Thermadapt shape memory polymer and application method thereof

Abstract

A preparation method of thermadapt shape memory polymers includes: (1) synthesis of pendant hydroxyl groups functionalized epoxy oligomer using epoxy resin and alcohol amine; (2) synthesis of alkoxyl groups terminated silane crosslinking agent by isocyanate silane coupling agent and diamine; (3) crosslinked shape memory polymers were prepared by condensation reaction of pendant hydroxyl groups functionalized epoxy oligomer and alkoxyl groups terminated silane crosslinking agent. The thermadapt shape memory polymers show high glass transition temperatures and high tensile strength. The original shape of thermadapt shape memory polymers can be reconfigured to a new permanent shape as needed, and thus effectively solving the bottleneck problems of reprocessing or reshape in the traditional crosslinked polymers once after molding. The thermadapt shape memory polymers are suitable for smart materials based on shape memory polymers with complex three-dimensional permanent shapes, and showing unfolding or folding behaviors along with convert to three-dimensional structures under heat stimulation.

Claims

1. A thermadapt shape memory polymer prepared by a preparation method comprising the following steps: (1) synthesizing an epoxy oligomer with hydroxyl side-groups by reacting an epoxy resin and an alcohol amine; (2) synthesizing a silane crosslinking agent with terminated alkoxyl groups by reacting a silane coupling agent and a diamine; (3) synthesizing the thermadapt shape memory polymer by reacting the epoxy oligomer with hydroxyl side-groups with the silane crosslinking agent with terminated alkoxyl groups.

2. The thermadapt shape memory polymer of claim 1, wherein: the epoxy resin includes one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, or hydrogenated epoxy resin; the alcohol amine comprises one or more of an ethanolamine, a 3-aminopropanol and a 2-(2-aminoethoxy)ethanol; the diamine is one or more of 4,4′-methylenedianiline, 4,4′-diaminodiphenylsulfone and 4,4′-oxydianiline; and the silane coupling agent is an isocyanate silane coupling agent.

3. The thermadapt shape memory polymer of claim 2, wherein: the isocyanate silane coupling agent is one or more of 3-isocyanatopropyltrimethoxysilane and 3-isocyanatopropyltriethoxysilane.

4. The thermadapt shape memory polymer of claim 1, wherein: the epoxy resin reacts with the alcohol amine in amide solvent under nitrogen atmosphere and; the silane coupling agent reacts with the diamine in the presence of chlorohydrin under nitrogen atmosphere.

5. The thermadapt shape memory polymer of claim 1, wherein: the reaction temperature of the epoxy resin and the alcohol amine is 120° C. and the reaction time is 10-12 h; the reaction temperature of the silane coupling agent and the diamine is 80° C. and the reaction time is 4-6 h; and the reaction temperature of the epoxy oligomer with hydroxyl side-groups and the silane crosslinking agent with terminated alkoxyl groups is 80° C. and the reaction time is 10-12 h.

6. The thermadapt shape memory polymer of claim 1, wherein: the mass ratio of the epoxy resin to the alcohol amine is 100:(15-25); the mass ratio of the silane coupling agent and the diamine is 100: (190˜230); and the mass ratio of the epoxy oligomer with hydroxyl side-groups to the silane crosslinking agent with terminated alkoxyl groups is 100:(20-60).

7. The thermadapt shape memory polymer of claim 1, wherein: in the step (3), the thermadapt shape memory polymer are synthesized as follows: dissolving the epoxy oligomer with hydroxyl side-groups and the silane crosslinking agent with terminated alkoxyl groups in amide solvent and crosslinking the epoxy oligomer with hydroxyl side-groups and the silane crosslinking agent with terminated alkoxyl groups to form a network, and subsequently drying to obtain the thermadapt shape memory polymer.

8. The thermadapt shape memory polymer of claim 1, prepared by a preparation method further comprising the following steps: (4) heating the thermadapt shape memory polymer to a temperature above its glass transition temperature and deforming to a fixed memory shape; heating the fixed memory shape to 180-200° C. for 1-2 h; after that, cooling the shape memory polymer to room temperature to obtain a thermadapt shape memory polymer with a reconfigurable permanent shape; (5) heating the thermadapt shape memory polymer with a reconfigurable permanent shape obtained in step (1) to a temperature above its glass transition temperature and then forming the polymer material into a temporary shape, then cooling to room temperature and obtaining a shape memory polymer material with a temporary shape; and (6) reheating the shape memory polymer material with a temporary shape above its glass transition temperature to obtain a polymer material with a reconfigurable permanent shape and complete the shape recovery of the thermadapt shape memory polymer.

9. The thermadapt shape memory polymers of claim 8, wherein: the temperature above the glass transition temperature in steps (4) or (5) is over the glass transition temperature by 10-20° C.

10. The thermadapt shape memory polymers of claim 8, wherein the thermadapt shape memory polymers are made into the reconfigurable memory shape or the temporary shape by applying external force.

Description

DESCRIPTION OF THE FIGURES

(1) FIG. 1 shows .sup.1H NMR spectra of epoxy oligomer with hydroxyl side-groups according to Example 1.

(2) FIG. 2 shows .sup.1H NMR spectra of silane crosslinking agent with terminated methoxy groups according to Example 1.

(3) FIG. 3 shows FTIR spectra of the thermadapt shape memory polymer according to Example 1.

(4) FIG. 4 shows DMA curves of the thermadapt shape memory polymer according to Example 1.

(5) FIG. 5 shows tensile stress-strain curves of the thermadapt shape memory polymer according to Example 1.

(6) FIG. 6 shows shape memory curves tested by DMA of the thermadapt shape memory polymer according to Example 1.

(7) FIG. 7 shows shape memory behaviors of the thermadapt shape memory polymer according to Example 1.

(8) FIG. 8 shows DMA curves of the thermadapt shape memory polymer according to Example 2.

(9) FIG. 9 shows tensile stress-strain curves of the thermadapt shape memory polymer according to Example 2.

(10) FIG. 10 shows shape memory curves tested by DMA of the thermadapt shape memory polymer according to Example 2.

(11) FIG. 11 shows shape memory behaviors of the thermadapt shape memory polymer according to Example 2.

(12) FIG. 12 shows DMA curves of the thermadapt shape memory polymer according to Example 3.

(13) FIG. 13 shows tensile stress-strain curves of the thermadapt shape memory polymer according to Example 3.

(14) FIG. 14 shows shape memory curves tested by DMA of the thermadapt shape memory polymer according to Example 3.

(15) FIG. 15 shows shape memory behaviors of the thermadapt shape memory polymer according to Example 3.

(16) FIG. 16 shows DMA curves of the thermadapt shape memory polymer according to Example 4.

(17) FIG. 17 shows tensile stress-strain curves of the thermadapt shape memory polymer according to Example 4.

(18) FIG. 18 shows shape memory curves tested by DMA of the thermadapt shape memory polymer according to Example 4.

(19) FIG. 19 shows shape memory behaviors of the thermadapt shape memory polymer according to Example 4.

(20) FIG. 20 shows DMA curves of the thermadapt shape memory polymer according to Example 10.

EXAMPLES

(21) The technical scheme of the present invention is further elaborated in combination with attached Figures and Examples.

Example 1

(22) (1) under the condition of 25° C., by mass, Bisphenol A epoxy (E51, 50 g), ethanolamine (9 g) and N,N-Dimethylformamide (300 mL) were added into a round-bottomed flask, and then the mixture was heated to 120° C. and kept for 12 h under nitrogen atmosphere. When the reaction finished, the resulting solution was added drop by drop into the deionized water to separate out the white solid. After filtration, washing and drying, the epoxy oligomer with hydroxyl side-groups was obtained. The .sup.1H NMR spectra of epoxy oligomer with hydroxyl side-groups according to Example 1 was shown in FIG. 1.

(23) (2) under the condition of 25° C., by mass, 4,4′-diaminodiphenylmethane (5 g) was added to a three-necked flask and stirred to dissolve in chloroform (100 mL) at room temperature. 3-isocyanatopropyltrimethoxysilane (10.35 g) was added in drops to the above solution with stirring under nitrogen atmosphere. After that, the solution was heated to 80° C. and maintained for 4 h. When the reaction finished, the solvent was removed by rotary evaporator. After dried in the vacuum oven, silane crosslinking agent with terminated methoxy groups was obtained. .sup.1H NMR spectra of silane crosslinking agent with terminated methoxy groups according to Example 1 was shown in FIG. 2.

(24) (3) under the condition of 25° C., epoxy oligomer with hydroxyl side-groups according to step 1 (5 g) and silane crosslinking agent with terminated methoxy groups according to step 1 (1.7 g) were dissolved in N,N-Dimethylformamide at room temperature to obtain a uniform mixture. The mixture was poured into a mold and then putting the mold in the vacuum oven at 80° C. for 12 h. After that, the obtained polymer film was put out of the mold and dried in vacuum oven according to the process of 120° C./12 h+200° C./2 h, and the thermadapt shape memory polymer was obtained. FTIR spectra of the thermadapt shape memory polymer according to Example 1 is shown in FIG. 3. The silyl ether linkages in the networks were obtained by condensation reaction of terminated methoxy six-functional groups. The crosslinking density of polyfunctional groups was higher than that of difunctional groups. The crosslinking density calculated from the thermadapt shape memory polymer in the present invention reaches 2510 mol/m.sup.3, which is higher than the crosslinking density of the thermadapt shape memory polymers reported in the literature.

(25) (4) When heated to the temperature above the glass transition temperature (140° C.), the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional box shape under external force; Then the thermadapt shape memory with box shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional box shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(26) The themadapt shape memory polymer with box shape mentioned above is heated to the temperature above the glass transition temperature (140° C.) and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature (140° C.), the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent box shape. The shape memory curves tested by DMA of the thermadapt shape memory polymer according to Example 1 are shown in FIG. 6, and shape memory behaviors of the thermadapt shape memory polymer according to Example 1 are shown in FIG. 7.

(27) FIG. 1 shows the .sup.1H NMR spectra of epoxy oligomer with hydroxyl side-groups according to Example 1. The characteristic peaks of protons on epoxy group (δ=2.6 ppm and δ=2.8 ppm, a) disappear and show up the overlapping peaks (δ=2.52-2.72 ppm, c, d) of protons on methylene group adjacent to nitrogen atom. In addition, the broad peaks at 4.51-5.10 ppm (a, f, f′, h) correspond to protons on hydroxyl group, indicating that a number of hydroxyl group in epoxy oligomer with hydroxyl side-groups. The overlapping board peaks at 3.68-4.04 ppm (e, e′, g, g′) represent protons of repeating unit on tertiary carbon atom adjacent to hydroxyl group and methylene group adjacent to ether bond, indicating that amino groups of ethanolamine reacted with the epoxy groups to give an oligomer. The GPC results show the number average molecular weight of epoxy oligomer is 5200 g/mol.

(28) FIG. 2 shows .sup.1H NMR spectra of silane crosslinking agent with terminated methoxy groups. All the characteristic peaks of protons are shown in the .sup.1H NMR spectrum of silane crosslinking agent with terminated methoxy groups, concluding protons of methoxy group (3.47 ppm, a), protons of three methylene adjacent to silicon atom (0.56-0.60 ppm, b; 1.46 ppm, c; 3.01 ppm, d).

(29) FIG. 3 shows the FTIR spectra of FTIR spectra of the thermadapt shape memory polymer according to Example 1. Compared with the spectrum of epoxy oligomer/silane crosslinking agent mixtures, a new absorption peak of —O—Si— (1000-1150 cm.sup.−1) show up in the spectrum of the thermadapt shape memory polymer, and the absorption peak intensity of methoxy group (810 cm.sup.−1 and 775 cm.sup.−1) eventually disappear. These results indicate that the hydroxyl groups have reacted with the methoxy groups to remove the methanol and form a crosslinking network.

(30) FIG. 4 shows the DMA curves of the thermadapt shape memory polymer according to Example 1. The glass transition temperature of the thermadapt shape memory polymer is 129.3° C.

(31) FIG. 5 shows the tensile stress-strain curves of the thermadapt shape memory polymer according to Example 1. The tensile strength of the thermadapt shape memory polymer is 82.4±1.3 MPa.

(32) FIG. 6 shows the shape memory curves tested by DMA of the thermadapt shape memory polymer according to Example 1. The test procedure includes dual-shape memory behavior and thermadapt shape memory behavior. Dual-shape memory behavior is conducted as follows: First, the specimen is heated to the programming temperature (140° C.) and stretched to the strain of 10% under external loading; next, the stretched specimen is cooled to 20° C. and then unloaded the external force to obtain a temporary shape; finally, the specimen with a temporary shape is reheated to 140° C. for recovery without force. thermadapt shape memory behavior is as follows: the specimen is heated to the programming temperature (140° C.) and stretched to the strain of 6% under external loading and then heated to 200° C. and kept for 60 min to trigger the dynamic exchange of silyl ether and hydroxy group in networks and obtaining the reconfiguration shape with strain of 6%; after that, the specimen was continued to conduct a typical dual-shape memory test on the basis of the new permanent strain mentioned above.

(33) FIG. 7 shows shape memory behaviors of the thermadapt shape memory polymer according to Example 1. When heated to the temperature above the glass transition temperature (140° C.), the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional box shape under external force; Then the thermadapt shape memory with box shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional box shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(34) The themadapt shape memory polymer with box shape mentioned above is heated to the temperature above the glass transition temperature (140° C.) and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature (140° C.), the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent box shape.

Example 2

(35) (1) under the condition of 25° C., by mass, Bisphenol A epoxy (E51, 50 g), ethanolamine (9 g) and N,N-Dimethylformamide (300 mL) were added into a round-bottomed flask, and then the mixture was heated to 120° C. and kept for 12 h under nitrogen atmosphere. When the reaction finished, the resulting solution was added drop by drop into the deionized water to separate out the white solid. After filtration, washing and drying, the epoxy oligomer with hydroxyl side-groups was obtained.

(36) (2) under the condition of 25° C., by mass, 4,4′-diaminodiphenylmethane (5 g) was added to a three-necked flask and stirred to dissolve in chloroform (100 mL) at room temperature. 3-isocyanatopropyltrimethoxysilane (10.35 g) was added in drops to the above solution with stirring under nitrogen atmosphere. After that, the solution was heated to 80° C. and maintained for 4 h. When the reaction finished, the solvent was removed by rotary evaporator. After dried in the vacuum oven, silane crosslinking agent with terminated methoxy groups was obtained.

(37) (3) under the condition of 20˜30° C., by mass, epoxy oligomer with hydroxyl side-groups according to step 1 (5 g) and silane crosslinking agent with terminated methoxy groups according to step 1 (1 g) were dissolved in N,N-Dimethylformamide at room temperature to obtain a uniform mixture. The mixture was poured into a mold and then putting the mold in the vacuum oven at 80° C. for 12 h. After that, the obtained polymer film was put out of the mold and dried in vacuum oven according to the process of 120° C./12 h+200° C./2 h, and the thermadapt shape memory polymer was obtained.

(38) (4) When heated to the temperature above the glass transition temperature (130° C.), the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional shape under external force; Then the thermadapt shape memory with three-dimensional shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(39) The themadapt shape memory polymer with three-dimensional shape mentioned above is heated to the temperature above the glass transition temperature (130° C.) and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature (130° C.), the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent three-dimensional shape. The shape memory curves tested by DMA of the thermadapt shape memory polymer according to Example 2 are shown in FIG. 10.

(40) FIG. 10 shows the shape memory curves tested by DMA of the thermadapt shape memory polymer according to Example 2. The test procedure includes dual-shape memory behavior and thermadapt shape memory behavior. Dual-shape memory behavior is conducted as follows: First, the specimen is heated to the programming temperature (130° C.) and stretched to the strain of 10% under external loading; next, the stretched specimen is cooled to 20° C. and then unloaded the external force to obtain a temporary shape; finally, the specimen with a temporary shape is reheated to 130° C. for recovery without force. thermadapt shape memory behavior is as follows: the specimen is heated to the programming temperature (130° C.) and stretched to the strain of 6% under external loading and then heated to 200° C. and kept for 60 min to trigger the dynamic exchange of silyl ether and hydroxy group in networks and obtaining the reconfiguration shape with strain of 6%; after that, the specimen was continued to conduct a typical dual-shape memory test on the basis of the new permanent strain mentioned above.

(41) FIG. 11 shows shape memory behaviors of the thermadapt shape memory polymer according to Example 2. When heated to the temperature above the glass transition temperature (138.1° C.), the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional “six-claw stool” shape under external force; Then the thermadapt shape memory with box shape was heated to 180° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional “six-claw stool” shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(42) The themadapt shape memory polymer with “six-claw stool” shape mentioned above is heated to the temperature above the glass transition temperature (138.1° C.) and transformed into a temporary shape of two-dimensional plane shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature (138.1° C.), the thermadapt shape memory polymer with two-dimensional plane shapes will spontaneously recover to the new permanent “six-claw stool” shape.

(43) FIG. 8 shows the DMA curves of the thermadapt shape memory polymer according to Example 2. The glass transition temperature of the thermadapt shape memory polymer is 119.8° C.

(44) FIG. 9 shows the tensile stress-strain curves of the thermadapt shape memory polymer according to Example 2. The tensile strength of the thermadapt shape memory polymer is 68.9±0.4 MPa.

Example 3

(45) (1) under the condition of 25° C., by mass, Bisphenol A epoxy (E51, 50 g), ethanolamine (9 g) and N,N-Dimethylformamide (300 mL) were added into a round-bottomed flask, and then the mixture was heated to 120° C. and kept for 12 h under nitrogen atmosphere. When the reaction finished, the resulting solution was added drop by drop into the deionized water to separate out the white solid. After filtration, washing and drying, the epoxy oligomer with hydroxyl side-groups was obtained.

(46) (2) under the condition of 25° C., by mass, 4,4′-diaminodiphenylmethane (5 g) was added to a three-necked flask and stirred to dissolve in chloroform (100 mL) at room temperature. 3-isocyanatopropyltrimethoxysilane (10.35 g) was added in drops to the above solution with stirring under nitrogen atmosphere. After that, the solution was heated to 80° C. and maintained for 4 h. When the reaction finished, the solvent was removed by rotary evaporator. After dried in the vacuum oven, silane crosslinking agent with terminated methoxy groups was obtained.

(47) (3) under the condition of 25° C., by mass, epoxy oligomer with hydroxyl side-groups according to step 1 (5 g) and silane crosslinking agent with terminated methoxy groups according to step 1 (2.3 g) were dissolved in N,N-Dimethylformamide at room temperature to obtain a uniform mixture. The mixture was poured into a mold and then putting the mold in the vacuum oven at 80° C. for 12 h. After that, the obtained polymer film was put out of the mold and dried in vacuum oven according to the process of 120° C./12 h+200° C./2 h, and the thermadapt shape memory polymer was obtained.

(48) (4) When heated to the temperature above the glass transition temperature (160° C.), the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional shape under external force; Then the thermadapt shape memory with three-dimensional shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(49) The themadapt shape memory polymer with three-dimensional shape mentioned above is heated to the temperature above the glass transition temperature (160° C.) and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature (160° C.), the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent three-dimensional shape. The shape memory curves tested by DMA of the thermadapt shape memory polymer according to Example 3 are shown in FIG. 14. The shape memory behaviors of the thermadapt shape memory polymer according to Example 3 are shown in FIG. 15.

(50) FIG. 14 shows the shape memory curves tested by DMA of the thermadapt shape memory polymer according to Example 3. The test procedure includes dual-shape memory behavior and thermadapt shape memory behavior. Dual-shape memory behavior is conducted as follows: First, the specimen is heated to the programming temperature (160° C.) and stretched to the strain of 10% under external loading; next, the stretched specimen is cooled to 20° C. and then unloaded the external force to obtain a temporary shape; finally, the specimen with a temporary shape is reheated to 160° C. for recovery without force. thermadapt shape memory behavior is as follows: the specimen is heated to the programming temperature (160° C.) and stretched to the strain of 6% under external loading and then heated to 200° C. and kept for 60 min to trigger the dynamic exchange of silyl ether and hydroxy group in networks and obtaining the reconfiguration shape with strain of 6%; after that, the specimen was continued to conduct a typical dual-shape memory test on the basis of the new permanent strain mentioned above.

(51) FIG. 15 shows shape memory behaviors of the thermadapt shape memory polymer according to Example 3. When heated to the temperature above the glass transition temperature (160° C.), the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional “windmill” shape under external force; Then the thermadapt shape memory with box shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional “windmill” shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(52) The themadapt shape memory polymer with “windmill” shape mentioned above is heated to the temperature above the glass transition temperature (160° C.) and transformed into a temporary shape of two-dimensional plane shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature (160° C.), the thermadapt shape memory polymer with two-dimensional plane shapes will spontaneously recover to the new permanent “windmill” shape.

(53) FIG. 12 shows the DMA curves of the thermadapt shape memory polymer according to Example 3. The glass transition temperature of the thermadapt shape memory polymer is 148.8° C.

(54) FIG. 13 shows the tensile stress-strain curves of the thermadapt shape memory polymer according to Example 3. The tensile strength of the thermadapt shape memory polymer is 64.8±1.6 MPa.

Example 4

(55) (1) under the condition of 25° C., by mass, Bisphenol A epoxy (E51, 50 g), ethanolamine (9 g) and N,N-Dimethylformamide (300 mL) were added into a round-bottomed flask, and then the mixture was heated to 120° C. and kept for 12 h under nitrogen atmosphere. When the reaction finished, the resulting solution was added drop by drop into the deionized water to separate out the white solid. After filtration, washing and drying, the epoxy oligomer with hydroxyl side-groups was obtained.

(56) (2) under the condition of 25° C., by mass, 4,4′-diaminodiphenylmethane (5 g) was added to a three-necked flask and stirred to dissolve in chloroform (100 mL) at room temperature. 3-isocyanatopropyltrimethoxysilane (10.35 g) was added in drops to the above solution with stirring under nitrogen atmosphere. After that, the solution was heated to 80° C. and maintained for 4 h. When the reaction finished, the solvent was removed by rotary evaporator. After dried in the vacuum oven, silane crosslinking agent with terminated methoxy groups was obtained.

(57) (3) under the condition of 25° C., by mass, epoxy oligomer with hydroxyl side-groups according to step 1 (5 g) and silane crosslinking agent with terminated methoxy groups according to step 1 (3 g) were dissolved in N,N-Dimethylformamide at room temperature to obtain a uniform mixture. The mixture was poured into a mold and then putting the mold in the vacuum oven at 80° C. for 12 h. After that, the obtained polymer film was put out of the mold and dried in vacuum oven according to the process of 120° C./12 h+200° C./2 h, and the thermadapt shape memory polymer was obtained.

(58) (4) When heated to the temperature above the glass transition temperature (167° C.), the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional shape under external force; Then the thermadapt shape memory with three-dimensional shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(59) The themadapt shape memory polymer with three-dimensional shape mentioned above is heated to the temperature above the glass transition temperature (167° C.) and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature (167° C.), the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent three-dimensional shape. The shape memory curves tested by DMA of the thermadapt shape memory polymer according to Example 4 are shown in FIG. 18.

(60) FIG. 18 shows the shape memory curves tested by DMA of the thermadapt shape memory polymer according to Example 4. The test procedure includes dual-shape memory behavior and thermadapt shape memory behavior. Dual-shape memory behavior is conducted as follows: First, the specimen is heated to the programming temperature (167° C.) and stretched to the strain of 10% under external loading; next, the stretched specimen is cooled to 20° C. and then unloaded the external force to obtain a temporary shape; finally, the specimen with a temporary shape is reheated to 167° C. for recovery without force. thermadapt shape memory behavior is as follows: the specimen is heated to the programming temperature (167° C.) and stretched to the strain of 6% under external loading and then heated to 200° C. and kept for 60 min to trigger the dynamic exchange of silyl ether and hydroxy group in networks and obtaining the reconfiguration shape with strain of 6%; after that, the specimen was continued to conduct a typical dual-shape memory test on the basis of the new permanent strain mentioned above.

(61) FIG. 19 shows shape memory behaviors of the thermadapt shape memory polymer according to Example 4. When heated to the temperature above the glass transition temperature (166.4° C.), the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional “paper airplane” shape under external force; Then the thermadapt shape memory with box shape was heated to 220° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional “paper airplane” shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(62) The themadapt shape memory polymer with “paper airplane” shape mentioned above is heated to the temperature above the glass transition temperature (166.4° C.) and transformed into a temporary shape of two-dimensional plane shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature (166.4° C.), the thermadapt shape memory polymer with two-dimensional plane shapes will spontaneously recover to the new permanent “paper airplane” shape.

(63) FIG. 16 shows the DMA curves of the thermadapt shape memory polymer according to Example 4. The glass transition temperature of the thermadapt shape memory polymer is 156.4° C.

(64) FIG. 17 shows the tensile stress-strain curves of the thermadapt shape memory polymer according to Example 3. The tensile strength of the thermadapt shape memory polymer is 59.3±1.8 MPa.

(65) Table 1 shows the performance indexes such as glass transition temperature, initial thermal decomposition temperature and tensile strength of thermadapt shape memory polymers prepared by Example 1, 2, 3 and 4 and existing thermadapt shape memory polymers reported. As shown in Table 1, the thermadapt shape memory polymer provided by Example 1-4 in the present invention exhibit both high glass transition temperature and high tensile strength.

(66) TABLE-US-00001 TABLE 1 Performance indexes such as glass transition temperature, initial thermal decomposition temperature and tensile strength of thermadapt shape memory polymers reported until now Glass Initial thermal transition decomposition Tensile Thermadapt shape temperature temperature strength memory polymers (° C.) (° C.) (MPa) Reference Example 1 129.3 314 82.4 ± 1.3 Example 2 119.8 325 68.9 ± 0.4 Example 3 148.8 303 64.8 ± 1.6 Example 4 156.4 296 59.3 ± 1.8 Epoxy resin 1 42.9 345 12.0 ± 0.8 [1] Epoxy resin 2 53 310 ~25 [2] Epoxy resin 3 41.4 268.8 10.9 ± 2.2 [3] Epoxy resin 4 75 — — [4] Polysulfide 36.4 252.9  ~5 [5] networks Thermoset 57 — ~17 [6] polyurethane 1 Thermoset ~50 —  8.16 ± 0.57 [7] polyurethane 2 Thermoset ~40 —   ~1.1 [8] polyurethane 3 Thermoset ~41 — — [9] polyurethane 4 Thermoset ~80 — — [10]  polyurethane 5 Crosslinked ~30 — 4~5 [11]  polyanhydride Crosslinked ~55 — — [12]  poly(caprolactone) Reference: [1] Z. Yang, Q. Wang and T. Wang, ACS Applied Materials & Interfaces, 2016, 8, 21691-21699. [2] T. Liu, C. Hao, L. Wang, Y. Li, W. Liu, J. Xin and J. Zhang, Macromolecules, 2017, 50, 8588-8597. [3] Z. Ma, Y. Wang, J. Zhu, J. Yu and Z. Hu, Journal of Polymer Science Part A: Polymer Chemistry, 2017, 55, 1790-1799. [4] J. Zhu, G. Fang, Z. Cao, X. Meng and H. Ren, Industrial & Engineering Chemistry Research, 2018, 57, 5276-5281. [5] S. Zhang, L. Pan, L. Xia, Y. Sun and X. Liu, Reactive and Functional Polymers, 2017, 121, 8-14. [6] S. Ji, F. Fan, C. Sun, Y. Yu and H. Xu, ACS Applied Materials & Interfaces, 2017, 9, 33169-33175. [7] Y. Wang, Y. Pan, Z. Zheng and X. Ding, Macromolecular Rapid Communications, 2018, 39, 1800128. [8] Z. Fang, N. Zheng, Q. Zhao and T. Xie, ACS Applied Materials & Interfaces, 2017, 9, 22077-22082. [9] N. Zheng, Z. Fang, W. Zou, Q. Zhao and T. Xie, Angewandte Chemie International Edition, 2016, 55, 11421-11425. [10] N. Zheng, J. Hou, Y. Xu, Z. Fang, W. Zou, Q. Zhao and T. Xie, ACS Macro Letters, 2017, 6, 326-330. [11] M. I. Lawton, K. R. Tillman, H. S. Mohammed, W. Kuang, D. A. Shipp and P. T. Mather, ACS Macro Letters, 2016, 5, 203-207. [12] Q. Zhao, W. Zou, Y. Luo and T. Xie, Science Advances, 2016, 2, e1501297.

Example 5

(67) (1) under the condition of 25° C., by mass, Bisphenol F epoxy resin (NPEF-170, 50 g), 3-aminopropanol (11 g) and N,N-Dimethylformamide (300 mL) were added into a round-bottomed flask, and then the mixture was heated to 120° C. and kept for 10 h under nitrogen atmosphere. When the reaction finished, the resulting solution was added drop by drop into the deionized water to separate out the white solid. After filtration, washing and drying, the epoxy oligomer with hydroxyl side-groups was obtained.

(68) (2) under the condition of 25° C., by mass, 4,4′-diaminodiphenylsulfone (5 g) was added to a three-necked flask and stirred to dissolve in dichloromethane (100 mL) at room temperature. 3-isocyanatopropyltriethoxysilane (9.95 g) was added in drops to the above solution with stirring under nitrogen atmosphere. After that, the solution was heated to 80° C. and maintained for 5 h. When the reaction finished, the solvent was removed by rotary evaporator. After dried in the vacuum oven, silane crosslinking agent with terminated ethoxy groups was obtained.

(69) (3) under the condition of 25° C., by mass, epoxy oligomer with hydroxyl side-groups according to step 1 (5 g) and silane crosslinking agent with terminated ethoxy groups according to step 1 (1.5 g) were dissolved in N,N-Dimethylformamide at room temperature to obtain a uniform mixture. The mixture was poured into a mold and then putting the mold in the vacuum oven at 80° C. for 11 h. After that, the obtained polymer film was put out of the mold and dried in vacuum oven according to the process of 120° C./12 h+200° C./2 h, and the thermadapt shape memory polymer was obtained.

(70) (4) When heated to the temperature above the glass transition temperature 15° C., the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional shape under external force; Then the thermadapt shape memory with three-dimensional shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(71) The themadapt shape memory polymer with three-dimensional shape mentioned above is heated to the temperature above the glass transition temperature 15° C. and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature 15° C., the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent three-dimensional shape.

Example 6

(72) (1) under the condition of 25° C., by mass, Bisphenol F epoxy resin (NPEF-170, 50 g), 3-aminopropanol (11 g) and N,N-Dimethylformamide (300 mL) were added into a round-bottomed flask, and then the mixture was heated to 120° C. and kept for 10 h under nitrogen atmosphere. When the reaction finished, the resulting solution was added drop by drop into the deionized water to separate out the white solid. After filtration, washing and drying, the epoxy oligomer with hydroxyl side-groups was obtained.

(73) (2) under the condition of 25° C., by mass, 4,4′-diaminodiphenylsulfone (5 g) was added to a three-necked flask and stirred to dissolve in dichloromethane (100 mL) at room temperature. 3-isocyanatopropyltriethoxysilane (9.95 g) was added in drops to the above solution with stirring under nitrogen atmosphere. After that, the solution was heated to 80° C. and maintained for 5 h. When the reaction finished, the solvent was removed by rotary evaporator. After dried in the vacuum oven, silane crosslinking agent with terminated ethoxy groups was obtained.

(74) (3) under the condition of 25° C., by mass, epoxy oligomer with hydroxyl side-groups according to step 1 (5 g) and silane crosslinking agent with terminated ethoxy groups according to step 1 (2 g) were dissolved in N,N-Dimethylformamide at room temperature to obtain a uniform mixture. The mixture was poured into a mold and then putting the mold in the vacuum oven at 80° C. for 11 h. After that, the obtained polymer film was put out of the mold and dried in vacuum oven according to the process of 120° C./12 h+200° C./2 h, and the thermadapt shape memory polymer was obtained.

(75) (4) When heated to the temperature above the glass transition temperature 15° C., the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional shape under external force; Then the thermadapt shape memory with three-dimensional shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(76) The themadapt shape memory polymer with three-dimensional shape mentioned above is heated to the temperature above the glass transition temperature 15° C. and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature 15° C., the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent three-dimensional shape.

Example 7

(77) (1) under the condition of 25° C., by mass, Bisphenol F epoxy resin (NPEF-170, 50 g), 3-aminopropanol (11 g) and N,N-Dimethylformamide (300 mL) were added into a round-bottomed flask, and then the mixture was heated to 120° C. and kept for 10 h under nitrogen atmosphere. When the reaction finished, the resulting solution was added drop by drop into the deionized water to separate out the white solid. After filtration, washing and drying, the epoxy oligomer with hydroxyl side-groups was obtained.

(78) (2) under the condition of 25° C., by mass, 4,4′-diaminodiphenylsulfone (5 g) was added to a three-necked flask and stirred to dissolve in dichloromethane (100 mL) at room temperature. 3-isocyanatopropyltriethoxysilane (9.95 g) was added in drops to the above solution with stirring under nitrogen atmosphere. After that, the solution was heated to 80° C. and maintained for 5 h. When the reaction finished, the solvent was removed by rotary evaporator. After dried in the vacuum oven, silane crosslinking agent with terminated ethoxy groups was obtained.

(79) (3) under the condition of 25° C., by mass, epoxy oligomer with hydroxyl side-groups according to step 1 (5 g) and silane crosslinking agent with terminated ethoxy groups according to step 1 (2.5 g) were dissolved in N,N-Dimethylformamide at room temperature to obtain a uniform mixture. The mixture was poured into a mold and then putting the mold in the vacuum oven at 80° C. for 11 h. After that, the obtained polymer film was put out of the mold and dried in vacuum oven according to the process of 120° C./12 h+200° C./2 h, and the thermadapt shape memory polymer was obtained.

(80) (4) When heated to the temperature above the glass transition temperature 18° C., the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional shape under external force; Then the thermadapt shape memory with three-dimensional shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(81) The themadapt shape memory polymer with three-dimensional shape mentioned above is heated to the temperature above the glass transition temperature 18° C. and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature 18° C., the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent three-dimensional shape.

Example 8

(82) (1) under the condition of 25° C., by mass, hydrogenated epoxy resin (YDH3000, 50 g), 3-aminopropanol (10.5 g) and N,N-Dimethylformamide (300 mL) were added into a round-bottomed flask, and then the mixture was heated to 120° C. and kept for 11 h under nitrogen atmosphere. When the reaction finished, the resulting solution was added drop by drop into the deionized water to separate out the white solid. After filtration, washing and drying, the epoxy oligomer with hydroxyl side-groups was obtained.

(83) (2) under the condition of 25° C., by mass, 4,4′-diaminodiphenylsulfone (5 g) was added to a three-necked flask and stirred to dissolve in 1,2-dichloroethane (100 mL) at room temperature. 3-isocyanatopropyltrimethoxysilane (10.25 g) was added in drops to the above solution with stirring under nitrogen atmosphere. After that, the solution was heated to 80° C. and maintained for 6 h. When the reaction finished, the solvent was removed by rotary evaporator. After dried in the vacuum oven, silane crosslinking agent with terminated methoxy groups was obtained.

(84) (3) under the condition of 25° C., by mass, epoxy oligomer with hydroxyl side-groups according to step 1 (5 g) and silane crosslinking agent with terminated methoxy groups according to step 1 (1.25 g) were dissolved in N,N-Dimethylformamide at room temperature to obtain a uniform mixture. The mixture was poured into a mold and then putting the mold in the vacuum oven at 80° C. for 10 h. After that, the obtained polymer film was put out of the mold and dried in vacuum oven according to the process of 120° C./12 h+200° C./2 h, and the thermadapt shape memory polymer was obtained.

(85) (4) When heated to the temperature above the glass transition temperature 20° C., the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional shape under external force; Then the thermadapt shape memory with three-dimensional shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(86) The themadapt shape memory polymer with three-dimensional shape mentioned above is heated to the temperature above the glass transition temperature 20° C. and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature 20° C., the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent three-dimensional shape.

Example 9

(87) (1) under the condition of 25° C., by mass, hydrogenated epoxy resin (YDH3000, 50 g), 3-aminopropanol (10.5 g) and N,N-Dimethylformamide (300 mL) were added into a round-bottomed flask, and then the mixture was heated to 120° C. and kept for 11 h under nitrogen atmosphere. When the reaction finished, the resulting solution was added drop by drop into the deionized water to separate out the white solid. After filtration, washing and drying, the epoxy oligomer with hydroxyl side-groups was obtained.

(88) (2) under the condition of 25° C., by mass, 4,4′-diaminodiphenylsulfone (5 g) was added to a three-necked flask and stirred to dissolve in 1,2-dichloroethane (100 mL) at room temperature. 3-isocyanatopropyltrimethoxysilane (10.25 g) was added in drops to the above solution with stirring under nitrogen atmosphere. After that, the solution was heated to 80° C. and maintained for 6 h. When the reaction finished, the solvent was removed by rotary evaporator. After dried in the vacuum oven, silane crosslinking agent with terminated methoxy groups was obtained.

(89) (3) under the condition of 25° C., by mass, epoxy oligomer with hydroxyl side-groups according to step 1 (5 g) and silane crosslinking agent with terminated methoxy groups according to step 1 (1.75 g) were dissolved in N,N-Dimethylformamide at room temperature to obtain a uniform mixture. The mixture was poured into a mold and then putting the mold in the vacuum oven at 80° C. for 10 h. After that, the obtained polymer film was put out of the mold and dried in vacuum oven according to the process of 120° C./12 h+200° C./2 h, and the thermadapt shape memory polymer was obtained.

(90) (4) When heated to the temperature above the glass transition temperature 10° C., the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional shape under external force; Then the thermadapt shape memory with three-dimensional shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(91) The themadapt shape memory polymer with three-dimensional shape mentioned above is heated to the temperature above the glass transition temperature 10° C. and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature 10° C., the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent three-dimensional shape.

Example 10

(92) (1) under the condition of 25° C., by mass, Bisphenol A epoxy (E51, 50 g), ethanolamine (9 g) and N,N-Dimethylformamide (300 mL) were added into a round-bottomed flask, and then the mixture was heated to 120° C. and kept for 12 h under nitrogen atmosphere. When the reaction finished, the resulting solution was added drop by drop into the deionized water to separate out the white solid. After filtration, washing and drying, the epoxy oligomer with hydroxyl side-groups was obtained.

(93) (2) under the condition of 25° C., by mass, 4,4′-diaminodiphenylmethane (5 g) was added to a three-necked flask and stirred to dissolve in chloroform (100 mL) at room temperature. 3-isocyanatopropyltrimethoxysilane (10.35 g) was added in drops to the above solution with stirring under nitrogen atmosphere. After that, the solution was heated to 80° C. and maintained for 4 h. When the reaction finished, the solvent was removed by rotary evaporator. After dried in the vacuum oven, silane crosslinking agent with terminated methoxy groups was obtained.

(94) (3) under the condition of 25° C., by mass, epoxy oligomer with hydroxyl side-groups according to step 1 (5 g) and silane crosslinking agent with terminated methoxy groups according to step 1 (0.34 g) were dissolved in N,N-Dimethylformamide at room temperature to obtain a uniform mixture. The mixture was poured into a mold and then putting the mold in the vacuum oven at 80° C. for 12 h. After that, the obtained polymer film was put out of the mold and dried in vacuum oven according to the process of 120° C./12 h+200° C./2 h, and the thermadapt shape memory polymer was obtained.

(95) (4) When heated to the temperature above the glass transition temperature 10° C., the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional shape under external force; Then the thermadapt shape memory with three-dimensional shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(96) The themadapt shape memory polymer with three-dimensional shape mentioned above is heated to the temperature above the glass transition temperature 10° C. and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature 10° C., the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent three-dimensional shape.

(97) FIG. 20 shows the DMA curves of the thermadapt shape memory polymer according to Example 10. The glass transition temperature of the thermadapt shape memory polymer is 99.6° C. The tensile strength of the thermadapt shape memory polymer is 30.1±2.7 MPa.

Example 11

(98) (1) under the condition of 25° C., by mass, Bisphenol A epoxy resin (E51, 27 g), Bisphenol F epoxy resin (NPEF-170, 23 g) and ethanolamine (10 g) and N,N-Dimethylformamide (300 mL) were added into a round-bottomed flask, and then the mixture was heated to 120° C. and kept for 12 h under nitrogen atmosphere. When the reaction finished, the resulting solution was added drop by drop into the deionized water to separate out the white solid. After filtration, washing and drying, the epoxy oligomer with hydroxyl side-groups was obtained.

(99) (2) under the condition of 25° C., by mass, 4,4′-diaminodiphenylmethane (2.52 g) and 4,4′-diaminodiphenylsulfone (2.49 g) was added to a three-necked flask and stirred to dissolve in dichloromethane/chloroform mixtures (100 mL) at room temperature. 3-isocyanatopropyltrimethoxysilane (10.3 g) was added in drops to the above solution with stirring under nitrogen atmosphere. After that, the solution was heated to 80° C. and maintained for 4 h. When the reaction finished, the solvent was removed by rotary evaporator. After dried in the vacuum oven, silane crosslinking agent with terminated methoxy groups was obtained.

(100) (3) under the condition of 25° C., by mass, epoxy oligomer with hydroxyl side-groups according to step 1 (5 g) and silane crosslinking agent with terminated methoxy groups according to step 1 (2 g) were dissolved in N,N-Dimethylformamide at room temperature to obtain a uniform mixture. The mixture was poured into a mold and then putting the mold in the vacuum oven at 80° C. for 12 h. After that, the obtained polymer film was put out of the mold and dried in vacuum oven according to the process of 120° C./12 h+200° C./2 h, and the thermadapt shape memory polymer was obtained.

(101) (4) When heated to the temperature above the glass transition temperature 10° C., the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional shape under external force; Then the thermadapt shape memory with three-dimensional shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(102) The themadapt shape memory polymer with three-dimensional shape mentioned above is heated to the temperature above the glass transition temperature 10° C. and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature 10° C., the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent three-dimensional shape.

Example 12

(103) (1) under the condition of 25° C., by mass, hydrogenated epoxy resin (YDH3000, 50 g), 3-aminopropanol (10.5 g) and N,N-Dimethylformamide (300 mL) were added into a round-bottomed flask, and then the mixture was heated to 120° C. and kept for 11 h under nitrogen atmosphere. When the reaction finished, the resulting solution was added drop by drop into the deionized water to separate out the white solid. After filtration, washing and drying, the epoxy oligomer with hydroxyl side-groups was obtained.

(104) (2) under the condition of 25° C., by mass, 4,4′-diaminodiphenylsulfone (5 g) was added to a three-necked flask and stirred to dissolve in 1,2-dichloroethane (100 mL) at room temperature. 3-isocyanatopropyltrimethoxysilane (10.25 g) was added in drops to the above solution with stirring under nitrogen atmosphere. After that, the solution was heated to 80° C. and maintained for 6 h. When the reaction finished, the solvent was removed by rotary evaporator. After dried in the vacuum oven, silane crosslinking agent with terminated methoxy groups was obtained.

(105) (3) under the condition of 25° C., by mass, epoxy oligomer with hydroxyl side-groups according to step 1 (5 g) and silane crosslinking agent with terminated methoxy groups according to step 1 (2.25 g) were dissolved in N,N-Dimethylformamide at room temperature to obtain a uniform mixture. The mixture was poured into a mold and then putting the mold in the vacuum oven at 80° C. for 10 h. After that, the obtained polymer film was put out of the mold and dried in vacuum oven according to the process of 120° C./12 h+200° C./2 h, and the thermadapt shape memory polymer was obtained.

(106) (4) When heated to the temperature above the glass transition temperature 15° C., the thermadapt shape memory polymer was transformed from a two-dimensional plane original shape into a designing three-dimensional shape under external force; Then the thermadapt shape memory with three-dimensional shape was heated to 200° C. and keep the temperature and the external force, and the dynamic exchange reaction of silyl ether and hydroxy group in networks and realizing the reconfiguration of networks; When cooled to room temperature, the thermadapt shape memory polymer with three-dimensional shape is fixed and obtaining a new permanent shape of the themadapt shape memory polymer.

(107) The themadapt shape memory polymer with three-dimensional shape mentioned above is heated to the temperature above the glass transition temperature 15° C. and transformed into a temporary shape of two-dimensional plane or folded shape under external force; Then cooled to room temperature, the temporary shapes were fixed; finally, when reheated to the temperature above the glass transition temperature 15° C., the thermadapt shape memory polymer with two-dimensional plane or folded temporary shapes will spontaneously recover to the new permanent three-dimensional shape.