ELECTROMAGNETIC INTERFERENCE SHIELDING OF GAS DETECTOR

Abstract

Disclosed is an electromagnetic interference (EMI) cover for a gas detector including one or more electrical components. The EMI cover includes one or more cover layers, each cover layer including a plastic material layer and one or more layers of conductive or dielectric ink applied to the plastic material layer defining one or more conductive pathways. The one or more conductive pathways are positioned in a pattern to provide electromagnetic interference (EMI) shielding to the one or more electrical component.

Claims

1. An electromagnetic interference (EMI) cover for a gas detector comprising one or more electrical component, the EMI cover comprising: one or more cover layers, each cover layer including: a plastic material layer; and one or more layers of conductive or dielectric ink applied to the plastic material layer defining one or more conductive pathways; wherein the one or more conductive pathways are disposed in a pattern to provide electromagnetic interference (EMI) shielding to the one or more electrical component.

2. The EMI cover of claim 1, wherein the one or more conductive pathways are arranged in one of a grid pattern, a spoke and spiral pattern, or a spoke and wheel pattern.

3. The EMI cover of claim 1 wherein the plastic material layer is transparent or translucent.

4. The EMI cover of claim 1, wherein the one or more cover layers comprise a first cover layer and a second cover layer arranged in a stack.

5. The EMI cover of claim 4, wherein a first plastic material layer of the first cover layer is disposed between a first electrically conductive ink layer of the first cover layer and a second electrically conductive ink layer of the second cover layer.

6. The EMI cover of claim 5, wherein the first electrically conductive ink layer is arranged in a first pattern and the second electrically conductive ink layer is arranged in a second pattern different from the first pattern.

7. The EMI cover of claim 5, further comprising at least one light source embedded in the stack or disposed on an exterior surface of the stack. diode.

8. The EMI cover of claim 7, wherein the light source is a light emitting

9. The EMI cover of claim 7, wherein: the first electrically conductive ink layer is operably connected to the light source to power the light source; and the second electrically conductive ink layer is connected to electrical ground.

10. A method of forming an electromagnetic interference (EMI) cover for a gas detector comprising one or more electrical component, the method comprising: forming a plastic material layer; applying an electrically conductive ink layer to the plastic material layer forming one or more electrically conductive pathways, thereby defining one or more cover layers; and forming the one or more cover layers into a desired cover shape; wherein the one or more conductive pathways are disposed in a pattern to provide electromagnetic interference (EMI) shielding to the one or more electrical component.

11. The method of claim 10, further comprising applying the electrically conductive ink in one of a grid pattern, a spoke and spiral pattern, or a wheel and spoke pattern.

12. The method of claim 10, further comprising: forming two or more cover layers; and arranging the two or more cover layers in a stack.

13. The method of claim 12, further comprising arranging the stack such that a first plastic material layer of a first cover layer is disposed between a first electrically conductive ink layer of the first cover layer and a second electrically conductive ink layer of a second cover layer.

14. The method of claim 13, wherein the first electrically conductive ink layer is arranged in a first pattern and the second electrically conductive ink layer is arranged in a second pattern different from the first pattern.

15. The method of claim 13, further comprising embedding or disposing at least one light source in the stack or on an exterior surface of the stack. diode.

16. The method of claim 15, wherein the light source is a light emitting

17. The method of claim 15, further comprising: operably connecting the first electrically conductive ink layer to the light source to power the light source; and connecting the second electrically conductive ink layer to electrical ground.

18. The method of claim 10, wherein the one or more cover layers are formed to the desired cover shape via an injection molding process.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The following descriptions should not be considered limiting in any way. With reference to the accompanying drawings, like elements are numbered alike:

[0023] FIG. 1 is a perspective view of a cover with EMI shielding, in accordance with exemplary embodiments;

[0024] FIG. 2 is a plane view of an electrically conductive pathway arrangement in a cover, in accordance with exemplary embodiments;

[0025] FIG. 3 is a plane view of another electrically conductive pathway arrangement in a cover, in accordance with exemplary embodiments;

[0026] FIG. 4 is a cross-sectional view of a cover, in accordance with exemplary embodiments; and

[0027] FIG. 5 is a flow diagram illustrating a method of forming a cover with EMI shielding, in accordance with exemplary embodiments.

DETAILED DESCRIPTION

[0028] A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the Figures.

[0029] FIG. 1 is a perspective view of a cover 10 with electromagnetic interference (EMI) shielding. Although described herein that the cover 10 may be incorporated as a component of a gas detector 12, it should be appreciated that the application of the EMI shielding process described herein within any product is within the scope of the current disclosure. As shown in FIG. 1, the cover 10 may be positioned over the exterior of the gas detector 12 such that the components 12 behind the cover 10 (e.g., the gas detector circuitry) are protected from electromagnetic interference. As will be described below, the features of the cover 10 are provided to produce the EMI shielding for the components 12.

[0030] The cover 10 may be formed from one or more plastic material layers 14, which in some embodiments are formed from a transparent or translucent plastic material. One or more electrically conductive pathways 16 are embedded in the cover 10. The conductive pathways 16 are formed by, for example, electrically conductive ink 18 applied to one or more of the plastic material layers 14. The conductive pathways 16 may be formed into a pattern, for example, a grid pattern or the like. The pattern includes a plurality of pathway portions 20 having a selected spacing 22 between adjacent pathway portions 20 to provide a selected coverage of the conductive pathways 16 in the cover 10, thus providing a desired level of EMI shielding in the cover 10. In at least one embodiment, the spacing 22 between adjacent pathway portions 20 is configured to provide shielding of up to a 6 Ghz frequency with a maximum spacing 22 of five (5) millimeters. In other embodiments, other spacing 22 may be used depending on the desired shielding, with smaller spacing 22 utilized to provide greater maximum shielding frequency.

[0031] Referring now to FIG. 2, in some embodiments the conductive pathways 16 are arranged in a grid pattern. In other embodiments, such as shown in FIG. 3, the conductive pathways 16 are arranged in a ring and spoke pattern, that is interconnected between the circular portions of the conductive pathways 16, or alternatively in another pattern such as a spoked spiral pattern. One skilled in the art will readily appreciate that the conductive pathways illustrated in FIGS. 2 and 3 are merely exemplary, and that other arrangements of conductive pathways 16 may be utilized to achieve a desired level of EMI shielding of the cover 10.

[0032] Referring now to FIG. 4, illustrated is a cross-sectional view of an embodiment of a cover 10. The cover 10 is a layered structure, having multiple cover layers 24 to form the cap 10. For example, the cover 10 may include two cover layers 24, each cover layer 24 including a plastic material layer 14 having electrically conductive ink 18 applied thereto to define one or more conductive pathways 16. The cover layers 24 may be stacked such that a first electrically conductive ink 18a of a first cover layer 24a does not contact a second electrically conductive ink 18b of an adjacent second cover layer 24b. One of the plastic material layers 14, such as a first plastic material layer 14a of the first cover layer 24a may be positioned between the first electrically conductive ink 18a and the second electrically conductive ink 18b to keep the first electrically conductive ink 18a separated from the second electrically conductive ink 18b. In some embodiments, the plastic material layer 14 is continuous covering the pathway portions 20 and the spacing, while in other embodiments the plastic material layer 14 is localized and present only in areas where the first electrically conductive ink 18a pathway portions 20a overlap the second electrically conductive ink 18b pathway portions 20b. In some embodiments, a light 26, for example, a light-emitting diode (LED), is incorporated or embedded into the cover 10. For example, the light 26 may be disposed between the first cover layer 24a and the second cover layer 24b. As shown, the light 26 may be connected to the first electrically conductive ink 18a, which is connected to a power source 28 defining a circuit for operation of the light 26. As shown, the second electrically conductive ink 18b may be connected to electrical ground 30. In the embodiment shown in FIG. 4, while the first electrically conductive ink 18a provides power to the light 26, the second electrically conductive ink 18b provides the desired EMI shielding. It should be appreciated that in certain instances the light 26 may be disposed on the exterior of the cover 10 (as opposed to being disposed between the cover layers 24a and 24b), and receive power from the first electrically conductive ink 18a. For example, the light 26 may be disposed on the external surface of the first electrically conductive ink 18a, instead of being disposed in the plastic layer between the first electrically conductive ink 18a and the second electrically conductive ink 18b.

[0033] In some embodiments, the cover layers 24 are formed in flat sheets, with the electrically conductive ink 18 applied to the flat plastic material sheet 14. Example methods of application of the conductive ink may include extrusion, screen printing, pad printing, gravure application, or the like. The cover layers 24 may then be formed to their desired shape to define the cover 10. An exemplary method of forming the cover 10 is illustrated in FIG. 5. In step 100, the plastic material sheet 14 is formed, and in step 102 the electrically conductive ink 18 is applied to the plastic material sheet 14 to define the electrically conductive pathways 16 and the cover layers 24. At step 104 the cover layers 24 are stacked, which may include embedding the light 26 between the cover layers 24. As described above, the light 26 may be disposed on the exterior of the cover 10 (as opposed to between the cover layers 24a and 24b), in certain instances. Once the cover layers 24 are stacked the cover layers 24 are fused together and formed to a selected shape to define the cover 10 at step 106 by, for example, injection molding or thermoforming to form the structural cover 10.

[0034] The term “about” is intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application.

[0035] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and/or groups thereof.

[0036] While the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.