COMPOSITE MATERIAL

Abstract

The present application relates to a composite material and a method for producing the same, which can provide a composite material having excellent impact resistance or processability and pore characteristics while having excellent heat dissipation performance, and a method for producing the composite material.

Claims

1. A composite material comprising a metal foam and a graphene component present on a surface of the metal foam or inside the metal foam, wherein the metal foam comprises pores, and the size of the pores having a size of from 20 μm to 380 μm.

2. The composite material according to claim 1, wherein the graphene component is included in a range of 10.sup.−5 to 10.sup.−1 wt % in the composite material.

3. The composite material according to claim 1, wherein the metal foam has a thickness in a range of 10 μm to 1000 μm.

4. The composite material according to claim 1, wherein the metal foam comprises a metal or a metal alloy having a thermal conductivity of 8 W/mK or greater.

5. The composite material according to claim 1, wherein the metal foam has a skeleton comprising comprises one or more metals or metal alloys selected from the group consisting of iron, cobalt, nickel, copper, phosphorus, molybdenum, zinc, manganese, chromium, indium, tin, silver, platinum, gold, aluminum, stainless steel and magnesium.

6. The composite material according to claim 1, wherein the metal foam has a porosity in a range of 30% to 99%.

7. The composite material according to claim 1, further comprising a polymer component present on the surface of the metal foam or on the graphene component.

8. The composite material according to claim 7, wherein the polymer component forms a surface layer on the surface of the metal foam or on the graphene component.

9. The composite material according to claim 7, wherein the polymer component comprises one or more resins selected from the group consisting of an acrylic resin, a silicone resin, an epoxy resin, a urethane resin, an amino resin and a phenol resin.

10. The composite material according to claim 1, wherein the graphene component forms a graphene layer on the surface of the metal foam or inside the metal foam.

11. The composite material according to claim 10, wherein the graphene layer is a single layer or has a multi-layer structure.

12. The composite material according to claim 10, wherein the graphene layer has a thickness in a range of 10 nm or less.

13. The composite material according to claim 1, wherein the composite material has a thermal conductivity of 0.4 W/mK or greater.

14. A method for producing the composite material according to claim 1, the method comprising: providing the metal foam; and forming the graphene component on the surface of or inside the metal foam.

15. The method according to claim 14, wherein the graphene component is formed by a chemical vapor deposition method.

16. The method according to claim 14, wherein providing the metal foam comprises forming the metal foam from a slurry that comprises a first solvent and a second solvent, and a ratio (D1/D2) of a first dielectric constant (D1) of the first solvent to a second dielectric constant (D2) of the second solvent is in a range of 5 to 100.

17. The method according to claim 16, wherein the first dielectric constant (D1) is in a range of 20 to 100, and the second dielectric constant (D2) is in a range of 1 to 15.

18. The method according to claim 14 further comprising forming a polymer component on the surface of the metal foam or on the graphene component.

19. The method according to claim 18, wherein forming the polymer component comprises: curing a curable polymer composition present on the surface of the metal foam or on the graphene component.

20. The method according to claim 18, wherein the polymer component comprises one or more resins selected from the group consisting of an acrylic resin, a silicone resin, an epoxy resin, a urethane resin, an amino resin and a phenol resin.

Description

BEST MODE

[0061] Hereinafter, the present application will be described in detail with reference to examples and comparative examples, but the scope of the present application is not limited to the following examples.

[0062]

Example 1

[0063] Methyl cellulose and hydropropyl methylcellulose as polymer binders were mixed and stirred in amounts of 0.17 g and 0.30 g, respectively, to dissolve them in 3.54 g of water (dielectric constant at 20° C.: about 80) as a first solvent. After the dissolution was completed, 4.0 g of copper powder, 0.2 g of a surfactant and 0.15 g of ethylene glycol were sequentially introduced thereto and stirred. Thereafter, 0.0.4 g of pentane (dielectric constant at about 20° C.: about 1.84) to be used as a blowing agent was introduced and stirred.

[0064] The sample prepared through the above process was bar-coated on a silicon nitride plate to a thickness of 200 μm, and heated to 40° C. in a space under humidity of 80% or more and foamed for 1 minute. Then, it was heated under humidity of 60% or less at 90° C. for 30 minutes and the solvent was dried to form a green structure (film). Thereafter, the green structure (film) was baked in a reducing atmosphere at 1000° C. to produce a metal foam.

[0065] After the baking process, CH.sub.4 gas was injected into, as the produced metal foam, the foamed copper foam having a pore size of about 50 to 100 μm, a thickness of 200 μm and a porosity of 80% to deposit graphene at 1000° C.

[0066]

Example 2

[0067] The graphene-deposited copper foam produced in Example 1 was immersed in a thermosetting resin (Dow Corning, PDMS, Sylgard 527kit) solution, and then extruded to a thickness of 250 μm using a film applicator to remove an excessive amount of the resin. Thereafter, it was cured in an oven at 120° C. for 10 minutes to produce a composite material.

[0068]

Comparative Example 1

[0069] A metal foam was produced in the same manner as in Example 1, except for depositing no graphene.

[0070]

Comparative Example 2

[0071] The metal foam without deposited graphene produced in Comparative Example 1 was immersed in a thermosetting resin (Dow Corning, PDMS, Sylgard 527kit) solution, and then extruded to a thickness of 250 μm using a film applicator to remove an excessive amount of the resin. Thereafter, it was cured in an oven at 120° C. for 10 minutes to produce a composite material.

[0072]

Comparative Example 3

[0073] A composite material was produced by injecting CH.sub.4 gas into a commercially available metal porous body from Alantum (porosity: 90%, thickness: 500 μm, pore size: 400 to 500 μm) to deposit grapheme at 1000° C.

[0074]

Experimental Example 1—Measurement of Thermal Conductivity and Thermal Resistance

[0075] For the composite materials produced in Examples and Comparative Examples, the thermal conductivity and the thermal resistance were measured using TIM Tester 1300 equipment. In the TIM Tester, a cooling plate is located at the bottom and a heat source is located at the top, where the composite materials produced in Examples and Comparative Examples are each cut into a circle having a diameter of 3.3 cm to prepare a sample, which is positioned so that the center of the measuring part is aligned between the cooling plate and the heat source. The lever is turned so that the cooling plate and the heat source are in close contact with the sample between them. At this time, the sample periphery is wrapped with an insulating material so that heat does not escape laterally and heat is transmitted only to the z-axis through the sample. The thermal resistance could be obtained by measuring a heat flux required to keep a temperature difference between two surfaces constant at a constant pressure, and the thermal conductivity was calculated based on this.

[0076]

TABLE-US-00001 TABLE 1 Thermal Thermal Thermal conductivity resistance resistance (W/mK) (10 psi) (K/W) (60 psi) (K/W) Example 1 1.75 0.60 0.31 Example 2 2.03 0.42 0.19 Comparative 1.45 0.83 0.55 Example 1 Comparative 1.62 0.65 0.40 Example 2 Comparative 0.40 2.33 1.14 Example 3

[0077]

[0078]