Layered body and method for manufacturing electronic component

Abstract

Provided is a laminate having a gel layer on a substrate able to protect the substrate during various types of processing used in industrial production steps prior to curing. The gel layer has excellent heat resistance, softness and flexibility, a low modulus of elasticity, low stress, excellent stress buffering properties, and electronic component retention properties. The gel layer has higher shape retention before curing but changing after curing into a hard layer having excellent release properties. The laminate is easily and readily releasable from the substrate even when the cured layer is localized. Applications thereof are also provided (such as an electronic component manufacturing method). The laminate comprises a laminated reaction-curable silicone gel and a sheet-like member laminated via an adhesive layer on top of the reaction-curable silicone gel.

Claims

1. A method for manufacturing an electronic component, said method comprising the steps of: (I) creating a laminate of an electronic component (L1-E), a reaction-curable silicone gel, and a sheet-like member having an adhesive layer; (II) chemically or physically processing the electronic component (L1-E) after step (I); (III) curing the reaction-curable silicone gel after step (II); and (IV) separating the sheet-like member and the cured product of the reaction-curable silicone gel substantially simultaneously from the electronic component (L1-E) after step (III).

2. The method for manufacturing an electronic component according to claim 1, further comprising the step of dicing the silicone gel and the electronic component in an integrated form after step (I).

3. The method for manufacturing an electronic component according to claim 1, wherein the loss tangent tan of the reaction-curable silicone gel at 23 C. to 100 C. is in a range from 0.01 to 1.00.

4. The method for manufacturing an electronic component according to claim 1, wherein the storage modulus G.sub.cured of the cured product of the reaction-curable silicone gel obtained from curing of the reaction-curable silicone gel increases by at least 50% compared to the storage modulus G.sub.gel of silicone gel prior to curing.

5. The method for manufacturing an electronic component according to claim 1, wherein the processing of step (II) is further defined as forming an electronic circuit, forming an electrode pattern, forming an conductive film, or forming an insulating film.

6. A method for manufacturing an electronic component, said method comprising the steps of: (I) laminating a reaction-curable silicone gel on an electronic component (L1-E); (II) chemically or physically processing the electronic component (L1-E) after step (I); (III) laminating a sheet-like member having an adhesive layer on the reaction-curable silicone gel after step (II); (IV) curing the reaction-curable silicone gel after step (III); and (V) separating the sheet-like member and the cured product of the reaction-curable silicone gel substantially simultaneously from the electronic component (L1-E) after step (IV).

7. The method for manufacturing an electronic component according to claim 6, further comprising the step of dicing the silicone gel and the electronic component in an integrated form after step (I).

8. The method for manufacturing an electronic component according to claim 6, wherein the loss tangent tan of the reaction-curable silicone gel at 23 C. to 100 C. is in a range from 0.01 to 1.00.

9. The method for manufacturing an electronic component according to claim 6, wherein the storage modulus G.sub.cured of the cured product of the reaction-curable silicone gel obtained from curing of the reaction-curable silicone gel increases by at least 50% compared to the storage modulus G.sub.gel of silicone gel prior to curing.

10. The method for manufacturing an electronic component according to claim 6, wherein the processing of step (II) is further defined as forming an electronic circuit, forming an electrode pattern, forming an conductive film, or forming an insulating film.

Description

EXAMPLES

(1) The following is a description of the present invention with reference to examples. Note that the present invention is not limited to these examples. The following compounds and compositions are used in the examples.

(2) Component (A1-1): Vinyl dimethylsiloxy group-endcapped dimethylsiloxane polymer (siloxane polymerization degree: approx. 540, vinyl group content: about 0.13 wt %)

(3) Component (A1-2): Vinyldimethylsiloxy group-endcapped dimethylsiloxane polymer (siloxane polymerization degree: approx. 315, vinyl group content: about 0.22 wt %)

(4) Component (A1-3): Trimethylsiloxy-endcapped dimethylsiloxane/vinylmethylsiloxane copolymer (siloxane polymerization degree: approx. 816, vinyl content: about 0.29 wt %)

(5) Component (A2): Resinous organopolysiloxane with vinyldimethylsiloxy-capped Q unit (vinyl content: approx. 4.1 wt %)

(6) Component (B1): Hydrogen dimethylsiloxy group-endcapped dimethylsiloxane polymer (siloxane polymerization degree: approx. 20, silicon atom-bonded hydrogen group content: 0.12 wt %)

(7) <Hydrosilylation Reaction Inhibitor>

(8) Component (C1): 1,3,5,7-tetramethyl-1,3,5,7-tetravinyl-cyclotetrasiloxane (vinyl content: 30.2 wt %)

(9) <Filler>

(10) Component (D1): hexamethyldisilazane-treated silica fine particles (Aerosil 200V from Nippon Aerosil)

(11) <Curing Agent>

(12) Component (E1): a vinylsiloxane solution of a platinum/divinyltetramethyldisiloxane complex (approx. 0.6 wt % in terms of platinum metal concentration)

(13) Component (E2): Mixture of 2,5-dimethyl-2,5-di (t-butylperoxy) hexane and trimethylsiloxy-endcapped siloxane polymer (2,5-dimethyl-2,5-di (t-butylperoxy) hexane concentration: approx. 50 wt %)

Composition: Example 1

(14) Components A1-1 (9.76 wt %), A1-2 (5.93 wt %), A1-3 (60.42 wt %), A2 (6.61 wt %), B1 (13.02 wt %), C1 (0.10 wt %), D1 (2.08 wt %), E1 (0.07 wt %) and E2 (2.00 wt %) were mixed together uniformly to obtain a curable liquid silicone composition. At this time, the amount of silicon atom-bonded hydrogen atoms (SiH) in component (B1) was 0.85 mol per mol of vinyl groups. In addition to these components, an appropriate amount of colorant was used in this example to facilitate confirmation of releasability.

Composition: Example 2

(15) Components A1-1 (9.87 wt %), A1-3 (66.27 wt %), A2 (6.69 wt %), B1 (8.74 wt %), C1 (0.10 wt %), D1 (6.25 wt %), E1 (0.07 wt %) Wt %) and E2 (2.00 wt %) were mixed together uniformly to obtain a curable liquid silicone composition. At this time, the amount of silicon atom-bonded hydrogen atoms (SiH) in component (B1) was 0.56 mol per mol of vinyl groups. In addition to these components, an appropriate amount of colorant was used in this example to facilitate confirmation of releasability.

(16) [Reactive Gel Preparation Condition and Appearance]

(17) A hydrosilylation reaction was conducted by heating the liquid silicone composition for two hours prior to curing at 80 C. to obtain a gel. The resulting reaction-curable silicone gel was clear in the absence of colorant.

(18) [Secondary Cured Product Preparation Conditions]

(19) The resulting reaction-curable silicone gel was subjected to secondary curing in nitrogen at 150 C. (Example 2) or 170 C. (Example 1) for one hour to obtain a secondary cured product.

(20) [Measurement of Viscoelasticity]

(21) Reaction-Curable Silicone Gel

(22) The uncured liquid silicone composition was placed in an aluminum container (diameter 50 mm) to a depth of about 1.5 mm, and a test sample with a diameter of 8 mm was cut from the reaction-curable silicone gel obtained under the conditions described above. The sample was affixed to a parallel plate with a diameter of 8 mm and measured using an MCR 302 viscoelasticity measuring device (from Anton Paar). The test was performed at 23 C., a frequency of 0.01 to 10 Hz, and a strain of 0.5%.

(23) Example 1: The storage modulus at 0.1 Hz was 6.110.sup.4 Pa, and the loss tangent (loss modulus/storage modulus) was 0.03.

(24) Example 2: The storage modulus at 0.1 Hz was 3.910.sup.4 Pa, and the loss tangent (loss modulus/storage modulus) was 0.05.

(25) Secondary Cured Product

(26) A reaction-curable silicone gel was prepared in the manner described above using an aluminum container. A secondary cured product was then obtained under the conditions described above. A test sample with a diameter of 8 mm was cut from the secondary cured product. The sample was affixed to a parallel plate with a diameter of 8 mm and measured using an MCR 302 viscoelasticity measuring device (from Anton Paar). The test was performed at 23 C., a frequency of 0.01 to 10 Hz, and a strain of 0.1%.

(27) Example 1: The storage modulus at 0.1 Hz was 1.010.sup.5 Pa.

(28) Example 2: The storage modulus at 0.1 Hz was 8.410.sup.4 Pa.

(29) [Release of Secondary Cured Product]

(30) The uncured liquid silicone composition was spin-coated on a substrate at room temperature to produce a curable gel layer on the substrate under the conditions described above. Adhesive tape (Nitroflon No. 903UL from Nitto Denko) was affixed to the resulting reaction-curable gel layer, and the reaction-curable silicone gel was subjected to secondary curing in nitrogen at 150 C. or 170 C. for one hour. The adhesive tape was peeled off the substrate including the secondary cured product prepared above, and it was visually confirmed that the secondary cured product had been transferred to the adhesive tape.

(31) <Comparative Testing>

(32) The uncured liquid silicone composition was spin-coated on a substrate at room temperature to produce a curable gel layer on the substrate under the conditions described above except that adhesive tape was not used, and the reaction-curable silicone gel was subjected to secondary curing in nitrogen at 150 C. or 170 C. for one hour. However, when there was no adhesive tape, the secondary cured product could not be effectively peeled off (separated from) the substrate.

(33) Adhesive Test with Adhesive Sheet

(34) Thin coatings of Primer X and Primer Y (both from Dow Corning) were applied to an aluminum substrate. The uncured liquid silicone composition described in Example 2 was applied on top to a thickness of about 230 m, and cured in the manner described above to obtain an elastomer. Adhesive tape (No. 336 from Nitto Denko) was affixed to the elastomer, and a reaction with the adhesive layer was conducted under heat for one hour at 150 C. in a nitrogen atmosphere. After storage for 30 minutes, a 180 peel test was performed at a speed of 300 mm/min under conditions of 23 C. and 50% relative humidity using the RTC 1210 (from Orientec). The peel strength was 165 N/m, and the peeling mode was cohesive failure. When adhesive tape was affixed to the elastomer in the same manner as above after being heated in a nitrogen atmosphere at 150 C. for one hour, the peel strength was 135 N/m, and the peeling mode was interfacial peeling. Thus, it was confirmed that a strong bond had been formed at the interface between the reaction-curable elastomer and the adhesive tape due to the aforementioned secondary curing reaction. This combination is removable from the substrate with the adhesive tape as an integrated unit.