Silicon Carbide Module Integrated with Heat Sink and the Method Thereof

Abstract

A silicon carbide module integrated with a heat sink includes a heat sink and a silicon carbide module, which is fixedly connected with the heat sink. The solder paste is arranged between the heat sink and the silicon carbide module, and the heat sink and the silicon carbide module are hot pressed through a welding process to weld the silicon carbide module and the heat sink together.

Claims

1. A device of a silicon carbide module integrated with a heat sink, comprising: a heat sink; a silicon carbide module configured to said heat sink; and solder paste arranged between said heat sink and said silicon carbide module such that said heat sink is attached on said silicon carbide module.

2. The device of claim 1, wherein said heat sink and said silicon carbide module are hot pressed through a welding process to weld said silicon carbide module and said heat sink together.

3. The device of claim 2, wherein an operation temperature of said welding process is a range of 130° C. to 140° C.

4. The device of claim 1, wherein said heat sink has a base plate and a plurality of heat conducting fins arranged on said base plate.

5. The device of claim 4, wherein said base plate is made of copper or copper alloy.

6. The device of claim 4, wherein said plurality of heat conducting fins are made of aluminum or aluminum alloy.

7. The device of claim 1, wherein said heat sink has a base plate, a plurality of heat conducting fins and at least one heat pipe connected said base plate and said plurality of heat conducting fins.

8. The device of claim 1, wherein said heat sink is integrally formed, including a base plate, a cover plate and a plurality of heat conducting fins configured between said base plate and said cover plate.

9. The device of claim 8, wherein said plurality of heat conducting fins are needle shaped, column shaped or sheet-like heat conducting fins.

10. The device of claim 1, wherein said solder paste includes solder powder and flux.

11. A method of combining a silicon carbide module with a heat sink, comprising: providing a silicon carbide module; arranging solder paste on said silicon carbide module; placing a heat sink on said silicon carbide module such that a surface of said heat sink contacts with said solder paste, wherein said solder paste is configured between said silicon carbide module and said heat sink; and hot pressing said heat sink and said silicon carbide module to solidify said solder paste such that said silicon carbide module is attached with said heat sink together.

12. The method of claim 11, said heat sink and said silicon carbide module are hot pressed through a welding process to weld said silicon carbide module and said heat sink together.

13. The method of claim 11, wherein an operation temperature of said hot pressing is a range of 130° C. to 140° C.

14. The method of claim 11, wherein said heat sink has a base plate and a plurality of heat conducting fins arranged on said base plate.

15. The method of claim 14, wherein said base plate is made of copper or copper alloy.

16. The method of claim 14, wherein said plurality of heat conducting fins are made of aluminum or aluminum alloy.

17. The method of claim 11, wherein said heat sink has a base plate, a plurality of heat conducting fins and at least one heat pipe connected said base plate and said plurality of heat conducting fins.

18. The method of claim 11, wherein said heat sink is integrally formed, including a base plate, a cover plate and a plurality of heat conducting fins configured between said base plate and said cover plate.

19. The method of claim 18, wherein said plurality of heat conducting fins are needle shaped, column shaped or sheet-like heat conducting fins.

20. The method of claim 11, wherein said solder paste includes solder powder and flux.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention can be understood by utilizing several preferred embodiments in the specification, the detailed description and the following drawings. The same element symbols in the drawings refer to the same elements in the present invention. However, it should be understood that all preferred embodiments of the present invention are only used for illustrative purposes, and not intended to limit the scope of the application.

[0014] FIG. 1 shows an architecture of a heat sink and a silicon carbide module of the present invention.

[0015] FIG. 2 shows a combined structure of the silicon carbide module combined with the heat sink of the present invention.

[0016] FIG. 3 shows a combined structure of the silicon carbide module combined with the heat sink of another embodiment of the present invention.

DETAILED DESCRIPTION

[0017] In order to give examiner more understanding of the features of the present invention and advantage effects which the features can be achieve, some preferred embodiments of the present invention will now be described in greater detail. However, it should be recognized that the preferred embodiments of the present invention are provided for illustration rather than limiting the present invention. In addition, the present invention can be practiced in a wide range of other embodiments besides those explicitly described, and the scope of the present invention is not expressly limited except as specified in the accompanying claims.

[0018] The present invention proposes a structure of a silicon carbide module integrated with a heat sink by solder paste to address the issue of poor heat transfer effect of heat dissipation cream or thermal silicon film as a material of heat transfer. The solder paste is used as heat conduction material and the heat sink is integrated on the silicon carbide module to improve the heat dissipation effect of the whole silicon carbide module.

[0019] The means of the invention: when the temperature of the silicon carbide module is too high, the load must be lowered to avoid the burning of the electronic components; however, the heat transfer effect of the heat dissipation cream or thermal silicon film is not good due to low coefficient of thermal conductivity (K=2.5) of the heat dissipation cream; therefore, the invention applies solder paste which can be melted at low temperature (130° C.˜140° C.) between the silicon carbide (SiC) module and the heat sink by using a low-temperature welding technology, and then heats to melt the solder paste, so that the silicon carbide (SiC) module and the heat sink are welded together.

[0020] The effect of the invention: the high temperature generated by the silicon carbide module when it is electrified can be transmitted to the heat sink through the metal solder/solder paste with high coefficient of thermal conductivity heat conductivity (K>40), so that the heat sink can have a better heat dissipation effect, and thereby reducing the temperature of the silicon carbide module.

[0021] The silicon carbide module of the invention includes silicon carbide (SiC) electronic components, such as SiC power component, power control unit (PCU), inverter, vehicle charger, etc. The silicon carbide module comprises a silicon carbide (SiC) substrate, a silicon carbide (SiC) component or a combination thereof. The electronic components made of silicon carbide (SiC) have three advantages: reducing the energy loss in the process of power conversion, easily achieving miniaturization, and more resistant to high temperature and high pressure. Most 5G communication products have the characteristics of high power, high pressure and high temperature, so most of them use silicon carbide (SiC) components. The silicon carbide module integrates a plurality of silicon carbide (SiC) components thereon. For example, the silicon carbide module is a silicon carbide (SiC) power module, silicon carbide (SiC) semiconductor module, silicon carbide (SiC) discrete semiconductor module, etc.

[0022] Please refer to FIG. 1, it shows the architecture of the heat sink and the silicon carbide module of the present invention. In this embodiment, the silicon carbide module structure with high thermal conductivity includes a silicon carbide module 100, solder paste 102 and a heat sink 110. In this embodiment, the silicon carbide module 100 is a silicon carbide (SiC) substrate.

[0023] The heat sink 110 may be thermally conductive and may have a first outer surface 112 and a second outer surface 114 substantially parallel to the first outer surface 112. The second outer surface 114 of the heat sink 110 may be a weldable portion which may be welded on the back side of the silicon carbide module 100. The material of the heat sink 110 is selected from a material with thermal conductivity and weldability, such as metal. The heat sink 110 is made of a heat conducting material. The structure of the heat sink 110 is designed to be facilitated for welding on the silicon carbide module 100 and for heat dissipation of the electronic components on the silicon carbide module 100.

[0024] In one embodiment, the heat sink 110 has a base plate (substrate) made of copper or copper alloy and a plurality of rod-shaped fins made of aluminum or aluminum alloy arranged on the base plate.

[0025] In one embodiment, the heat sink 110 is integrally formed, including a base plate, a cover plate and a plurality of needle shaped, column shaped, sheet-like or other shaped heat conducting fins fixed between the base plate and the cover plate, which extend from the base plate. The base plate or the fins are made of materials with good thermal conductivity, such as copper, aluminum and other metals.

[0026] In another embodiment, the heat sink 110 includes a base plate and a plurality of heat conducting fins, which are manufactured separately from the base plate to increase the heat conducting area of the fins, and then the fins and the base plate are welded to combine together to complete the manufacture of the heat sink.

[0027] The invention adopts a material of the solder paste 102 which can be melted at a low temperature. For example, the solder paste 102 can be melted at a temperature of 130° C.˜140° C. In one embodiment, the material of the solder paste 102 includes solder powder and flux. In one example, the low-temperature solder paste 102 includes a solder powder of Sn—Bi alloy or Sn—Bi—Ag alloy, wherein Sn—Bi alloy has Sn (42%), Bi (58%) and a melting point of 138° C. The content of Bi in low temperature solder paste 102 is between 0% and 58%. As the content of Bi is within this range, the characteristics of thermal cycling can be improved. The solder powder of the invention is preferably 35-95% of the total mass of the low temperature solder paste 102.

[0028] A solvent contained in the flux can mix all the constituent materials of the solder paste 102 together to form a paste form. In addition, the flux can also facilitate to remove oxides and impurities on the metal surface, and can form a film on the metal surface to isolate the air, so that the solder paste is not easy to oxidize. The content of flux is preferably 5-60% of the total mass of the low temperature solder paste 102.

[0029] In one embodiment, the low temperature solder paste 102 includes a flux composition. The flux composition can be any of organic acid, amine, amine halide, organic halogen compound, thixotropic agent, rosin, solvent, interfacial agent, base agent, polymer compound, silane coupling agent, colorant, or the combination of more than two. Organic acid includes but not limited to: succinic acid, glutaric acid, adipic acid, heptanoic acid, succinic acid, azelaic acid, sebacic acid, dimeric acid, propionic acid, 2,2-dihydroxymethylpropionic acid, tartaric acid, malic acid, glycolic acid, diethanolic acid, thioglycolic acid, dithioglycolic acid, stearic acid, 12-hydroxystearic acid, palmitic acid, oleic acid, etc. Amine halide is a compound by the reaction of amine and hydrogen halide, in which amine is ethylamine, ethylenediamine, triethylamine, methylimidazole, 2-ethyl-4-methylimidazole, etc., while hydrogen halide is hydride of chlorine, bromine, iodine, etc. Organic halogen compound includes but not limited to: 1-bromo-2-butanol, 1-bromo-2-propanol, 3-bromo-1-propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2,3-dibromo-1,4-butanediol, 2,3-dibromo-2-butene-1,4-diol, etc. Thixotropic agent includes such as wax thixotropic agent or amide thixotropic agent. Rosin is for example rubber rosin, wood rosin or tall oil rosin, and the derivatives obtained from the raw material rosin. The solvent is water, alcohol, glycol ether, terpene alcohol, etc. Interfacial agent is such as polyoxyalkylacetylene alcohols, polyoxyalkylglycerides, polyoxyalkylalkylethers, polyoxyalkylesters, polyoxyalkylamines, polyoxyalkylamides, etc.

[0030] In another embodiment, the flux includes the following four compositions: (1) resin rosin: including natural resin (rosin) or synthetic rosin, usually lead solder paste having natural resin, while lead-free solder paste having synthetic rosin, rosin can form a protective layer on the surface of the weld metal to isolate air to prevent oxidation; (2) activator: including organic acid and halogen having the ability to clean the metal surface, dissolve the oxides on the metal surface, to improve the welding effect; (3) solvent: including ethanol, water which can facilitate to dissolve and mix different chemicals in the flux, make the coating of the flux more uniform, improve the effect of the flux, and control the viscosity and fluidity of the solder paste, and the solvent will be evaporated during the preheating process of the solder paste, which will not affect the solderability of the whole solder paste; (4) rheology modifier: it provides thixotropy to control the viscosity of the solder paste, enhance the anti-collapse property of the solder paste, so that the solder paste printed on the silicon carbide (SiC) module can still maintain its original shape without affecting the thermal conductivity due to collapse.

[0031] In one embodiment, the solder paste 102 is first configured in paste form on the silicon carbide (SiC) module 100. For example, through a solder paste printer, the solder paste 102 is printed (added) on the silicon carbide (SiC) module 100. Then, the heat sink 110 is placed on the silicon carbide (SiC) module 100, and the second outer surface 114 of the heat sink 110 is directly contacted with the solder paste 102 so that the solder paste 102 is configured (arranged) between the silicon carbide (SiC) module 100 and the heat sink 110. The paste like solder paste 102 can be used to adhere to the surface (non-electronic components surface) of the silicon carbide (SiC) module 100 and the second outer surface 114 of the heat sink 110 placed on the silicon carbide (SiC) module 100, so that the heat sink 110 and the silicon carbide (SiC) module 100 are not in moving even under some slight vibration. The coating amount, position and area of the solder paste 102 can be determined according to the situation, so as to achieve the best viscosity and heat conduction effect of the solder paste 102.

[0032] Then, a heating welding device is used to perform a low-temperature welding process, for example, the operating temperature is 130° C.˜140° C., to heat the solder paste 102 applied and configured between the silicon carbide (SiC) module 100 and the heat sink 110; during the heating and welding process, the silicon carbide (SiC) module 100 and the heat sink 110 are hot pressed to make the solder paste 102 completely solidified and connect the silicon carbide (SiC) module 100 and the heat sink 110, so as to the heat sink is integrated on the silicon carbide (SiC) module 200, as shown in FIG. 2. The solder paste 102 can be melted at 130° C.˜140° C., so the melted solder paste 102 can be welded between the silicon carbide (SiC) module 100 and the heat sink 110; and the melted solder paste 102 can be evenly distributed between the silicon carbide (SiC) module 100 and the heat sink 110 to achieve the purpose of uniform heat conduction and dissipation.

[0033] In another embodiment, as shown in FIG. 3, the heat sink 302 is integrated on the package structure of the silicon carbide module 300. In one embodiment, the heat sink 302 includes a substrate 304, heat conducting fins 306 and heat pipe 308. For example, one end of the heat pipe 308 is connected with the heat conducting fins 306 so that the heat absorbed by the heat pipe 308 can be transferred to the heat conducting fins 306 for heat dissipation. The heat pipe 308 is made of a material with high thermal conductivity, such as copper or aluminum. The heat pipe 308 can be filled with a working liquid, for example water, alcohol or other liquid with low boiling point, so that the working liquid can absorb heat from the liquid and evaporate into a gaseous phase. The inner wall of the heat pipe 308 can be a wire mesh, a micro groove and other capillary structures to facilitate the working liquid for circulating. The number of the heat conducting fins 306 and the heat pipes 308 can be determined according to different situations or structures. In this embodiment, the substrate 304 is a copper base plate, and the heat conducting fins 306 are heat dissipating aluminum fins. The heat dissipating aluminum fins 306 are internally inserted with two heat pipes 308 connected to the copper base plate 304. The package structure of silicon carbide module 300 includes electronic components made of silicon carbide (SiC) substrate material, such as silicon carbide (SiC) power components, power control unit (PCU), inverter, vehicle charger, etc. The silicon carbide electronic components are encapsulated on the upper surface of the silicon carbide module 300, and then the solder paste between the silicon carbide (SiC) module 300 and the heat sink 302 is heated and coated by the low-temperature welding technology, and the heat sink 302 is welded on the back side of the encapsulated silicon carbide module 300 to complete the silicon carbide module packaging structure with high heat dissipation.

[0034] In the description above, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. In other instances, well-known structures and devices are shown in block diagram form. There may be intermediate structure between illustrated components. The components described or illustrated herein may have additional inputs or outputs that are not illustrated or described. The illustrated elements or components may also be arranged in different arrangements or orders, including the reordering of any fields or the modification of field sizes.