Loose lay plastic floor and preparation method thereof

Abstract

A preparation method of a loose lay plastic floor includes the following steps: (a) subjecting a wear layer, a printing layer, a semi-rigid PVC layer, a core layer and an adsorption layer to hot-melt compounding and shaping to obtain a composite board; (b) coating one or more layers of UV coating on a surface of the wear layer of the composite board; and (c) subjecting the composite board coated with the UV coating to tempering, conditioning and punching to obtain a loose lay plastic floor. The core layer is a stone plastic core (SPC), a wood plastic core (WPC), a high density fiberboard (HDF), or a medium density fiberboard (MDF).

Claims

1. A method of preparing a loose lay plastic floor, comprising the following steps: (a) subjecting a wear layer, a printing layer, a semi-rigid polyvinyl chloride (PVC) layer, a core layer and an adsorption layer to hot-melt compounding and shaping to obtain a composite board; (b) coating at least one layer of ultraviolet (UV) coating on a surface of the wear layer of the composite board; and (c) subjecting the composite board coated with the at least one layer of UV coating to tempering, conditioning and punching to obtain the loose lay plastic floor; wherein a temperature of the tempering is 70-95° C., and a time duration of the tempering is 2-15 minutes, and the conditioning is to place the composite board at 20-28° C. for 48-72 hours.

2. The method according to claim 1, wherein the core layer is a stone plastic core (SPC), the semi-rigid PVC layer comprises a first semi-rigid PVC layer and a second semi-rigid PVC layer, and the composite board is obtained by the hot-melt compounding by the following steps: stacking the wear layer, the printing layer, the first semi-rigid PVC layer, the second semi-rigid PVC layer and the adsorption layer sequentially, disposing the first semi-rigid PVC layer between the core layer and the printing layer and disposing the second semi-rigid PVC layer between the core layer and the adsorption layer; and performing the hot-melt compounding and the shaping to obtain the composite board.

3. The method according to claim 1, wherein the core layer is either a wood plastic core (WPC), a high density fiberboard (HDF), or a medium density fiberboard (MDF), the semi-rigid PVC layer comprises a first semi-rigid PVC layer and a second semi-rigid PVC layer, and the composite board is prepared by the following step: adhesively bonding an upper composite layer, the core layer and a lower composite layer to obtain the composite board by a hot melt adhesive, wherein the upper composite layer comprises the wear layer, the first semi-rigid PVC layer and the printing layer and is obtained by performing the hot-melt compounding on the wear layer, the first semi-rigid PVC layer and the printing layer and the shaping, and the lower composite layer comprises the adsorption layer and the second semi-rigid PVC layer and is obtained by performing the hot-melt compounding on the second semi-rigid PVC layer and an adsorption layer and the shaping.

4. The method according to claim 1, wherein during the hot-melt compounding, a temperature is controlled at 125-175° C., a pressure is controlled at 0.0-8.5 MPa, and a time duration is controlled at 15-45 minutes; and the shaping is performed for 15-45 minutes at a temperature of no higher than 80° C. and a pressure of 2.0-8.5 MPa.

5. The method according to claim 1, wherein the semi-rigid PVC layer comprises: 10.2-36.2% of PVC resin; 59.8-82.9% of CaCO.sub.3; 4.8-14.7% of dioctyl terephthalate (DOTP); 0-5.9% of modifier; and 0.2-1.8% of stabilizer.

6. The method according to claim 5, wherein the modifier is at least one selected from the group consisting of butadiene-acrylonitrile rubber, polyvinyl chloride-vinyl acetate copolymer resin, chlorinated polyethylene, and acrylate.

7. The method according to claim 1, wherein the wear layer is made of PVC material, and has a thickness of 0.1-1.0 mm; the printing layer is made of PVC material, and has a thickness of 0.05-0.09 mm; the semi-rigid PVC layer has a thickness of 0.7-3.0 mm; the adsorption layer is made of thermoplastic polyurethane (TPU) material or PVC micro foaming material, and has a thickness of 0.02-0.7 mm; and the core layer has a thickness of 1-6 mm.

8. The method according to claim 2, wherein during the hot-melt compounding, a temperature is controlled at 125-175° C., a pressure is controlled at 2.0-8.5 MPa, and a time duration is controlled at 15-45 minutes; and the shaping is performed for 15-45 minutes at a temperature of no higher than 80° C. and a pressure of 2.0-8.5 MPa.

9. The method according to claim 3, wherein during the hot-melt compounding, a temperature is controlled at 125-175° C., a pressure is controlled at 2.0-8.5 MPa, and a time duration is controlled at 15-45 minutes; and the shaping is performed for 15-45 minutes at a temperature of no higher than 80° C. and a pressure of 2.0-8.5 MPa.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The accompanying drawings that are required to be used in the description of the embodiments or the conventional technology are described briefly below, so that the technical solutions according to the embodiments of the present disclosure or according to the conventional technology will become clearer. It is apparent that the accompanying drawings in the following description are only illustrative. For those skilled in the art, other accompanying drawings may be obtained according to these drawings provided, without any creative work.

(2) The structure, proportion, size and the like shown in the present specification are only used to cooperate with the contents disclosed in the specification for those skilled in the art to understand and read, and are not intended to limit the conditions with which the present disclosure can be implemented. Therefore, they have no practical significance in a technical sense. Any modification to the structure, any change of the proportions or any adjustment of the size should fall within the scope covered by the technical contents disclosed in the present disclosure without influencing the effects and objects that can be achieved by the present disclosure.

(3) FIG. 1 is a schematic exploded view of a loose lay plastic floor prepared according to Embodiment 1 of the present disclosure;

(4) FIG. 2 is a schematic exploded view of a loose lay plastic floor prepared according to Embodiment 2 of the present disclosure; and

(5) FIG. 3 is a schematic exploded view of a loose lay plastic floor prepared according to Embodiment 3 of the present disclosure.

(6) In the drawings: 1—wear layer; 2—printing layer; 3—semi-rigid PVC layer; 4—core layer; 5—adsorption layer.

DETAILED DESCRIPTION OF THE EMBODIMENT

(7) The implementations of the present disclosure will be described in the specific embodiments below, and other advantages and functions of the present disclosure can be readily understood by those skilled in the art from the contents disclosed in the specification. It is apparent that the described embodiments are part of the embodiments of the present disclosure, instead of all of them. All the other embodiments obtained by those skilled in the art on the basis of the embodiments of the present disclosure without creative efforts will fall within the scope of protection of the present disclosure.

(8) The raw materials used in the following embodiments are listed as follows:

(9) a wear layer: the material being PVC, from Zhenjiang Sansheng Plastic Industry Co., Ltd.;

(10) a printing layer: the material being PVC, from Kunshan Big Orange Decoration Materials Co., Ltd.;

(11) an adsorption layer: the material being TPU, from Wenzhou Yinrun Packaging Co., Ltd.;

(12) a medium density fiberboard: from Wenzhou Yinrun Packaging Co., Ltd.;

(13) a wood plastic core: from Huzhou Yitong Decoration Materials Co., Ltd.; and

(14) a stone plastic core: from Jiangsu Zhongsheng Building New Material Co., Ltd.

Embodiment 1

(15) This embodiment is a method of preparing a loose lay plastic floor, and the preparation method includes the following steps:

(16) (a) bonding an upper composite layer, a core layer 4 having a thickness of 3 mm and a lower composite layer by using a PUR adhesive at a temperature of 20° C. and a pressure of 2.0 MPa for 24 hours to obtain a composite board, the upper composite layer being obtained by hot-melt compounding a wear layer 1 having a thickness of 0.1 mm and a printing layer 2 having a thickness of 0.09 mm at a temperature of 125° C. and a pressure of 7.5 MPa for 45 minutes, followed by shaping at a temperature of 60° C. and a pressure of 8 MPa for 45 minutes; and the lower composite layer being obtained by hot-melt compounding a semi-rigid PVC layer 3 having a thickness of 3.0 mm and an adsorption layer 5 having a thickness of 0.1 mm at a temperature of 125° C. and a pressure of 7.5 MPa for 45 minutes, followed by shaping at a temperature of 60° C. and a pressure of 8 MPa for 45 minutes;

(17) wherein the core layer 4 is a medium density fiberboard, and the semi-rigid PVC layer 3 is prepared from the following raw materials: PVC resin: 12.1%; CaCO.sub.3: 82.9%; DOTP: 4.8%; and stabilizer: 0.2%;

(18) (b) coating a surface of the wear layer of the composite board with a UV coating, wherein the UV coating has a grammage of 10 g/m.sup.2; and

(19) (c) tempering the composite board coated with UV coating by heating it to 90° C., keeping the temperature for 5 minutes, then placing the composite board at 20° C. for 72 hours, and punching, edge-cutting and chamfering the composite board according to customer requirements to obtain a loose lay plastic floor as shown in FIG. 1.

Embodiment 2

(20) This embodiment is a method of preparing a loose lay plastic floor, and the preparation method includes the following steps:

(21) (a) fast bonding an upper composite layer, a core layer 4 having a thickness of 4 mm and a lower composite layer by using a PUR hot-melt adhesive at a temperature of 200° C. to obtain a composite board, the upper composite layer being obtained by hot-melt compounding a wear layer 1 having a thickness of 0.3 mm, a printing layer 2 having a thickness of 0.05 mm and a semi-rigid PVC layer 3 having a thickness of 0.7 mm at a temperature of 175° C. and a pressure of 7.5 MPa for 15 minutes, followed by shaping at a temperature of 60° C. and a pressure of 8.5 MPa for 15 minutes, and the lower composite layer being an adsorption layer 5 having a thickness of 0.5 mm;

(22) wherein the core layer 4 is a wood plastic composite, and the semi-rigid PVC layer is prepared from the following raw materials: PVC resin: 18%; CaCO.sub.3: 63%; DOTP: 11.3%; butadiene-acrylonitrile rubber: 5.9%; and stabilizer: 1.8%;

(23) (b) coating a surface of the wear layer of the composite board with a UV coating, wherein the UV coating has a grammage of 18 g/m.sup.2; and

(24) (c) tempering the composite board coated with UV coating by heating it to 80° C., keeping the temperature for 15 minutes, then placing the composite board at 26° C. for 72 hours, and punching, edge-cutting and chamfering the composite board according to customer requirements to obtain a loose lay plastic floor as shown in FIG. 2.

Embodiment 3

(25) This embodiment is a method of preparing a loose lay plastic floor, and the preparation method includes the following steps:

(26) (a) hot-melt compounding a wear layer 1 having a thickness of 0.6 mm, a printing layer 2 having a thickness of 0.06 mm, a semi-rigid PVC layer 3 having a thickness of 1.2 mm, a core layer 4 having a thickness of 3 mm, a semi-rigid PVC layer 3 having a thickness of 1.2 mm and an adsorption layer 5 having a thickness of 0.4 mm, which are sequentially stacked, at a temperature of 150° C. and a pressure of 6 MPa under vacuum for 25 minutes, followed by shaping at a temperature of 60° C. and a pressure of 7 MPa for 20 minutes to obtain a composite board;

(27) wherein the core layer 4 is a stone plastic core, and the semi-rigid PVC layer 3 is prepared from the following raw materials: PVC resin: 23.6%; CaCO.sub.3: 64.3%; DOTP: 8.4%; polyvinyl chloride-vinyl acetate copolymer rubber: 1.7%; butadiene-acrylonitrile rubber: 1.1%; and stabilizer: 0.9%;

(28) (b) coating a surface of the wear layer of the composite board with a UV coating, wherein the UV coating has a grammage of 15 g/m.sup.2; and

(29) (c) tempering the composite board coated with UV coating by heating it to 95° C., keeping the temperature for 2 minutes, then placing the composite board at 24° C. for 60 hours, and punching, edge-cutting and chamfering the composite board according to customer requirements to obtain a loose lay plastic floor as shown in FIG. 3.

Comparative Example 1

(30) The comparative example is a method of preparing a loose lay plastic floor, and the preparation method is basically the same as the preparation method of Embodiment 3, except that in step (a), the core layer having a thickness of 3.0 mm is replaced with a mesh glass fiber layer having a thickness of 0.1 mm, and the semi-rigid PVC layer has a thickness of 2.7 mm.

Comparative Example 2

(31) The comparative example is a method of preparing a loose lay plastic floor, and the preparation method is basically the same as the preparation method of Embodiment 3, except that in step (a), the core layer having a thickness of 3.0 mm is replaced with a semi-rigid PVC layer having a thickness of 3 mm.

Experimental Example 1

(32) The loose lay plastic floor was cut into ten pieces of the same size. Firstly, the ten pieces of loose lay plastic floors were placed at a temperature of 20° C. for 4 hours, and the sizes of the samples were measured. Five samples were placed at a temperature of 50° C. for 4 hours, and the sizes of the samples were measured; the other five samples were placed at a temperature of 0° C. for 4 hours, and the sizes of the samples were measured; and a dimensional elongation or reduction rate at each temperature was calculated.

(33) The loose lay plastic floor prepared by Embodiment 3 and the loose lay plastic floors prepared by comparative examples 1 and 2 were respectively selected, and then these selected loose lay plastic floors were respectively tested by using the above method: the above experiment was repeated for six times, a dimensional change at another temperature as compared to a standard size at 20° C. is recorded, and a calculation result is shown in Table 1.

(34) TABLE-US-00001 TABLE 1 Type 50° C. 20° C. 0° C. Embodiment 3 +0.069% — −0.037% Comparative example 1 +0.142% — −0.098% Comparative example 2 +0.173% — −0.126%

(35) As can be seen from Table 1, the loose lay plastic floor prepared by the present application exhibits more excellent dimensional stability and flatness at different temperatures.

Experimental Example 2

(36) The loose lay plastic floor prepared by Embodiment 3 and the loose lay plastic floors prepared by comparative examples 1 and 2 were respectively selected, and a heating dimensional change rate and a heating warpage of the obtained floors were tested according to the test method of ASTM F2199. A test result is shown in Table 2:

(37) TABLE-US-00002 TABLE 2 heating dimensional heating Type change rate warpage Embodiment 3 0.03% −0.1 mm Comparative example 1 0.08% −0.8 mm Comparative example 2 0.13% −0.8 mm

(38) As can be seen from Table 2, the loose lay plastic floor prepared by the present application has smaller heating dimensional change rate and heating warpage than the comparative examples 1 and 2. Therefore, the loose lay plastic floor prepared by the present application has excellent dimensional stability and flatness.

(39) While the present disclosure is described in detail with reference to the specific embodiments and general description above, it is apparent to those skilled in the art that some modifications or improvements may be made on the basis of the present disclosure. Therefore, such modifications or improvements made without departing from the spirit of the present disclosure will all fall within the scope of protection of the present disclosure.