GAS SENSOR WITH SUPERLATTICE STRUCTURE
20230243770 · 2023-08-03
Assignee
Inventors
- Archana Venugopal (Mountain View, CA, US)
- Benjamin Stassen Cook (Woodinville, WA, US)
- Nazila Dadvand (SANTA CLARA, CA, US)
- Luigi Colombo (Dallas, TX)
Cpc classification
C23C18/06
CHEMISTRY; METALLURGY
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
C23C18/1657
CHEMISTRY; METALLURGY
C23C18/1651
CHEMISTRY; METALLURGY
H01L21/0262
ELECTRICITY
C23C16/04
CHEMISTRY; METALLURGY
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
International classification
G01N27/12
PHYSICS
G01N33/00
PHYSICS
H01L29/06
ELECTRICITY
H01L29/16
ELECTRICITY
C23C16/04
CHEMISTRY; METALLURGY
C23C18/06
CHEMISTRY; METALLURGY
C23C18/16
CHEMISTRY; METALLURGY
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A gas sensor has a microstructure sensing element which comprises a plurality of interconnected units wherein the units are formed of connected graphene tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing graphitic carbon on the metal microlattice, converting the graphitic carbon to graphene, and removing the metal microlattice.
Claims
1. A gas sensor comprising: a silicon layer; a dielectric layer having opposite first and second sides, the first side facing the silicon layer; and a graphene layer on the second side of the dielectric layer, the graphene layer being exposed on at least two sides.
2. The gas sensor of claim 1, wherein the dielectric layer has cavity on the second side, and one side of the graphene layer is exposed in the cavity.
3. The gas sensor of claim 1, wherein the graphene layer includes a microstructure sensing element including a plurality of interconnected units of graphene tubes.
4. The gas sensor of claim 3, wherein the plurality of interconnected units of graphene tubes includes at least a first unit formed of first graphene tubes; and a second unit formed of second graphene tubes; and wherein one or more of the second graphene tubes are connected to one or more of the first graphene tubes.
5. The gas sensor of claim 3, wherein the graphene tubes are arranged in an ordered structure and form symmetric patterns that repeat along principal directions of a three-dimensional space.
6. The gas sensor of claim 3, wherein the graphene tubes form a rigid structure.
7. The gas sensor of claim 3, wherein the plurality of interconnected units forms a microlattice.
8. The gas sensor of claim 3, wherein the graphene tubes are hollow.
9. The gas sensor of claim 3, wherein the graphene tubes are interconnected by chemical electronic bonds.
10. The gas sensor of claim 3, wherein the microstructure sensing element are formed by a process including: photo-initiating polymerization of a monomer in a pattern of repeating interconnected unit cells to form a three-dimensional (3D) polymer microlattice; removing unpolymerized monomer; coating the 3D polymer microlattice with a metal; removing the 3D polymer microlattice to leave a 3D metal microlattice having the pattern of repeating interconnected unit cells; forming graphitic carbon on the 3D metal microlattice; and removing the 3D metal microlattice to leave a 3D graphitic carbon microlattice having the pattern of repeating interconnected unit cells.
11. The gas sensor of claim 10, wherein photo-initiating the polymerization of the monomer includes at least one of: passing collimated light through a photomask, or multi-photon lithography.
12. The gas sensor of claim 10, wherein coating the polymer microlattice with a metal includes an electroless deposition of the metal.
13. The gas sensor of claim 12, wherein the electroless deposition employs hypophosphite as a reducer.
14. The gas sensor of claim 12, wherein the electroless deposition employs an aldehyde.
15. The gas sensor of claim 12, wherein the metal includes at least one of copper or nickel.
16. The gas sensor of claim 9, wherein forming the graphitic carbon on the 3D metal microlattice includes exposing the 3D metal microlattice to a hydrocarbon.
Description
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)
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DETAILED DESCRIPTION
[0016] Although graphene is an effective gas sensor (having low density of states (DOS) and carrier concentration plus reversible chemical doping), it has certain limitations when used in the 2D form. These limitations include: substrate effects including a lack of structural stability when suspended; and, a limited surface area (a single face) available for gas detection.
[0017] It has been found that an organic/inorganic superstructure may be used as a template for the formation of a 3D metal superstructure that may then be used to grow graphitic carbon on the surface of the metal. The template may be fabricated through a self-propagating photopolymer waveguide technique (see, e.g., Xiaoyu Zheng et. al., Ultralight, Ultrastiff Mechanical Metamaterials; Science 344 (2014) 1373-1377 and T. A. Schaedler, et al., Ultralight Metallic Microlattices; Science 334 (2011) 962-965). As illustrated schematically in
[0018]
[0019] The present disclosure is of a gas sensor having as its sensing element a “periodically structured” carbon nanostructure. The carbon nanostructures of the prior art are irregular and have much larger dimensions than those which may be achieved using the methodology disclosed herein.
[0020] The present process may be used to create a regular array, and the superstructure dimensions (unit) and structure may be optimized for strength, thermal and other fundamental properties.
[0021] There are several aspects of this procedure that are noteworthy:
[0022] it provides a regular structure with defined dimensions;
[0023] it can form very thin metal (e.g. Ni, Co, Cu, Ag, Au) microlattices;
[0024] it enables the formation of graphitic carbon on very thin metals by a surface-limited process for very thin metal wires or tubes.
[0025] The present process uses a polymeric structure as a template for such fabrication with the subsequent formation of a metal superstructure that may then be exposed to a hydrocarbon (e.g. methane, ethylene, acetylene, benzene) to form graphitic carbon, followed by etching of the metal from under the graphitic carbon using appropriate etchants such as, for example, FeCl.sub.3 or potassium permanganate.
[0026] Collimated UV light 12 through a photomask 14 or multi-photon lithography may be used in a photo-initiated polymerization to produce a polymer microlattice 18 comprised of a plurality of interconnected units. Exemplary polymers include polystyrene and poly(methyl methacrylate) (PMMA). Once polymerized in the desired pattern, the remaining un-polymerized monomer may be removed.
[0027] The polymer structure (polymer scaffold) 18 may then be plated with a suitable metal using an electroless plating process 20.
[0028] Electroless nickel plating (EN) is an auto-catalytic chemical technique that may be used to deposit a layer of nickel-phosphorus or nickel-boron alloy on a solid workpiece, such as metal, plastic, or ceramic. The process relies on the presence of a reducing agent, for example hydrated sodium hypophosphite (NaPO.sub.2H.sub.2.Math.H.sub.2O) which reacts with the metal ions to deposit metal. Alloys with different percentages of phosphorus, ranging from 2-5 (low phosphorus) to up to 11-14 (high phosphorus) are possible. The metallurgical properties of the alloys depend on the percentage of phosphorus.
[0029] Electroless plating has several advantages over electroplating. Free from flux-density and power supply issues, it provides an even deposit regardless of workpiece geometry, and with the proper pre-plate catalyst, may deposit on non-conductive surfaces. In contradistinction, electroplating can only be performed on electrically conductive substrates.
[0030] Before performing electroless plating, the material to be plated must be cleaned by a series of chemicals; this is known as the pre-treatment process. Failure to remove unwanted “soils” from the part's surface results in poor plating. Each pre-treatment chemical must be followed by water rinsing (normally two to three times) to remove chemicals that may adhere to the surface. De-greasing removes oils from surfaces, whereas acid cleaning removes scaling.
[0031] Activation may be done with an immersion into a sensitizer/activator solution—for example, a mixture of palladium chloride, tin chloride, and hydrochloric acid. In the case of non-metallic substrates, a proprietary solution is often used.
[0032] The pre-treatment required for the deposition of metals on a non-conductive surface usually consists of an initial surface preparation to render the substrate hydrophilic. Following this initial step, the surface may be activated by a solution of a noble metal, e.g., palladium chloride. Electroless bath formation varies with the activator. The substrate is then ready for electroless deposition.
[0033] The reaction is accomplished when hydrogen is released by a reducing agent, normally sodium hypophosphite (with the hydrogen leaving as a hydride ion) or thiourea, and oxidized, thus producing a negative charge on the surface of the part. The most common electroless plating method is electroless nickel plating, although silver, gold and copper layers can also be applied in this manner.
[0034] In principle any hydrogen-based reducing agent can be used although the redox potential of the reducing half-cell must be high enough to overcome the energy barriers inherent in liquid chemistry. Electroless nickel plating most often employs hypophosphite as the reducer while plating of other metals like silver, gold and copper typically makes use of low-molecular-weight aldehydes.
[0035] A benefit of this approach is that the technique can be used to plate diverse shapes and types of surfaces.
[0036] As illustrated in
[0037]
[0038] As illustrated in
[0039] Modifications are possible in the described embodiments, and other embodiments are possible, within the scope of the claims.