SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE

Abstract

A semiconductor device is provided that includes a substrate, a pocket within the substrate, a solderable/glueable re-distribution layer arranged in the pocket and a die. The die is arranged downwards, so that a base contact and an emitter contact of the die face the bottom of the device, and a collector contact of the die faces the top of the device. The solderable/glueable re-distribution layer includes a first and second re-distribution layer part and the first re-distribution layer part and the second re-distribution layer part are isolated from each other by an isolating material. The emitter contact is connected to the first re-distribution layer part and the base contact is connected to the second re-distribution layer part. The emitter contacts via the first re-distribution layer part, the base contacts via the second re-distribution layer part, and the collector contact are fan out to the top surface of the semiconductor device.

Claims

1. A semiconductor device comprising: a pocket; a solderable or glueable re-distribution layer arranged in the pocket, a die comprising at least two contacts; and an isolating material for isolating the contacts between each other, wherein all the contacts are fan out to a top surface of the semiconductor device.

2. The semiconductor device as claimed in claim 2, wherein the die is a transistor comprising a base contact, a collector contact and an emitter contact.

3. The semiconductor device as claimed in claim 1, wherein the pocket comprises a sidewall about 45 degrees.

4. The semiconductor device as claimed in claim 2, wherein the pocket comprises a sidewall about 45 degrees.

5. The semiconductor device as claimed in claim 2, wherein the die is arranged downwards, so that the base contact and the emitter contact are facing a bottom of the semiconductor device, and so that the collector contact is facing the top of the semiconductor device, wherein the solderable or glueable re-distribution layer comprises a first re-distribution layer part and a second re-distribution layer part, wherein the first re-distribution layer part and the second re-distribution layer part are isolated from each other by the isolating material, wherein the emitter contact is connected to the first re-distribution layer part and the base contact is connected to the second re-distribution layer part, and wherein the emitter contact via the first re-distribution layer part, the base contact via the second re-distribution layer part, and the collector contact are fan out to the top surface of the semiconductor device.

6. The semiconductor device as claimed in claim 3, wherein the die is arranged downwards, so that the base contact and the emitter contact are facing a bottom of the semiconductor device, and so that the collector contact is facing the top of the semiconductor device, wherein the solderable or glueable re-distribution layer comprises a first re-distribution layer part and a second re-distribution layer part, wherein the first re-distribution layer part and the second re-distribution layer part are isolated from each other by the isolating material, wherein the emitter contact is connected to the first re-distribution layer part and the base contact is connected to the second re-distribution layer part, and wherein the emitter contact via the first re-distribution layer part, the base contact via the second re-distribution layer part, and the collector contact are fan out to the top surface of the semiconductor device.

7. The semiconductor device as claimed in claim 2, wherein the die is arranged upwards, so that the base contact and the emitter contact are facing the top of the semiconductor device, and so that the collector contact is facing a bottom of the semiconductor device, wherein the collector contact is connected to the re-distribution layer, and wherein the emitter contact, the base contact, and the collector contact via the re-distribution layer, are fan out to the top surface of the semiconductor device.

8. The semiconductor device as claimed in claim 3, wherein the die is arranged upwards, so that the base contact and the emitter contact are facing the top of the semiconductor device, and so that the collector contact is facing a bottom of the semiconductor device, wherein the collector contact is connected to the re-distribution layer, and wherein the emitter contact, the base contact, and the collector contact via the re-distribution layer, are fan out to the top surface of the semiconductor device.

9. The semiconductor device as claimed in claim 2, wherein the die is arranged on a side, wherein the solderable or glueable re-distribution layer comprises a first re-distribution layer part and a second re-distribution layer part, wherein the first re-distribution layer part and the second re-distribution layer part are isolated from each other by the isolating material, wherein the second re-distribution layer part comprises a third re-distribution layer part and a fourth re-distribution layer part, wherein the third re-distribution layer part and the fourth re-distribution layer part are isolated from each other by the isolating material, wherein the collector contact is connected to the first re-distribution layer part, the emitter contact is connected to the third re-distribution layer part, and the base contact is connected to the fourth re-distribution layer part, and wherein the collector contact via the first re-distribution layer part, the collector contact via the third re-distribution layer part, and the base contact via the fourth re-distribution layer part are fan out to the top surface of the semiconductor device.

10. The semiconductor device as claimed in claim 3, wherein the die is arranged on a side, wherein the solderable or glueable re-distribution layer comprises a first re-distribution layer part and a second re-distribution layer part, wherein the first re-distribution layer part and the second re-distribution layer part are isolated from each other by the isolating material, wherein the second re-distribution layer part comprises a third re-distribution layer part and a fourth re-distribution layer part, wherein the third re-distribution layer part and the fourth re-distribution layer part are isolated from each other by the isolating material, wherein the collector contact is connected to the first re-distribution layer part, the emitter contact is connected to the third re-distribution layer part, and the base contact is connected to the fourth re-distribution layer part, and wherein the collector contact via the first re-distribution layer part, the collector contact via the third re-distribution layer part, and the base contact via the fourth re-distribution layer part are fan out to the top surface of the semiconductor device.

11. An automotive part comprising a semiconductor device as claimed in claim 1.

12. A method of producing a semiconductor device as claimed in claim 1.

13. A method of producing a semiconductor device, the method comprising the steps of: providing a substrate; creating a pocket with a first sidewall of about 45 degrees and a second sidewall of about 45 degrees on a opposite side with respect to the first sidewall; providing a first solder or glue re-distribution layer part on the first sidewall and providing a second solder or glue re-distribution layer part on the second sidewall; providing a die, wherein the die comprises a collector contact, a base contact and an emitter contact, wherein the base contact and emitter contact are oriented downwards, facing a bottom of the semiconductor device, wherein the collector contact is oriented upwards, facing a top of the semiconductor device, providing an isolation material that is isolating the first re-distribution layer part from the second re-distribution layer part, wherein the emitter contact is connected to the first re-distribution layer part and the base contact is connected to the second re-distribution layer part, so that the emitter contact via the first re-distribution layer part, the base contact via the second re-distribution layer part, and the collector contact are fan out to the top surface of the semiconductor device.

14. A method of producing a semiconductor device, the method comprising the steps of: providing a substrate; creating a pocket with a first sidewall of about 45 degrees and a second sidewall of about 45 degrees on a opposite side with respect to the first sidewall; providing a first solder or glue re-distribution layer part on the first sidewall; providing a die, wherein the die comprises a collector contact, a base contact and an emitter contact, wherein the base contact and emitter contact are oriented upwards, facing a top of the semiconductor device, wherein the collector contact is oriented downwards, facing a bottom of the semiconductor device, providing an isolation material between the die and the pocket, wherein the collector contact is connected to the first re-distribution layer part, so that the emitter contact, the base contact, and the collector contact via the first re-distribution layer part are fan out to the top surface of the semiconductor device.

15. A method of producing a semiconductor device, the method comprising the steps of: providing a substrate; creating a pocket with a first sidewall of about 45 degrees and a second sidewall of about 45 degrees on a opposite side with respect to the first sidewall; providing a first solder or glue re-distribution layer part on the first sidewall and providing a second solder or glue re-distribution layer part on the second sidewall, wherein the second re-distribution layer part comprises a third re-distribution layer part and a fourth re-distribution layer part, providing a die, wherein the die comprises a collector contact, a base contact and an emitter contact, wherein the die is arranged on a side with respect to the semiconductor device; and providing an isolation material that is isolating the first re-distribution layer part, the third re-distribution layer part and the fourth re-distribution layer part from each other, wherein the collector contact is connected to the first re-distribution layer part, the emitter contact is connected to the third re-distribution layer part, and the base contact is connected to the fourth re-distribution layer part, so that the collector contact via the first re-distribution layer part, the collector contact via the third re-distribution layer part, and the base contact via the fourth re-distribution layer part are fan out to a top surface of the semiconductor device.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0053] So that the manner in which the features of the present disclosure can be understood in detail, a more particular description is made with reference to embodiments, some of which are illustrated in the appended figures. It is to be noted, however, that the appended figures illustrate only typical embodiments and are therefore not to be considered limiting of its scope. The figures are for facilitating an understanding of the disclosure and thus are not necessarily drawn to scale. Advantages of the subject matter claimed will become apparent to those skilled in the art upon reading this description in conjunction with the accompanying figures, in which like reference numerals have been used to designate like elements, and in which:

[0054] FIG. 1 shows a known device known in the art.

[0055] FIG. 2 shows a known device known in the art.

[0056] FIG. 3 illustrates a semiconductor device according to an embodiment of the disclosure in a flipped configuration.

[0057] FIG. 4 illustrates a semiconductor device according to an embodiment of the disclosure in a non-flipped configuration.

[0058] FIG. 5 illustrates a semiconductor device according to an embodiment of the disclosure in a configuration with mounted side walls.

DETAILED DESCRIPTION

[0059] An embodiment of the disclosure relates to a vertical designed semiconductor device, e.g. a diode, a transistor, etc. having solderable/glueable contacts on both sides of the semiconductor device, wherein the semiconductor device is placed inside a pre-formed carrier. The preformed carrier is coated with conductive paths allowing to move all contacts to one side of the package of the semiconductor device.

[0060] The pre-formed carrier is designed with bevelled side walls to allow the application of a solderable/glueable redistribution layer, conductor tracks, on top of the pre-formed carrier surface. The paths can be created e.g. using printing, plating or equivalent technologies.

[0061] Since all contacts are on one side of the semiconductor device, an easy assembly is enabled.

[0062] The semiconductor device, which will be placed inside a pre-formed pocket of a fan-out carrier, requires solderable/glueable contacts on both, the top and the bottom surface.

[0063] The semiconductor device can be placed inside a pre-formed pocket and soldered/glued to a redistribution layer.

[0064] An embodiment of the disclosure is shown in FIG. 3. In this example the embodiment is presented for a transistor 308 comprising a base 400, a collector 402 and an emitter 404. However, the embodiment is not limited to this transistor example, it is applicable to any semiconductor device.

[0065] According to a method of this embodiment, as indicated with the reference number 300 in FIG. 3, pockets 506 with a sidewall of about 45 degrees or any other suitable angle are created. The pockets 506 are partially coated with a solderable/glueable re-distribution layer 500. This can be achieved by printing, plating, or any other equivalent technology. The solderable/glueable re-distribution layer 500 comprises a first re-distribution layer part 502 and a second re-distribution layer part 504.

[0066] In the step indicated with the reference number 302 in FIG. 3, a die, comprising a base contact and an emitter contact, is placed with its face downwards, i.e. flipped, in the pocket. In this way the base contact 400 and the emitter contact 404 are connected to the second re-distribution layer part 504 and the second re-distribution layer part 502 respectively.

[0067] The connection between the base contact 400 and the emitter contact 404 and the second re-distribution layer part 504 and the first re-distribution layer part 502 can be done glue, soldering, or any other suitable way.

[0068] In the step indicated with the reference number 304 in FIG. 3, the gaps 508 between the dies and the pockets are filled with an isolating material 510. Such an isolating material secures the stability of the dies and protects the dies against environment.

[0069] In the step indicated with the reference number 306 in FIG. 3, a separation of the transistors is executed. A top view of a separated transistor is indicated with the reference number 308.

[0070] A semiconductor device, in this particular example a transistor, has all contacts on the same side. Such fan out of the transistor contacts secures the low costs of the semiconductor device production and at the same time eliminates the need for wire bond, lead frames and/or moulding.

[0071] Additional advantage is that the package of this semiconductor device does not require vias since the form of the carrier allows to have only one redistribution layer on one side of the carrier.

[0072] There are various usages of such a semiconductor device next to the example of transistor packages shown in FIG. 3.

[0073] An embodiment of the disclosure is shown in FIG. 4. In this example the embodiment is presented for a transistor 328 comprising a base 400, a collector 402 and an emitter 404. However, the embodiment is not limited to this transistor example, it is applicable to any semiconductor device.

[0074] According to a method of this embodiment, as indicated with the reference number 320 in FIG. 4, pockets 506 with a sidewall of about 45 degrees or any other suitable angle are created. The pockets 506 are partially coated with a solderable/glueable re-distribution layer 500. This can be achieved by printing, plating, or any other equivalent technology.

[0075] In the step indicated with the reference number 322 in FIG. 4, a die, comprising a base contact 400 and an emitter contact 404, is placed with its face upwards, in the pocket 506. The collector contact 402 is placed with its face downwards. In this way the collector contact 402 is connected to the solderable/glueable re-distribution layer 500.

[0076] The connection between the collector contact 402 and the solderable/glueable re-distribution layer 500 can be done glue, soldering, or any other suitable way.

[0077] In the step indicated with the reference number 324 in FIG. 4, the gaps 508 between the dies and the pockets are filled with an isolating material 510. Such an isolating material secures the stability of the dies and protects the dies against environment.

[0078] In the step indicated with the reference number 326 in FIG. 4, a separation of the transistors is executed. A top view of a separated transistor is indicated with the reference number 328.

[0079] Similarly to the transistor 308 shown in FIG. 3, the transistor 328 shown in FIG. 4 has all contacts on the same side. Such fan out of the transistor contacts secures the low costs of the semiconductor device production and at the same time eliminates the need for wire bond, lead frames and/or moulding.

[0080] The package of this semiconductor device does not require vias since the form of the carrier allows to have only one redistribution layer on one side of the carrier.

[0081] An embodiment of the disclosure is shown in FIG. 5. In this example the embodiment is presented for a transistor 348 comprising a base 400, a collector 402 and an emitter 404. However, the embodiment is not limited to this transistor example, it is applicable to any semiconductor device.

[0082] According to a method of this embodiment, as indicated with the reference number 340 in FIG. 5, pockets 506 with a sidewall of about 45 degrees or any other suitable angle are created. The pockets 506 are partially coated with a solderable/glueable re-distribution layer 500. This can be achieved by printing, plating, or any other equivalent technology. The solderable/glueable re-distribution layer 500 comprises a first re-distribution layer part 502 and a second re-distribution layer part 504. The second re-distribution layer part 504 comprises two parts, a third re-distribution layer part 520 and a fourth re-distribution layer part which are isolated from each other. The third re-distribution layer part 520 is visible in FIG. 5, while the fourth re-distribution layer part is behind the third re-distribution layer part and it is therefore not visible in FIG. 5.

[0083] In the step indicated with the reference number 342 in FIG. 5, a die, comprising a base contact 400, the collector contact 402 and an emitter contact 404, is placed on side in the pocket. The side walls of the die are insulated. In this way the collector contact 402 is connected to the first re-distribution layer part 502. The emitter contact 404 and the base contact 400 are connected to the third re-distribution layer part 520 and the fourth re-distribution layer part, respectively.

[0084] The connection between the collector contact 402, the base contact 400 and the emitter contact 404 with the first re-distribution layer part 502, the third re-distribution layer part 520 and the fourth re-distribution layer part, respectively, can be done glue, soldering, or any other suitable way.

[0085] In the step indicated with the reference number 344 in FIG. 5, the gaps 508 between the dies and the pockets are filled with an isolating material 510. Such an isolating material secures the stability of the dies and protects the dies against environment.

[0086] In the step indicated with the reference number 346 in FIG. 5, a separation of the transistors is executed. A top view of a separated transistor is indicated with the reference number 348.

[0087] Similarly to the transistors 308 and 328 shown in FIG. 3 and FIG. 4 respectively, the transistor 348 shown in FIG. 5 has all contacts on the same side. Such fan out of the transistor contacts secures the low costs of the semiconductor device production and at the same time eliminates the need for wire bond, lead frames and/or moulding.

[0088] The package of this semiconductor device does not require vias since the form of the carrier allows to have only one redistribution layer on one side of the carrier.

[0089] Although there are just three example embodiments of the disclosure shown on FIGS. 3, 4 and 5, the scope of this invention covers all similar embodiments, and also the embodiments with simple/trivial modification(s) of the elements of these embodiments.

[0090] Particular and preferred aspects of the invention are set out in the accompanying independent claims. Combinations of features from the dependent and/or independent claims may be combined as appropriate and not merely as set out in the claims.

[0091] The scope of the present disclosure includes any novel feature or combination of features disclosed therein either explicitly or implicitly or any generalisation thereof irrespective of whether or not it relates to the claimed invention or mitigate against any or all of the problems addressed by the present invention. The applicant hereby gives notice that new claims may be formulated to such features during prosecution of this application or of any such further application derived therefrom. In particular, with reference to the appended claims, features from dependent claims may be combined with those of the independent claims and features from respective independent claims may be combined in any appropriate manner and not merely in specific combinations enumerated in the claims.

[0092] Features which are described in the context of separate embodiments may also be provided in combination in a single embodiment. Conversely, various features which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable sub combination.

[0093] The term “comprising” does not exclude other elements or steps, the term “a” or “an” does not exclude a plurality. Reference signs in the claims shall not be construed as limiting the scope of the claims.