Power Module Having Reduced Intrinsic Inductance

Abstract

The present invention relates to a power module (1) having reduced intrinsic inductance, comprising an at least partially electrically insulating layer (3) that has a first side (3a) on which a power electronics unit (2) is arranged and a second side (3b) which is opposite the first side (3a), a compensation layer (10) being arranged on the second side (3b), which compensation layer is electrically conductive and to which compensation layer an electric potential can be applied. The invention also relates to a method for producing a power module, preferably a power module as described above.

Claims

1. A power module having reduced intrinsic inductance, comprising: an at least partially electrically insulating layer that has a first side on which a power electronics unit is arranged and a second side which is opposite the first side; and a compensation layer is arranged on the second side, which compensation layer is electrically conductive and to which compensation layer an electric potential can be applied.

2. The power module according to claim 1, wherein: the power electronics unit substantially has a layer structure, the layer structure preferably comprising a layer selected from a group comprising silicon, silicon carbide and gallium nitrite.

3. The power module according to claim 1, wherein: the insulating layer is at least substantially planar and preferably extends parallel to a layer of the power electronics unit.

4. The power module according to any of claim 1, wherein: the compensation layer is electrically connected to an electric potential of the power electronics unit, preferably of a switch.

5. The power module according to any of claim 1, wherein: the compensation layer is divided into a plurality of portions, these portions being electrically insulated from one another and it being possible for different electric potentials, preferably potentials with opposite polarity signs, to be applied to these portions.

6. The power module according to claim 1, further comprising: a plurality of at least partially electrically insulating layers, each of these layers having, on a second side opposite the power electronics unit, a compensation layer which is electrically conductive and to which an electric potential can be applied.

7. The power module according to claim 5, wherein: at least two of the plurality of portions of a compensation layer and/or of the plurality of compensation layers have a mutually different geometry.

8. The power module according to claim 1, wherein: the compensation layer is thermally conductive and is thermally connected to a heat sink in order to dissipate heat from the power electronics unit.

9. A method for producing a power module, comprising the steps of: providing a power electronics unit comprising an at least partially electrically insulating layer which has a first side that faces the power electronics and an opposite second side that faces away from the power electronics, and depositing an electrically conductive compensation layer on the second side of the at least partially electrically insulating layer.

10. The method according to claim 9, wherein: the compensation layer is electrically connected to a pole of a direct voltage source or, in the case of alternating voltage, to an outer conductor.

Description

[0031] Additional aims, advantages and expedient uses of the present invention can be found in the following description in conjunction with the drawings, in which:

[0032] FIG. 1: is a detail of a power module according to a preferred embodiment.

[0033] FIG. 1 is a detail of a power module 1, the individual constituents of the power electronics unit 2 not being shown. In a preferred embodiment, the power electronics unit is a multilayer (for example three-layer, preferably four-layer) semiconductor component, preferably an IGBT. The p- or n-doped regions of such a power electronics unit 2 are not shown.

[0034] In this schematic illustration of a detail, the power module 1 comprises only a single power electronics unit 2. This is arranged between two at least partially insulating layers 3 and 4. Together with further boundaries (only a lateral boundary 5 is shown), extensive insulation from the environment and thus protection against electric shock can be provided. The electrical insulation is preferably only interrupted by connections for the electrical connection of the power electronics unit. Only one such connection 6 is shown as an example.

[0035] A compensation layer 10 is arranged on the second side of the insulating layer 3 that faces away from the power electronics unit. This compensation layer is electrically conductive and has a connection 9 by means of which an electric potential can be applied to this compensation layer 10.

[0036] All features disclosed in the application documents are claimed as essential to the invention, provided that they are, individually or in combination, novel over the prior art.

LIST OF REFERENCE SIGNS

[0037] 1 power module [0038] 2 power electronics unit [0039] 3, 4 layer [0040] 3a first side [0041] 3b second side [0042] 5 boundary [0043] 6 connection [0044] 9 connection [0045] 10 compensation layer