HIGH TEMPERATURE RESISTANT PHOTOCURABLE MATERIAL FOR 3D INKJET PRINTING AND PREPARATION METHOD THEREOF, 3D PRINTING PRODUCT AND 3D PRINTER

Abstract

The present application provides a high temperature resistant photocurable material for 3D inkjet printing, a preparation method thereof, a 3D printing product and a 3D printer, which relates to 3D printing technology. The high temperature resistant photocurable material for 3D inkjet printing includes the following components: 60-99 parts by weight of first vinyl compounds, 0-39 parts by weight of second vinyl compounds, and 0.5-4 parts by weight of free radical photoinitiators, where: the first vinyl compounds have a non-reactive cyclic structure, and the non-reactive cyclic structure does not have photopolymerization properties under initiations of the free radical photoinitiators; the second vinyl compounds do not have the non-reactive cyclic structure, and the number of methylene on a main chain are not less than 3.

Claims

1. A high temperature resistant photocurable material for 3D inkjet printing, comprising the following components: 60-99 parts by weight of first vinyl compounds, 0-39 parts by weight of second vinyl compounds, and 0.5-4 parts by weight of free radical photoinitiators, wherein: the first vinyl compounds have a non-reactive cyclic structure, and the non-reactive cyclic structure does not have photopolymerization properties under initiations of the free radical photoinitiators; and the second vinyl compounds do not have the non-reactive cyclic structure, and a number of methylene on a main chain of the second vinyl compounds is not less than 3.

2. The high temperature resistant photocurable material for 3D inkjet printing according to claim 1, wherein a number of methylene on a main chain of at least partial of the first vinyl compounds is not less than 3.

3. The high temperature resistant photocurable material for 3D inkjet printing according to claim 1, wherein the first vinyl compounds are selected from at least one of vinyl monomers with the non-reactive cyclic structure and vinyl oligomers with the non-reactive cyclic structure.

4. The high temperature resistant photocurable material for 3D inkjet printing according to claim 3, wherein the first vinyl compounds at least comprise a vinyl compound with a non-reactive nitrogen-containing heterocyclic ring, and the vinyl compound with the non-reactive nitrogen-containing heterocyclic ring is not less than 10 parts by weight; wherein the vinyl compound with the non-reactive nitrogen-containing heterocyclic ring is selected from at least one of a (methyl)acrylate monomer with a non-reactive nitrogen-containing heterocyclic ring, a (methyl)acrylate oligomer with a non-reactive nitrogen-containing heterocyclic ring, and an amide monomer with a non-reactive nitrogen-containing heterocyclic ring.

5. The high temperature resistant photocuring material for 3D inkjet printing according to claim 4, wherein the first vinyl compounds comprise at least one of the (methyl)acrylate monomer with the non-reactive nitrogen-containing heterocyclic ring and the amide monomer with the non-reactive nitrogen-containing heterocyclic ring.

6. The high temperature resistant photocuring material for 3D inkjet printing according to claim 5, wherein a sum of the (methyl)acrylate monomer with the non-reactive nitrogen-containing heterocyclic ring and the amide monomer with the non-reactive nitrogen-containing heterocyclic ring is 10-50 parts by weight.

7. The high temperature resistant photocurable material for 3D inkjet printing according to claim 4, wherein the first vinyl compounds further comprise at least one of the following four vinyl compounds: a vinyl compound with a non-reactive aliphatic ring, a vinyl compound with a non-reactive aromatic ring, a vinyl compound with a non-reactive oxygen-containing heterocyclic ring, and a vinyl compound with a non-reactive sulfur-containing heterocyclic ring.

8. The high temperature resistant photocurable material for 3D inkjet printing according to claim 7, wherein each of the four vinyl compounds does not exceed 50 parts by weight.

9. The high temperature resistant photocurable material for 3D inkjet printing according to claim 7, wherein the vinyl compound with the non-reactive aliphatic ring is selected from at least one of a (methyl)acrylate monomer with a non-reactive aliphatic ring and a (methyl)acrylate oligomer with a non-reactive aliphatic ring; wherein the (methyl)acrylate monomer with the non-reactive aliphatic ring is selected from at least one of dicyclopentadiene methacrylate, dicyclopentyl (methyl)acrylate, isobornyl (methyl)acrylate, 1-adamantane (methyl)acrylate, cyclohexane dimethanol diacrylate and tricyclodecane dimethanol di(methyl)acrylate; and the (methyl)acrylate oligomer with the non-reactive aliphatic ring is selected from at least one of aliphatic polyurethane acrylate and aliphatic epoxy acrylate.

10. The high temperature resistant photocurable material for 3D inkjet printing according to claim 7, wherein the vinyl compound with the non-reactive aromatic ring is selected from at least one of a (methyl)acrylate monomer with a non-reactive aromatic ring and a (methyl)acrylate oligomer with a non-reactive aromatic ring; wherein the (methyl)acrylate monomer with the non-reactive aromatic ring is selected from at least one of ethoxylated bisphenol A di(methyl)acrylate, propoxylated bisphenol A di(methyl)acrylate, benzyl methacrylate and 2-phenoxyethyl methacrylate; and the (methyl)acrylate oligomer with the non-reactive aromatic ring is selected from at least one of bisphenol A (methyl)epoxy acrylate, aromatic polyurethane (methyl)acrylate and aromatic polyester (methyl)acrylate.

11. The high temperature resistant photocurable material for 3D inkjet printing according to claim 7, wherein the vinyl compound with the non-reactive oxygen-containing heterocyclic ring is selected from at least one of a (methyl)acrylate monomer with a non-reactive oxygen-containing heterocyclic ring and a (methyl)acrylate oligomer with a non-reactive oxygen-containing heterocyclic ring; and the vinyl compound with the non-reactive sulfur-containing heterocyclic ring is selected from at least one of a (methyl)acrylate monomer with a non-reactive sulfur-containing heterocyclic ring and a (methyl)acrylate oligomer with a non-reactive sulfur-containing heterocyclic ring.

12. The high temperature resistant photocurable material for 3D inkjet printing according to claim 1, wherein glass transition temperatures of the first vinyl compounds are not lower than 20° C.

13. The high temperature resistant photocurable material for 3D inkjet printing according to claim 1, wherein the second vinyl compounds are selected from at least one of a (methyl)acrylate monomer without a non-reactive cyclic structure and a number of methylene on a main chain of which is not less than 3 and a (methyl)acrylate oligomer without a non-reactive cyclic structure and a number of methylene on a main chain of which is not less than 3.

14. The high temperature resistant photocurable material for 3D inkjet printing according to claim 13, wherein: the (methyl)acrylate monomer without the non-reactive cyclic structure and the number of methylene on the main chain of which is not less than 3 is selected from at least one of 3-hydroxy-2,2-dimethylpropyl-3-hydroxy-2,2-dimethyl propyl ester diacrylate, diethylene glycol diacrylate and dipropylene glycol diacrylate; and the (methyl)acrylate oligomer without the non-reactive cyclic structure and the number of methylene on the main chain of which is not less than 3 is selected from at least one of polyether acrylate, polyester acrylate and hyperbranched acrylate oligomer.

15. The high temperature resistant photocurable material for 3D inkjet printing according to claim 13, wherein glass transition temperatures of the second vinyl compounds are not lower than 60° C.

16. The high temperature resistant photocurable material for 3D inkjet printing according to claim 13, wherein a total content of the vinyl oligomer with the non-reactive cyclic structure and the (methyl)acrylate oligomer without non-reactive cyclic structure and the number of methylene on the main chain of which is not less than 3 does not exceed 40 parts by weight.

17. The high temperature resistant photocurable material for 3D inkjet printing according to claim 1, wherein the free radical photoinitiators are free radical ultraviolet photoinitiators; or wherein the high temperature resistant photocurable material for 3D inkjet printing further comprises at least one of 0.01 to 5 parts by weight of auxiliary agents and 0-10 parts by weight of colorants.

18. The high temperature resistant photocurable material for 3D inkjet printing according to claim 1, wherein the high temperature resistant photocurable material for 3D inkjet printing has a viscosity of 10-80 cp, a surface tension of 20-35 mN/m at 25° C.; a viscosity of 8-15 cp, a surface tension of 20-35 mN/m at an operating temperature, wherein the operating temperature is at least one temperature of 30-70° C.

19. A preparation method of the high temperature resistant photocurable material for 3D inkjet printing according to claim 1, comprising: mixing components other than free radical photoinitiators to obtain a first mixture; adding the free radical photoinitiators into the first mixture until the free radical photoinitiators are completely dissolved to obtain a second mixture; and filtering the second mixture and collecting a filtrate to obtain the high temperature resistant photocurable material for 3D inkjet printing.

20. A 3D printing product, wherein the 3D printing product is obtained using the high temperature resistant photocurable material for 3D inkjet printing according to claim 1 by 3D printing.

21. A 3D printer comprising an inkjet print head, a material storage container, a bearing platform, and a connecting device for connecting the inkjet print head and the material storage container, wherein the material storage container contains the high temperature resistant photocurable material for 3D inkjet printing according to claim 1.

22. The 3D printer according to claim 21, further comprising at least one of a controller and an ultraviolet light source, wherein the controller is capable of controlling the material storage container to supply ink to the inkjet print head.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0078] FIG. 1 is a schematic structural diagram of a 3D printer provided in Embodiment 7 of the present disclosure.

DESCRIPTION OF REFERENCE SIGNS IS AS FOLLOWS

[0079] 1-Material storage container;

[0080] 2-Inkjet print head;

[0081] 3-Connecting device;

[0082] 4-Controller;

[0083] 5-ultraviolet light source;

[0084] 6-Photocuring layer; and

[0085] 7-Bearing platform.

DESCRIPTION OF EMBODIMENTS

[0086] In order to make the objects, technical solutions and advantages of embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present application will be clearly and completely described in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application.

Embodiment 1

[0087] This embodiment provides a high temperature resistant photocurable material for 3D inkjet printing, which has the following composition as in Table 1:

TABLE-US-00001 TABLE 1 Composition of the high temperature resistant photocurable material for 3D inkjet printing in Embodiment 1 Composition Compound/Trade name Weight First vinyl PAR-68A ((Methyl)acrylate monomer with  6 g compounds nitrogen-containing heterocyclic structure) Acryloyl morpholine 20 g Isobornyl acrylate 10 g Tricyclodecane dimethanol diacrylate  5 g Aliphatic epoxy acrylate 22.4 g   Trimethylolpropane formal acrylate 13 g Second vinyl 3-hydroxy-2,2-dimethylpropyl-3-hydroxy- 17 g compounds 2,2-dimethyl propyl ester diacrylate Free radical TPO  4 g photoinitiators Auxiliary agents GENORAD 20 (Polymerization inhibitor) 0.5 g  BYK333 (Surfactant) 0.05 g   TEGO Airex 920 (Defoamer) 0.05 g   Colorants Greenish blue 9S1494  2 g

[0088] The preparation method of the high temperature resistant photocurable material for 3D inkjet printing is as follows:

[0089] (1) putting the components other than the free radical photoinitiators in a glass container evenly, stirring with a stirrer to obtain a uniformly mixed first mixture; then adding the free radical photoinitiators to the first mixture, and continuing to stir until that the free radical photoinitiators are completely dissolved, to obtain a second mixture;

[0090] (2) performing a primary filtration on the second mixture using a 0.6 μm glass fiber membrane, and then performing a secondary filtration using a 0.2 μm polypropylene membrane (PP membrane) to obtain a filtrate; and

[0091] (3) under a vacuum of 0.1 MPa, vacuum suction filtrating for 1 hour to remove bubbles in the filtrate, to finally obtain the high temperature resistant photocurable material for 3D inkjet printing, which is blue.

Embodiment 2

[0092] This embodiment provides a high temperature resistant photocurable material for 3D inkjet printing, which has the following composition as in Table 2:

TABLE-US-00002 TABLE 2 Composition of the high temperature resistant photocurable material for 3D inkjet printing in Embodiment 2 Composition Compound/Trade name Weight First vinyl Acryloyl morpholine 48.93 g   compounds Trimethylolpropane formal acrylate 14 g Second vinyl 3-hydroxy-2,2-dimethylpropyl-3-hydroxy- 25 g compounds 2,2-dimethyl propyl ester diacrylate Polyester acrylate 10 g Free radical TPO  1 g photoinitiators 184  1 g Auxiliary agents GENORAD 20 (Polymerization inhibitor) 0.05 g   BYK333 (Surfactant) 0.02 g 

[0093] The preparation method of the high temperature resistant photocurable material for 3D inkjet printing in this embodiment is basically the same as that in Embodiment 1, except that the components used are replaced accordingly, and a manner of heating and degassing is used in step (3), the filtrate obtained in step (2) is heated to 40° C. for performing a degassing process, and a degassing time is 50 min.

[0094] The high temperature resistant photocurable material for 3D inkjet printing obtained in this embodiment is a transparent material.

Embodiment 3

[0095] This embodiment provides a high temperature resistant photocurable material for 3D inkjet printing, which has the following composition as in Table 3:

TABLE-US-00003 TABLE 3 Composition of the high temperature resistant photocurable material for 3D inkjet printing in Embodiment 3 Composition Compound/Trade name Weight First vinyl Acryloyl morpholine 10 g compounds Isobornyl acrylate 25.5 g   Tricyclodecane dimethanol diacrylate 20 g Bisphenol A epoxy acrylate 39 g Free radical 819 0.5 g  photoinitiators Auxiliary agents GENORAD 20 (Polymerization inhibitor)  l g TEGO wet 500 (Surfactant)  l g TEGO Airex 920 (Defoamer) 0.5 g  Colorants Yellowish red 9R1519 2.5 g 

[0096] The preparation method of the high temperature resistant photocurable material for 3D inkjet printing in this embodiment is basically the same as that in Embodiment 1, except that the components used are replaced accordingly, and in step (3), the specific time for degassing under reduced pressure is adjusted to 2 hours. The high temperature resistant photocurable material for 3D inkjet printing obtained in this embodiment is a red material.

Embodiment 4

[0097] This embodiment provides a high temperature resistant photocurable material for 3D inkjet printing, which has the following composition as in Table 4:

TABLE-US-00004 TABLE 4 Composition of the high temperature resistant photocurable material for 3D inkjet printing in Embodiment 4 Composition Compound/Trade name Weight First vinyl BMA-200 ((Methyl)acrylate oligomer with  5 g compounds nitrogen-containing heterocyclic structure) Acryloyl morpholine 26 g Isobornyl acrylate 17.2 g   Tricyclodecane dimethanol diacrylate 10 g 2-phenoxyethyl methacrylate 15 g Aromatic polyurethane acrylate  5 g Ethoxylated bisphenol A dimethylacrylate 18 g Free radical ITX 1.5 g  photoinitiators Genomer 5142  2 g Auxiliary agents GENORAD 22 (Polymerization inhibitor) 0.2 g  BYK333 (Surfactant) 0.1 g 

[0098] The preparation method of the high temperature resistant photocurable material for 3D inkjet printing in this embodiment is basically the same as that in Embodiment 1, except that the components used are replaced accordingly, and normal pressure static degassing is adopted for the degassing process in step (3), a static time is 3 hours.

[0099] The high temperature resistant photocurable material for 3D inkjet printing obtained in this embodiment is a transparent material.

Embodiment 5

[0100] This embodiment provides a high temperature resistant photocurable material for 3D inkjet printing, which has the following composition as in Table 5:

TABLE-US-00005 TABLE 5 Composition of the high temperature resistant photocurable material for 3D inkjet printing in Embodiment 5 Composition Compound/Trade name Weight First vinyl Acryloyl morpholine 20 g compounds Isobornyl acrylate 21.6 g   1-adamantane acrylate 25 g Tricyclodecane dimethanol diacrylate 20 g Ethoxylated bisphenol A dimethylacrylate 10 g Free radical ITX  1 g photoinitiators N,N-dimethyl ethyl benzoate  2 g Auxiliary agents GENORAD 22 (Polymerization inhibitor) 0.2 g  TEGO wet 500 (Surfactant) 0.2 g 

[0101] The preparation method of the high temperature resistant photocurable material for 3D inkjet printing in this embodiment is basically the same as that in Embodiment 1, except that the components used are replaced accordingly, and a manner of heating and degassing is used in step (3), the filtrate obtained in step (2) is heated to 50° C. for performing a degassing process, and a degassing time is 30 min.

[0102] The high temperature resistant photocurable material for 3D inkjet printing obtained in this embodiment is a transparent material.

Embodiment 6

[0103] This embodiment provides a high temperature resistant photocurable material for 3D inkjet printing, which has the following composition as in Table 6:

TABLE-US-00006 TABLE 6 Composition of the high temperature resistant photocurable material for 3D inkjet printing in Embodiment 6 Composition Compound/Trade name Weight First vinyl Isobornyl acrylate 22.53 g   compounds Tricyclodecane dimethanol diacrylate  5 g Aliphatic epoxy acrylate 17 g Trimethylolpropane formal acrylate 30 g Secon 3-hydroxy-2,2-dimethylpropyl-3-hydroxy- 20 g vinyl compounds 2,2-dimethyl propyl ester diacrylate Free radical TPO  3 g photoinitiators Auxiliary agents GENORAD 20 (Polymerization inhibitor) 0.4 g  BYK333 (Surfactant) 0.02 g   TEGO Airex 920 (Defoamer) 0.05 g   Colorants Greenish blue 9S1494  2 g

[0104] The preparation method of the high temperature resistant photocurable material for 3D inkjet printing in this embodiment is basically the same as that in Embodiment 1, except that the components used are replaced accordingly.

[0105] The high temperature resistant photocurable material for 3D inkjet printing obtained in this embodiment is blue.

Comparative Embodiment 1

[0106] This comparative example provides a photocurable material for 3D inkjet printing, which has the following composition as in Table 7:

TABLE-US-00007 TABLE 7 Composition of the high temperature resistant photocurable material for 3D inkjet printing in Comparative Embodiment 1 Composition Compound/Trade name Weight First vinyl Acryloyl morpholine  12 g compounds Isobornyl acrylate 11.3 g  Trimethylolpropane formal acrylate   5 g Second vinyl 3-hydroxy-2,2-dimethylpropyl-3-hydroxy-  70 g compounds 2,2-dimethyl propyl ester diacrylate Free radical 819 0.6 g photoinitiators Auxiliary agents GENORAD 20 (Polymerization inhibitor) 0.2 g TEGO wet 500 (Surfactant) 0.5 g Colorants Yellowish red 9R1519 0.4 g

[0107] The preparation method of the high temperature resistant photocurable material for 3D inkjet printing in this comparative embodiment 1 is basically the same as that in Embodiment 1, except that the components used are replaced accordingly.

[0108] The high temperature resistant photocurable material for 3D inkjet printing in this comparative embodiment 1 is red.

[0109] Performance tests of the high temperature resistant photocurable material for 3D inkjet printing in each of the foregoing embodiments are performed. A test method is as follows, and test results are shown in Table 8.

[0110] 1. Viscosity

[0111] A DV-I digital viscometer is used to test the viscosity of the photocurable material.

[0112] 2. Size Accuracy

[0113] The photocurable material is applied to a Sailner J501 3D photocuring inkjet printer, a nozzle temperature is set at 30-70° C., and a model with a length, width, and height of 100 mm×100 mm×100 mm is printed. After the printing is completed, the actual length, width, and height sizes of the model are tested, the actual length, width, and height sizes are respectively subtracted by 100 mm, and a maximum value of the three difference values is an accuracy size error.

[0114] 3. Shore Hardness

[0115] The photocurable material is applied to a Sailner J501 3D photocuring inkjet printer, and a tested material of size and specifications required by GB/T2411-2008 “Plastics and ebonite-Determination of indentation hardness by means of a durometer (shore hardness)”, and the shore hardness is tested according to this standard.

[0116] 4. Tensile Strength

[0117] The photocurable material is applied to a Sailner J501 3D photocurable inkjet printer, a tested material of size and specifications required by GB/T 528-2009 “Rubber, vulcanized or thermoplastic-Determination of tensile stress-strain properties” is printed, and the tensile strength of the high temperature photocurable material of this embodiment is tested according to GB/T1040-2006 “Plastics-Determination of tensile property-Part 1: General principles”.

[0118] 5. Flexural Strength

[0119] The photocurable material is applied to a Sailner J501 3D photocuring inkjet printer, a tested material of size and specifications required by GB/T 9341-2008 “Plastic-Determination of flexural properties” is printed, and the flexural strength is tested according to this standard.

[0120] 6. Impact Strength

[0121] The photocurable material is applied to a Sailner J501 3D photocuring inkjet printer, a tested material of size and specifications required by GB/T 1843-2008 “Plastic-Determination of izod impact strength” is printed, and the impact strength is tested according to this standard.

[0122] 7. Heat Deflection Temperature

[0123] The material composition of this embodiment is applied to a Sailner J501 3D photocuring inkjet printer, a tested material of size and specifications required by GB/T 1634.2-2004 “Plastics-Deformation of temperature of deflection under load-Part 2: Plastics, ebonite and long-fiber-reinforced composites” is printed, and the heat deflection temperature is measured according to this standard (0.45 MPa).

TABLE-US-00008 TABLE 8 Test results of performance parameters of each embodiment and comparative embodiment Number Performance Comparative parameters Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Embodiment 5 Embodment 6 Embodiment 1 25° C. Viscosity (cp) 50.9 19.6 77.0 40.2 12.5 24.9 15.5 25° C. Surface tension 22.3 25.5 30.2 20.9 34.9 25.3 33.8 (mN/m) Viscosity under a 12.0 14.8 8.2 13.5 10.8 9.5 11.2 printing temperature (62° C.) (55° C.) (70° C.) (50° C.) (30° C.) (50° C.) (35° C.) (cp) Surface tension 20.5 23.5 30.5 20.3 34.7 22.5 32.5 under a printing (62° C.) (55° C.) (70° C.) (50° C.) (30° C.) (50° C.) (35° C.) temperature (mN/m) Tensile strength 87 82 83 85 86 81 70 (MPa) Flexural strength 130 124 125 121 122 121 90 (MPa) Impact strength 15 20 12 13 18 11 8 (J/m) Shore hardness (D) 90 85 89 90 87 82 85 0.45 MPa Heat 105 98 95 107 97 87 85 deflection temperature (° C.) Size accuracy (mm) 0.05 0.02 0.05 0.01 0.07 0.08 0.15

[0124] It can be seen from the test results in Table 8 above:

[0125] 1. The high temperature resistant photocurable material for 3D inkjet printing provided by the embodiments of the present disclosure has a viscosity of 10-80 cp and a surface tension of 20-35 mN/m at room temperature (25° C.); and has a viscosity of 8-15 cp and a surface tension of 20-35 mN/m at least one operating temperature of 30-70° C., therefore, a normal inkjet printing can be performed at a low temperature of 30-70° C., which effectively saves energy and prolongs the service life of the print head.

[0126] 2. The 3D printing product obtained using the high temperature resistant photocurable material for 3D inkjet printing provided by the embodiments of the present disclosure by 3D inkjet printing has the following properties:

[0127] (1) a size error of a printed model is less than 0.1 mm, and thus the 3D printing product has very high molding accuracy;

[0128] (2) the heat deflection temperature (0.45 MPa) is higher than 80° C., especially when the content of the vinyl compound with the non-reactive nitrogen-containing heterocyclic is greater than 10 parts by weight (Embodiments 1-5), the heat deflection temperature is higher than 95° C., and thus the 3D printing product has very outstanding temperature resistance; and

[0129] (3) the tensile strength is higher than 80 MPa, the flexural strength is higher than 120 Mpa, the impact strength resistance is higher than 10 J/m, and the shore hardness is higher than 80D, therefore, the 3D printing product has good mechanical properties, especially outstanding impact strength resistance, which meets requirements of actual usage.

[0130] 3. Comparing the test results of Embodiments 1-6 and Comparative Embodiment 1, although the heat deflection temperature of the 3D printing product obtained from the photocurable material provided in Comparative Embodiment 1 is basically close to that of Embodiment 6, the mechanical properties thereof in terms of tensile strength, flexural strength, impact strength and the like are obviously inferior to those of Embodiments 1-6, and the molding accuracy is low.

Embodiment 7

[0131] This embodiment provides a 3D inkjet printer, a schematic diagram thereof is shown in FIG. 1, which includes a material storage container 1, an inkjet print head 2, a connecting device 3, and a bearing platform 7, among them:

[0132] the material storage container 1 contains the high temperature resistant photocurable material for 3D inkjet printing provided in any one of Embodiments 1-6;

[0133] the connecting device 3 is configured to connect the material storage container 1 and the inkjet print head 2, and the high temperature resistant photocurable material for 3D inkjet printing contained in the material storage container 1 is supplied to the inkjet print head 2 through the connecting device 3; and

[0134] the high temperature resistant photocurable material for 3D inkjet printing sprayed out from the inkjet print head 2 is cured on the bearing platform 7 to form a photocuring layer 6.

[0135] Specifically, the number of the material storage container 1 is not particularly limited by this embodiment, and a corresponding number of the material storage container 1 may be provided according to the type of the high temperature resistant photocurable material for 3D inkjet printing. The above-mentioned connecting device 3 may specifically be a connecting pipe or connecting devices in other forms, as long as it can realize the above-mentioned connection and ink transfer functions.

[0136] The inkjet print head 2 may specifically be a single-channel print head or a multi-channel print head, or a combination of a single-channel print head and a multi-channel print head.

[0137] With further reference to FIG. 1, the 3D inkjet printer provided by this embodiment may further include: a controller 4 and an ultraviolet light source 5. Among them, the controller 4 is capable of controlling the material storage container 1 to supply the high temperature resistant photocurable material to the inkjet print head 2, and the controller 4 is also capable of controlling the ultraviolet light source 5 to perform ultraviolet radiation and curing for the high temperature resistant photocurable material for 3D inkjet printing sprayed on the bearing platform 7 to form the photocuring layer 6; where the specific ultraviolet light source 5 may be an ultraviolet light emitting diode.

Embodiment 8

[0138] This embodiment provides a 3D printing product, which is obtained using the high temperature resistant photocurable material for 3D inkjet printing in each of the foregoing Embodiments 1-6 by 3D inkjet printing.

[0139] Specifically, 3D inkjet printing products in different colors and with high temperature resistance and good mechanical properties can be printed according to requirements, for example, applying the materials in the above Embodiments 1-6 to the Sailner J501 printer or the 3D printer provided by the above Embodiment 7 can respectively print 3D printing products that match colors of the high temperature resistant photocurable material for 3D inkjet printing, and the obtained 3D printing products have an outstanding high temperature resistance property and good mechanical properties.

[0140] Of course, the materials in the above embodiments can also be mixed in a certain proportion to obtain 3D printing products with good high temperature resistance and mechanical properties in other colors.

[0141] Finally, it should be noted that the above embodiments are merely intended for describing, rather than limiting, the technical solutions of the present application; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that they may still make modifications to the technical solutions described in the foregoing embodiments, or make equivalent substitutions to some or all of the technical features therein; and the modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions in the embodiments of the present application.