CALIBRATION TOOL FOR PLANAR CHIP APPLICATIONS

Abstract

A system comprising a device or the device itself for measuring temperatures, comprising a sensor array plate, comprising on a first surface at least one temperature sensor arranged on at least one tongue that is surrounded by a cut-out leaving a bridge to the sensor array plate, wherein the at least one sensor has on both sides' spacer and a second surface opposite the first surface for connection to at least one operating plate of a thermocycler; and a pressure plate, comprising fins at the side for connection to the sensor array plate that align with the spacer of the sensor array plate when a pressure plate is arranged onto a sensor array plate.

Claims

1. A device for measuring temperatures, comprising a. a sensor array plate, comprising on a first surface at least one temperature sensor arranged on at least one tongue that is surrounded by a cut-out leaving a bridge to the sensor array plate, wherein the at least one temperature sensor has on both sides' spacer and a second surface opposite the first surface for contacting at least one operating plate of a member of an automated analyser system; and b. a pressure plate, comprising fins at the side for connection to the sensor array plate that align with the spacer of the sensor array plate when a pressure plate is arranged onto a sensor array plate.

2. The device of claim 1, comprising up to 16 temperature sensors.

3. The device of claim 1, wherein the temperature sensors are analogue or digital.

4. The device of claim 1, wherein the sensor array plate comprises a non-volatile data memory.

5. The device of claim 1, comprising an analogue-digital converter when analogue sensors are arranged onto the sensor array plate.

6. The device of claim 1, wherein the components arranged onto the sensor array plate are surface mounted devices and the second surface is planar.

7. The device of claim 1, wherein between the at least one temperature sensor and the sensor array plate a first thermal pad is arranged that is connected to thermal bridges reaching a second thermal pad on the second surface of the sensor array plate.

8. The device of claim 7, wherein the second thermal pad is covered by a heat transfer foil.

9. The device of claim 1, wherein the sensor array plate comprises alignment features for alignment with the at least one operating plate of the member of an automated analyser system.

10. The device of claim 1, wherein the sensor array plate further comprises a handle for moving it.

11. The device of claim 1, wherein the sensor array plate comprises a flat cable socket.

12. A system for measuring temperatures of an operating plate of an automated analyser system comprising a device according to claim 1 and control electronics arranged apart from a heated operating plate of the member of an automated analyser system.

13. The system of claim 12, wherein the device of claim 1 and the control electronics are connected by a flexible flat cable.

14. The system of 1, wherein the member of an automated analyser system or the automated analyser system is a thermocycler.

15. The use of a device of claim 1 for measuring temperatures in a thermocycler.

Description

BRIEF DESCRIPTION OF THE FIGURES

[0038] The invention will be described based on figures. It will be understood that the embodiments and aspects of the invention described in the figures are only examples and do not limit the protective scope of the claims in any way. The invention is defined by the claims and their equivalents. It will be understood that features of one aspect or embodiment of the invention can be combined with a feature of a different aspect or aspects of other embodiments of the invention, in which:

[0039] FIG. 1 shows schematically a sectional view of a sensor array plate.

[0040] FIG. 2 shows a perspective view on a sensor array plate.

[0041] FIG. 3 shows a pressure plate above a sensor array plate.

[0042] FIG. 4 shows the arrangement of pressure plate, sensor array plate and operating plate.

[0043] FIG. 5 shows the bottom side of a pressure plate.

[0044] FIGS. 6A-6C show the interaction between pressure plate and sensor array plate.

[0045] FIG. 7 shows the connection and arrangement of the two parts comprising sensor array plate (left side) and control electronics (right side).

[0046] FIG. 8 shows an isometric view on operating plate, sensor array plate and pressure plate.

DETAILED DESCRIPTION OF THE INVENTION

[0047] The technical problem is solved by the independent claims. The dependent claims cover further specific embodiments of the invention.

[0048] A tool according to the present invention shall be separated in two parts, a sensor array and control electronics tin order to o keep all electronics away from the heat source except for the sensors and signal conversation, Other major requirements for a measurement tool according to the invention refer to a precise temperature measurement, height compensation to ensure a good thermal contact to the thermocycler operating plate, a small thermal mass and a fast response to temperature changes. Temperature sensors shall be calibratable and the calibration values shall be stored in every sensor array separately. This allows to exchange a sensor board without the need of a new calibration because the calibration values are stored in a memory in the sensor board. Thus, it will be possible to use the tool with a spare sensor array while the sensors used before will require a new calibration. The down time of a device according to the invention in case of faulty sensor or other electronics will also be reduced due to the lack of performing a new calibration when a substitute or second sensor is present or available. The measurement tool of the present invention shall further have an interface for the thermocycler instrument to allow calibration during use of other parts of the thermocycler.

[0049] The present invention is based on the use of a measurement tool with an optimized design, to ensure similar thermal conditions while measuring, compared to normal operation and to split the sensor plate from the control electronics allowing an easy sensor replacement in case of a defect or a necessary recalibration. Additionally, each sensor of the measurement tool can be pressed individually towards or onto the operation plate to ensure an optimal thermal contact between them.

[0050] The measurement tool according to the present invention comprises two parts. The first part is a sensor array plate and the second part comprise a separate and outside of the heated area placed control electronic. A flexible flat cable (FFC) connects both parts.

[0051] The device of the present invention is intended to be part of a member of an automated analyzer system, wherein member means a device, sub-device or modular part that is attached or part of a multi-component analyzer system

[0052] The design of the measurement tool allows to use standard instrument interfaces like alignment features for microfluidic consumables and consumables comprising a pressure plate mechanism. Therefore, the measurement tool of the present invention is suitable to use the same frame as the consumable and comprises features to allow the instrument's pressure plate mechanism to press each single sensor individually towards the operating plate. The sensor array plate contains at least one analog or digital sensor element 5, e.g. a temperature sensor, a nonvolatile memory and in cases of analog sensors an A/D converter. All components are surface mounted devices (SMD) so that the bottom side is completely planar, like microfluidic consumables. The point of measurement is located on a sensor housing bottom first thermal pad 10 (FIG. 1). At least one thermal bridge 25 connects the sensor area with a not solder mask coated second thermal pad 30 on the bottom or opposite side of the circuit board 20 for a good heat transfer. An additional heat transfer foil 35 is used to even surface roughness, optimizes thermal conductivity and insulates electrically (FIG. 1).

[0053] The areas of the sensor array plate 1, where sensors elements 5 are placed are surrounded by a cut out in a way that only a small bridge remains to connect a sensor comprising tongue 6 to the reaming part of the circuit board (FIG. 2). The cut-out represents a kind of a thermal insulation of the area comprising the sensor. The use of a thin material for manufacturing the circuit board of approx. 0.4 mm ensures that each measuring point has a minimized thermal mass. The small bridge also allows a slight individually vertical movement of every sensor tongue.

[0054] The pressure plate comprises fins to ensure good thermal contact between microfluidic consumables and the operating plate without increasing the thermal mass by the pressure plate.

[0055] It is to be noted that each sensor and not the circuit board has to be in thermal contact with the operating plate. Therefore, spacers 55 (FIG. 2) are installed on the surface of the sensor array plate 1 to align with the fins 56 (FIGS. 6A-6C) of the pressure plate. These spacers ensure transfer of the pressure plate force only to tongues comprising a sensor. FIGS. 6B and 6C are magnifications in different views of the part in the circle on FIG. 6A with the two individual thermocycler operating plates 75.

[0056] FIG. 3 shows a pressure plate 50 that is arranged next to two individual thermocycler operating plates 75 and in FIG. 4 is a handle 7 shown that is optional for easier handling of the measurement plate.

[0057] FIG. 5 shows a pressure plate 50 in a view on its underside.

[0058] FIG. 7 shows the arrangement of both parts, a sensor array that is connected by a flat cable with the control electronics. The evaluation electronics is placed in a separated housing with -controller, power conversation and stabilization, memory, sensor array interface, USB interface and CAN interface.

[0059] The control electronic processes the sensor information with the stored calibration data and provides temperature values to the instrument or an external PC via CAN bus, USB or any other suitable interfaces. Power is supplied over a respective interface connector.

[0060] FIG. 8 shows the pressure plate that is attached to the sensor array plate. And the operating plates.

[0061] The advantages of the invention can be summarized as follows: [0062] A separable design allows disjointed transport and storage. [0063] It is possible to change functional components without the need of a new calibration of the whole system. [0064] Calibration data is stored on the sensor array PCB. [0065] It is possible to use different sensor array plates, e.g. with different geometries with one evaluation electronics. [0066] It is possible to change a sensor array plate with an expired calibration with a recently calibrated one without any downtime of the tool. [0067] There is no difference regarding thermal behavior between sensor PCB and operating plate resulting in a similar behavior compared to normal operation. [0068] The use of a pressure plate generates a uniform pressure, no additional weight is necessary. [0069] Using the alignment features, it is simple to place the tool onto the operating plate. [0070] The measurement tool can measure the homogeneity and absolute temperature of the operating plate. [0071] By connecting the tool to the instrument interface, it will be possible to calibrate the operating plate temperature sensors in the field.

[0072] The foregoing description of the preferred embodiment of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed, and modifications and variations are possible in light of the above teachings or may be acquired from practice of the invention. The embodiment was chosen and described in order to explain the principles of the invention and its practical application to enable one skilled in the art to utilize the invention in various embodiments as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims appended hereto, and their equivalents. The entirety of each of the aforementioned documents is incorporated by reference herein.

REFERENCE NUMERALS

[0073] 1 sensor array plate [0074] 5 sensor element [0075] 6 sensor tongue [0076] 7 handle [0077] 10 first thermal pad [0078] 20 circuit board [0079] 25 thermal bridge [0080] 30 second thermal pad [0081] 35 heat transfer foil [0082] 50 pressure plate [0083] 55 spacer [0084] 56 fin [0085] 75 operating plate