Method for producing gallium oxide Schottky barrier diode with negative beveled angle terminal

Abstract

A gallium oxide Schottky barrier diode with negative beveled angle terminal and a production method thereof are provided. The production method includes four steps. In the first step, a photoresist layer with a preset pattern is formed on a gallium oxide epitaxial layer, where the gallium oxide epitaxial layer is formed on an upper surface of a gallium oxide substrate. In the second step, first electrode layer is formed on the gallium oxide epitaxial layer. In the third step, the gallium oxide substrate is rotated and the gallium oxide epitaxial layer is etched. In the fourth step, a second electrode layer is formed on the lower surface of the gallium oxide substrate.

Claims

1. A method comprising: forming a photoresist layer with a preset pattern on a gallium oxide epitaxial layer, wherein a first part of the gallium oxide epitaxial layer is not covered by the photoresist layer, and the gallium oxide epitaxial layer is formed on an upper surface of a gallium oxide substrate; forming a temporary electrode layer, wherein a first part of the temporary electrode layer is on the photoresist layer and a second part of the temporary electrode layer is on the first part of the gallium oxide epitaxial layer; removing the photoresist layer and the first part of the temporary electrode layer, wherein the second part of the temporary electrode layer is retained as a first electrode layer; rotating, in a first direction, the gallium oxide substrate such that the gallium oxide substrate and a horizontal plane form a first tilt angle, to expose a second part of the gallium oxide epitaxial layer that is partially under the first electrode layer, and etching the second part of the gallium oxide epitaxial layer, wherein the first tilt angle is less than 90 degrees and an etched gallium oxide epitaxial layer is formed; rotating, in a second direction, the gallium oxide substrate such that the gallium oxide substrate and the horizontal plane form a second tilt angle, to expose a first part of the etched gallium oxide epitaxial layer that is partially under the first electrode layer, and etching the first part of the etched gallium oxide epitaxial layer, wherein the second tilt angle is less than 90 degrees; and forming a second electrode layer on the lower surface of the gallium oxide substrate.

2. The method according to claim 1, wherein forming the photoresist layer with the preset pattern comprises: forming a temporary photoresist layer on the gallium oxide epitaxial layer; and photoetching the temporary photoresist layer to form the preset pattern and expose the first part of the gallium oxide epitaxial layer, whereby forming the photoresist layer with the preset pattern.

3. The method according to claim 1, wherein both the first tilt angle and the second tilt angle are more than 30 degrees and less than 60 degrees.

4. The method according to claim 1, wherein the first tilt angle is equal to the second tilt angle.

5. The method according to claim 1, wherein both etching the second part of the gallium oxide epitaxial layer and etching the first part of the etched gallium oxide epitaxial layer are performed a plurality of times.

6. The method according to claim 1, wherein the temporary electrode layer is formed by electron beam evaporation or sputtering metal, and the second electrode layer is formed by electron beam evaporation.

7. The method according to claim 1, wherein the gallium oxide substrate is a high doped N type gallium oxide substrate, and the gallium oxide epitaxial layer is a low doped N type gallium oxide epitaxial layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) In order to more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings to be used in the descriptions of the embodiments or the prior art will be briefly described below. Obviously, the accompanying drawings in the following description are only some embodiments of this application, and for a person of ordinary skill in the art, without involving any inventive effort, other accompanying drawings may also be obtained according to these accompanying drawings.

(2) FIG. 1 is a flow diagram of the method for producing gallium oxide Schottky barrier diode with negative beveled angle terminal according to embodiments of the present application;

(3) FIG. 2A and FIG. 2B are two schematic diagrams of forming the photoresist layer with the preset pattern in the production method according to embodiments of the present application;

(4) FIG. 3A and FIG. 3B are two schematic diagrams of forming the first electrode layer in the production method according to embodiments of the present application;

(5) FIG. 4A and FIG. 4B are two schematic diagrams of rotating the gallium oxide substrate and etching the gallium oxide epitaxial layer in the production method according to embodiments of the present application;

(6) FIG. 5 is a schematic diagram of forming the second electrode layer in the production method according to embodiments of the present application;

(7) FIG. 6 is a schematic diagram of the structure of the Schottky barrier diode in the prior art;

(8) FIG. 7 is a schematic diagram of the structure of the Schottky barrier diode with positive beveled angle terminal in the prior art; and

(9) FIG. 8 is a schematic diagram of the structure of the Schottky barrier diode with negative beveled angle terminal in the prior art.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

(10) In the following description, for illustrative rather than limiting, specific details such as specific system structure, technology and the like are provided in order to thoroughly understand embodiments of the present application. However, those ordinarily skilled in the art should understand that aspects of the present application may also be implemented in other embodiments without one or more these specific details. It is noted that in some cases, detailed description of well-known systems, devices, circuits, and methods may be omitted, so as not to interfere with the description of the present application with unnecessary details.

(11) It should be understood that when used in the present application, the term “including” indicates the presence of the described features, ensembles, steps, operations, elements and/or components, but does not exclude the presence or addition of one or more other features, ensembles, steps, operations, elements, components and/or collections thereof.

(12) It should also be understood that the term “and/or” as used in the present application refers to any combination of one or more of the associated listed items and all possible combinations, and include these combinations.

(13) As used in the present application, the term “if” may be interpreted in the context to mean “when . . . ”, “once”, “upon”, “in response to”. Similarly, the term “if determined” or “if something is detected” may be interpreted as meaning “once determined”, “in response to determination”, “once something is detected” or “in response to detection of something”.

(14) In addition, in the present application, the terms “first”, “second”, “third”, etc. are only used to distinguish, and cannot be understood as indicating or implying relative importance.

(15) Beveled angle terminal is one of the important terminal structures to improve the performance of power diodes, where the surface of negative beveled angle terminal has stronger electric field control ability than positive beveled angle terminal, and negative beveled angle terminal saves more area. However, it is hard for the etching methods in the prior art to realize the processing of the negative beveled angle terminal. Therefore, there is an urgent need to develop new processing technologies.

(16) To solve the above technical problem, the present application provides a method for producing gallium oxide Schottky barrier diode with negative beveled angle terminal. The method can realize the production of gallium oxide Schottky barrier diode with negative beveled angle terminal by the following steps: forming a photoresist layer with a preset pattern on a gallium oxide epitaxial layer, where a first part of the gallium oxide epitaxial layer is not covered by the photoresist layer and the gallium oxide epitaxial layer is formed on an upper surface of a gallium oxide substrate; forming a temporary electrode layer on the gallium oxide epitaxial layer and the photoresist layer, and removing the photoresist layer to form a first electrode layer; taking a horizontal plane as a reference, rotating the gallium oxide substrate in two reverse directions by a first tilt angle and a second tilt angle, respectively, and etching a second part of the gallium oxide epitaxial layer and a third part of the gallium oxide epitaxial layer, both of which can be exposed and partially under the first electrode layer, where both the first tilt angle and the second tilt angle are less than 90 degrees; and forming a second electrode layer on the lower surface of the gallium oxide substrate.

(17) The following in combination with the accompanying drawings and embodiments, the method provided by the present application is described in detail. As shown in FIG. 1, the method includes four steps that are step 101 to step 104 and they are described, respectively, in detail in the following.

(18) Step 101: as shown in FIG. 2B, forming a photoresist layer 3a with a preset pattern on a gallium oxide epitaxial layer 2, where a first part 21 of the gallium oxide epitaxial layer 2 is not covered by the photoresist layer 3a and the gallium oxide epitaxial layer 2 is formed on an upper surface of a gallium oxide substrate 1.

(19) In a possible embodiment, forming a photoresist layer 3a with a preset pattern on a gallium oxide epitaxial layer 2 includes: as shown in FIG. 2A, forming a temporary photoresist layer 3 on the gallium oxide epitaxial layer 2; and as shown in FIG. 2B, photoetching the temporary photoresist layer 3 to form the preset pattern and expose the first part 21 of the gallium oxide epitaxial layer 2, and the photoresist layer 3a with the preset pattern is formed.

(20) In this embodiment, before forming the temporary photoresist layer 3 on the gallium oxide epitaxial layer 2, the gallium oxide epitaxial layer 2 may be cleaned.

(21) Exemplary, the gallium oxide epitaxial layer 2 may be cleaned sequentially with acetone, isopropanol, and deionized water.

(22) In this embodiment, photoetching the temporary photoresist layer 3 includes photolithography, exposure, development of the temporary photoresist layer 3, thus exposing the first part 21 of the gallium oxide epitaxial layer 2.

(23) Step 102: forming a temporary electrode layer on the gallium oxide epitaxial layer and the photoresist layer, and removing the photoresist layer to form a first electrode layer.

(24) In a possible embodiment, step 102 specifically includes the following steps: as shown in FIG. 3A, forming a first part 41 of the temporary electrode layer 4 on the photoresist layer 3a and a second part 42 of the temporary electrode layer 4 on the first part of the gallium oxide epitaxial layer 2; and as shown in FIG. 3B, removing the photoresist layer 3a and the first part 41 of the temporary electrode layer 4, where the second part 42 of the temporary electrode layer 4 is retained as a first electrode layer.

(25) In this embodiment, the temporary electrode layer 4 may be formed by electron beam evaporation or sputtering metal and the second electrode layer may be formed by electron beam evaporation.

(26) Exemplary, when sputtering anode metal in a self-aligning manner to form the temporary electrode layer 4, the target purity may be 99.99% and the sputtering power may be 150 watts.

(27) Exemplary, after the electron beam evaporates anode metal to form the temporary electrode layer 4, excess metal may be stripped and then may perform cleaning.

(28) In this embodiment, the thickness of the first electrode layer 42 and the thickness of the photoresist layer 3a may be equal or unequal.

(29) Exemplary, the material of the first electrode layer 42 may be Ni or Au. When the material of the first electrode layer 42 is Ni, the thickness of the first electrode layer 42 may be 50 nanometers (nm); when the material of the first electrode layer 42 is Au, the thickness of the first electrode layer 42 may be 400 nm.

(30) Step 103: as shown in FIG. 4A and FIG. 4B, taking a horizontal plane as a reference, rotating the gallium oxide substrate 1 in two reverse directions by a first tilt angle θ and a second tilt angle α, respectively, and etching a second part 22 of the gallium oxide epitaxial layer 2 and a third part 23 of the gallium oxide epitaxial layer 2, both of which can be exposed and partially under the first electrode layer 42, where both the first tilt angle θ and the second tilt angle α are less than 90 degrees.

(31) In a possible embodiment, both the first tilt angle θ and the second tilt angle α may be more than 30 degrees and less than 60 degrees.

(32) In a possible embodiment, the first tilt angle θ may be equal to the second tilt angle α.

(33) In a possible embodiment, both etching the second part 22 of the gallium oxide epitaxial layer 2 and etching the third part 23 of the gallium oxide epitaxial layer 2 are performed in a plurality of times to ensure that the etched shapes meet the preset accuracy requirements.

(34) In a possible embodiment, after etching the second part 22 and the third part 23 of the gallium oxide epitaxial layer 2, the etched gallium oxide epitaxial layer may be cleaned.

(35) Exemplary, the etched gallium oxide epitaxial layer may be cleaned with acetone, isopropanol, and deionized water.

(36) Exemplary, all the etching in step 103 may be achieved using the method of inductively coupled plasma (ICP) etching. When etch the gallium oxide epitaxial layer 2, the first etch step, as shown in FIG. 4A, may rotate the gallium oxide substrate 1 by a first tilt angle θ and etch the second part 22 using the ICP etching method along the etching direction A. When the first etch step is finished, an etched gallium oxide epitaxial layer 2a is formed. The second etch step may etch the etched gallium oxide epitaxial layer 2a, as shown in FIG. 4B. In the second etch step, the gallium oxide substrate 1 may be rotated by a second tilt angle α and the etched gallium oxide epitaxial layer 2a may be etched using the ICP etching method along the etching direction B. When the second etch step is finished, a further etched gallium oxide epitaxial layer 2b is formed. The gas used in the ICP etching may be sulfur hexafluoride (SF.sub.6), argon gas (Ar), boron trichloride (BCl.sub.3) or other gases. The scope of the first tilt angle θ is: 90°>θ>0°, and a preferred scope is: 60°>θ>30°. The scope of the second tilt angle α is: 90°>θ>0°, and a preferred scope is: 60°>θ>30°. The first tilt angle θ may be equal to the second tilt angle α or not, where the first tilt angle θ being equal to the second tilt angle α is preferred.

(37) Step 104: as shown in FIG. 5, forming a second electrode layer 5 on the lower surface of the gallium oxide substrate 1.

(38) In a possible embodiment, the second electrode layer 5 is formed by electron beam evaporation.

(39) Exemplary, the material of the second electrode layer 5 may be Ti or Au. When the material of the second electrode layer 5 is Ti, the thickness of the second electrode layer 5 may be 20 nm; when the material of the second electrode layer 5 is Au, the thickness of the second electrode layer 5 may be 400 nm.

(40) The present application provides a production method of gallium oxide diode device with negative beveled angle terminal. When the production method provided is implemented, by rotating the gallium oxide substrate in two reverse directions, respectively, at a certain angle, it can partially expose the gallium oxide epitaxial layer under the first electrode layer to the etching range, thus realizing the processing of the negative beveled angle terminal and solving the technical problem that the negative beveled angle terminal is hard to be processed by the etching method in the prior art. Every above non-vertical rotation corresponds to at least one etches. The next etch continuously complements the previous etch, and finally forms the negative beveled angle terminal. In addition, self-alignment technique may be used in the production process of the Schottky barrier diode, such as anode self-aligning filling. The gallium oxide diode device with the negative beveled angle terminal has good withstand voltage characteristic.

(41) The present application further provides a gallium oxide Schottky barrier diode device with negative beveled angle terminal. As shown in FIG. 5, the gallium oxide diode device includes a gallium oxide substrate 1, a gallium oxide epitaxial layer 2b, a first electrode layer 42 and a second electrode layer 5. The gallium oxide epitaxial layer 2b is formed on an upper surface of the gallium oxide substrate 1. An upper part of the gallium oxide epitaxial layer 2b is a boss structure which extends from the gallium oxide epitaxial layer 2b to the gallium oxide substrate 1 with a width of the boss structure decreasing gradually. The first electrode layer 42 is formed on the gallium oxide epitaxial layer 2b. The second electrode layer 5 is formed on a lower surface of the gallium oxide substrate 1.

(42) The side surfaces of the boss structure slope towards the area under the first electrode layer 42. The side surfaces of the boss structure are formed by rotating the gallium oxide substrate 1 in different directions by some angles, respectively, and etching some parts of the gallium oxide epitaxial layer, where all the parts of the gallium oxide epitaxial layer are exposed and partially under the first electrode layer 42. The angles may be 30 degrees to 60 degrees.

(43) Exemplary, the gallium oxide Schottky barrier diode device with negative beveled angle terminal may be manufactured by the production method provided in the present application.

(44) It should be understood that the size of the sequence numbers of the steps in the above embodiments does not mean the sequence of execution, and the execution sequence of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

(45) The above descriptions are only some embodiments of the present disclosure, and are not intended to limit the present disclosure. Any modifications, equivalent replacements and improvements made within the spirit and principle of the present disclosure shall be included within the protection scope of the present disclosure.