZOL 2PZ-CN: (Product Name, manufactured by SHIKOKU CHEMICALS CORPORATION, 1-cyanoethyl-2-phenyl imidazole) 0.03 parts by mass; and [0149] Solvent: cyclohexane.

Example 1

[0150] As described above, a solid content ratio of the varnish A was adjusted to 40 mass % by using cyclohexanone as a solvent. The varnish A was filtered with a 100-mesh filter and was vacuum-defoamed. As a film to be coated with the varnish A, a polyethylene terephthalate (PET) film (a thickness of 38 μm) subjected to a mold release treatment was prepared. The varnish A after being vacuum-defoamed was applied onto the surface of the PET film that had been subjected to the mold release treatment. The applied varnish A was heated and dried in two stages at 90° C. for 5 minutes, and then, at 140° C. for 5 minutes. Accordingly, a thermosetting resin layer A in a B-stage state (a semi-cured state) was prepared on the surface of the PET film.

[0151] A laminate film (a dicing tape) including an ultraviolet-curable adhesive layer was prepared in the following procedure. First, a copolymer was obtained by solution radical polymerization using 83 parts by mass of 2-ethyl hexyl acrylate, 15 parts by mass of 2-hydroxy ethyl acrylate, and 2 parts by mass of a methacrylic acid as a raw material, and ethyl acetate as a solvent. Such an acrylic copolymer was reacted with 12 parts by mass of 2-methacryloyloxyethyl isocyanate to synthesize an ultraviolet irradiation type acrylic copolymer having a carbon-carbon double bond. In the reaction described above, 0.05 parts of hydroquinone monomethyl ether was used as a polymerization inhibitor. A weight average molecular weight of the synthesized acrylic copolymer was measured by GPC and was 300000 to 700000. The acrylic copolymer obtained as described above, 2.0 parts of a polyisocyanate compound (manufactured by Nippon Polyurethane Industry Co., Ltd., Product Name: CORONATE L) as a curing agent in terms of a solid content, and 0.5 parts of 1-hydroxy cyclohexyl phenyl ketone as a photopolymerization initiator were mixed to prepare an ultraviolet irradiation type adhesive agent solution. Such an ultraviolet irradiation type adhesive agent solution was applied onto a polyethylene terephthalate peeling film (Thickness: 38 μm) and was dried such that the thickness after drying was 10 μm. After that, a polyolefin film (Thickness: 90 μm) of which one surface had been subjected to a corona discharge treatment was bonded to the adhesive layer. The obtained laminate film was aged in a constant-temperature bath at 40° C. for 72 hours to prepare the dicing tape.

[0152] The thermosetting resin layer A having a thickness of 50 was cured by being heated at 110° C. for 1 hour, and then, heated at 130° C. for 3 hours to obtain a curing resin layer A. The curing resin layer A was bonded to the adhesive layer of the dicing tape on a hot plate at 70° C. by using a rubber roll. Through this process, a laminated body of the support piece formation film and the dicing tape was obtained.

Example 2

[0153] A laminated body of a support piece formation film and a dicing tape was obtained as with Example 1, except that the thermosetting resin layer A was cured by being heated at 110° C. for 1 hour, and then, heated at 110° C. for 2 hours instead of being heated at 130° C. for 3 hours.

Example 3

[0154] A thermosetting resin layer B was formed on the surface of the PET film by using the varnish B instead of the varnish A, and the thermosetting resin layer B was bonded to the adhesive layer of the dicing tape on a hot plate at 70° C. by using a rubber roll, and then, a polyimide film (a thickness of 25 μm) was bonded to the thermosetting resin layer B by a rubber roll. Through this process, a laminated body of the support piece formation film and the dicing tape was obtained.

[0155] The support piece formation films of Examples 1 to 3 were subjected to the following evaluation.

[0156] (1) Peeling Strength

[0157] The laminated bodies including the support piece formation films according to Examples 1 to 3 were respectively cut to have a width of 25 mm and a length of 100 mm, and test pieces were prepared. After that, an ultraviolet ray was applied from the dicing tape side with a halogen lamp in a condition of 80 mW/cm.sup.2 and 200 mJ/cm.sup.2. Peeling strength (Peeling Angle: 180°, Peeling Rate: 300 mm/minute) on the interface between the adhesive layer irradiated with an ultraviolet ray and the support piece formation film was measured. In each of Examples, the measurement was performed three times, and average values thereof are shown below: [0158] Example 1: 0.03 N/25 mm; [0159] Example 2: 0.04 N/25 mm; and [0160] Example 3: 0.05 N/25 mm.

[0161] (2) Pickup Properties

[0162] The laminated bodies of the support piece formation films (Shape: a circular shape having a diameter of 320 mm) according to Examples 1 to 3, and the dicing tape (Shape: a circular shape having a diameter of 335 mm) prepared as described above were prepared. A dicing ring was laminated on the dicing tape of the laminated body in a condition of 70° C. The support piece formation film was singulated by using a dicer in a condition of a height of 55 μm. Accordingly, a support piece having a size of 10 mm×10 mm was obtained. An ultraviolet ray was applied toward the adhesive layer of the support piece from the dicing tape side with a halogen lamp in a condition of 80 mW/cm.sup.2 and 200 mJ/cm.sup.2. After that, the support piece was picked up in a state of being expanded (Expansion Amount: 3 mm) with a die bonder. A three-step thrust-up stage was used as a thrust-up jig, and a condition was a thrust-up rate of 10 mm/second and a thrust-up height of 1200 μm. In each of Examples, six support pieces were tried to be picked up, and in any of Examples 1 to 3, all of six support pieces were capable of being picked up.

INDUSTRIAL APPLICABILITY

[0163] According to the present disclosure, a manufacturing method for a semiconductor device is provided in which in a manufacturing process of a semiconductor device having a dolmen structure, a process of preparing a support piece can be simplified. In addition, according to the present disclosure, a semiconductor device having a dolmen structure, and a support piece formation laminate film and a manufacturing method therefor are provided.

REFERENCE SIGNS LIST

[0164] 1: base material film, 2: adhesive layer, 5: thermosetting resin layer, 6: resin layer, 10: substrate, 20, 20A, 20B: support piece formation laminate film, 50: sealing material, 100, 200: semiconductor device, D: support piece formation film, D2: two-layer film (support piece formation film), D3: three-layer film (support piece formation film), Da: support piece, Dc: support piece (cured product), R: region, T1: first chip, T2: second chip, T2a: adhesive piece-attached chip, Ta: bonding adhesive piece, Tc: bonding adhesive piece (cured product).