ETCHING DEVICE AND ETCHING METHOD

Abstract

The present invention provides an etching device which comprises an oxygen supplier, so that the etching device of the present invention can etch copper gently by means of the dissolved oxygen in the etching solution to accurately control the etching degree so as to fulfill the stricter requirements of microcircuit manufacturing. The present invention further provides an etching method. Finally, the etching waste solution of the present invention can be recycled to further ameliorate the environmental pollution and reduce the production cost, so the present invention is widely applicable in integrated circuit packaging.

Claims

1. An etching device, comprising: a carrier supplier, an oxygen supplier, an acid source supplier, a buffer zone, an etching solution supplier and a communicating pipe assembly; wherein the carrier supplier is used for supplying a carrier to the communicating pipe assembly; the oxygen supplier is used for supplying oxygen to the buffer zone; the acid source supplier is used for supplying an acidic solution to the buffer zone; the buffer zone is used for mixing the carrier, the oxygen and the acidic solution to obtain an etching solution; the etching solution supplier comprises an etching reaction chamber and an etching solution supply unit, and the etching solution supply unit is used for supplying the etching solution to the etching reaction chamber; and the communicating pipe assembly is in fluid communication with the carrier supplier, the buffer zone and the etching solution supplier, sequentially.

2. The etching device as claimed in claim 1, wherein the etching solution supply unit comprises a spray assembly or a switch assembly.

3. The etching device as claimed in claim 1, wherein the oxygen supplier comprises a pressurizer.

4. The etching device as claimed in claim 1, wherein the buffer zone comprises a dissolved oxygen buffer tank and a pH adjustment tank, and the dissolved oxygen buffer tank is in fluid communication with the pH adjustment tank through the communicating pipe assembly; wherein the dissolved oxygen buffer tank connects to the communicating pipe assembly and the oxygen supplier, so that the carrier and the oxygen are mixed in the dissolved oxygen buffer tank; and the pH adjustment tank connects to the communicating pipe assembly and the acid source supplier, so that the carrier and the acidic solution are mixed in the pH adjustment tank.

5. The etching device as claimed in claim 4, further comprising a temperature control assembly connecting to the dissolved oxygen buffer tank, the communicating pipe assembly or a combination thereof.

6. The etching device as claimed in claim 1, wherein the etching device further comprises a circulatory component for recycling, and the circulatory component for recycling comprises an outlet tube, and the outlet tube connects to the etching reaction chamber to drain the etching waste solution.

7. The etching device as claimed in claim 2, wherein the etching device further comprises a circulatory component for recycling, and the circulatory component for recycling comprises an outlet tube, and the outlet tube connects to the etching reaction chamber to drain the etching waste solution.

8. The etching device as claimed in claim 3, wherein the etching device further comprises a circulatory component for recycling, and the circulatory component for recycling comprises an outlet tube, and the outlet tube connects to the etching reaction chamber to drain the etching waste solution.

9. The etching device as claimed in claim 4, wherein the etching device further comprises a circulatory component for recycling, and the circulatory component for recycling comprises an outlet tube, and the outlet tube connects to the etching reaction chamber to drain the etching waste solution.

10. The etching device as claimed in claim 5, wherein the etching device further comprises a circulatory component for recycling, and the circulatory component for recycling comprises an outlet tube, and the outlet tube connects to the etching reaction chamber to drain the etching waste solution.

11. The etching device as claimed in claim 6, wherein the circulatory component for recycling further comprises a recycling tank; wherein the recycling tank connects to the outlet tube, and the recycling tank comprises an electroplating device.

12. The etching device as claimed in claim 7, wherein the circulatory component for recycling further comprises a recycling tank; wherein the recycling tank connects to the outlet tube, and the recycling tank comprises an electroplating device.

13. The etching device as claimed in claim 8, wherein the circulatory component for recycling further comprises a recycling tank; wherein the recycling tank connects to the outlet tube, and the recycling tank comprises an electroplating device.

14. The etching device as claimed in claim 9, wherein the circulatory component for recycling further comprises a recycling tank; wherein the recycling tank connects to the outlet tube, and the recycling tank comprises an electroplating device.

15. The etching device as claimed in claim 10, wherein the circulatory component for recycling further comprises a recycling tank; wherein the recycling tank connects to the outlet tube, and the recycling tank comprises an electroplating device.

16. The etching device as claimed in claim 11, wherein the recycling tank connects to the carrier supplier.

17. The etching device as claimed in claim 12, wherein the recycling tank connects to the carrier supplier.

18. The etching device as claimed in claim 13, wherein the recycling tank connects to the carrier supplier.

19. The etching device as claimed in claim 14, wherein the recycling tank connects to the carrier supplier.

20. The etching device as claimed in claim 15, wherein the recycling tank connects to the carrier supplier.

21. An etching method, comprising: Step 1: providing an etching solution; wherein the etching solution comprises a carrier, an acidic solution and oxygen; and Step 2: supplying the etching solution to a target placed in an etching reaction chamber for etching the target to obtain an etched target and an etching waste solution; wherein the target comprises a metal, and the etching waste solution comprises a metal ion derived from etching the target.

22. The etching method as claimed in claim 21, wherein the metal is copper, the carrier is water, and the oxygen is dissolved oxygen dissolved in the water.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0031] FIG. 1 is a schematic diagram of an embodiment of an etching device of the present invention.

[0032] FIG. 2 is a schematic diagram of an embodiment of an etching device of the present invention.

[0033] FIG. 3 is a schematic diagram of an embodiment of an etching device of the present invention.

[0034] FIG. 4 is a schematic diagram of an embodiment of an etching device of the present invention.

[0035] FIG. 5 is a schematic diagram of an embodiment of an etching device of the present invention.

[0036] FIG. 6 is a schematic diagram of an embodiment of an etching device of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0037] The present invention is further explained through the following embodiments. A person having ordinary skill in the art can easily understand the advantages and efficacies achieved by the present invention. The present invention should not be limited to the contents of the embodiments. A person having ordinary skill in the art can make some improvement or modifications which are not departing from the spirit and scope of the present invention to practice or apply the content of the present invention.

Example 1: The Etching Device

[0038] As shown in FIG. 1, the etching device 1 of the present invention comprises: a carrier supplier 10, an oxygen supplier 11, an acid source supplier 12, a buffer zone 13, an etching solution supplier 14 and a segmented communicating pipe assembly 15A, 15B, and the communicating pipe assembly 15A, 15B is in fluid communication with the carrier supplier 10, the buffer zone 13 and the etching solution supplier 14, sequentially; and the etching solution supplier 14 comprises an etching reaction chamber 140 and an etching solution supply unit 141.

[0039] The carrier supplier 10 is used for supplying the carrier (not shown) to the communicating pipe assembly 15A; the oxygen supplier 11 is used for supplying oxygen (not shown) to the buffer zone 13; the acid source supplier 12 is used for supplying the acidic solution (not shown) to the buffer zone 13; the buffer zone 13 is used for mixing the carrier, the oxygen and the acidic solution to obtain an etching solution 2; the etching solution 2 enters the etching solution supplier 14 by the communicating pipe assembly 15B, and the etching solution 2 is supplied to the etching reaction chamber 140 by the etching solution supply unit 141 of the etching solution supplier 14.

[0040] The oxygen supplier 11 comprises an oxygen pressure blower, which can increase the quantity of the dissolved oxygen. The etching solution supply unit 141 comprises a spray assembly, which can evenly sprinkle the etching solution 2 on the surface of the target 3 for chemical etching.

[0041] The etching device 1 of the present invention supplies the etching solution 2 through the etching solution supply unit 141 to the target 3 placed in an etching reaction chamber 140 for etching the target 3 to obtain an etched target and an etching waste solution 4; wherein the target 3 comprises copper, and the etching waste solution 4 comprises copper ions. Further, the etching device 1 of this Example does not comprise the carrier, the oxygen, the acidic solution, the etching solution 2, the target 3 and the etching waste solution 4.

Example 2: The Etching Device

[0042] As shown in FIG. 2, the etching device 1 in Example 2 is similar to that in Example 1, and the major difference is the buffer zone 13 in Example 2 comprises a dissolved oxygen buffer tank 130 and a pH adjustment tank 131, which are disposed individually and separated from each other. The dissolved oxygen buffer tank 130 is in fluid communication with the pH adjustment tank through the communicating pipe assembly 15B. The oxygen supplier 11 connects to the dissolved oxygen buffer tank 130, and supplies oxygen (not shown) to the dissolved oxygen buffer tank 130. The acid source supplier 12 connects to the pH adjustment tank 131, and supplies the acidic solution (not shown) to the pH adjustment tank 131.

[0043] The dissolved oxygen buffer tank 130 connects to the communicating pipe assembly 15A and the oxygen supplier 11, so that the carrier (not shown) and the oxygen are mixed in the dissolved oxygen buffer tank 130. The pH adjustment tank 131 connects to the communicating pipe assembly 15C and the acid source supplier 12, so that the carrier and the acidic solution are mixed in the pH adjustment tank 131.

[0044] The communicating pipe assembly 15A, 15C, 15B connects the carrier supplier 10, the dissolved oxygen buffer tank 130, the pH adjustment tank 131 and the etching solution supplier 14, sequentially. In other words, in the etching device 1 of the present invention, the communicating pipe assembly 15A firstly is in fluid communication with the dissolved oxygen buffer tank 130. The carrier supplier 10 firstly supplies the carrier to the communicating pipe assembly 15A, and the carrier further enters the dissolved oxygen buffer tank 130 so as to be mixed with the oxygen to obtain a carrier with the dissolved oxygen. The carrier with the dissolved oxygen is then delivered to the pH adjustment tank 131 through the communicating pipe assembly 15C so as to be mixed with the acidic solution to obtain a carrier with the dissolved oxygen and pH<7, which is the etching solution 2. Finally, the etching solution 2 is delivered to the etching solution supplier 14 through the communicating pipe assembly 15B, and then the etching solution 2 is supplied to the target 3 placed in the etching reaction chamber 140 by the etching solution supply unit 141 for etching the target 3 to obtain an etched target and an etching waste solution 4.

Example 3: The Etching Device

[0045] As shown in FIG. 3, the etching device 1 in Example 3 is similar to that in Example 2, and the major difference is that the dissolved oxygen buffer tank 130 and the pH adjustment tank 131 of the buffer zone 13 in Example 3 are disposed in a different order. The communicating pipe assembly 15A, 15C, 15B connects to the carrier supplier 10, the pH adjustment tank 131, the dissolved oxygen buffer tank 130 and the etching solution supplier 14 in sequence.

[0046] In other words, the order of adjusting quantity of the dissolved oxygen and pH can be switched. That is, in the etching device 1 of the present invention, the communicating pipe assembly 15A firstly is in fluid communication with the pH adjustment tank 131. The carrier supplier 10 firstly supplies the carrier (not shown) to the communicating pipe assembly 15A, and the carrier further enters the pH adjustment tank 131 so as to be mixed with the acidic solution (not shown) to obtain a carrier with pH<7. The carrier with pH <7 is then delivered to the dissolved oxygen buffer tank 130 through the communicating pipe assembly 15C so as to be mixed with the oxygen to obtain a carrier with the dissolved oxygen and pH<7, which is the etching solution 2. Finally, the etching solution 2 is delivered to the etching solution supplier 14 through the communicating pipe assembly 15B, and then the etching solution 2 is supplied to the etching reaction chamber 140 by the etching solution supply unit 141 for etching the target 3 to obtain an etched target and an etching waste solution 4.

Example 4: The Etching Device

[0047] As shown in FIG. 4, the etching device 1 of the present invention is that in Example 2, which further comprises a temperature control assembly 16A. The temperature control assembly 16A connects to the dissolved oxygen buffer tank 130, and can further control the quantity of the dissolved oxygen in the carrier to further increase etching accuracy when using the obtained etching solution.

Example 5: The Etching Device

[0048] As shown in FIG. 5, the etching device 1 of the present invention comprises the communicating pipe assembly 15A, 15C, 15B. Besides, the etching device 1 of the present invention is that in Example 2, which further comprises the temperature control assembly 16A, 16B. The temperature control assembly 16A, 16B connects to the dissolved oxygen buffer tank 130 and the communicating pipe assembly 15B, respectively. The temperature control assembly 16B is disposed near the site of the etching solution supplier 14, which is the etching reaction chamber 140 or the etching solution supply unit 141, and can further control the quantity of the dissolved oxygen in the carrier to further increase etching accuracy when using the obtained etching solution.

Example 6: The Etching Device

[0049] As shown in FIG. 6, the etching device 1 of the present invention further comprises a circulatory component for recycling 17. The circulatory component for recycling 17 comprises an outlet tube 170. The outlet tube 170 connects to the etching reaction chamber 140 to drain the etching waste solution 4.

[0050] The circulatory component for recycling 17 further comprises a recycling tank 171. The recycling tank 171 connects to the outlet tube 170. The recycling tank 171 comprises an electroplating device (not shown), which can reduce the metal ions derived from chemical etching to metals to lower the concentration of copper ions in the etching waste solution 4. Besides, the carrier supplier 10 comprises a switch device to control the delivery of the acidic carrier recycled from the etching waste solution 4 to the communicating pipe assembly 15A. Thus, the acidic carrier recycled from the etching waste solution 4 is reusable, which facilitates reducing the production costs and ameliorating environmental pollution. The recycling tank 171 can comprise a heater (not shown), such as: a distillatory for separating the carrier from the etching waste solution 4 to further obtain a purified carrier.

[0051] To sum up, the etching device of the present invention can etch copper gently by means of the dissolved oxygen in the etching solution to accurately control the etching degree so as to fulfill the stricter requirements of microcircuit manufacturing. Besides, the etching waste solution of the present invention can be recycled, which further ameliorates the environmental pollution and reduces the production cost, so the present invention is widely applicable in integrated circuit packaging.