HEAT TRANSFER ASSEMBLY

20210088293 ยท 2021-03-25

    Inventors

    Cpc classification

    International classification

    Abstract

    A heat transfer assembly includes a first plate, a second plate, and an engaging unit. The first plate has a first side and a second side, and the second plate has a third side and a fourth side. The third side is attached to the first side, which defines a sealed chamber between the first and second plates. The fourth side has an accommodating portion that is in thermal contact with at least a heat source. The engaging unit is disposed adjacent to the accommodating portion, and engaged with the heat source, thereby allowing the heat transfer assembly to be in direct contact with the heat source. Therefore, a lower thermal resistance can be achieved by the direct contact, and no penetration to the heat transfer assembly prevents the assembly from vacuum leaks.

    Claims

    1. A heat transfer assembly, comprising: a first plate having a first side and a second side; a second plate having a third side and a fourth side, the third side attached to the first side which defines a sealed chamber between the first and second plates, the fourth side having an accommodating portion that is in thermal contact with at least a heat source; and an engaging unit adjacent to the accommodating portion and receiving the heat source therein.

    2. The heat transfer assembly according to claim 1, wherein the first side has a hydrophilic coating.

    3. The heat transfer assembly according to claim 1, wherein a capillary wick is formed on the third side relative to the sealed chamber.

    4. The heat transfer assembly according to claim 3, wherein the capillary wick is any of a mesh structure, fiber structure, and structure having a porous material.

    5. The heat transfer assembly according to claim 3, wherein the capillary wick is formed by electrochemical deposition, electroforming, 3D printing, or printing.

    6. The heat transfer assembly according to claim 5, wherein the material for the electrochemical deposition is any of copper, titanium, aluminum, and a metal with high thermal conductivity.

    7. The heat transfer assembly according to claim 4, wherein the material of the mesh structure is any of copper, aluminum, stainless steel, and titanium.

    8. The heat transfer assembly according to claim 1, wherein the material of the first and second plate are any of copper, aluminum, stainless steel, and titanium.

    9. The heat transfer assembly according to claim 1, wherein the engaging unit is fixed together with the second plate by any of overmolding, welding, adhesively attaching, and hook-and-loop fastener.

    10. The heat transfer assembly according to claim 3, wherein a plurality of protrusions extends from the first side toward the third side, and open ends of the plurality of protrusions is in contact with the capillary wick.

    11. The heat transfer assembly according to claim 1, wherein the engaging unit has a first engaging part, a second engaging part, a third engaging part, and a fourth engaging part, and the heat source is stuck in the first, second, third, and forth engaging parts.

    12. The heat transfer assembly according to claim 1, further comprising an engaging element, wherein the engaging element is a pair of dovetail keys and disposed around the perimeter of the heat source, the engaging unit is a pair of dovetail grooves, and the pair of dovetail keys of the engaging element is engaged with the engaging unit.

    13. The heat transfer assembly according to claim 1, wherein the perimeter of the heat source is formed with a plurality of holes through which open ends of the engaging units pass, and c-type retaining rings secure the open ends in place.

    14. The heat transfer assembly according to claim 1, wherein the engaging unit has a passing hole through which the first and second plates pass, one side of the engaging unit has at least a projection, and at least a hole is disposed around the perimeter of the heat source that allows the at least a projection to pass through.

    15. The heat transfer assembly according to claim 1, wherein the engaging unit is integrally formed with the second plate.

    Description

    BRIEF DESCRIPTION OF THE DRAWINGS

    [0010] FIG. 1 is an exploded perspective view of a first embodiment of a heat transfer assembly of the present invention;

    [0011] FIG. 2 is a side cross-sectional view of the first embodiment of the heat transfer assembly of the present invention;

    [0012] FIG. 3 is a side cross-sectional view of a second embodiment of the heat transfer assembly of the present invention;

    [0013] FIG. 4 is a side cross-sectional view of a third embodiment of the heat transfer assembly of the present invention;

    [0014] FIG. 5 is an exploded perspective view of a fourth embodiment of the heat transfer assembly of the present invention;

    [0015] FIG. 6 is a side cross-sectional view of a fifth embodiment of the heat transfer assembly of the present invention;

    [0016] FIG. 7 is an exploded perspective view of a sixth embodiment of the heat transfer assembly of the present invention;

    [0017] FIG. 8 is an exploded perspective view of the sixth embodiment of the heat transfer assembly of the present invention;

    [0018] FIG. 9 is a top view of a conventional heat transfer device; and

    [0019] FIG. 10 is a side cross-sectional view of the conventional heat transfer device.

    DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

    [0020] FIGS. 1 and 2 are exploded perspective view and side cross-sectional view of a first embodiment of a heat transfer assembly of the present invention, respectively. As shown in the FIGS., heat transfer assembly 1 includes a first plate 11, a second plate 12, and an engaging unit 13.

    [0021] The first plate 11 has a first side 111 and second side 112, which are defined by the upper and lower sides of the first plate 11, respectively.

    [0022] The second plate 12 has a third side 121 and fourth side 122. The third side 121 is attached to the first side 111, which defines a sealed chamber 14 between the first and second plates 11 and 12. The fourth side 122 has an accommodating portion 123 in thermal contact with at least a heat source 2.

    [0023] The engaging unit 13 is disposed adjacent to the accommodating portion 123 to receive the heat source 2 therein. In this embodiment of the present invention, the engaging unit 13 is formed with a first engaging part 131, second engaging part 132, third engaging part 133, and fourth engaging part 134. The engaging unit 13 is integrally extended from the fourth side 122 of the second plate 12, or disposed on the fourth side by any of overmolding, welding, adhesively attaching, and hook-and-loop fastener.

    [0024] The first, second, third, and fourth engaging parts 131, 132, 133, and 134 are disposed adjacent to the heat source 2, and enables the heat source 2 to be stuck therein.

    [0025] The first and second plates 11 and 12 are formed from any of copper, aluminum, stainless steel, and titanium, and the first plate 11 can be formed from a material the same as or different from the second plate 12.

    [0026] A hydrophilic coating 141 is coated on the first side 111 of the first plate 11 relative to the sealed chamber 14, thereby improving the efficiency of the vapor-liquid flow of working fluids inside the sealed chamber 14.

    [0027] FIG. 3 is a side cross-sectional view of a second embodiment of the heat transfer assembly of the present invention. As shown in the FIG., some structures of this embodiment are the same as the above-mentioned first embodiment, and here are not described again. The difference between this embodiment and the first embodiment is that the third side 121 of the sealed chamber 14 has a capillary wick 4. The capillary wick 4 can be any of a mesh structure, fiber structure, and structure having a porous material. In an embodiment where the capillary wick 4 is the structure having a porous material, the wick can be formed locally or in a stacked way by electrochemical deposition, electroforming, 3D printing, or printing.

    [0028] In an embodiment where the structure having a porous material is formed by the electrochemical deposition, the material thereof is any of copper, titanium, aluminum, and a metal with high thermal conductivity.

    [0029] In an embodiment where the capillary wick is the mesh structure, the material of the wick is copper, aluminum, stainless steel or titanium, or combination thereof.

    [0030] FIG. 4 is a side cross-sectional view of a third embodiment of the heat transfer assembly of the present invention. As shown in the FIG. 4, some structures of this embodiment are the same as the above-mentioned second embodiment, and here are not described again. The difference between this embodiment and the second embodiment is that a plurality of protrusions 123 extends from the first side 111 of the first plate 11 toward the third side 121 of the second plate 12 with their one side, and are in contact with the capillary wick 4 that is formed on the third side 121. Also, the other side of the plurality of protrusions 123 is recessed.

    [0031] FIG. 5 is an exploded perspective view of a fourth embodiment of the heat transfer assembly of the present invention. As shown in the FIG. 5, some structures of this embodiment are the same as the above-mentioned first embodiment, and here are not described again. The difference between this embodiment and the first embodiment is that an engaging element 3 is disposed around the perimeter of the heat source. In this embodiment, the engaging element 3 is a pair of dovetail keys, and the engaging unit 13 is a pair of dovetail grooves, so that the pair of dovetail keys of the engaging element 3 can be engaged with the engaging unit 13.

    [0032] FIG. 6 is a side cross-sectional view of a fifth embodiment of the heat transfer assembly of the present invention. As shown in the FIG. 6, some structures of this embodiment are the same as the above-mentioned first embodiment, and here are not described again. The difference between this embodiment and the first embodiment is that the perimeter of the heat source 2 is formed with a plurality of holes 21 through which each open end of the engaging units 13 passes, and a c-type retaining rings 5 are used to prevent the engaging parts from moving.

    [0033] FIGS. 7 and 8 are exploded perspective views of a sixth embodiment of the heat transfer assembly of the present invention. As shown in the FIGS. 7 and 8, some structures of this embodiment are the same as the above-mentioned first embodiment, and here are not described again. The difference between this embodiment and the first embodiment is that the engaging unit 13 has a passing hole 136 through which the first and second plates 11 and 12 pass, and one side of the engaging unit 13 has at least a projection 137. Also, at least a hole 21 is disposed around the perimeter of the heat source 2 that allows the at least a projection 137 to pass through.

    [0034] The main purpose of the present invention is to provide a heat transfer assembly having a vacuum chamber that can be engaged with a heat source by the engagement between engaging unit 13 and the engaging element 3 without penetrating the chamber. Accordingly, the vapor-liquid flow of working fluids inside the heat transfer assembly is not blocked and kept advantageous circulation. In addition, the efficiency of the vapor-liquid flow of working fluids inside the heat transfer assembly can be improved by the combination of the hydrophilic coating and capillary wick.