Clip having locking recess for connecting an electronic component with a carrier in a package

Abstract

A clip for connecting an electronic component with a carrier in a package is provided. The clip includes a clip body having a component connection portion configured to be connected with the electronic component to be mounted on the carrier, and a carrier connection portion configured to be connected with the carrier. The clip further includes at least one locking recess in a surface portion of the clip body, the surface portion being configured to face the carrier. The at least one locking recess is configured to accommodate material of an encapsulant of the package so as to lock the encapsulant and the clip. A corresponding method of manufacturing the package is also provided.

Claims

1. A clip for connecting an electronic component with a carrier in a package, the clip comprising: a clip body comprising: a component connection portion configured to be connected with the electronic component to be mounted on the carrier; and a carrier connection portion configured to be connected with the carrier; a first surface portion configured to face the carrier; a second surface portion configured to face away from the carrier; and a plurality of parallel locking grooves formed only in the first surface portion of the clip body in a region of the clip body interposed between the component connection portion and the carrier connection portion, wherein the plurality of parallel locking grooves is configured to accommodate material of an encapsulant of the package so as to lock the encapsulant and the clip.

2. The clip of claim 1, further comprising at least one further locking groove formed only in the second surface portion of the clip body.

3. The clip of claim 1, wherein at least part of at least one of the plurality of parallel locking grooves has an undercut.

4. The clip of claim 1, wherein at least one of the plurality of parallel locking grooves and/or material of the clip body between two adjacent locking ones of the locking grooves has a dovetail shape.

5. The clip of claim 1, wherein the plurality of parallel locking grooves is formed as a groove array comprising a central groove between two other grooves of the groove array.

6. The clip of claim 5, wherein the central groove has a larger width than each of the two other grooves of the groove array.

7. The clip of claim 5, wherein the central groove has at least partially tapering side walls, and wherein the two other grooves of the groove array have straight side walls.

8. The clip of claim 1, wherein at least one of a depth and a width of the plurality of parallel locking grooves is in a range between 20 μm and 200 μm.

9. The clip of claim 1, wherein a thickness of the clip body is in a range between 200 μm and 1 mm.

10. The clip of claim 1, wherein the plurality of parallel locking grooves comprises a central groove between two other grooves of the groove array, and wherein at least part of the central groove has an undercut.

11. The clip of claim 1, wherein the plurality of parallel locking grooves is grouped into sets of locking grooves, and wherein each of the sets of locking grooves corresponds to an assigned dimension of a different electronic component such that the clip is a multipurpose clip usable for electronic components of different sizes.

12. The clip of claim 11, wherein each of the sets of locking grooves has three parallel locking grooves that correspond to one assigned chip size.

13. The clip of claim 11, wherein each of the sets of locking grooves has a central locking groove between two lateral locking grooves.

14. The clip of claim 13, wherein the central locking groove is wider than the two lateral locking grooves.

15. The clip of claim 13, wherein the central locking groove has side walls with tapering sections and straight sections, and wherein the two lateral locking grooves have fully straight side walls.

16. A package, comprising: a clip configured to connect an electronic component with a carrier and having a plurality of parallel locking grooves in a region of the clip interposed between a component connection portion of the clip configured to be connected with the electronic component to be mounted on the carrier and a carrier connection portion of the clip configured to be connected with the carrier; and an encapsulant partially encapsulating the clip so that the clip remains partially exposed with respect to the encapsulant, wherein material of the encapsulant is accommodated in the plurality of parallel locking grooves so as to lock the encapsulant and the clip, wherein the plurality of parallel locking grooves is formed only in a surface portion of the clip configured to face towards the carrier.

17. The package of claim 16, further comprising at least one further locking groove formed only in a surface portion of the clip configured to face away from the carrier.

18. The package of claim 16, wherein the package further comprises the electronic component, and wherein the electronic component is at least partially encapsulated in the encapsulant and connected with a component connection portion of the clip.

19. The package of claim 18, wherein the package further comprises the carrier on which the electronic component is mounted, and wherein the carrier is partially encapsulated in the encapsulant and connected with a carrier connection portion of the clip.

20. The package of claim 18, wherein at least one connection selected from the group consisting of a connection between the electronic component and the carrier, a connection between the electronic component and the clip, and a connection between the carrier and the clip, is formed by a connection medium.

21. The package of claim 20, wherein the connection medium is accommodated in the plurality of parallel locking grooves, and wherein the connection medium is selected from the group consisting of a solder structure, a sinter structure, a welding structure, and a glue structure.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The accompanying drawings, which are included to provide a further understanding of exemplary embodiments of the invention and constitute a part of the specification, illustrate exemplary embodiments of the invention.

(2) In the drawings:

(3) FIG. 1 illustrates a cross-sectional view of a clip according to an exemplary embodiment.

(4) FIG. 2A illustrates a cross-sectional view of a package according to an exemplary embodiment.

(5) FIG. 2B illustrates a cross-sectional view of a package according to another exemplary embodiment.

(6) FIG. 3 illustrates a block diagram of a method of manufacturing a package according to an exemplary embodiment.

(7) FIG. 4 to FIG. 8 illustrate different views of a clip according to an exemplary embodiment.

(8) FIG. 9 illustrates a cross-sectional view of a manufactured clip according to an exemplary embodiment.

(9) FIG. 10 to FIG. 12 illustrate different views of a package according to another exemplary embodiment.

(10) FIG. 13 to FIG. 18 illustrate different constituents of the package according to FIG. 10 to FIG. 12.

DETAILED DESCRIPTION

(11) The illustration in the drawing is schematically and not to scale.

(12) Before exemplary embodiments will be described in more detail referring to the Figures, some general considerations will be summarized based on which exemplary embodiments have been developed.

(13) According to an exemplary embodiment, an encapsulant looking clip design (in particular a grooved clip mold lock design) is provided in form of at least one locking recess in a clip surface to avoid delamination between an encapsulant (such as a mold compound) and a clip surface. Simultaneously, at least one locking recess in a clip surface may act as a solder stop for preventing flow of solder into undesired regions of a package. In particular, such a solder stop feature may be advantageous for dual side cool clip packages. For instance, a clip (preferably comprising or consisting of copper) according to an exemplary embodiment may be configured for promoting a clip-mold locking.

(14) More specifically, undesired clip bottom delamination of a copper clip in a molded package may be significantly suppressed and in particular even eliminated when providing preferably the bottom surface of the clip with one or more locking recesses for accomplishing an interlocking with mold material. Especially for dual side cool clip packages, clip bottom delamination has turned out as critical to further propagate to the outside of the package and even on the inside which may lead to internal breaking of the adhesive itself. By providing one or more locking recesses at a clip surface (in particular at a clip surface being oriented towards electronic component and carrier in the readily manufactured package) may efficiently prevent moisture or humidity to easily reach the top of the electronic component (in particular a semiconductor chip). Moreover, clip solder attach can be efficiently prevented from degrading due to the provision of one or more locking recesses.

(15) Conventionally, certain factors may be considered for strengthening mechanical integrity of the package: On the one hand, clip surface roughness may be adjusted to suppress delamination. On the other hand, an implemented mold material may be selected with superior adhesion strength, high package resistance to stress, etc. Such conventional optimization strategies may be effective relative to package construction complexity and stress. However, in many design scenarios of packages, there is only a very limited freedom of selection of compounds, for instance due to risk of copper migration on wafers with copper pad metallization. Finding a proper match may take time and may involve high efforts, especially if a mold compound is unique or with given formulation. Even higher risk for delamination may occur with the mentioned conventional approaches in particular due to additional processes which need to be considered for dual side cool clip packages.

(16) According to an exemplary embodiment, a clip (in particular a clip bottom) locking recess (preferably a locking groove) may be designed for suppressing delamination and improving infra-package adhesion. More specifically, such at least one locking recess may be provided with a dovetail shape feature further enhancing a mechanical mold locking function to hold mold compound in place and prevent it from detaching from the clip surface even with varying degree of surface roughness. Although it may be preferred to use a clip according to an exemplary embodiment with at least one locking recess in combination with a mold compound, other encapsulant materials may be used in other embodiments. Descriptively speaking, the encapsulant material (in particular mold material) may fill the preferably groove-type locking recess and may anchor itself inside the locking reverse, preferably with dovetail design. Upon curing the encapsulant material, the cooperation between the cured encapsulant (in particular solidified mold compound) and clip with locking recess mechanically holds the clip-encapsulant-arrangement in place even during temperature exchange.

(17) In addition to its encapsulant-interlocking (in particular mold-locking) function, a locking groove edge may also work as mitigation for solder over bleed or flow. The edge may create a significant surface tension effect for solder to be contained within that area.

(18) For instance, the at least one locking recess, preferably embodied as at least one locking groove, can be a series of punched or etched recesses creating a locking mechanism, can be a single groove, or at least one groove on top and/or bottom of the clip. For instance, the at least one locking recess (in particular embodied as groove) can be formed by a square punch or a tri-angular punch. The dimensions of the at least one locking recess as well as distances between adjacent locking recesses may be selected in accordance with the requirements of a specific application.

(19) In an embodiment, a clip with at least one locking recess may be implemented in any desired package, preferably in a dual side cooling package, and most preferably in an SSO8 Dual Side Cool package. Investigations have encountered almost zero delamination tendency in packages having one or more clips with at least one locking recess. In particular by implementation of a clip groove, delamination performance may be improved significantly. In experimental tests, it has been demonstrated that no delamination occurs in a package with clip having locking recesses even after 2000 stress events.

(20) According to an exemplary embodiment, a lead package may be provided having a discrete single die with exposed copper clip. In particular, such a package may employ a universal clip design for multiple different sizes of electronic components. This can be accomplished in particular by configuring the clip with a set of locking recesses, wherein each set may be specifically adapted (in particular dimensioned and positioned) for a corresponding size of an electronic component, such as a chip. The geometry and density of metal on the clip may be designed to meet demanding thermal performance. These advantages can be accomplished with a package according to an exemplary embodiment to be versatile as dual side cooling package with high reliability.

(21) In another embodiment, the at least one locking recess may be configured as one or more through holes. In such an approach, care should be taken that the current carrying capability remains sufficiently high, that metal density is kept sufficiently large and that a sufficient thermal performance can be achieved.

(22) FIG. 1 illustrates a cross-sectional view of a clip 100 according to an exemplary embodiment. Clip 100 is illustrated in FIG. 1 with other constituents of a package 106 as the one shown in FIG. 2A, for the sake of clarity.

(23) The illustrated clip 100 is configured for connecting an electronic component 102 with a carrier 104 in a package 106 (compare FIG. 2A). The illustrated clip 100 comprises a clip body 108 having a component connection portion 110 configured for connecting the electronic component 102 when mounted on the carrier 104. Moreover, clip 100 comprises a carrier connection portion 112 connected with component connection portion 110 and configured for connecting the carrier 104. Advantageously, the clip 100 further comprises locking recesses 114 in a surface portion of the clip body 108 facing towards the carrier 104. The locking recesses 114 are configured for accommodating material of an encapsulant (compare reference numeral 128 in FIG. 2A) of the package 106 to thereby lock the encapsulant 128 and the clip 100.

(24) FIG. 2A illustrates a cross-sectional view of a package 106 according to an exemplary embodiment.

(25) The illustrated package 106 comprises clip 100 for connecting electronic component 102 with carrier 104. As shown, clip 100 comprises a plurality of locking recesses 114. An encapsulant 128 partially encapsulates the clip 100 so that the clip 100 remains partially exposed with regard to the encapsulant 128 on a top main surface of the clip 100. As shown in FIG. 2A, the top main surface of the clip 100 may be on the same level as a top surface of the encapsulant 128. Moreover, material of the encapsulant 128 is accommodated in the locking recesses 114 to thereby lock the encapsulant 128 and the clip 100.

(26) As can be taken from FIG. 2A, an exposed upper main surface of the clip body 108 is positioned at the same vertical level as an upper main surface of the encapsulant 128. However, alternatively, the upper main surfaces of the clip body 108 and of the encapsulant 128 may also be at different vertical levels.

(27) FIG. 2B illustrates a cross-sectional view of a package 106 according to another exemplary embodiment.

(28) The embodiment of FIG. 2B differs from the embodiment according to FIG. 2A in particular in that, according to FIG. 2B, further locking recesses 114 are formed in a surface portion of the clip body 108 facing away from the carrier 104. This may further promote interlocking between clip 100 and encapsulant 128.

(29) A further difference of the embodiment of FIG. 2B compared to the embodiment of FIG. 2A is that, according to FIG. 2B, the clip 100 is overmolded in a vertical direction by the encapsulant 128 so that at least a part of the upper main surface of the clip 100 is not exposed with regard to the encapsulant 128 in the illustrated embodiment.

(30) FIG. 3 illustrates a block diagram 200 of a method of manufacturing a package 106 according to an exemplary embodiment.

(31) As illustrated by block 210, the method comprises connecting an electronic component 102 with a carrier 104 by a clip 100, the latter having at least one locking recess 114. Block 220 shows that the method further comprises partially encapsulating the clip 100 by an encapsulant 128 so that an upper main surface of the clip 100 remains partially exposed with regard to the encapsulant 128. Beyond this, as shown in block 230, the method comprises locking the encapsulant 128 and the clip 100 by accommodating material of the encapsulant 128 in the at least one locking recess 114.

(32) FIG. 4 to FIG. 8 illustrate different views of a clip 100 according to an exemplary embodiment: FIG. 4 shows a three-dimensional top view of clip 100. FIG. 5 shows a detailed view of a part of the clip 100. FIG. 6 shows a bottom view of clip 100. FIG. 7 illustrates a detailed view of part of a groove portion of clip 100. FIG. 8 shows a cross-sectional view of clip 100.

(33) The illustrated clip 100 is configured for connecting an electronic component 102 (compare for example FIG. 2A, for instance a semiconductor chip, in particular a power semiconductor chip) with a carrier 104 (compare for example FIG. 2A, for example a leadframe) in a package 106. The clip 100 comprises a three-dimensionally curved clip body 108. Clip body 108 may be an integral body which may for instance be made of a homogeneous metallic material such as copper and/or aluminum. Optionally, one or more surface portions of the clip 100 may already be provided with solder or sinter material for accomplishing connection with electronic component 102 and/or carrier 104.

(34) In accordance with the function of clip 100, clip body 108 has a component connection portion 110 configured for connecting an upper main surface of the electronic component 102 when mounted with its lower main surface on the carrier 104. Furthermore, clip body 108 has a carrier connection portion 112 configured for connecting an upper main surface of the carrier 104. More specifically, a lower main surface of carrier connection portion 112 may be attached to an upper main surface of carrier 104, in particular a lead of carrier 104 (compare reference numeral 176 in FIG. 10 and FIG. 18).

(35) The cooperating main surfaces of carrier connection portion 112 and carrier 104 may be connected (in particular electrically coupled), for instance by soldering. Moreover, the cooperating main surfaces of component connection portion 110 and component 102 may also be connected (in particular electrically coupled), for instance by soldering. Beyond this, the cooperating main surfaces of carrier 104 and component 102 may also be connected (in particular electrically coupled), for instance by soldering.

(36) As shown, the component connection portion 110 and the carrier connection portion 112 may be electrically coupled with each other as integral parts of carrier body 108. For instance, carrier body 108 may be a punched and bent portion of a metal plate such as a copper sheet processed for manufacturing clip 100.

(37) As best seen in FIG. 5 to FIG. 7, the lower main surface of the clip 100 comprises multiple locking recesses 114. Thus, the illustrated locking recesses 114 are provided in a surface portion of the clip body 108 which are configured to face towards the carrier 104 in the readily manufactured package 106. As best seen in FIG. 6, the locking recesses 114 are formed in a lower surface portion of the clip body 108 between component connection portion 110 and carrier connection portion 112. As a result, the locking recesses 114 remain exposed and are not covered neither by the electronic component 102 when connected to component connection portion 110, nor by carrier 104 when connected with carrier connection portion 112. Consequently, when a still uncured encapsulant material (for instance still flowable, liquid or viscous) is provided, said uncured encapsulant 128 will flow into locking recesses 114. After curing (in particular solidification) of the encapsulant material, the solid encapsulant 128 (compare FIG. 2A) will remain permanently within locking recesses 114 to thereby establish an interlocking between encapsulant 128 and clip 100. Thus, the locking recesses 114 are configured for accommodating material of encapsulant 128 of package 106 to thereby lock the encapsulant 128 and the clip 100 together.

(38) As shown in FIG. 4 to FIG. 8, all locking recesses 114 are formed in a surface portion of the clip body 108 facing towards the carrier 104 in the readily manufactured package 106. It has turned out that in particular the provision of locking recesses 114 in the lower main surface of the clip 100 has a highly positive impact on the intra-package adhesion, in particular between encapsulant 128 and clip 100 via locking recesses 114. Furthermore, maintaining the upper main surface of the clip 100 free from locking recesses 114 ensures that the upper main surface of clip 100 may largely remain exposed to an environment after encapsulation (compare FIG. 2A and FIG. 11). This, in turn, may additionally promote heat removal also via an exposed upper main surface of clip 100. Moreover, one or more locking recesses 114 in the lower main surface of clip body 108 have turned out as being particularly efficient for promoting adhesion between clip 100 and encapsulant 128.

(39) However, although not shown in the figures, it is also possible to provide one or more locking recesses 114 in the upper main surface of the clip body 108, additionally or alternatively to the provision of one or more locking recesses 114 in the lower main surface thereof. In particular, such one or more further locking recesses 114 in the upper main surface of the clip 100 may be provided in a surface portion of the clip 108 being encapsulated in the package 106. Thus, it may be possible that also such additional one or more locking recesses 114 may contribute to a mechanical interlocking with material of encapsulant 128.

(40) As best seen in FIG. 7, at least part of the locking recesses 114 may be provided with an undercut 116. In the shown embodiment, central recess 120 is provided with undercut 116. It has turned out that the provision of such an undercut 116 may be particularly efficient for creating a strong clip-encapsulant locking after solidifying previously flowable encapsulant material. Such an undercut 116 can also be advantageously used for forming dovetail shaped locking recesses 114 and/or dovetail shaped material portions of clip 100 in between. In particular, a locking recess 114 with undercut 116 may be formed with sidewalls having at least a section tapering towards an exterior of the locking recess 114.

(41) As already mentioned, locking recesses 114 and/or material of the clip body 108 between adjacent locking recesses 114 may have a dovetail shape 118. As a result, a series of pins formed by material of the clip body 108 or of encapsulant 128 interlock with a series of tails formed by material of encapsulant 128 or of clip body 108 to thereby establish a form closure involving a pronounced undercut 116. The pins and tails may for instance have a trapezoidal shape or a hexagonal shape.

(42) As can be seen best in FIG. 6, the locking recesses 114 are configured as parallel locking grooves. As shown, the locking grooves are oblong narrow hollow spaces formed as straight channels in the surface of the clip body 108.

(43) Referring to FIG. 5 and FIG. 6, the illustrated locking recesses 114 are grouped into groups or sets 180, 181 and 182 of locking recesses 114. Each set 180, 181 and 182 corresponds to an assigned dimension of an electronic component 104 to be connected using one and the same clip 100. Thus, the illustrated clip 100 is a multipurpose clip usable for electronic components 104 (for instance different power semiconductor chips) of different sizes. Thus, clip 100 may serve as a universal clip for different die sizes, in particular each recess array of three grooved type locking recesses 114 corresponding to one assigned chip size.

(44) For instance, each of the sets 180, 181 and 182 of locking recesses 114 assigned to a respective component dimension may be composed of a central recess 120 between two lateral recesses 122, 124 (compare FIG. 5 to FIG. 8). As shown, the central recess 120 may be wider than the two narrower lateral recesses 122, 124. Furthermore, the central recess 120 has side walls with tapering sections and straight sections, whereas the two narrower lateral recesses 122, 124 have fully straight side walls.

(45) Thus, the embodiment of FIG. 4 to FIG. 8 shows a clip 100 with three sets 180, 181 and 182 of (partially dovetail shaped) locking grooves 114 to achieve correspondence with different die sizes. Although not shown, it is additionally or alternatively possible to provide one or more groove sets also on top of clip 100 to further improve adhesion between clip 100 and encapsulant 128.

(46) Now specifically referring to FIG. 8, a depth d of the locking recesses 114 may for instance be 50 μm. A width w1 of the central recesses 120 may for instance be 80 μm, whereas a width w2 of the lateral recesses 122, 124 may be 50 μm. A thickness L of the clip body 108 can be for instance 400 μm.

(47) The locking recesses 114 may be formed for example by punching or etching into a planar lower main surface portion of clip body 108. In terms of manufacturing locking grooves 114, it is in particular possible to punch V-shaped groove to create the describe advantageous dovetail effect. More specifically, the lateral recesses 122, 124 may be formed by a vertical punching process. The central recesses 120 may be formed by side punching.

(48) Advantageously, the locking recesses 114 positioned and shaped as illustrated in FIG. 4 to FIG. 8 may promote mechanical interlocking between clip 100 and encapsulant 128. However, the locking recesses 114 also function as surface tensioner so that not only encapsulant material, but optionally also solder material may flow into at least part of said locking recesses 114. By corresponding positioning the locking recesses 114, they may synergistically also prevent or at least suppress undesired flow of solder material into undesired regions of the package 106.

(49) FIG. 9 illustrates a cross-sectional view of a manufactured clip 100 according to an exemplary embodiment. Thus, FIG. 9 shows an actual clip image captured by an X-ray camera.

(50) FIG. 10 to FIG. 12 illustrate different views of a package 106 according to another exemplary embodiment. More specifically, FIG. 10 illustrates package 106 without mold type encapsulant 128. FIG. 11 shows a top view of encapsulated package 106. FIG. 12 shows a bottom view of encapsulated package 106.

(51) The package 106 comprises a clip 100 with locking recesses 114, as the one shown in FIG. 4 to FIG. 8, for connecting a semiconductor chip type electronic component 102 with a leadframe type carrier 104. As described below in further detail, carrier 104 of the shown embodiment is composed of three separate carrier bodies.

(52) A mold type encapsulant 128 partially encapsulates the electronic component 102, partially encapsulates the carrier 104 and partially encapsulates the clip 100. However, an upper main surface of the clip 100 remains partially exposed with regard to the encapsulant 128, as shown in FIG. 11. Furthermore, a lower main surface of the carrier 104 also remains partially exposed with regard to the encapsulant 128, compare FIG. 12. As a result, package 106 is configured for double-sided cooling, wherein the exposed copper surfaces of clip 100 and carrier 104 significantly contribute to heat removal.

(53) Material of the encapsulant 128 is accommodated in the locking recesses 114 to thereby mechanically lock the encapsulant 128 and the clip 100. Consequently, delamination of the constituents of package 106 is efficiently suppressed and the mechanical integrity of the package 106 is enhanced. This has a positive impact on both mechanical and electrical reliability of package 106. According to FIG. 10 to FIG. 12, the locking recesses 114 may be formed in a surface portion of the clip body 108 facing towards the carrier 104 (as in FIG. 4 to FIG. 8).

(54) In the shown embodiment, the electronic component 102 is a transistor type power semiconductor chip. The electronic component 102 has a top side with a source pad 170 on which the component connection portion 110 of clip body 108 is mounted. On the top side of the electronic component 102, a gate pad 172 is formed as well which is electrically coupled with a lead 176 of carrier 104 by a bond wire 174 (for instance a gold wire, or any other interconnect structure such as a bond ribbon or a further clip). The electronic component 102 has a bottom side with a drain pad (not shown) which is mounted on a die pad 178 of carrier 104. In the shown embodiment, the electronic component 102 experiences a vertical current flow during operation.

(55) The electronic component 102 is mounted on the carrier 104 by a connection medium 130, such as solder, which may be partially accommodated in at least one of the locking recesses 114 so that solder flow into undesired portions of the package 106 may be suppressed. Furthermore, a connection medium 130, such as solder, may be also provided between component 102 and clip 100, between lead 176 and bond wire 174, between bond wire 174 and component 102, and/or on top of clip 100.

(56) For instance, the illustrated package 106 may be a PQFN type package, for instance having dimensions of 5.0 mm×6.0 mm×0.65 mm.

(57) FIG. 13 to FIG. 18 illustrate different constituents of the package 106 according to FIG. 10 to FIG. 12. In the following, these various constituent of package 106 will be explained referring to FIG. 13 to FIG. 18:

(58) Referring to FIG. 13, encapsulant 128 is shown which may be a mold compound. Encapsulant 128 encapsulates, inter alia, clip 100 and electronic component 102.

(59) Referring to FIG. 14, clip 100 is illustrated which may be optionally plated on top thereof for instance with a connection medium 130, for instance may be CuSn plated. Clip 100 may have a thickness of for the example 0.385 mm.

(60) Referring to FIG. 15, bond wire 174 is shown together with connection medium 130 on top of electronic component 102. For example, the bond wire 174 may be made of Au-4N and may have a filament thickness of 33 μm. Connection medium 130, functioning as top solder, may be embodied as PbSnAg.

(61) Referring to FIG. 16, and upper side of MOSFET type electronic component 102 is shown, illustrating source pad 170 and gate pad 172. Drain pad (not shown) is provided on the lower side of electronic component 102.

(62) Referring to FIG. 17, connection medium 130, being here embodied as bottom solder, is shown which may be applied to the upper main service of carrier 104. Connection medium 130, functioning as bottom solder, may be embodied as PbSnAg.

(63) Referring to FIG. 18, leadframe type carrier 104 is shown which is composed of die pad 178 and two leads 176 which may all be covered with a solder type connection medium 130. The carrier 104 may be made of copper, provided with a selective silver plating, etc.

(64) Terms such as “first”, “second”, and the like, are used to describe various elements, regions, sections, etc. and are also not intended to be limiting. Like terms refer to like elements throughout the description.

(65) As used herein, the terms “having”, “containing”, “including”, “comprising” and the like are open ended terms that indicate the presence of stated elements or features, but do not preclude additional elements or features. The articles “a”, “an” and “the” are intended to include the plural as well as the singular, unless the context clearly indicates otherwise.

(66) It is to be understood that the features of the various embodiments described herein may be combined with each other, unless specifically noted otherwise.

(67) Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and/or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, it is intended that this invention be limited only by the claims and the equivalents thereof.