Anisotropic conductive film (ACF) with controllable distribution state of conductive substance and manufacturing method thereof

Abstract

The present disclosure relates to an anisotropic conductive film (ACF) with controllable distribution state of conductive substance and a manufacturing method thereof. The ACF includes: a porous template, a plurality of conductive tubes, and an insulation glue layer. A plurality of through holes are configured on the porous template and to penetrate the porous template along a thickness direction of the porous template. Each of the conductive tubes is respectively inserted into one through hole and protrudes from the through hole at both ends, and the insulation glue layer is configured to wrap at least one protruding portion of the conductive tube protruding from the porous template. As such, the distribution state of the conductive tube may be controlled by controlling the density of the through holes within the porous template during the preparation process, and the distribution state of the conductive substances in the ACF may be precisely controlled.

Claims

1. An anisotropic conductive film (ACF) with a controllable distribution state of conductive substance, comprising: a porous template, a plurality of conductive tubes, and an insulation glue layer; wherein a plurality of through holes are configured on the porous template and are configured to penetrate the porous template along a thickness direction of the porous template, each of the conductive tubes is respectively inserted into one through hole and protrudes from the through hole at both ends, and the insulation glue layer is configured to wrap at least one protruding portion of the conductive tube protruding from the porous template; wherein the conductive tube is carbon nanotube (CNT); and wherein a coverage dimension of the insulation glue layer of the porous template for the two opposite sides is less than a dimension of the porous template, and edges of the two opposite sides of the insulation glue layer are retracted with respect to edges of the porous template.

2. The ACF according to claim 1, wherein the insulation glue layer covers two opposite sides of the porous template, and the insulation glue layer completely covers the conductive tubes.

3. The ACF according to claim 2, wherein the through holes are formed on the porous template in an array, and each of the conductive tubes respectively corresponds to one through hole.

4. The ACF according to claim 1, wherein the porous template is made of SiO.sub.2 or porous anodized aluminum.

5. The ACF according to claim 1, wherein the insulation glue layer is an epoxy resin or an acrylic adhesive.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic view illustrating a manufacturing process of an anisotropic conductive film (ACF) in accordance with one embodiment of the present disclosure.

(2) FIG. 2 is a flowchart illustrating a manufacturing method of an ACF in accordance with one embodiment of the present disclosure.

(3) FIG. 3 is a schematic view of an ACF in accordance with one embodiment of the present disclosure.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

(4) The following descriptions for the respective embodiments are specific embodiments capable of being implemented for illustrations of the present invention with referring to appended figures.

(5) Referring to FIG. 1, the present disclosure relates to a manufacturing method of an anisotropic conductive film (ACF), including the following steps.

(6) In step S01, providing a porous template 10 configured with a plurality through holes 100.

(7) In step S02, forming a conductive tube array, wherein each of conductive tubes 20 in the conductive tube array is configured within one through hole 100 of the porous template 10, and two ends of each of the conductive tubes 20 protrude from the through holes 100.

(8) In step S03, coating an insulation glue layer 30 on two sides of the porous template 10 covering the two ends of the conductive tube 20.

(9) In one example, the conductive tube 20 may adopt carbon nanotube (CNT), which is of a coaxial tubular hollow structure formed by winding a graphite layer at a certain angle along a center. A radial movement of electrons in the CNTs is limited, and the movement of the electrons in an axial direction is not limited. That is, the metallic CNTs have excellent axial conductivity. The CNTs also have extraordinary mechanical properties. An elastic modulus of the CNT is about 1 TPa, which is about 5 times that of steel. An elastic strain of CNT is about 5%, however, the fracture process is not brittle fracture, but has certain plasticity, such that the CNT is capable of withstanding the strain by more than 40%. A CNTs array is formed by the plurality of CNTs having the same length-to-diameter ratio, great orientation, and high purity. As such, the CNT is proper to be adopted as an anisotropic conductive composite material of the present disclosure.

(10) In one example, the porous template 10 may be made of SiO.sub.2 or porous anodized aluminum. The porous template 10 may include a limitation structure of the through holes 100 arranged in an array, and the limitation structure is configured to provide a channel limitation during the manufacturing process of the CNT. The conductive tube 20 may be carbon source, such as methane or acetylene, obtained by conducting a chemical vapor deposition (CVD), In one example, the insulation glue layer 30 may be an insulating resin adhesive material suitable for a bonding process, such as an epoxy resin, an acrylic adhesive, or the like.

(11) In step S03, a top and a bottom side of the porous template 10 are coated with the insulation glue layer 30. A thickness of each side of the insulation glue layer 30 is slightly greater than a protruding length of the CNT, and at least one protruding portion of the CNT is buried in the insulation glue layer 30. The through holes 100 are formed on the porous template 10 in an array, and each of the conductive tubes 20 respectively corresponds to one through hole 100. During the manufacturing process, a distribution state of the CNTs array may be controlled by controlling a density of the through holes 100 on the porous template 10, such that a distribution state of the conductive substances in the ACF may be precisely controlled. For example, a pore size and a film thickness of porous anodized aluminum may be controlled by controlling parameters, such as type, concentration, temperature, voltage, and anodization time of reaction liquid, thereby controlling an arrangement of the through holes 100 of the porous template 10.

(12) Referring to FIG. 3, after the manufacturing process is completed, the ACF may include the porous template 10, the plurality of conductive tubes 20, and the insulation glue layer 30. The plurality of the through holes 100 penetrates the porous template 10 along a thickness direction of the porous template 10. Each of the conductive tubes 20 is respectively inserted into one through hole 100 and protrudes from the through hole at both ends. The insulation glue layer 30 is configured to wrap the at least one protruding portion of the conductive tube 20 protruding from the porous template 10. In one example, a surface of the insulation glue layer 30 may not be parallel to the porous template 10. The insulation glue layer 30 may only wrap outer surfaces of each of the conductive tubes 20, however, the present disclosure is not limited thereto. In another example, the insulation glue layer 30 may cover two opposite sides of the porous template 10, which are configured with the through holes 100, and the insulation glue layer 30 may completely cover the conductive tubes 20.

(13) A coverage dimension of the insulation glue layer 30 of the porous template 10 for the two opposite sides is less than a dimension of the porous template 10. Edges of the two opposite sides of the insulation glue layer 30 are retracted with respect to edges of the porous template 10. As such, glue material may be squeezed and spread around under an appropriate pressure to fully bond components, such as chip on film (COF), flexible printed circuits (FPCs), and the like. The CNT penetrates through the surface of the insulation glue layer 30 to electrically connect an upper circuit and a lower circuit. Thus, the ACF may achieve a circuit conduction along the thickness direction of the ACF.

(14) In view of the above, the present disclosure adopts the conductive tubes, with superior axial conductivity, low cost, and easy availability, to form the conductive substance in the through holes porous template. The distribution state of the conductive tube may be controlled by controlling the density of the through holes within the porous template during the preparation process. As such, the distribution state of the conductive substances in the ACF may be precisely controlled

(15) Above are embodiments of the present invention, which does not limit the scope of the present invention. Any equivalent amendments within the spirit and principles of the embodiment described above should be covered by the protected scope of the invention.