A display apparatus includes a display panel to display an image and a cushion plate disposed under the display panel. The cushion plate has an adhesive member and a porous member including a body portion area and a side portion area disposed along a side face of the body portion area. A thickness of the side portion area is smaller than a thickness of the body portion area. A porosity of the side portion area is lower than a porosity of the body portion area.

The present application provides a composite material and a method for producing the same. The present application can provide a composite material which comprises a metal foam and a polymer component, and has other excellent physical properties such as impact resistance, processability and insulation properties while having excellent thermal conductivity.

The present application relates to a composite material and a method for producing the same, which can provide a composite material having excellent impact resistance or processability and pore characteristics while having excellent heat dissipation performance, and a method for producing the composite material.

The present application relates to a composite material and a method for producing the same, which can provide a composite material having excellent impact resistance or processability and pore characteristics while having excellent heat dissipation performance, and a method for producing the composite material.

A plurality of porous metal bodies which are bonded with each other at bonded-boundary surfaces parallel to a first direction, each of the porous metal bodies has a three-dimensional network structure formed from a continuous skeleton in which a plurality of pores are interconnected so as to have a porosity rate different from another porous metal body, the pores formed in at least the porous metal body having the higher porosity rate are formed to have flat shapes which are long along a direction parallel to the bonded-boundary surface and short along a direction orthogonal to the bonded-boundary surface, an entire porosity rate of a bonded body of the porous metal bodies is 50% to 92%, a compressive strength compressing in the direction parallel to the bonded-boundary surface is 1.4 times to 5 times of a compressive strength compressing in the direction orthogonal to the bonded-boundary surface.

A metal-foam structure is used to shield or reduce harmful electromagnetic waves that are generated by electronic devices. A metal-foam material has regulated pores and is incorporated in an electronic device. The metal foam structure shields, prevents, or reduces harmful electromagnetic waves generated by the electronic device from reaching the human body or interfering with a sensitive electronic component. This metal foam is a relatively lightweight material having regulated microscale pore structure. The pores in the metal foam can also form directionality relative to the direction of incoming electromagnetic waves for more effective reflection or absorption of electromagnetic waves. The metal foam can also be used as both an electromagnetic-shielding and a heat-dissipating component for electronics including popular consumer electronics such as mobile phones, notebooks, and high-power desktop computers.

A preparation method of copper foam includes coating copper paste on a release film to form a coating sheet with a thickness of 50-200 m on the release film, peeling off the release film to obtain a copper foam preform after drying the release film with the coating sheet, and performing a glue discharging process on the copper foam preform and sintering the copper foam preform to obtain the copper foam having a thickness of 30-120 m and having a porosity of 50-80%. The thickness of the copper foam is reduced, which ensures a balance between the porosity and a structural strength of the copper foam, so the copper foam has a good water absorption performance, and a heat dissipation performance of the copper foam is effectively improved.

A preparation method of copper foam includes coating copper paste on a release film to form a coating sheet with a thickness of 50-200 m on the release film, peeling off the release film to obtain a copper foam preform after drying the release film with the coating sheet, and performing a glue discharging process on the copper foam preform and sintering the copper foam preform to obtain the copper foam having a thickness of 30-120 m and having a porosity of 50-80%. The thickness of the copper foam is reduced, which ensures a balance between the porosity and a structural strength of the copper foam, so the copper foam has a good water absorption performance, and a heat dissipation performance of the copper foam is effectively improved.