Highly-dielectric, elastic structure and a touch sensor including the same

Abstract

A highly-dielectric, elastic structure includes an elastic body that is highly-dielectric and includes a polymer matrix that including 1000 pbw of a polydimethylsiloxane (PDMS) base and 100 pbw of a PDMS curing agent, and has a tensile strength of 0.1 to 10 MPa; and 22.4 pbw of carbon black that is surface-treated with octadecyltrimethoxysilane (ODTMS) in an amount of at least 0.707 mmol per 22.4 pbw of the carbon black, and that is dispersed in the polymer matrix and cured; and an adhesive electrode that is stretchable, that is disposed on the elastic body, and that includes a polymer adhesive including a 500 pbw of a thermosetting silicone-based polymer adhesive including a curable polymer and a curing agent; and a conductive filler comprising 500 pbw of silver particles and 4000 pbw of a carbonaceous material that is a multi-walled carbon nanotube that are dispersed in the polymer adhesive and cured.

Claims

1. A highly-dielectric, elastic structure, comprising: an elastic body that is highly-dielectric and comprises: a polymer matrix that comprises 1000 parts by weight of a polydimethylsiloxane (PDMS) base and 100 parts by weight mg of a PDMS curing agent, and has a tensile strength of 0.1 to 10 MPa; and 22.4 parts by weight of carbon black that is a dielectric material and a conductive filler, that is surface-treated with octadecyltrimethoxysilane (ODTMS) in an amount of at least 0.707 mmol per 22.4 parts by weight of the carbon black, and that is dispersed in the polymer matrix and cured; and an adhesive electrode that is adhesive and stretchable, that is disposed on the body, and that comprises: a polymer adhesive comprising a 500 parts by weight of a thermosetting silicone-based polymer adhesive including a curable polymer and a curing agent; and a conductive filler comprising 1500 parts by weight of silver particles and 4000 parts by weight of a carbonaceous material that is a multi-walled carbon nanotube that are dispersed in the polymer adhesive and cured.

2. The highly-dielectric, elastic structure according to claim 1, wherein the polymer matrix of the elastic body has a dielectric constant of 1-10.

3. The highly-dielectric, elastic structure according to claim 1, wherein the polymer adhesive of the adhesive electrode comprises 5-20 parts by weight of the curing agent based on 100 parts by weight of the curable polymer.

4. The highly-dielectric, elastic structure according to claim 1, wherein the polymer adhesive of the adhesive electrode has a bulk tensile strength of 0.1-10 MPa after curing.

5. The highly-dielectric, elastic structure according to claim 1, wherein the polymer adhesive of the adhesive electrode has a volume shrinkage ratio of 1-10% after curing.

6. The highly-dielectric, elastic structure according to claim 1, wherein the polymer adhesive comprises 10-120 parts by weight of the curing agent based on 100 parts by weight of the curable polymer.

7. The highly-dielectric, elastic structure according to claim 1, wherein the metal of the conductive filler is a mixture of metal particles having a diameter of 100-200 nm, 1-4 μm, or 5-10 μm.

8. The highly-dielectric, elastic structure according to claim 1, wherein the carbonaceous material of the conductive filler is a multi-walled carbon nanotube having a diameter of 15-40 nm and a length of 10-50 μm.

9. The highly-dielectric, elastic structure according to claim 1, wherein the elastic body and the adhesive electrode are connected to each other to form a single structure.

10. A touch sensor comprising the highly-dielectric, elastic structure according to claim 1.

11. The touch sensor according to claim 10, wherein the touch sensor is a capacitance-type force sensor.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a flow chart sequentially showing a method for preparing a highly dielectric elastic structure of the present disclosure.

(2) FIG. 2 shows the change in dielectric properties of a highly dielectric elastic structure made of a Pt electrode of Test Example 2.

(3) FIGS. 3 and 4 illustrate the electrode reliability evaluation results of a stretchable conductive adhesive layer and a platinum coating layer of a highly dielectric elastic structure of Test Example 3.

DETAILED DESCRIPTION OF EMBODIMENTS

(4) Hereinafter, various aspects and exemplary embodiments of the present disclosure are described in more detail. Hereinafter, the exemplary embodiments of the present disclosure are described in detail with reference to accompanying drawings so that those of ordinary skill in the art to which the present disclosure belongs can easily carry out the present disclosure. However, the following description is not intended to limit the present disclosure to specific exemplary embodiments. When it is determined that there is a specific description of the related art in the following description of the present disclosure that may obscure the subject matter of the present disclosure, a detailed description thereof will be omitted.

(5) The terms used herein are merely used to describe particular exemplary embodiments, and are not intended to limit the present disclosure. A singular expression includes plural forms unless the context clearly indicates otherwise. In this application, the terms “contain”, “include” or “have” are used to specify that the features, numbers, steps, operations, elements or combinations thereof described in the specification are present, and the presence or addition of one or more other features, numbers, steps, operations, elements or combinations thereof are not intended to be precluded.

(6) Hereinafter, a highly dielectric elastic structure of the present disclosure is described.

(7) A highly dielectric elastic structure of the present disclosure contains: a highly dielectric elastic body containing a polymer matrix and a dielectric material dispersed in the polymer matrix; and a stretchable adhesive electrode disposed on the highly dielectric elastic body, wherein the stretchable adhesive electrode contains: a polymer adhesive containing a curable polymer and a curing agent; and a conductive filler containing a metal and a carbonaceous material dispersed in the polymer adhesive.

(8) First, the highly dielectric elastic body is described.

(9) Specifically, the polymer matrix may be at least one selected from a silicone-based resin, a urethane-based resin, an acrylic resin, an isoprene-based resin, a chloroprene-based resin, a fluorine-based resin, butadiene rubber, styrene-butadiene rubber and a vinylidene fluoride polymer. More specifically, the polymer matrix may be a silicon-based resin, and even more specifically, the polymer matrix may be polydimethylsiloxane (PDMS) as a the silicone-based resin.

(10) Specifically, the polymer matrix may have a tensile strength of 0.1-10 MPa and a dielectric constant of 1-10. It is preferred that it has no conductivity.

(11) When the tensile strength and the dielectric constant of the polymer matrix exceed the upper limits or are below the lower limits, the performance of a manufactured touch sensor may be unsatisfactory due to undesirable dielectric constant and elasticity.

(12) The dielectric material may contain at least one selected from a conductive filler, a ceramic filler and an organometallic compound, and the at least one selected from the conductive filler, the ceramic filler and the organometallic compound may be surface-treated with a silane-based compound or an amine-based compound.

(13) The conductive filler may be at least one selected from metal particles, carbon black, carbon fiber, graphene, graphite, fullerene, single-walled carbon nanotube and multi-walled carbon nanotube.

(14) The ceramic filler may be at least one selected from metal oxide, silicate, boride, carbide, nitride and perovskite.

(15) The metal oxide as the ceramic filler may be at least one selected from ZrO.sub.2, Ta.sub.2O.sub.5, SnO.sub.2, Nb.sub.2O.sub.5, TiO.sub.2, Sb.sub.2O.sub.3, V.sub.2O.sub.5, FeO, FeO.sub.4, Fe.sub.2O.sub.3, SrO, Cu.sub.2O, Cu.sub.2O.sub.3, ZnO, Y.sub.2O.sub.3, CaTiO.sub.3, MgZrSrTiO.sub.6, MgTiO.sub.3, MgAl.sub.2O.sub.4, BaZrO.sub.3, BaTiO.sub.3, BaSnO.sub.3, BaNb.sub.2O.sub.6, BaTa.sub.2O.sub.6, BaSrTiO.sub.3, W.sub.03, MnO.sub.2, SrZrO.sub.3, SnTiO.sub.4, ZrTiO.sub.4, CaZrO.sub.3, CaSnO.sub.3, CaWO.sub.4, MgTa.sub.2O.sub.6, MrZrO.sub.3, La.sub.2O.sub.3, CaZrO.sub.3, MgSnO.sub.3, MgNb.sub.2O.sub.6, SrNb.sub.2O.sub.6, MgTa.sub.2O.sub.6 and Ta.sub.2O.sub.3.

(16) The silicate as the ceramic filler may be at least one selected from Na.sub.2SiO.sub.3, Li.sub.4SiO.sub.4, BaTiSi.sub.3O.sub.9, ZrSiO.sub.4, CaMgSi.sub.2O.sub.6 and Zn.sub.2SiO.sub.4.

(17) The organometallic compound may be a compound wherein at least one metal selected from copper, zinc and nickel is bound to one or more organic substance selected from phthalocyanine, uranine and rhodamine.

(18) The silane-based compound or the amine compound used for the surface treatment of the dielectric material may be at least one selected from octadecyltrimethoxysilane (ODTMS), hexadecyltrimethoxysilane, dodecyltrimethoxysilane (DDTMS), octyltrimethoxysilane (OTMS), octadecylamine and dodecylamine. Specifically, it may be octadecyltrimethoxysilane (ODTMS).

(19) Specifically, the dielectric elastic body may contain 0.1 to 100 parts by weight of the dielectric material based on 100 parts by weight of the polymer matrix. When the content of the dielectric material is less than 0.1 part by weight based on 100 parts by weight of the polymer matrix, the dielectric constant may decrease. And, when it exceeds 100 parts by weight, the curing of the polymer may be negatively affected.

(20) The polymer matrix may contain 5-20 parts by weight of the curing agent based on 100 parts by weight of the polymer.

(21) Hereinafter, the stretchable adhesive electrode contained in the highly dielectric elastic structure of the present disclosure will be described.

(22) The polymer adhesive contained in the stretchable adhesive electrode contains a curable polymer and a curing agent. It may have a mixture viscosity of 3000-5000 mPa.Math.s before curing, a bulk tensile strength of 0.1-10 MPa after curing, and a volume shrinkage ratio of 1-10% after curing.

(23) The stretchable adhesive electrode may contain 100 to 500 parts by weight of the conductive filler based on 100 parts by weight of the polymeric adhesive.

(24) The curable polymer contained in the polymer adhesive may be at least one selected from a silicone-based resin, a urethane-based resin, an acrylic resin, an isoprene-based resin, a chloroprene-based resin, a fluorine-based resin, butadiene rubber and styrene-butadiene rubber. Specifically, a silicone-based resin may be contained.

(25) The polymer adhesive may contain 10 to 120 parts by weight of the curing agent based on 100 parts by weight of the curable polymer.

(26) The metal may be at least one selected from gold (Au), silver (Ag), copper (Cu), nickel (Ni), aluminum (Al), platinum (Pt), ruthenium (Ru), rhodium (Rh), tungsten (W), cobalt (Co), palladium (Pd), titanium (Ti), tantalum (Ta), iron (Fe), molybdenum (Mo), hafnium (Hf), lanthanum (La) and iridium (Ir), Specifically, the metal may be at least one selected from gold (Au), silver (Ag) and copper (Cu).

(27) Specifically, the metal may be a mixture of metal particles having a diameter of 100 to 200 nm, 1 to 4 μm, or 5 to 10 μm.

(28) The carbonaceous material may be at least one selected from single-walled carbon nanotube, multi-walled carbon nanotube, graphene, graphite, carbon black, carbon fiber and fullerene.

(29) Specifically, the carbonaceous material may be multi-walled carbon nanotube having a diameter of 15 to 40 nm and a length of 10 to 50 μm.

(30) Specifically, the conductive filler may be contained in an amount of 0.1 to 2 parts based on 100 parts by weight of the metal.

(31) Specifically, the highly dielectric elastic body and the stretchable adhesive electrode may be connected to each other to form a single structure. Therefore, it is preferred that the polymer contained in the highly dielectric elastic body and the polymer contained in the stretchable adhesive electrode are of the same polymer family. Accordingly, the highly dielectric elastic structure of the present disclosure can exert increased adhesion between the polymeric elastic body and the stretchable adhesive electrode as well as sufficient dielectric properties.

(32) FIG. 1 sequentially shows a method for preparing a highly dielectric elastic structure of the present disclosure. Hereinafter, the method for preparing a highly dielectric elastic structure of the present disclosure will be described with reference to FIG. 1.

(33) First, a Dielectric Material is Dispersed in an Organic Solvent to Prepare a Dielectric Material Dispersion (Step a).

(34) For details about the dielectric material, refer to the above description.

(35) The organic solvent may be one or more selected from chloroform, toluene, ethanol, methanol, dichloromethane and tetrahydrofuran. Specifically, when chloroform is used, the dispersion of the dielectric material and the drying of the solvent may be conducted easily.

(36) Specifically, the amount of the dielectric material may be 0.1 to 100 parts by weight based on 100 parts by weight of the polymer.

(37) Next, a Dielectric Material/Polymer Mixture Wherein a Dielectric Material and a Polymer are Mixed is Prepared by Mixing the Dielectric Material Dispersion with the Polymer (Step b).

(38) The dielectric material/polymer mixture may contain specifically 0.1 to 100 parts by weight, more specifically 1 to 5 parts by weight, of the dielectric material based on 100 parts by weight of the polymer.

(39) When the content of the dielectric material is less than 0.1 part by weight based on 100 parts by weight of polymer, the dielectric constant of the finally prepared elastic structure may decrease. And, when it exceeds 100 parts by weight, the curing of the polymer may be negatively affected.

(40) Specifically, the mixing may be carried out by stirring and degassing processes at the same time. For this, a high-viscosity mixing/degassing apparatus may be used.

(41) After mixing the dielectric material dispersion with the polymer, the solvent may be removed through drying.

(42) Then, a Highly Dielectric Elastic Body is Prepared by Mixing the Dielectric Material/Polymer Mixture with a Curing Agent and Performing Curing (Step c).

(43) Specifically, the mixing amount of the curing agent may be 5 to 20 parts by weight per 100 parts by weight of the polymer.

(44) Specifically, the mixing may be carried out by stirring and degassing processes at the same time. For this, a high-viscosity mixing/degassing apparatus may be used.

(45) Specifically, the mixture of the dielectric material/polymer mixture and the curing agent may be cured after being coated on a substrate to form a film. Accordingly, it is possible to uniformly coat a stretchable adhesive agent in the next step.

(46) The coating may be performed according to any one of the method selected from a doctor blade method, a bar coating method, a flat screen method, a spin coating method, a roll coating method, a flow coating method, a gravure printing method and a flexographic printing method.

(47) Finally, a Highly Elastic Dielectric Structure is Prepared by Forming a Stretchable Adhesive Electrode on the Highly Dielectric Elastic Body (Step d).

(48) This step can be carried out according to the following procedure.

(49) First, a conductive filler dispersion is prepared by dispersing a metal and a carbonaceous material in an organic solvent (step d-1).

(50) Specifically, the conductive filler dispersion may prepared by dispersing 0.1 to 2 parts by weight of the carbonaceous material based on 100 parts by weight of the metal in the organic solvent.

(51) The metal may be at least one selected from gold (Au), silver (Ag), copper (Cu), nickel (Ni), aluminum (Al), platinum (Pt), ruthenium (Ru), rhodium (Rh), tungsten (W), cobalt (Co), palladium (Pd), titanium (Ti), tantalum (Ta), iron (Fe), molybdenum (Mo), hafnium (Hf), lanthanum (La) and iridium (Ir), specifically at least one selected from gold (Au), silver (Ag) and copper (Cu).

(52) More specifically, it may be a mixture of (Ag) particles whose diameter is 100 to 200 nm, 1 to 4 μm, or 5 to 10 μm.

(53) The carbonaceous material may be at least one selected from single-walled carbon nanotube, multi-walled carbon nanotube, graphene, graphite, carbon black, carbon fiber and fullerene. Specifically, it may be multi-walled carbon nanotube with a length of 15 to 40 nm and a diameter of 10 to 50 μm.

(54) The organic solvent may be any one selected from chloroform, toluene, ethanol, methanol, dichloromethane and tetrahydrofuran.

(55) Then, a mixture of the conductive filler and a polymer adhesive is prepared by mixing the conductive filler dispersion with a curable polymer and a curing agent (step d-2).

(56) The curable polymer contained in the stretchable adhesive electrode may be at least one selected from a silicon-based resin, a urethane-based resin, an acrylic resin, an isoprene-based resin, a chloroprene-based resin, a fluorine-based resin, butadiene rubber and styrene-butadiene rubber. Specifically, it may be a silicone-based resin.

(57) Specifically, the mixing amount of the curing agent may be 0 to 120 parts by weight based on 100 parts by weight of the curable polymer.

(58) Next, a stretchable adhesive electrode is formed by forming an adhesive mixture coating layer on the highly dielectric elastic body by coating the mixture of the conductive filler and the polymer adhesive and then curing the same (step d-3).

(59) The coating may be performed according to any one of the method selected from a doctor blade method, a flat screen method, a spin coating method, a roll coating method, a flow coating method, a gravure printing method and a flexographic printing method.

(60) The thickness of the adhesive mixture coating layer may be from 10 to 200 μm.

(61) The curing may be performed at a curing temperature of 150 to 200° C. for a curing time of 60 to 120 minutes.

(62) The present disclosure provides a touch sensor containing the above-described highly dielectric elastic structure.

(63) The touch sensor may be a capacitance-type force sensor.

(64) The present disclosure provides a method for preparing a touch sensor, which includes the method for preparing a highly dielectric elastic structure described above.

(65) In particular, although not explicitly described in the following examples, the highly dielectric elastic structure according to the present disclosure was prepared by varying the type of dielectric material, the type of surface treatment material and the organic solvent used in the step (a), the type of polymer, the compositional ratio and mixing method of the dielectric material/polymer mixture in the step (b), the coating method of the mixture of the dielectric material/polymer mixture and the curing agent, the content of the mixed the curing agent, the curing temperature and time and the thickness of coating film in the step (c), and the curing temperature and time and the content of the curing agent in the stretchable adhesive in the step (d).

(66) The physical properties of the prepared highly dielectric elastic structure were confirmed by performing tests related to the dielectric constant and specific resistance of the stretchable adhesive electrode.

(67) As a result, only when all of the following conditions were satisfied, unlike the other conditions and other numerical ranges, the dielectric constant was measured high, there was little electrode failure phenomenon, good mechanical properties were achieved due to good adhesion between the highly dielectric elastic body and the electrode, and the sensitivity when applied to a touch sensor was measured high. The preparation conditions are as follows.

(68) In the step (a), the dielectric material is carbon black as a carbonaceous material, octadecylsilane (ODTMS) is used for surface treatment of the carbon black, and chloroform is used as an organic solvent to disperse the carbonaceous material. In the step (b), the polymer is polydimethylsiloxane (PDMS), and the dielectric material/polymer mixture is 1 to 3 parts by weight was of carbon black mixed with 100 parts by weight of polydimethylsiloxane (PDMS). In the step (c), the coating is carried out according to a doctor blade method or a bar coating method, 5 to 20 parts by weight of a curing agent is used based on 100 parts by weight of polydimethylsiloxane (PDMS), the curing is carried out at a curing temperature of 120 to 180° C. for a curing time of 60 to 120 minutes to form a coating film with a thickness of 100 to 500 μm. In the step (d), the stretchable adhesive electrode contains a polymer adhesive containing a silicone polymer and a curing agent and multi-walled carbon nanotube and silver (Ag) particles as a conductive filler, the silver (Ag) particles are a mixture of silver particles with a diameter of 100 to 200 nm, 1 to 4 μm or 5 to 10 μm, the multi-walled carbon nanotube has a diameter of 15 to 40 nm and a length of 10 to 50 μm, the amount of the carbonaceous material is 0.1 to 2 parts by weight based on 100 parts by weight of the silver (Ag) particles, and 100 to 500 parts by weight of the conductive filler is mixed based on 100 parts by weight of the polymer adhesive.

(69) Hereinafter, the present disclosure is explained in more detail through examples, etc. In the followings, however, the examples, etc. should not be interpreted to reduce or limit the scope and content of present disclosure. In addition, it is obvious that those of ordinary skill can easily carry out the disclosure based on the present disclosure including the following examples.

EXAMPLES

Example 1

(70) (1) Preparation of Highly Dielectric Elastic Body

(71) 22.4 mg of carbon black and 0.598 mmol of ODTMS (octadecyltrimethoxysilane) were added to chloroform and dispersed for 1 hour. Then, 1 g of transparent two-component thermosetting PDMS consisting of a base resin and a curing agent with a ratio of 10:1 was mixed and stirred. After the stirring was terminated, a mixture of the PDMS base and the ODTMS-surface-treated carbon black was prepared by removing the chloroform used in the dispersion of the filler on a hot plate at 59.5° C. The dispersion of the ODTMS-surface-treated carbon black was carried out by using an ultrasonic device and the mixing the ODTMS-surface-treated carbon black filler and the PDMS based dispersed in chloroform was carried out by using a high-viscosity mixing/degassing device. The stirring and degassing processes were conducted at the same time. Then, the mixture of the PDMS base and the ODTMS-surface-treated carbon black was mixed with 100 mg of a two-component thermosetting PDMS curing agent and then a film with of thickness 100 μm was prepared on a 100-μm copper substrate by utilizing a doctor blade method. The prepared film was cured at 150° C. for 90 minutes.

(72) (2) Formation of Conductive Adhesive Electrode on Highly Dielectric Elastic Body

(73) 500 mg of silver (Ag)/multi-walled carbon nanotube (4 g/0.01 g) dispersed in chloroform and 500 mg of a transparent two-component thermosetting polymer adhesive were mixed and stirred. After completion of the reaction, a mixture of the polymer adhesive and the silver (Ag)/multi-walled carbon nanotube was prepared by removing the chloroform used in the dispersion of the filler at room temperature (25° C.). As the silver (Ag) particles, a mixture of silver (Ag) particles with three different diameters of 100 to 200 nm, 1 to 4 μm and 5 to 10 μm was used. As the multi-walled carbon nanotube, one having an average diameter of 30 nm and an average length of 30 μm was used. The dispersion of the silver (Ag)/multi-walled carbon nanotube was carried out by using an ultrasonic grinding device. The mixing of the silver (Ag)/multi-walled carbon nanotube dispersed in chloroform with the matrix of the adhesive polymer was carried out by using a high-viscosity mixing/degassing apparatus. The stirring and degassing processes were carried out at the same time. A stretchable conductive adhesive layer was prepared by coating the prepared mixture of the polymer adhesive and the silver (Ag)/multi-walled carbon nanotube on the highly dielectric elastic body prepared in (1) to a film thickness of 100 μm at 180° C. for 90 minutes and then curing the same.

Example 2

(74) A highly dielectric elastic structure was prepared in the same manner as in Example 1, except that 0.707 mmol, instead of 0.598 mmol, of ODTMS was used.

Example 3

(75) A highly dielectric elastic structure was prepared in the same manner as in Example 1, except that 0.825 mmol, instead of 0.598 mmol, of ODTMS was used.

Example 4

(76) A highly dielectric elastic structure was prepared in the same manner as in Example 1, except that 0.943 mmol, instead of 0.598 mmol, of ODTMS was used.

Comparative Example 1

(77) An elastic structure was prepared in the same manner as in Example 1, except that a Pt electrode was formed by using a sputter apparatus instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 2

(78) An elastic structure was prepared in the same manner as in Example 1, except that 0.707 mmol, instead of 0.598 mmol, of ODTMS was used and a Pt electrode was formed by using a sputter apparatus instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 3

(79) An elastic structure was prepared in the same manner as in Example 1, except that 0.825 mmol, instead of 0.598 mmol, of ODTMS was used and a Pt electrode was formed by using a sputter apparatus instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 4

(80) An elastic structure was prepared in the same manner as in Example 1, except that 0.943 mmol, instead of 0.598 mmol, of ODTMS was used and a Pt electrode was formed by using a sputter apparatus instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 5

(81) An elastic structure was prepared in the same manner as in Example 1, except that an acrylic silver paste electrode was formed instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 6

(82) An elastic structure was prepared in the same manner as in Example 1, except that 0.707 mmol, instead of 0.598 mmol, of ODTMS was used and an acrylic silver paste electrode was formed instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 7

(83) An elastic structure was prepared in the same manner as in Example 1, except that 0.825 mmol, instead of 0.598 mmol, of ODTMS was used and an acrylic silver paste electrode was formed instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 8

(84) An elastic structure was prepared in the same manner as in Example 1, except that 0.943 mmol, instead of 0.598 mmol, of ODTMS was used and an acrylic silver paste electrode was formed instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 9

(85) An elastic structure was prepared in the same manner as in Example 1, except that an electrode was formed using a copper tape instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 10

(86) An elastic structure was prepared in the same manner as in Example 1, except that 0.707 mmol, instead of 0.598 mmol, of ODTMS was used and an electrode was formed using a copper tape instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 11

(87) An elastic structure was prepared in the same manner as in Example 1, except that 0.825 mmol, instead of 0.598 mmol, of ODTMS was used and an electrode was formed using a copper tape instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 12

(88) An elastic structure was prepared in the same manner as in Example 1, except that 0.943 mmol, instead of 0.598 mmol, of ODTMS was used and an electrode was formed using a copper tape instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 13

(89) An elastic structure was prepared in the same manner as in Example 1, except that an electrode was formed using a conductive silver epoxy adhesive instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 14

(90) An elastic structure was prepared in the same manner as in Example 1, except that 0.707 mmol, instead of 0.598 mmol, of ODTMS was used and an electrode was formed using a conductive silver epoxy adhesive instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 15

(91) An elastic structure was prepared in the same manner as in Example 1, except that 0.825 mmol, instead of 0.598 mmol, of ODTMS was used and an electrode was formed using a conductive silver epoxy adhesive instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

Comparative Example 16

(92) An elastic structure was prepared in the same manner as in Example 1, except that 0.943 mmol, instead of 0.598 mmol, of ODTMS was used and an electrode was formed using a conductive silver epoxy adhesive instead of forming the stretchable conductive adhesive electrode on the prepared highly dielectric elastic body.

TEST EXAMPLES

Test Example 1: Dielectric Constant of Highly Dielectric Elastic Structure Depending on ODTMS Content

(93) For the highly dielectric elastic structures prepared in Examples 1-4 and Comparative Examples 1-16, dielectric constant was measured using an impedance analyzer (Agilent 4263B), and the results are shown in Table 1 below.

(94) TABLE-US-00001 TABLE 1 Highly dielectric elastic body PDMS PDMS curing Carbon ODTMS Dielectric base content agent content black content content constant Electrode (mg) (mg) (mg) (mmol) (at 100 Hz) Untreated — 1000 100 Untreated 0 2.72 group Example 1 Silicone-based 1000 100 22.4 0.598 22.15 silver/CNT Example 2 Silicone-based 1000 100 22.4 0.707 118.54 silver/CNT Example 3 Silicone-based 1000 100 22.4 0.825 218.41 silver/CNT Example 4 Silicone-based 1000 100 22.4 0.943 330.11 silver/CNT Comp. Ex. 1 Sputtering Pt 1000 100 22.4 0.598 21.22 Comp. Ex. 2 Sputtering Pt 1000 100 22.4 0.707 120.15 Comp. Ex. 3 Sputtering Pt 1000 100 22.4 0.825 210.11 Comp. Ex. 4 Sputtering Pt 1000 100 22.4 0.943 317.21 Comp. Ex. 5 Acrylic silver 1000 100 22.4 0.598 8.21 paste Comp. Ex. 6 Acrylic silver 1000 100 22.4 0.707 22.45 paste Comp. Ex. 7 Acrylic silver 1000 100 22.4 0.825 30.45 paste Comp. Ex. 8 Acrylic silver 1000 100 22.4 0.943 45.87 paste Comp. Ex. 9 Copper tape 1000 100 22.4 0.598 9.57 Comp. Ex. 10 Copper tape 1000 100 22.4 0.707 28.45 Comp. Ex. 11 Copper tape 1000 100 22.4 0.825 31.54 Comp. Ex. 12 Copper tape 1000 100 22.4 0.943 60.11 Comp. Ex. 13 Silver epoxy 1000 100 22.4 0.598 8.98 Comp. Ex. 14 Silver epoxy 1000 100 22.4 0.707 15.45 Comp. Ex. 15 Silver epoxy 1000 100 22.4 0.825 24.58 Comp. Ex. 16 Silver epoxy 1000 100 22.4 0.943 38.45

(95) The dielectric constant was significantly higher for the highly dielectric elastic structures of Examples 1-4 of the present disclosure and Comparative Examples 1-4 as compared to the elastic structures of Comparative Examples 5-16. For Examples 1-4 of the present disclosure, the dielectric constant was higher as the content of ODTMS was higher.

Test Example 2: Change in Dielectric Properties of Highly Dielectric Elastic Structure Made of Pt Electrode

(96) After applying a force of 100 kPa to the highly dielectric elastic structure of Comparative Example 2 multiple times, dielectric constant was measured using an impedance analyzer (Agilent 4263B). The result is shown in FIG. 2. It can be seen that the dielectric constant of the platinum-coated highly dielectric elastic structure decreases as force is applied thereto.

Test Example 3: Evaluation of Electrode Reliability of Stretchable Conductive Adhesive Layer and Platinum Coating Layer of Highly Dielectric Elastic Structure

(97) After applying a force of 100 kPa or 500 kPa to the electrode layer of the highly dielectric elastic structure of Example 2 and the highly dielectric elastic structure of Comparative Example 2 multiple times, the state of the platinum electrode was observed using an optical microscope (DM2500M). The state of the platinum electrode of Comparative Example 2 is shown in FIG. 3, and the state of the electrode of Example 2 is shown in FIG. 4. It can be seen that the stretchable conductive adhesive of the highly dielectric elastic structure of Example 2 exhibits higher reliability as compared to the sputtered platinum electrode of the highly dielectric elastic structure of Comparative Example 2.

(98) Those skilled in the art will appreciate that the conceptions and specific embodiments disclosed in the foregoing description may be readily utilized as a basis for modifying or designing other embodiments for carrying out the same purposes of the present disclosure. Those skilled in the art will also appreciate that such equivalent embodiments do not depart from the spirit and scope of the disclosure as set forth in the appended claims.