ENGINEERED SUBSTRATE WITH EMBEDDED MIRROR

Abstract

An engineered substrate comprising: a seed layer made of a first semiconductor material for growth of a solar cell; a first bonding layer on the seed layer; a support substrate made of a second semiconductor material; a second bonding layer on a first side of the support substrate; a bonding interface between the first and second bonding layers; the first and second bonding layers each made of metallic material; wherein doping concentration and thickness of the engineered substrate, in particular, of the seed layer, the support substrate, and both the first and second bonding layers, are selected such that the absorption of the seed layer is less than 20%, preferably less than 10%, as well as total area-normalized series resistance of the engineered substrate is less than 10 mOhm.Math.cm.sup.2, preferably less than 5 mOhm.Math.cm.sup.2.

Claims

1. An engineered substrate, the engineered substrate comprising: a seed layer made of a first semiconductor material for growth of a solar cell; a first bonding layer on the seed layer; a support substrate made of a second semiconductor material; a second bonding layer on a first side of the support substrate; and a bonding interface between the first and second bonding layers; where each of the first and second bonding layers are made of metallic material; and wherein doping concentrations of the first and second semiconductor materials and thicknesses of the seed layer, the support substrate, and both the first and second bonding layers, are selected such that the absorption of the seed layer is less than 20%, as well as a total area-normalized series resistance of the engineered substrate is less than 10 mOhm.Math.cm.sup.2.

2. The engineered substrate of claim 1, wherein the doping concentration of the seed layer is less than 5×10.sup.17 at/cm.sup.3.

3. The engineered substrate of claim 2, wherein the thickness of the seed layer is in a range extending from 150 nm to 1 μm.

4. The engineered substrate of claim 3, wherein the thickness of the support substrate is in a range extending from 100 μm to 500 μm and the doping concentration of the support substrate is in a range extending from 10.sup.14 to 5×10.sup.17 at/cm.sup.3.

5. The engineered substrate of claim 1, wherein the metallic material of the first and second bonding layers is one of W or Ti together with TiN.

6. The engineered substrate of claim 1, wherein the first semiconductor material has a lattice constant in a range extending from 5.8 Å to 6 Å.

7. The engineered substrate of claim 1, wherein the first semiconductor material is InP or a ternary or quaternary or penternary III-V material, and wherein the second semiconductor material is GaAs or Ge.

8. The engineered substrate of claim 1, further comprising a metal contact on a second side of the support substrate opposite to the first side.

9. A light detection or conversion device, comprising an engineered substrate according to claim 1.

10. A method of manufacturing an engineered substrate comprising: providing a first substrate; providing a seed layer on a first side of the first substrate; forming a first bonding layer of metallic material on the seed layer; providing a support substrate; forming a second bonding layer of metallic material on the support substrate; directly bonding the first and second bonding layers; and then: removing the first substrate; wherein doping concentrations of the first and second semiconductor materials and thicknesses of the seed layer, the support substrate, and both the first and second bonding layers, are selected such that absorption of the seed layer is less than 20%, as well as a total area-normalized series resistance of the engineered substrate is less than 10 mOhm.Math.cm.sup.2.

11. The method of claim 10, wherein providing the seed layer is obtained by epitaxial growth.

12. The method of claim 10, further comprising: an ion implantation step for forming a weakened layer in a part of the first substrate or the seed layer before directly bonding the first and second bonding layers, and a detaching step to separate the remaining part of the first substrate or the seed layer provided on the first substrate after directly bonding the first and second bonding layers.

13. The method of claim 10, further comprising a step of providing a metal contact on a second side of the support substrate opposite to the first side.

14. The engineered substrate of claim 1, wherein the doping concentrations of the first and second semiconductor materials and the thicknesses of the seed layer, the support substrate, and both the first and second bonding layers, are selected such that the absorption of the seed layer is less than 10%.

15. The engineered substrate of claim 14, wherein the doping concentrations of the first and second semiconductor materials and the thicknesses of the seed layer, the support substrate, and both the first and second bonding layers, are selected such that the total area-normalized series resistance of the engineered substrate is less than 5 mOhm.Math.cm.sup.2.

16. The engineered substrate of claim 1, wherein the doping concentrations of the first and second semiconductor materials and the thicknesses of the seed layer, the support substrate, and both the first and second bonding layers, are selected such that the total area-normalized series resistance of the engineered substrate is less than 5 mOhm.Math.cm.sup.2.

17. The engineered substrate of claim 1, wherein the thickness of the seed layer is in a range extending from 150 nm to 1 μm.

18. The engineered substrate of claim 1, wherein the thickness of the support substrate is in a range extending from 100 μm to 500 μm and the doping concentration of the support substrate is in a range extending from 10.sup.14 to 5×10′.sup.7 at/cm.sup.3.

19. The method of claim 10, wherein doping concentrations of the first and second semiconductor materials and thicknesses of the seed layer, the support substrate, and both the first and second bonding layers, are selected such that the absorption of the seed layer is less than 10%.

20. The method of claim 10, wherein doping concentrations of the first and second semiconductor materials and thicknesses of the seed layer, the support substrate, and both the first and second bonding layers, are selected such that the total area-normalized series resistance of the engineered substrate is less than 5 mOhm.Math.cm.sup.2.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG. 1: Schematic drawing of one embodiment.

[0030] FIG. 2: A modification of the embodiment shown in FIG. 1.

DETAILED DESCRIPTION

[0031] In FIG. 1, a first embodiment is depicted of a method of manufacturing an engineered substrate according to the present disclosure.

[0032] In a first step, in the leftmost part of FIG. 1, it is indicated that a support substrate 5 is provided. Furthermore, a first substrate 1 is provided. The first substrate 1 serves as an auxiliary substrate that, however, may be removed or sacrificed before the final engineered substrate is ready.

[0033] In a next step, as indicated by the arrow A, a seed layer 3 is formed on the first substrate 1. The seed layer 3 may be of a first semiconductor material. The first semiconductor material may be, e.g., InP or it may be a ternary or quaternary or penternary III-V material, for example, InGaAs or InGaAsP.

[0034] Furthermore, a first bonding layer 4A is formed on the seed layer 3. The first bonding layer 4A is a metallic layer; the material may be one of W or Ti together with TiN.

[0035] In principle, as indicated in FIG. 1, the first substrate 1, seed layer 3 and first bonding layer 4A may also be viewed as one structure 10A.

[0036] Furthermore, a second bonding layer 4B is formed on the support substrate 5. The second bonding layer 4B is also a metallic layer; the material may be one of W or Ti together with TiN. The second bonding layer 4B is grown, e.g., deposited by chemical vapor deposition (CVD), on a first side of the support substrate 5. The support substrate 5 and the second bonding layer 4B are made of a second semiconductor material. Typically, the second semiconductor material is GaAs or Ge. In principle, the support substrate 5 and the second bonding layer 4B together may be viewed as one structure 10B. The one structure 10B corresponds to a support substrate comprising the second bonding layer 4B being formed in the uppermost/top part of the support substrate 5.

[0037] No correlation in time between forming the two parts or structures 10A and 10B, respectively, i.e., the part comprising the seed layer formed on the first substrate and the part comprising the second bonding layer 4B being provided on the support substrate 5, is required, other that both are available at the beginning of the next step, which is indicated by an arrow B.

[0038] As illustrated in FIG. 1, in a next step indicated by B, the two structures are bonded together. That is, the structure 10A comprising the first substrate 1 with the seed layer 3 and the second bonding layer 4A is bonded together with the second structure 10B comprising the support substrate 5 and the second bonding layer 4B. In FIG. 1, this is depicted as if one of the structures 10A, 10B, here for purely exemplary reasons structure 10A, is flipped upside down so that the first bonding layer 4A and the second bonding layer 4B substantially contact each other. The first bonding layer 4A and the second bonding layer 4B then form a bonding interface 4 between both bonding layers. The bonding interface 4 may be a direct bonding interface. Typically, the bonding is performed by direct bonding of the two structures via the two bonding layers 4A, 4B. Direct bonding typically represents molecular adhesion between the two surfaces involved, without using any further bonding layers. Molecular adhesion is typically performed under partial vacuum. The bonding interface 4 comprising the first and second bonding layers 4A and 4B integrate the functionality of being both a bonding interface and due to the metallic nature of the bonding layers 4A, 4B also having a mirror function. Thus, by integrating a mirror function, the efficiency of the engineered substrate for use in light detection or conversion devices is increased. Integration of a mirror function at the bonding interface is further advantageous with respect to a mirror formed at the backside of the substrate because it gives more flexibility in the design of the support substrate with respect to the maintenance of low electrical resistance. Such support substrate may be highly doped in order to maintain low electrical resistance, which, however, induces higher absorption of photons as already pointed out.

[0039] Subsequently, in step C, the first substrate 1 is removed/detached from the first substrate 1, resulting in an engineered substrate 101 comprising an exposed seed layer 3. Removal of the first substrate 1 may be performed in various ways. Notably, grinding and/or back etching may be used to remove the first substrate 1, thereby eventually exposing the seed layer 3. If this treatment is chosen, the bonding process performed in the step before may be conducted at higher temperatures, e.g., temperatures in a range of 200° C.-600° C. or, more preferably, between 300° C.-500° C. Another possibility may be performing the transfer of the first structure 10A onto the second structure 10B prior to bonding by means of SMART CUT®, i.e., introducing an ion implantation step before bonding and then splitting/detaching, cf. FIG. 2. For this possibility, the bonding process should be carried out at a lower temperature, preferably less than 200° C.

[0040] Subsequently, in step D, an additional back side metal contact 11 may be provided on a second side of the support substrate 5 opposite to the first side, thereby resulting in an engineered substrate 103. The engineered substrate 103 may be substantially the same as the engineered substrate 101, except for having the additional back side metal contact. Step D and thus providing the additional back side metal contact 11 are optional, but may further improve the efficiency of the engineered substrate 103, and ultimately a solar cell including the engineered substrate. The back side metal contact 11 may serve as another mirror in addition to the mirror functionality of the bonding interface 4, i.e., its purpose is to reflect such photons that have not yet been converted in the substrate back into the interior. The back side metal contact 11 may also serve for providing an electrical contact to the back side of a solar cell, e.g., contacting a conductive plate in order to avoid complex wiring.

[0041] FIG. 2 shows a slight modification of the embodiment of FIG. 1, however, sharing the same major steps A, B, C and optional step D. The same elements are denoted by the same reference numbers and will not be explained again. In FIG. 2, the first support substrate comprises a zipper layer 2, which is provided at the surface of the first substrate 1, representing the contact to the seed layer 3. For example, the zipper layer 2 may be provided in the form of a weakened layer formed by the implantation of ionic species. The ionic species may be, for example, hydrogen or helium ions. In this case, the first substrate 1 can be provided as a bulk substrate, such as an InP substrate, then the implantation through the top surface of the bulk substrate forms the weakened layer 2. The weakened layer or zipper layer 2 thus separates the seed layer 3 and the first substrate 1, respectively, in the top portion and the bottom portion of the bulk substrate. Subsequently, the first substrate 1 is detached from the seed layer 3 by means of the zipper layer 2, for example, the first engineered substrate is cleaved at the zipper layer 2 allowing the detachment of first substrate 1 from the seed layer 3. Then, the further process of detachment of the first substrate 1 may be mediated by the application of mechanical forces to delaminate at the weakened layer formed by hydrogen or helium ions.

[0042] With respect to the above embodiment shown in FIG. 2, one understands that the seed layer 3 may be part of the first substrate 1 and is defined by the presence of the weakened layer 2. However, the present disclosure is not limited to such configuration. It is understood that the seed layer may be provided by epitaxial growth on the first substrate. An implantation step may thus define a weakened layer 2 either in the first substrate 1 or the seed layer. Such weakened layer 2 is formed in view of a subsequent detachment step as already explained above. Further surface preparation after such detachment (e.g., grinding, polishing, etching) of the transferred layer leaves behind a seed layer that is suitable for epitaxial growth (reduced roughness required), such as seed layer 3 bonded via metallic bonding layers (4A, 4B) to the support substrate 5.

[0043] The resulting engineered substrates 101 and 103, the latter including a back side metal contact, are substantially the same as in FIG. 1. The thickness of the seed layer 3 typically is in a range of 150 nm up to 1 If the transfer is performed by SMART CUT®, the thickness may be up to 300 nm, but can be as low as 20 nm. Furthermore, the thickness of the support substrate 5 may range from 100 μm up to 500 The doping concentration of the support substrate 5 typically ranges from 1×10.sup.14-5×10.sup.17 at/cm.sup.3. The first semiconductor material typically has a lattice constant in the range of 5.8-6 Å (0.58 nm-0.6 nm). The thickness of the bonding layers is in the range of 3 nm up to 2 preferentially in the range of 3 nm to 20 nm. In the latter case, due to low absorption within the bonding layers, which depends on the thickness, a second mirror on the back side may be applicable in order to further increase the efficiency.

[0044] Each of the engineered substrates 101 and 103 may be used in forming an MJ solar cell. The advantage is that materials of the various junctions may be tuned in order to better match the solar spectrum.