Manifold valve body and method for producing the manifold valve body
11168799 · 2021-11-09
Assignee
Inventors
Cpc classification
Y10T137/87885
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
G05B19/416
PHYSICS
F16K37/0041
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
G06K7/10386
PHYSICS
Y10T137/5283
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
G06K19/0723
PHYSICS
F16K27/003
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16K7/126
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16K27/0263
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16K11/22
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16K27/0236
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16K11/20
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F16K11/22
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
G06K7/10
PHYSICS
G05B19/416
PHYSICS
B23P15/00
PERFORMING OPERATIONS; TRANSPORTING
F16K11/20
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16K7/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16K37/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16K27/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A valve body (4) for a valve assembly (2) is proposed. The valve body (4) comprises a valve seat (96) which can be accessed by means of an opening (86). A plurality of threaded holes is provided around the opening (86). A plurality of first studs (22a-c) is arranged, in portions, in the threaded holes in order to arrange a valve drive. At least one second stud (24) comprises an electronic data carrier (26) for contactless identification of the valve seat (96). A portion of the second stud (24) is arranged in one of the threaded holes.
Claims
1. A valve assembly for processing of process fluids comprising: a manifold valve body comprising a plurality of valve seats which are accessible by means of respective openings, a plurality of threaded holes being provided around each opening, a plurality of studs being arranged, in portions, in the threaded holes in order to arrange a valve drive on the relevant opening, wherein at least one of the studs that is associated with the relevant opening comprises a first electronic data carrier for contactless identification of the relevant valve seat, wherein the first electronic data carrier is accessible from the outside of the valve assembly, and wherein the valve body is formed in the nature of a one-piece manifold; a plurality of valve drives associated with the plurality of valve seats, wherein a second electronic data carrier is arranged on each of the valve drives, and wherein the second electronic data carrier is accessible from the outside of the valve assembly; and a plurality of diaphragms clamped between the manifold valve body and the associated valve drive closing the associated opening peripherally in a fluid-tight manner, each of the plurality of diaphragms comprising a tab projecting outwards and in which a third electronic data carrier is arranged, wherein the third electronic data carrier is accessible from the outside of the valve assembly.
2. The valve assembly according to claim 1, wherein the stud comprising the electronic data carrier comprises a distal recess, wherein the electronic data carrier is arranged inside the distal recess, and wherein the distal recess is sealed by means of a protective layer.
3. The valve assembly according to claim 2, wherein the stud comprising the electronic data carrier comprises a first external thread in a first distal portion, wherein a second distal portion comprises a second external thread and the distal recess, and wherein the first distal portion of the stud that comprises the electronic data carrier is received in the associated threaded hole of the manifold valve body.
4. The valve body assembly according to claim 2, wherein the distal recess has two steps, and wherein the electronic data carrier is arranged in the proximal step of the distal recess.
5. The valve assembly according to claim 2, wherein the distal recess comprises an undercut that increases in the proximal direction.
6. The valve assembly according to claim 1, wherein the electronic data carrier is an RFID chip.
7. The valve assembly according to claim 1, wherein the RFID chip is discoid.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) Further advantages and features can be found in the following description of embodiments, and in the drawings, in which:
(2)
(3)
(4)
(5)
DETAILED DESCRIPTION
(6)
(7) A portion of a first stud 16a is screwed into a threaded hole of the manifold valve body 4, and projects from the manifold valve body 4 by such a distance as to protrude through a through-hole of a flange 20 of the first valve drive 6 in order to fix the first valve drive 6 to the manifold valve body 4 by means of a nut 22a. At the same time, the associated diaphragm is clamped between the manifold valve body 4 and the first valve drive 6. A portion of a second stud 24 is screwed into a threaded hole of the manifold valve body 4 and comprises an electronic data carrier 26 for contactless identification of the valve seat.
(8) A portion of a third stud 36a is screwed into a further threaded hole of the manifold valve body 4, and projects from the manifold valve body 4 by such a distance as to protrude through a through-hole of a flange 40 of the second valve drive 8 in order to fix the second valve drive 8 to the manifold valve body 4 by means of a nut 42a. At the same time, the associated diaphragm is clamped between the manifold valve body 4 and the second valve drive 8. A portion of a fourth stud 44 is screwed into one of the further threaded holes of the manifold valve body 4 and comprises a further electronic data carrier 46 for contactless identification of the valve seat.
(9) The diaphragm clamped between the manifold valve body 4 and the first valve drive 6 comprises a tab 50 which projects outwards and in which an electronic data carrier 56 is arranged. An electronic data carrier 66 is arranged on the valve drive 6 at a suitable position (shown here only schematically). Identifications 72, 74 and 76 can be read out by means of a mobile reader 70 in order to be combined in a central management unit 78. The central management unit 78 communicates with a network unit 80 that is arranged in a wide area network. The use of the first valve drive 6 jointly with a particular diaphragm on the valve seat that can be identified by the stud 24 is saved in the central management unit 78, allowing the individual components to be tracked and inventoried during operation. The network unit 80 allows the individual components to be tracked until production.
(10) The data carriers 26, 46, 56, 66 can be any electronic component on which data can be stored and read out again. In particular, the data carrier 26, 46, 56, 66 can be what is known as an RFID chip (RFID=radio frequency identification), which generally comprises a transponder in which data can be written, which data can then be read out by a reader by using electrical waves or pulses.
(11)
(12) Of course, the manifold valve body 4 can comprise further openings and associated valve seats, as well as further connections, and can be adapted for use by the customer. Accordingly, multi-way valve bodies 4 of complex designs are also included in this description.
(13)
(14) In
(15) In order to produce the stud 24, the electronic data carrier 26 is first introduced into the recess 112 and arranged on the base thereof, and optionally adhesively bonded thereto. A casting compound, such as epoxy resin, is then metered into the recess 112. The metered casting compound is then cured for a curing period of at least 10 minutes, in particular at least 15 minutes, in an oven at a curing temperature of over 100° C., in particular of over 130° C. In a further embodiment, the stud 24 is cured in the oven at 150° for one hour. The distal recess 112 is thus sealed by the protective layer 114 in a fluid-tight manner. At the same time, the protective layer 114 is not electrically conductive and is not magnetizable, and therefore the electronic data carrier 26 can be wirelessly addressed through the protective layer 114.
(16)