EEPROM MEMORY DEVICE AND CORRESPONDING METHOD

Abstract

The memory device of the electrically-erasable programmable read-only memory type comprises write circuitry designed to carry out a write operation in response to receiving a command for writing at least one selected byte in at least one selected memory word of the memory plane, the write operation comprising an erase cycle followed by a programming cycle, and configured for generating, during the erase cycle, an erase voltage in the memory cells of all the bytes of the at least one selected memory word, and an erase inhibit potential configured, with respect to the erase voltage, for preventing the erasing of the memory cells of the non-selected bytes of the at least one selected memory word, which are not the at least one selected byte.

Claims

1. An electrically-erasable programmable read-only memory device comprising: a matrix memory plane arranged in rows and columns of memory words, each memory word comprising several bytes of memory cells; and write circuitry configured to perform a write operation in response to receiving a command for writing at least one selected byte in at least one selected memory word of the matrix memory plane, wherein the write operation comprises an erase cycle followed by a programming cycle, and wherein the write circuitry is configured for generating, during the erase cycle: an erase voltage in memory cells of all bytes of the at least one selected memory word, wherein the erase voltage is configured to cause the memory cells of the at least one selected memory word to be erased, and an erase inhibit potential configured relative to the erase voltage for preventing erasing of memory cells of non-selected bytes of the at least one selected memory word.

2. The device according to claim 1, wherein the memory cells each comprise a floating gate state transistor capable of storing a data value, sources of the state transistors being coupled to a source line common to the memory cells of the same byte and distinct from the source lines of the other bytes of the same memory word, the device comprising a source line decoder configured for selectively transmitting the erase inhibit potential in the source lines of the non-selected bytes of the at least one selected memory word.

3. The device according to claim 2, wherein the state transistors comprise a control gate, the control gates of the state transistors being coupled to a control gate line common to the memory cells of the same memory word, and the write circuitry is configured for generating, during the erase cycle, the erase voltage on the control gate line(s) of the at least one selected memory word.

4. The device according to claim 3, wherein the write circuitry is configured for generating, during the erase cycle, a ground reference potential in the source line(s) of the at least one selected byte.

5. The device according to claim 1, further comprising read circuitry configured for reading, during the write operation and prior to the erase cycle, data contained in the memory cells of at least one non-selected byte of the at least one selected memory word, and the write circuitry is configured for generating, during the programming cycle, a programming voltage in previously programmed memory cells of the at least one non-selected byte of the at least one selected memory word.

6. The device according to claim 5, wherein each memory cell is coupled to a bit line, and the write circuitry is configured for generating, during the programming cycle, the programming voltage on the bit lines of the memory cells to be programmed.

7. The device according to claim 5, wherein the read circuitry is configured for reading previous data and measuring a quantification of programming of previously programmed memory cells in the at least one non-selected byte of the at least one selected memory word, and the write circuitry is configured for generating the programming voltage in the previously programmed memory cells of the at least one non-selected byte of the at least one selected memory word, in response to the quantification of the programming measured in these memory cells being less than a margin taken on a nominal value of the quantification of the programming.

8. The device according to claim 5, wherein the erase inhibit potential is configured so as to result, with respect to the erase voltage, in an erase alteration in the memory cells of the non-selected bytes of the at least one selected memory word, causing an incomplete erasing of these memory cells, in order to prevent complete erasing of the memory cells.

9. The device according to claim 1, wherein the erase inhibit potential is configured so as to result, with respect to the erase voltage, in a negligible erase alteration in the memory cells of the non-selected bytes of the at least one selected memory word, causing a negligible partial erasing of these memory cells, in order to prevent the erasing of the memory cells.

10. An integrated circuit comprising: an electrically-erasable programmable read-only memory device comprising: a matrix memory plane arranged in rows and columns of memory words, each memory word comprising several bytes of memory cells; and write circuitry configured to perform a write operation in response to receiving a command for writing at least one selected byte in at least one selected memory word of the matrix memory plane, wherein the write operation comprises an erase cycle followed by a programming cycle, and wherein the write circuitry is configured for generating, during the erase cycle: an erase voltage in memory cells of all bytes of the at least one selected memory word, wherein the erase voltage is configured to cause the memory cells of the at least one selected memory word to be erased, and an erase inhibit potential configured relative to the erase voltage for preventing erasing of memory cells of non-selected bytes of the at least one selected memory word.

10. integrated circuit according to claim 10, wherein the memory cells each comprise a floating gate state transistor capable of storing a data value, sources of the state transistors being coupled to a source line common to the memory cells of the same byte and distinct from the source lines of the other bytes of the same memory word, the device comprising a source line decoder configured for selectively transmitting the erase inhibit potential in the source lines of the non-selected bytes of the at least one selected memory word.

12. A method for writing in an electrically-erasable programmable read-only memory comprising a matrix memory plane arranged in rows and columns of memory words each comprising several bytes of memory cells, the method comprising: receiving a command for writing at least one selected byte in at least one selected memory word of the matrix memory plane; in response to receiving the command, performing a write operation comprising an erase cycle followed by a programming cycle, in which the erase cycle comprises, generating an erase voltage in memory cells of all bytes of the at least one selected memory word, the erase voltage being able to cause the memory cells to be erased and, generating an erase inhibit potential configured with respect to the erase voltage for preventing erasing of memory cells of non-selected bytes of the at least one selected memory word.

13. The method according to claim 12, the memory cells of the memory each comprising a floating gate state transistor capable of storing a data value, sources of the state transistors being coupled to a source line common to the memory cells of the same byte and distinct from the source lines of the other bytes of the same memory word, the method comprising a decoding of source lines for selectively transmitting the erase inhibit potential in the source lines of the non-selected bytes of the at least one selected memory word.

14. The method according to claim 13, the state transistors comprising a control gate, the control gates of the state transistors being coupled to a control gate line common to the memory cells of the same memory word, in which the erase cycle comprises generating the erase voltage on the control gate line(s) of the at least one selected memory word.

15. The method according to claim 13, in which the erase cycle comprises generating a ground reference potential in the source line(s) of at least the selected byte.

16. The method according to claim 12, in which the write operation comprises, prior to the erase cycle, a reading of data contained in at least one non-selected byte of the at least one selected memory word and, during the programming cycle, generating a programming voltage in previously programmed memory cells of the at least one non-selected byte of the at least one selected memory word.

17. The method according to claim 16, in which each memory cell is coupled to a bit line, and the programming cycle comprises generating the programming voltage on the bit lines of the memory cells to be programmed.

18. The method according to claim 16, in which the write operation comprises the reading and a measurement of a quantification of programming of previously programmed memory cells in the at least one non-selected byte of the at least one selected memory word, and generating the programming voltage in the previously programmed memory cells of the at least one non-selected byte of the at least one selected memory word, in response to the quantification of the programming measured in these memory cells being less than a margin taken on a nominal value of the quantification of the programming.

19. The method according to claim 16, in which the erase inhibit potential is configured so as to result, with respect to the erase voltage, in an erase alteration in the memory cells of the non-selected bytes of the at least one selected memory word, causing an incomplete erasing of these memory cells, in order to prevent complete erasing of the memory cells.

20. The method according to claim 12, in which the erase inhibit potential is configured so as to result, with respect to the erase voltage, in a negligible erase alteration in the memory cells of the non-selected bytes of the at least one selected memory word, causing a negligible partial erasing of these memory cells, in order to prevent the erasing of the memory cells.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Other advantages and features of the invention will become apparent upon examining the detailed description of non-limiting embodiments and their implementation and from the appended drawings, in which:

[0053] FIG. 1 illustrates an EEPROM including a memory plane;

[0054] FIG. 2 illustrates a memory cell of the memory plane of FIG. 1;

[0055] FIG. 3 illustrates a portion of the memory plane of FIG. 1;

[0056] FIG. 4 illustrates a portion of a memory plane of a compact memory device; and

[0057] FIG. 5 illustrates a portion of the memory plane of FIG. 1.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0058] FIGS. 1 to 5 will now be described, where common references in the figures denote the same elements, or elements of analogous functions in different embodiments. When a figure is described, reference could be made to an element not shown but described in relation with another figure showing it.

[0059] Generally speaking, in relation to FIGS. 1 to 5, an index “i” in the references indicates that the element referenced belongs to the column of index “i”, and an index “j” in the references indicates that the element referenced belongs to the row of index “j”. The indices may be incremented or decremented “i−1”, “j+1”, etc. and indicate that the element referenced belongs to the column or the row with the respectively incremented index.

[0060] FIG. 1 shows an electrically-erasable programmable non-volatile memory device EE of the EEPROM (Electrically Erasable Programmable Read Only Memory) type, which may be fabricated in an integrated circuit in the form of an integrated circuit chip.

[0061] The memory device EE comprises a matrix memory plane PM, comprising memory cells CEL (FIG. 2) each capable of storing a binary data value. The memory cells CEL are organized in memory words, arranged in rows RGj (FIGS. 3 to 5) and in columns COLi (FIGS. 3 to 5) in word regions MWEM of the memory plane PM.A memory word MWi,j (FIGS. 3 to 5) is at the single intersection between a column COLi and a row RGj of the memory plane PM. In summary, the access to a memory word MWi,j is carried out by matrix selection on the columns COLi and the row RGj to which it belongs.

[0062] Consequently, the physical granularity of the memory, in other words the smallest unit modified in a write operation, is defined by a memory word.

[0063] On the periphery of the memory plane PM, the memory device EE comprises writing means ME, reading means ML, a column decoder DECX and a row decoder DECY.

[0064] The reading means ML and the writing means ME comprise a logic part and an analogue part, the logic part of the reading and writing means may be incorporated into the same circuit, for example a logic block referred to as state machine (not shown).

[0065] The state machine is a unit for control and management of the device EE, and is configured for receiving a command COM coming from outside the memory device EE, referred to as user command. The user command COM may comprise a command for writing one byte as a minimum, and one complete page as a maximum. One byte is a group of eight memory cells, a page corresponds to one entire row of memory cells.

[0066] Thus, the “client” granularity of the memory, in other words the smallest unit modifiable in a write command is one byte.

[0067] However, in order to limit the space occupied by control gate switching circuits CGSW (see hereinafter), the memory words MWi,j of the memory plane PM comprise at least two bytes of memory cells.

[0068] Consequently, the physical granularity of the memory (one memory word) is greater than the client granularity (one byte) for a write operation.

[0069] The bytes to be written are referred to as selected bytes, and the memory words comprising the bytes to be written are referred to as selected memory words. Typically, a write command COM comprises the address of the first byte and the data to be written starting from this address of the memory plane PM.

[0070] The state machine is configured for decoding the addresses of the command into physical coordinates of the arrangement of the memory plane PM, and for respectively controlling the column decoder DECX and row decoder DECY.

[0071] The writing means ME are configured for carrying out a write operation in response to the receipt of the write command COM. The write operation comprises a collective erase cycle on all the memory cells of the selected memory word(s), followed by a selective programming cycle on each memory cell to be programmed depending on the data to be written.

[0072] The writing means ME are configured for generating erase and programming stimuli and for transmitting them to the memory cells of the memory plane PM via the column decoders DECX and the row decoders DECY.

[0073] FIG. 2 shows a memory cell CEL of the memory plane PM (Figure i). The memory cell CEL comprises a state transistor TE, of the NMOS type, having a floating gate and a control gate, and an access transistor TA, of the NMOS type, having a simple gate.

[0074] The state transistor TE and the access transistor TA are coupled in series, the drain of the state transistor TE being coupled to the source of the access transistor TA.

[0075] The drain of the access transistor TA is coupled to a bit line BL, whereas the source of the state transistor TE is coupled to a source line SL.

[0076] The gate of the access transistor TA is coupled to a word line WL, and the control gate of the state transistor TE is coupled to a control gate line CG.

[0077] In order to erase a memory cell CEL, a voltage high enough to inject charges by the Fowler-Nordheim effect into the floating gate of the state transistor TE is applied between the control gate CG and the drain of the state transistor TE. Such an erase voltage is typically of the order of 15V between the gate and the drain, positively on the gate, and the injected charges are of negative sign. An erase voltage, for example of 15V, is applied to the control gate CG of the state transistor TE, and the potential on the drain of the state transistor TE, for example ground, is transmitted from the source line SL via the channel region of the state transistor TE thus controlled to be conducting.

[0078] As will be seen hereinafter, notably in relation to FIG. 5, an erase inhibit potential, for example of 3V or 4V, is transmitted on the source line SL, and for an unchanged erase voltage of 15V on the control gate CG of the state transistor TE. Thus, the voltage resulting from this between the control gate and the drain of the state transistor TE is substantially 12V or, respectively, 11V. Gate—drain voltages of the order of 12V or 11V are insufficient to cause an injection of charges by effect Fowler-Nordheim, or at least for injecting charges with a quantity sufficient to result in a complete erasing of the memory cell CEL.

[0079] In other words, the erase inhibit potential, for example transmitted on the source line SL of a memory cell, is configured with respect to the erase voltage so as to prevent the erasing of the memory cell CEL.

[0080] In order to programme a memory cell CEL, a voltage sufficient for injecting charges by the Fowler-Nordheim effect into the floating gate of the state transistor TE is applied between the control gate CG and the drain of the state transistor TE. Such a programming voltage is typically of the order of −15V between the gate and the drain, negatively on the gate, and the injected charges are consequently of positive sign.

[0081] In a technique known as a shared voltage technique, a negative programming potential, for example of −7V, is applied to the control gate CG of the state transistor TE and a positive programming potential, for example of +8V, is applied to the drain of the state transistor TE from the bit line BL via the access transistor TA controlled to be conducting by a control voltage, for example of boy, transmitted on the word line WL.

[0082] In a technique that does not provide the generation of negative potentials, a ground potential is applied to the control gate CG and a positive programming potential, for example of +15V, is applied to the drain of the state transistor TE from the bit line BL via the access transistor TA controlled to be conducting by a control voltage, for example of 17V, transmitted on the word line WL.

[0083] FIG. 3 shows a portion 300 of the memory plane PM in FIG. 1, illustrating, in particular, a memory word MWi,j belonging to the row RGj and to the column COLi.

[0084] The memory word MWi,j+1 belonging to the row RGj+1 and to the column COLi, and one byte OCToi−1 of the memory words MWi−1,j and MWi−1,j+1 belonging to the column COLi−1 and, respectively, to the rows RGj, RGj+1 are also shown.

[0085] Each memory word MWi,j, comprises at least two bytes OCToi-OCT3i, for example 4 bytes, of eight memory cells CEL each.

[0086] In the following part, the phrase “coupling of a memory cell to an element” is understood to mean the coupling with the corresponding element such as shown hereinbefore in relation to FIG. 2.

[0087] Each memory cell is coupled to a dedicated and individual bit line BLoi, BL1i, . . . , BL7i, . . . , BL24i, BL25i, . . . , BL31i, for the column COLi (BLoi−1, BL1i−1, . . . , BL7i−1, . . . for the column COLi−1).

[0088] The bit lines BL are nevertheless coupled with the respective memory cells of each other row RGj+1.

[0089] The memory cells CEL of the same byte OCToi, . . . , OCT3i (and OCToi−1) are coupled to a common and dedicated source line SLoi, . . . , SL3i (and SLoi−1) for each byte.

[0090] In a noteworthy manner, the sources of the state transistors TE are thus coupled to a source line SLoi common to the memory cells of the same byte OCToi and distinct from the source lines of the other bytes OCT1i-OCT3i of the same memory word MWi,j.

[0091] The source lines SLoi, . . . , SL3i are nevertheless coupled with the respective bytes OCToi, . . . , OCT3i of the other rows RGj+1.

[0092] All the memory cells of the same row RGj, RGj+1 are coupled to a word line WLj, WLj+1, common and dedicated to each row.

[0093] The memory cells of the same memory word MWi,j MWi,j+1 MWi−1,j MWi−1,j+1 are coupled to a common control gate line CGi,j CGi,j+1 CGi−1,j CGi−1,j+1. Each control gate line CGi,j is exclusively dedicated to one memory word MWi,j of a column COLi and of a row RGj.

[0094] The access (decoding) to a control gate line CGi,j CGi,j+1 CGi−1,j CGi−1,j+1 in the memory plane PM is gained by means of a control gate switching circuit CGSWi,j CGSWi,j+1 CGSWi−1,j CGSWi−1,j+1 situated in a region CGSW of the memory plane PM close to the respective memory words MWi,j MWi,j+1 MWi−1,j MWi−1,j+1.

[0095] Each control gate switching circuit CGSWi,j comprises an inverter circuit comprising a PMOS transistor and an NMOS transistor, controlled by a control signal on their gates. Well biasing lines Bn, Bp allow the complementary wells containing the PMOS and NMOS transistors to be biased, in the region CGSW of the memory plane PM, in a manner adapted to the routed signals (Dpi, Dni, see hereinbelow).

[0096] The control signal is transmitted on a control line CLj, CLj+1, common and dedicated to each row RGj, RGj+1.

[0097] The drains of the complementary transistors of the inverters of the respective switching circuits CGSWi,j CGSWi−1,j are coupled to biasing lines Dpi, Dni, Dpi−1, Dni−1, common and dedicated for each of the columns COLi, COLi−1.

[0098] The sources of the complementary transistors of the inverters of the switching circuits CGSWi,j are coupled to the respective control gate lines CGi,j.

[0099] Thus, the control line CLj of the row RGj and the biasing lines Dpi, Dni of the column COLi allow a bias potential to be selectively transmitted on the control gate line CGi,j of the memory word MWi,j belonging to the column COLi and to the row RGj.

[0100] Such control gate switching circuits CGSWi,j occupy a non-negligible surface area, notably owing to the presence of wells with the complementary dopings, and, in order to limit the number of control gate switching circuits, several bytes OCToi-OCT3i have been grouped within each memory word MWi,j to the detriment of a physical granularity greater than 1 byte.

[0101] It will be noted that the bias potential on the control gate line CGi,j can be of positive or negative sign, by using a complementary circuit of the inverter type in the control gate switching circuits CGSWi,j.

[0102] This enables the shared-voltage writing techniques.

[0103] Reference is again made to FIG. 1.

[0104] The row decoders DECY comprise word-line locks WLL configured for distributing signals in the word-lines WLj of the memory plane PM; and control-line locks CLL configured for distributing signals in control lines CLj controlling the control gate switches CGSWi,j of each row RGj of the memory plane PM.

[0105] The column decoders DECX comprise bit-line locks BLL configured for distributing signals in the various bit lines BLoi-BL32i of the memory plane PM; source-line locks SLL configured for distributing signals in the various source lines SLoi-SL3i of the memory plane PM; and control gate signal locks CGL configured for distributing control gate line bias potentials Dpi, Dni to the control gate switches CGSWi,j of each column COLi of the memory plane PM.

[0106] The control gate switches CGSWi,j are situated in the memory plane PM, in mid-regions CGSW comprising complementary doping wells. The mid-regions are surrounded by word regions WMEM of the memory plane PM. The word regions WMEM comprise the memory cells grouped by memory words. In the example in FIG. 1, two mid-regions of control gate switches CGSW are provided, each being situated in the middle (in the direction of the rows) of one half of the total surface area of the word regions MWEM of the memory plane PM.

[0107] The regions of control gate switches CGSW, such as previously described in relation to FIGS. 1 to 3, occupy a non-negligible surface area but advantageously allow shared voltage writing operations.

[0108] The shared voltage technique allows the size of the memory cells to be reduced, which can compensate for the surface area occupied by the control gate switches CGSW for high-density memories.

[0109] FIG. 4 illustrates a portion 400 of memory plane of one example of a memory of the type of that described in the publication FR 3070537 A1, describing a compact device in which the surface area occupied by the control gate switching circuits CGSi,j is reduced.

[0110] The architecture of the portion 400 of the memory plane is identical to the architecture of the portion .sub.300 of the memory plane PM previously described in relation to FIGS. 1 to 3, except as regards the control gate switching circuits CGSi,j CGSi,j+1 CGSi−1,j CGSi−1,j+1.

[0111] Indeed, in this example, each control gate switching circuit comprises a single control gate selection transistor, each control gate selection transistor being accommodated within and on a semiconductor well PW1, PWo neighbouring the semiconductor well PWo, PW1 accommodating the memory word WDi,j to which it is assigned.

[0112] The wells PWo, PW1 in FIG. 4 may correspond to two word regions WMEM previously described in relation to FIG. 1.

[0113] Thus, in each of the two rows RGj, RGj+1, the control gate selection transistors CGSi,j CGSi,j+1, assigned to memory words MWi,j MWi,j+1, are accommodated in the well PWo neighbouring the well PW1, the well PWo accommodating the memory words MWi−1,j MWi−1,j+1.

[0114] Conversely, the control gate selection transistors CGSi−1,j CGSi−1,j+1, assigned to the memory words MWi−1,j MWi−1,j+1 are accommodated in the well PW1 neighbouring the well PWo, the well PW1 accommodating the memory words MWi,j MWi,j+1.

[0115] Each well PWo, PW1 can accommodate several memory words belonging to several columns (within the same row RGj), as for example illustrated hereinafter in relation to FIG. 5, or as notably described in relation to FIG. 4 of the publication FR 3070537 A1.

[0116] Furthermore, each memory word MWi,j comprises several bytes OCToi-OCT3i of memory cells, connected to individual bit lines BLoi-BL31i, word-lines WLj, and control gate lines CGi,j, such as previously described in relation to FIG. 3; the same elements consequently carry the same references.

[0117] The control gate selection transistors are controlled by a control line CLj, CLj+1 common to the whole row RGj, RGj+1, respectively, and for transmitting a signal transmitted on biasing control gate lines CGSLi, CGSLi−1, dedicated to each column COLi, COLi−1, to the control gate lines CGi,j CGi−1,j CGi,j+1CGi−1,j+1.

[0118] In contrast to the device described in the publication FR 3070537 A1, in this embodiment, the sources of the state transistors TE are coupled to a source line SLoi common to the memory cells of the same byte OCToi and distinct from the source lines of the other bytes OCT1i-OCT3i of the same memory word MWi,j.

[0119] The source decoders SLL such as described in relation to FIG. 1 are also provided, forming a memory device EE such as illustrated by FIG. 1, but more compact owing to the absence of the mid-regions CGSW in the memory plane PM and to simpler, and hence smaller, control gate signal locks CGL.

[0120] In summary, a memory device EE has been described in relation to FIGS. 1 to 4 comprising a matrix memory plane PM arranged in rows RGj and columns COLi of memory words MWi,j each comprising several bytes OCToi-OCT3i of memory cells CEL. Writing means ME are designed to carry out a write operation in response to receiving a write command COM for at least one selected byte OCToi-OCT1i in at least one selected memory word MWi,j of the memory plane PM, the write operation comprising an erase cycle followed by a programming cycle. The writing means ME are configured for generating, during the erase cycle, an erase voltage in the memory cells CEL of all the bytes OCToi-OCT3i of the at least one selected memory word MWi,j, the erase voltage being designed to cause the memory cells to be erased.

[0121] According to a general feature of the memory device EE, and as will be seen in more detail hereinafter in relation to Figure .sub.5, the writing means ME are configured for generating, furthermore, during the erase cycle, an erase inhibit potential in the memory cells of the non-selected bytes OCT2i-OCT3i of the at least one selected memory word MWi,j, which are not the at least one selected byte OCToi-OCT1i.

[0122] The erase inhibit potential is configured with respect to the erase voltage for preventing the erasing of the memory cells of the non-selected bytes OCT2i-OCT3i of the at least one selected memory word MWi,j.

[0123] The memory cells CEL each comprise a floating gate state transistor TE capable of storing a data value, the sources of the state transistors being coupled to a source line SLoi common to the memory cells of the same byte OCToi and distinct from the source lines of the other bytes OCT1i-OCT3i of the same memory word MWi,j.

[0124] The source line decoder SLL advantageously allows the erase inhibit potential to be selectively transmitted in the source lines SL2i-SL3i of the non-selected bytes OCT2i-OCT3i of the at least one selected memory word MWi,j.

[0125] FIG. 5 illustrates schematically a portion 500 of the memory plane PM in FIG. 1 comprising, in particular, the control gate switches CGSW dedicated to the memory words MWi,j-MWi+3,j situated in a word region MWEM, together with the corresponding memory words MWi,j-MWi+3,j, and along a single row RGj.

[0126] In this example, a word region WMEM contains four memory words MWi,j, MWi+1,j MWi+2,j MWi+3,j in four respective columns COLi, COLi+1 COLi+2 COLi+3.

[0127] The number of memory words per word region WMEM (here 4) is essentially limited by the interconnections needed to route the control gate lines CGLi,j to the respective memory words MWi,j. The more levels of interconnections in the integrated circuit there are, and/or the more the pitch of the interconnections is reduced (the pitch of the interconnections corresponds to the width of a metal track and the distance between two adjacent tracks), the larger the number of memory words per word region WMEM could be.

[0128] It is recalled that each memory word MWi,j-MWi+3,j comprises four bytes OCToi-OCT3i-OCToi+3-OCT3i+3, and one control gate switching circuit CGSWi,j CGSWi+1,j CGSWi+2,j CGSWi+3,j is dedicated to each memory word and is configured for transmitting voltages on the respective control gate lines CGi,j CGi+1,j CGi+2,j CGi+3,j.

[0129] It is also recalled that a source line SLoi is provided that is common to the memory cells of the same byte OCToi and distinct from the source lines SL1i SL2i SL3i of the other bytes OCT1i OCT2i OCT3i of the same memory word MWi,j.

[0130] It will be noted that, on the drawing in FIG. 5, the points at the intersections between a source line, for example SLoi, and a control gate line, for example CGi,j, do not show a coupling between these two lines, but show a coupling of each of these two lines with the memory cells of the corresponding byte, in this example OCToi, in the manner previously described in relation to FIGS. 2 to 4.

[0131] One embodiment of a method for writing in a memory device EE such as previously described in relation to FIGS. 1 to 4, will now be described in relation to FIG. 5.

[0132] The writing means ME (FIG. 1) are configured for carrying out a write operation comprising an erase cycle followed by a programming cycle, in response to receiving a write command COM.

[0133] The user command COM may comprise a write command for at least one selected byte in at least one selected memory word, up to an entire page at the most.

[0134] The selected bytes will be written with new data transmitted in the command COM.

[0135] The addresses of the selected bytes are typically consecutive in the same row, from the first to the last selected byte. It is preferable for the bytes of consecutive addresses to be physically arranged consecutively in the memory plane, without this however being necessary.

[0136] According to a first example, in the write command, the selected bytes are the first two bytes OCToi and OCT1i of the memory word MWi,j. The selected memory word is MWi,j.

[0137] In the selected memory word MWi,j, the non-selected bytes OCT2i OCT3i are the bytes which are not the selected bytes OCToi OCT1i.

[0138] The erase cycle comprises the generation of an erase voltage, for example of 15V, on the control gate line CGi,j of the selected memory word MWi,j, and hence in all the bytes OCToi-OCT3i of the selected memory word MWi,j, via the control gate switching circuit CGSWi.

[0139] At the same time, a ground reference potential is generated in the source lines SLoi SL1i of the selected bytes OCToi OCT1i; and an erase inhibit potential, for example of 3V, is generated in the source lines SL2i SL3i of the non-selected bytes OCT2i OCT3i.

[0140] With reference to the example of programming cycle previously described in relation to FIG. 2, such an erase voltage is able to erase the memory cells, whereas such an erase inhibit potential allows the complete erasing of the memory cells of the non-selected bytes OCT2i OCT3i of the selected memory word MWi,j to be prevented.

[0141] For example, the source line locks SLL allow the decoding selectively transmitting the erase inhibit potential and the ground voltage in the respective source lines, depending on the command re-transcribed by the state machine and the writing means ME (FIG. 1).

[0142] In this first example, the erase inhibit potential of 3V is configured so as to result, with respect to the erase voltage of 15V, in an erase alteration in the memory cells of the non-selected bytes OCT2i OCT3i.

[0143] The erase alteration does not result in a complete erasing of the memory cells, but causes an incomplete erasing of these memory cells, which do not completely lose their programmed state (if this was the case).

[0144] Indeed, under these conditions, the previously programmed cells had a threshold voltage typically of −1.5V prior to the erase alteration and have a threshold voltage typically of −0.5V after the erase alteration, whereas a complete erasing results in a threshold voltage typically at +2.5V.

[0145] After the erase cycle, the programming cycle comprises the generation of a programming voltage on the bit lines BLoi-BL31i selectively for the memory cells to be programmed, and on the control gate line CGi,j according to one of the ways previously described in relation to FIG. 2.

[0146] The memory cells to be programmed are conventionally the memory cells intended to store a “1”.

[0147] On the one hand, the memory cells of the selected bytes OCToi OCT1i are thus selectively programmed according to the data of the write command.

[0148] On the other hand, the previously programmed memory cells of the non-selected bytes OCT2i OCT3i of the selected memory word MWi,j are programmed once again.

[0149] For this purpose, the device EE comprises conventional reading means ML, configured for reading, prior to the erase cycle, the data contained in the non-selected bytes OCT2i OCT3i.

[0150] Thus, all the cells programmed with a “1” end up with a threshold voltage typically of −1.5V.

[0151] The aging of these cells is determined by the two shifts in the threshold voltage of +1V and −1V during the erase-programming cycles. By virtue of the inhibiting of the erase, this shift is 4 times lower than a situation in which the erase is complete (i.e. from −1.5V to +2.5V then from +2.5V to −1.5V consisting of shifts of +4V and −4V).

[0152] According to a second example, in the write command, the selected bytes are all the consecutive bytes from OCT3i+1 to OCToi+3 (in other words the bytes OCT3i+1, OCToi+2, OCT1i+2, OCT2i+2, OCT3i+2, OCToi+3). The selected memory words are therefore MWi+1,j MWi+2,j and MWi+3,j.

[0153] In the selected memory words MWi+1,j MWi+2,j MWi+3,j, the non-selected bytes are the bytes OCToi+1 OCT1i+1 OCT2i+1 and OCT1i+3 OCT2i+3 OCT3i+3.

[0154] In an analogous manner, the erase cycle comprises the generation of the erase voltage of 15V on the control gate line CGi+1,j CGi+2,j CGi+3,j of the selected memory words MWi+1,j MWi+2,j MWi+3,j, via the control gate switching circuits CGSWi+1 CGSWi+2 CGSWi+3.

[0155] At the same time, the ground reference potential is generated in the source lines SL3i+1, SLoi+2, SL1i+2, SL2i+2, SL3i+2, SLoi+3 of the selected bytes OCT3i+1-OCToi+3; and an erase inhibit potential, for example this time of 4V, is generated in the source lines SLoi+1, SL1i+1, SL2i+1 and SL1i+3, SL2i+3, SL3i+3 of the non-selected bytes OCToi+1, OCT1i+1, OCT2i+1, and OCT1i+3, OCT2i+3, OCT3i+3.

[0156] In this second example, the erase inhibit potential of 4V is configured so as to result, with respect to the erase voltage of 15V, in a negligible erase alteration in the memory cells of the non-selected bytes.

[0157] The negligible erase alteration causes a negligible partial erasing of these memory cells, preventing the erasing of the memory cells which thus keep their programmed state (if this were the case).

[0158] Indeed, under these conditions, the previously programmed cells had a threshold voltage typically of −1.5V prior to the erase alteration and have an unchanged threshold voltage after the erase alteration, whereas a complete erasing results in a threshold voltage at typically +2.5V.

[0159] After the erase cycle, a programming cycle such as described in relation to FIG. 2 may be implemented.

[0160] In a first alternative, the programming is implemented only in the selected bytes, given that the memory cells of the non-selected bytes have not been modified.

[0161] According to a second alternative, a programming such as described in relation with the first example is implemented, on the one hand in the selected bytes with the new data to be written, on the other hand in the non-selected bytes with the old data that they contained.

[0162] Indeed, negligible erase alteration effects in very large number could lead to an erased state of the memory cells, and this alternative prevents such a situation from occurring.

[0163] In this case, all the cells previously programmed with a “1” end up with a threshold voltage typically of −2V.

[0164] The shift of the threshold voltage is, on the one hand, of low amplitude (0.5V) and, on the other hand, varies monotonically (programming on a memory cell in the programmed state).

[0165] Accordingly, the aging of these cells is zero.

[0166] If the operation is repeated, the cells may be programmed once again with a threshold voltage typically of −2.5V, etc.

[0167] Subsequently, the inhibit potential of 4V no longer completely inhibits the erase operation, an alteration effect similar to that of the first example takes place during the erase phase, and an equilibrium is reached at −2.5V for the programmed threshold voltages.

[0168] According to a third alternative, the generation of the programming voltage in the previously programmed memory cells of the non-selected bytes of the selected memory words is conditioned by a measurement of the quantification of the programming of the memory cells, with respect to a margin taken on a nominal value of the quantification of the programming.

[0169] For example, the nominal value is the value of the threshold voltage of a memory cell programmed normally at −1.5V, and the margin is for example 1V, the condition then being fulfilled for any measurement of the threshold voltage greater than −0.5V in the programmed state.

[0170] The write operation comprises, in this regard, a measurement of the quantification of the programming, typically a measurement of the threshold voltage of the previously programmed memory cells in the non-selected bytes.

[0171] Such a measurement of the quantification corresponds, for example, to a read in ‘margin mode’, typically provided in the reading means ML of EEPROM memories.

[0172] This third alternative allows the number of re-writing operations to be limited and exhibits a zero aging of the non-selected cells, and without any risk of corruption of the data.

[0173] The first, second and third alternatives each have advantages and drawbacks. The second alternative is notably better for the reduction of the aging, and with no danger of corruption of the data. Indeed, errors during write operations (power cuts, etc.) will not lead to the corruption of the data of the inhibited bytes. However, the second alternative may lead to an over-programming of memory cells, rendering them more susceptible to degradations by hot carriers. This is not the case of the first alternative. The third alternative is not subject to any of the faults of the other two, at the cost of an additional measurement of the quantification of the programming (read in margin mode).

[0174] For all the embodiments, examples and alternatives presented hereinbefore, it will be noted that, since the inhibit voltage is transferred to sources of bytes belonging to the same column but to different rows, inhibit voltages that are too high may generate interference in the bytes of the neighbouring rows. In order to maintain a good level of safety, the difference in voltage between the sources of the non-selected rows and the control gate voltages of the non-selected rows does not exceed 4V. Since the control gate voltages in the non-selected rows are typically at 3V, erase inhibit potentials up to 7V may be provided.

[0175] The embodiments described hereinbefore may be applied to any given number of bytes per memory word greater than 2, right up to a full-page operation, in which the size of the word is an entire page, in other words all the memory cells of a row.

[0176] The embodiments described hereinbefore form an optimum compromise in terms of minimizing the surface areas occupied and the reliability of the EEPROM memory devices, in particular the reliability in terms of life expectancy and of retention of the data.

[0177] While this invention has been described with reference to illustrative embodiments, this description is not intended to be construed in a limiting sense. Various modifications and combinations of the illustrative embodiments, as well as other embodiments of the invention, will be apparent to persons skilled in the art upon reference to the description. It is therefore intended that the appended claims encompass any such modifications or embodiments.