Vehicle radar signaling device including a substrate integrated waveguide

Abstract

An illustrative example electronic device includes a substrate integrated wave guide (SIW) comprising a substrate and a plurality of conductive members in the substrate. An antenna member is situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled with the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator.

Claims

1. A radar signalling device for detecting objects in a vicinity of a vehicle, the device, comprising: a substrate including a metal layer on at least one side of the substrate; a substrate integrated waveguide (SIW) comprising a portion of the substrate and a plurality of conductive members in the substrate; an antenna member situated at least partially in the substrate within the SIW in a vicinity of at least some of the plurality of conductive members; a radar detection signal generator component situated on the at least one side of the substrate, the radar detection signal generator component having a conductive output directly connected with the metal layer on the at least one side of the substrate; and a conductor within the substrate, the conductor being directly connected to the metal layer and the antenna member, wherein the antenna member comprises a portion of a metal layer in the substrate comprising a generally circular and generally planar disk, the antenna member radiates a radar detection signal into the SIW based on operation of the signal generator, and the SIW transmits the radar detection signal out of the SIW into the vicinity of the vehicle.

2. A radar signalling device for detecting objects in a vicinity of a vehicle, the device, comprising: a substrate including a metal layer on at least one side of the substrate; a substrate integrated waveguide (SIW) comprising a portion of the substrate and a plurality of conductive members in the substrate; an antenna member situated at least partially in the substrate within the SIW in a vicinity of at least some of the plurality of conductive members; a radar detection signal generator component situated on the at least one side of the substrate, the radar detection signal generator component having a conductive output directly connected with the metal layer on the at least one side of the substrate; and a conductor within the substrate, the conductor being directly connected to the metal layer and the antenna member, wherein the radar detection signal generator component comprises a ball grid array including a plurality of solder balls, the conductive output comprises at least one of the plurality of solder balls, the antenna member radiates a radar detection signal into the SIW based on operation of the signal generator, and the SIW transmits the radar detection signal out of the SIW into the vicinity of the vehicle.

3. The device of claim 2, wherein the metal layer includes a solder pad on the at least one side of the substrate, and the conductor comprises a via establishing an electrically conductive connection between the solder pad and the antenna member.

4. The device of claim 3, wherein at least some of a material of the at least one of the plurality of solder balls is reflowed to connect the solder pad to the radar detection signal generator component.

5. The device of claim 2, wherein the plurality of conductive members in the substrate of the SIW leave one side of the SIW open.

6. The device of claim 2, wherein a material of the substrate separates the antenna member from the at least some of the plurality of conductive members of the SIW.

7. The device of claim 2, wherein each of the plurality of conductive members of the SIW respectively comprise a metalized via or a metal-filled via in the substrate; the SIW transmits the radar detection signal out of the SIW in a direction of signal output on a first side of the antenna element; the SIW includes a plurality of backshort vias in the substrate on a second side of the antenna element; at least some of the second side faces in an opposite direction from the direction of signal output; and the plurality of backshort vias reflect radiation from the antenna element in the direction of signal output.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 diagrammatically illustrates a vehicle including a signaling device designed according to an embodiment of this invention.

(2) FIG. 2 diagrammatically illustrates a signaling device designed according to an embodiment of this invention.

(3) FIG. 3 is a sectional illustration taken along the lines 3-3 in FIG. 2.

(4) FIG. 4 diagrammatically illustrates an example antenna member.

(5) FIG. 5 schematically illustrates selected portions of the example device shown in FIGS. 2 and 3.

(6) FIG. 6 is a cross-sectional view taken along the lines 6-6 in FIG. 5.

DETAILED DESCRIPTION OF THE INVENTION

(7) Embodiments of this invention provide a signaling device having a unique connection between a signal generator output and a substrate-integrated-waveguide (SIW). Embodiments of this invention eliminate interconnecting transitions between the signal generator and the SIW, which maximizes system performance while minimizing complexity.

(8) FIG. 1 illustrates a vehicle 20 including a plurality of signaling devices schematically shown at 22. In some examples, the signaling devices 22 are configured as radar signaling devices useful for detecting objects in a vicinity of the vehicle 20 based on signals schematically shown at 24 transmitted by the devices 22. The example signaling devices 22 may be useful for parking assistance, collision avoidance and other object detection features on a passenger vehicle.

(9) Referring to FIGS. 2 and 3, which show one of the signalling devices 22, a substrate 26 comprises a known integrated circuit substrate material. A variety of dielectric materials are suitable as the substrate 26. A plurality of conductive members 28 are situated in the substrate 26 to establish a SIW 30, which is useful, for example, as a microwave antenna. The SIW 30 in this example has a direction of signal transmission represented by the arrows 32. In one example, the conductive members 28 comprise metalized vias in the substrate 26. In another example, the conductive members 28 comprise metal filled vias in the substrate 26.

(10) A signal generator component 34 is supported on the substrate 26. In this example, the signal generator component 34 includes an integrated circuit configured in a known manner for generating a desired type of signal. In this example, the signal generator component 34 includes all of the functions necessary for radio based signaling that may be useful for sensing or communication, for example. In one example embodiment, the signal generator component 34 is configured for radar detection signal transmission.

(11) The signal generator component 34 in this example includes a ball grid array that is useful for establishing a connection with a metal layer, for example, on the substrate 26. FIG. 3 illustrates three of the solder balls of the ball grid array at 36, 38 and 40. In this example, the solder ball 38 provides a direct connection between the signal generator component 34 and an antenna member 44 that is situated at least partially in the substrate 26.

(12) As shown in FIG. 4, the antenna member 44 of this example includes a generally flat, generally circular plate of conductive material, such as metal. In some examples, the antenna member 44 comprises a copper disk printed on a metal layer supported on the substrate 26 (FIG. 2). In the illustrated example, a via 46 provides a connection to the antenna member 44. The dimensions of the via 46 and the antenna member 44 establish the resonant frequency of the antenna element.

(13) Referring to FIGS. 5 and 6, a solder pad 48 is supported on the substrate 26, for example on a metal layer on one surface of the substrate 26. The solder ball 38 (FIG. 3) is connected to the solder pad 48 during a reflow process used for mounting the signal generator component 34 (FIGS. 2 and 3) on the substrate 26. The solder ball 38 (FIG. 3), the solder pad 48 and the via 46 provide a direct connection between the antenna member 44 and the operative circuitry of the signal generator component 34 (FIGS. 2 and 3). Such a direct connection does not include or introduce microwave losses or microwave reflections, such as those that typically accompany connections to microstrips.

(14) The antenna member 44 radiates a signal into the SIW 30 (FIG. 2) based on operation of the signal generator component 34. As best appreciated from FIG. 5, the antenna member 44 is spaced from the conductive members 28 of the SIW 00 in FIG. 2). There is at least some substrate material between the antenna member 44 and the conductive members 28. The dimensions of the antenna member 44 and its location relative to the conductive members 28 may be varied to meet different needs in different situations. For example, the desired transmission frequency and the substrate material have an impact on the desired relationship between the antenna member 44 and the conductive members 28. Given this description, those skilled in the art will be able to select appropriate dimensions and materials to meet their particular needs.

(15) One feature of the illustrated example is a backshort established by a plurality of the conductive members 28′ (FIGS. 3, 5 and 6). In the illustrated example, the three rightmost conductive members 28′ (according to FIG. 5, for example) establish the backshort. Some of the conductive members 28 are situated on a first side of the antenna member 44. The direction of signal transmission represented at 32 is on the first side of the antenna member 44. RF signal energy radiated from the antenna member 44 toward the first side of the antenna member 44 travels in the signal transmission direction 32 (FIGS. 2 and 6). Some RF energy will be radiated from the antenna member 44 toward a second, different side of the antenna member, which is in an opposite direction from the direction of signal transmission shown at 32. The conductive members 28′ of the backshort reflect such RF energy and direct it into or toward the direction of signal transmission 32. The dimensions of the area on the substrate 26 for establishing the backshort is determined based on the substrate material and the frequency of the signal transmitted by the device 22. The RF energy reflected by the backshort is preferably in phase with the radiated energy from the antenna member 44 already moving in the direction of signal transmission 32. The arrangement of the conductive members 28′ on the substrate 26 needed to achieve a desired reflection of the radiated energy from the antenna member 44 for a particular implementation can be determined by those skilled in the art who have the benefit of this description.

(16) The illustrated example signaling device 22 includes a direct connection of the ball grid array of the signal generator component 34 to the SIW 30. With the illustrated embodiment, there is no need for loss-introducing transmissions from the signal generator component to a planar wave guide and then from a planar wave guide to the SIW. It follows that the illustrated example signaling device is more effective and has potentially wider application than previous signaling device configurations.

(17) In the illustrated example, the radiating structure of the antenna member 44 is achieved using standard planar printed circuit board technology such that no special processing is required. Additionally, no external components are needed. The illustrated example provides a lower cost solution compared to previous configurations.

(18) The preceding description is exemplary rather than limiting in nature. Variations and modifications to the disclosed examples may become apparent to those skilled in the art that do not necessarily depart from the essence of this invention. The scope of legal protection given to this invention can only be determined by studying the following claims.