Three Dimensional Thermoforming and Lamination

Abstract

A system and method for forming plastic sheet into a three-dimensional shape. The plastic sheet may include one or more sheet-mounted components, such as electronics, that must be shielded from excessive heat, pressure, and/or crushing when the formation of the sheet occurs. A recess will be formed to protect against directly contacting sheet-mounted component. The recess may be aligned along the heating plate and/or the form core and/or along a protective blanket which may be set over (and under) sheet prior to heating/forming. The sheet is registered (with or without a blanket) onto a base plate, and preferably over a form core. The sheet is then raised to contact with a heating plate, and then placed downward over the (optionally heated) form core. Recess(es) align in locations corresponding to mounted component to protect same.

Claims

1. An apparatus for producing a three-dimensional thermoformed plastic form, said apparatus comprising: (a) a sheet of plastic material, said sheet comprising a top surface and a bottom surface, said sheet further comprising at least one electronic component disposed upon at least one of said top and bottom surfaces, said at least one electronic component set in at least one predetermined location; (b) a form core, said form core comprising at least one cavity, said cavity positioned on a surface of said form core in a predetermined position corresponding with the predetermined location on said sheet; (c) a first platen comprising a heating element, said first platen comprising a heating surface; (d) a source of differential pressure in fluid communication with a space between said first platen and said sheet; and (d) a second platen supporting said form core.

2. The apparatus of claim 1 further comprising complementary registration elements on opposing surfaces of said first and second platens.

3. The apparatus of claim 1 further comprising a second source of differential pressure in fluid communication with said space.

4. The apparatus of claim 1 further comprising an air gap formed within said cavity, said air gap set between said form core and said sheet directly opposite said predetermined location as between said form core and said sheet when said first differential pressure is applied.

5. The apparatus of claim 4 wherein said electronic component is positioned within said air gap.

6. The apparatus of claim 1 wherein said first platen comprises an extending surface; said second platen adapted to mate with said extending surface of said first platen to form a continuous compressible seal disposed between said first platen and said second platen around said form core; said continuous compressible seal extending laterally circumferentially around said form core; said continuous compressible seal being adapted to bear against said sheet and effect a seal between said first platen and said second platen upon compression of said continuous compressible seal.

7. The apparatus of claim 1 further comprising a blanket set between said sheet and said heating surface.

8. The apparatus of claim 7 wherein said blanket comprises at least one relief corresponding with the predetermined location.

9. An apparatus for producing a three-dimensional thermoformed plastic form, said apparatus comprising: (a) a sheet of plastic material, said sheet comprising at least one sheet-mounted component disposed thereon in at least one predetermined location; (b) a form core; (c) a first platen comprising a heating element, said first platen comprising a heating surface, said heating surface comprising at least one cavity, said cavity positioned on a surface of said heating surface in a predetermined position corresponding with the predetermined location on said sheet; (d) a source of differential pressure in fluid communication with a space between said first platen and said sheet; and (d) a second platen supporting said form core.

10. The apparatus of claim 9 further comprising complementary registration elements on opposing surfaces of said first and second platens.

11. The apparatus of claim 9 further comprising a second source of differential pressure in fluid communication with said space.

12. The apparatus of claim 9 further comprising an air gap formed within said cavity, said air gap set between said heating plate and said sheet directly opposite said predetermined location as between said heating plate and said sheet when said first differential pressure is applied.

13. The apparatus of claim 12 wherein said electronic component is positioned within said air gap.

14. The apparatus of claim 9 wherein said second platen adapted to mate with a lower portion of said first platen to form a continuous compressible seal disposed between said first platen and said second platen and extending laterally circumferentially about said heating surface; said continuous compressible seal adapted to bear against said sheet and effect a seal between said first platen and said second platen upon compression of said continuous compressible seal.

15. The apparatus of claim 9 further comprising a blanket set between said sheet and said heating surface.

16. The apparatus of claim 15 wherein said blanket comprises at least one relief corresponding with the predetermined location.

17. The apparatus of claim 9 wherein said cavity comprises an edge adapted to make initial contact with said sheet, said initial contact disposed around said component.

18. The apparatus of claim 9 further comprising a blanket set between said sheet and said heating surface.

19. The apparatus of claim 18 wherein said blanket comprises at least one relief corresponding with the predetermined location.

20. A method of thermoforming a sheet of plastic material having at least one sheet-mounted component disposed thereon into a three-dimensional formed part without compromising function of the component, said method comprising the steps of: (a) registering a plastic sheet having at least one sheet-mounted electronic component; (b) defining at least one predetermined location in an X-Y plane corresponding to the at least one sheet-mounted electronic component relative a first platen in said step of registering: (c) aligning the at least one predetermined location over at least one cavity formed in a form core; (d) providing an air gap disposed around the at least one predetermined location the component; (e) heating a heating surface in the first platen over the sheet to at least a deformation temperature of the plastic sheet; (f) forcing at least portions of the plastic sheet up and against the heating surface, so the plastic sheet is into contact with the heated platen to transfer heat to the sheet; (g) removing the plastic sheet from the heating surface; (h) drawing the plastic sheet over the form core while maintaining the air gap.

21. The method according to claim 20 further comprising the step of: (i) laminating an electronic component onto a sheet via adhesive prior to said step (a) of registering.

22. A method of thermoforming a sheet of plastic material having at least one sheet-mounted component disposal thereon into a three-dimensional formed part without compromising function of the component, said method comprising the steps of: (a) registering a plastic sheet having at least one sheet-mounted electronic component; (b) defining at least one predetermined location in an X-Y plane corresponding to the at least one sheet-mounted electronic component relative a first platen in said step of registering; (c) aligning a cavity in a heating surface of the first platen over the at least one predetermined location; (d) heating a heating surface in the first platen over the sheet to at least a deformation temperature of the plastic sheet; (e) forcing at least portions of the plastic sheet up and against the heating surface, so the plastic sheet is into contact with the heated platen to transfer heat to the sheet, while maintaining the air gap disposed around the at least one predetermined location the component; (f) removing the plastic sheet from the heating surface; (g) drawing the plastic sheet over the form core to thermoform the plastic sheet into a three-dimensional shape.

23. The method according to claim 22 further comprising the step of: (i) laminating an electronic component onto the plastic sheet via adhesive prior to said step (a) of registering.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be described with greater specificity and clarity with reference to the following drawings, in which:

[0019] FIG. 1 illustrates a top view of a male form core of an embodiment of the present invention.

[0020] FIG. 2 illustrates a side view of a male form core of an embodiment of the present invention as shown in FIG. 1.

[0021] FIG. 3 illustrates a top view of heating platen of an embodiment of the present invention.

[0022] FIG. 4 illustrates a side view of a heating platen of an embodiment of the present invention shown in FIG. 3

[0023] FIG. 5 illustrates a further side view of a heating platen an embodiment of the present invention shown in FIG. 3.

[0024] FIG. 6 cross-sectional view along line 6-6 of the heating platen embodiment shown in FIG. 3.

[0025] FIG. 7 a perspective top view of a base plate of an embodiment of the present invention.

[0026] FIG. 8 a perspective bottom view of a heating platen of an embodiment of the present invention.

[0027] FIG. 9 is a top view of a male form core and base plate of an embodiment of the present invention.

[0028] FIG. 10 is a side separated cross-sectional view of the form core and base plate of an embodiment of the present invention along line B-B of FIG. 9.

[0029] FIG. 11 is a side separated cross-sectional view of the form core and base plate of an embodiment of the present invention along line C-C of FIG. 9.

[0030] FIG. 12 is a perspective separated view of the bottom of the form core and base plate of an embodiment of the present invention shown in FIG. 9.

[0031] FIG. 13 is a perspective separated view of the top of the form core and base plate of an embodiment of the present invention shown in FIG. 9.

[0032] FIG. 14 a perspective view of the top of a finished formed product of an embodiment of the present invention.

[0033] FIG. 15 a perspective view of the bottom of a finished formed product of an embodiment of the present invention.

[0034] FIG. 16 demonstrates a top view of a raw sheet of an embodiment of the present invention.

[0035] FIG. 17 demonstrates a top view of a blanket of an embodiment of the present invention corresponding generally to the complimentary sheet of FIG. 16.

[0036] FIG. 18 demonstrates a perspective partially exploded view of a sheet and complementary blanket of an embodiment of the present invention.

[0037] FIG. 19 demonstrates a cross-sectional exploded side view of a blanket and sheet of an embodiment of the present invention.

[0038] FIG. 20 demonstrates a cross-sectional exploded side view of a blanket and sheet of an alternative embodiment of the present invention.

[0039] FIG. 21 demonstrates a cross-sectional view of a recess and sheet with electronics of an embodiment of the present invention.

[0040] FIG. 22 demonstrates a cross-sectional view of a recess and sheet with electronics of an embodiment of the present invention.

[0041] FIG. 23 demonstrates a cross-sectional view of a recess and sheet with electronics of an embodiment of the present invention.

[0042] FIG. 24 demonstrates a cross-sectional view of a recess and sheet with electronics of an embodiment of the present invention.

[0043] FIG. 25 demonstrates a top planar view of a first laminating fixture of an embodiment of the present invention.

[0044] FIG. 26 demonstrates a top planar view of a first laminating fixture with adhesive set in a recess of an embodiment of the present invention.

[0045] FIG. 27 demonstrates a side cross-sectional view of a fixture with sheet and roller applied thereon of an embodiment of the present invention.

[0046] FIG. 28 demonstrates a top planar view of a first laminating fixture with adhesive and sheet of an embodiment of the present invention.

[0047] FIG. 29 demonstrates a planar view of a sheet with adhesive set thereon of an embodiment of the present invention.

[0048] FIG. 30 demonstrates a top planar view of a second laminating fixture of an embodiment of the present invention.

[0049] FIG. 31 demonstrates a perspective view of an electronic circuit and components of an embodiment of the present invention.

[0050] FIG. 32A demonstrates a side cross-sectional view of a fixture with sheet and roller applied thereon of an embodiment of the present invention.

[0051] FIG. 32B demonstrates top planar view of a second laminating fixture with sheet of an embodiment of the present invention.

[0052] FIG. 33 demonstrates a planar view of a sheet with electronics set thereon of an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0053] The process for forming plastic sheeting utilizing air pressures to conform the plastic sheeting to a form core is as follows. A tool is mounted onto a table, the tool preferably having a form core imparted thereon. The form core may be set upon a lower platen (or base plate), may be formed within the base plate, or may be complimentary fitted into the base plate. Plastic sheeting, or a plastic sheet, is placed upon the tool, over the form core and at least portions of the base plate. Typically, the form core (or more usually the base plate) will include registration pins (or bosses) to mate with complimentary apertures within the plastic sheet so as to ensure proper alignment of plastic sheet over a form core and base plate. Plastic sheeting of the present invention will often include onboard electronics including but not limited to items such as conductive glue, conductive ink, insulation, graphics, indicia, resistors, or larger embedded electronics such as connection boxes, conductive ink strips, pushbuttons, LEDs, haptic feedback devices, cameras, MEMS, Bluetooth (and other wireless communication receivers and/or emitters), proximity sensors, near-field communications equipment, fingerprint sensors, temperature sensors, microphones, mirrors, microchips, RAM, FCB (flexible circuit board), and adhesives. Generally referring to these electronic components, the term electronic or electronics Or electronic components may be used interchangeably.

[0054] In order to ensure that the electronics are not compromised, or otherwise damaged, when forming the plastic sheet, recesses will be placed within the heating apparatus, or forming apparatus, to prevent direct heating on the sheet where electronics are located. Conversely, the form core will include recesses, or both the platen and form core can include complementary or alternating recesses. In most embodiments, a heat platen is placed above the sheet mounted on the base plate, and the heat platen is heated high enough to cause plastic deformation of the plastic sheeting. Typically, the heat platen is made of aluminum, which can be heated in excess of 450 degrees Fahrenheit to achieve a heated sheet of approximately between 150- and 450-degrees Fahrenheit.

[0055] When recesses are provided on the exterior surface of the form core, this may be used to protect larger electronics on the bottom surface of the sheet, so as to (potentially allow the sheet to be heated upon contact with the heating platen, and) protect the on board electronics from being crushed or otherwise compromised via deformation of the plastic sheet directly adjacent to the electronics when the sheet is lowered (and deformed) over the form core. When a recess (or relief) is provided in the heating platen, the larger onboard electronics may be placed on the top side of the plastic sheet so as to prevent heating at (and around) the electronics against the heating platen, and to otherwise prevent crushing or compromising of the top mounted electronics. Larger electronics can be provided on both top and bottom of sheet, and recesses may be formed in heating platen and form core in aligning locations, and/or offset locations.

[0056] In some embodiments, the table will rise to match the tool with the top heating platen. A heating surface (such as a heating plate) in the heating upper platen will directly contact (at least) portions of the plastic sheeting material to impart heat thereon. The heating platen will include a section (preferably a cavity) with the heating platen to fit the plastic sheet thereon. Air pressure can push the plastic sheet up to the heating platen, such air pressure supplied via apertures in the base plate, form core, or through the form core, for air pathways in the form core and/or around the form core to force the plastic sheet up into the heating platen to cause the heating surface to impart heat onto the plastic sheet.

[0057] Often, the heating surface will be coated with a material to prevent sticking, such as TEFLON or other like substance, and/or may have a surface that is not entirely flat that may be sandblasted, for instance using 1-4 micron sandblasting surface structure to provide dual purpose of preventing air escape while also preventing sticking of the sheet onto the platen. Air pressures used may be between one and ten bars of pressure. Optionally, the lower tool may also be heated to a lower temperature, such as 140-300 degrees F., to provide better definition when forming the plastic. The heating process can take from one second to sixty seconds depending on temperatures, thickness of sheet, etc. Pressure is then applied through the heating platen (above the sheet) to force the plastic sheet down onto the base plate and form core. This pressure may be from high pressure systems above the sheet or a vacuum provided below the sheet. The pressure is then exhausted and the platens are separated so as to access the sheets for removal etc.

[0058] The present invention is directed to 3D forming of thermoform plastics with electronic components embodied thereon. The electronic components can be formed or placed on the plastic sheet prior to forming by using this method and system. The system allows the plastic sheet to include embedded electronics and/or printed graphics and/or printed circuitry (such as via conductive ink), in or on a formed flat sheet. Use of conductive inks may cause the plastic sheet system to be thicker providing a 3D surface features upon the plastic sheeting. Once formed, the system should provide for a formed conductive circuitry within a specific resistance range. Certain circuitry will be formed and the stretching of the conductive inks or other circuitry may require a thicker conductive ink and/or circuitry that can be stretched, folded, etc. while still maintaining specific resistance properties.

[0059] In the embodiment shown in FIG. 8, the upper heating platen will include reliefs to avoid heating electronic components, such as LEDs, or crushing when a form core is pressed thereon with an electronic component carrying plastic sheet. The reliefs (or recesses) will match the pattern of the electronic components placed on the sheet over the form core. Therefore, the electronics are protected from damage and direct heating on the platen. The reliefs are sized such as they can surround the electronic component on the plane of the sheet, and may provide adequate spacing to prevent heating the electronic components laterally through the sheet. Air gaps will form within the recesses so as to prevent direct heating from the platen onto the electronic component, while the air serves as a resistance or gas shield to insulate or prevent excessive and quick heating of the electronic components embodied thereon. The gas bubbles formed with the recesses provide insulation to protect the electronic components.

[0060] The recesses may be round and/or may be shaped to provide protection of the electronic components thereon. Alternatively, if the location is meant to be deformed, such as along a sidewall, the recess may be shaped in alternative shapes to provide for a final shape as-is known in the art (tear drop, partial lunar, etc.). Typical depth may be between 0.016 to 0.18 inches. The planar size of the recess should be at least 4% larger in diameter than any electronic component thereon and may be as large as 10% or 15% larger than the components thereon so as to allow for proper forming of the plastic. The recess may include further non-stick material such as TEFLON, ceramic, or silicon or other insulators embedded within, or around, the recess so as to further insulate the electronic component. It is possible that an O-ring may be used around the recess to protect more sensitive and/or larger electronic components on the plastic sheeting. Conductive ink will allow for structures such as capacitive switches, or capacitive strips, where no mechanical switch is required. Haptic notification may be provided by further electronic components on the plastic sheeting.

[0061] Certain challenges with providing the safety and security of the electronic components on the plastic sheeting include providing the appropriate capacitance and/or resistance of conductive inks or other components on the plastic sheeting that will continue to work after deformation. Further, it is imperative that the plastic sheets be printed in a very repeatable manner where the location of various electronic components is positioned in the exact same location for industrial repeated forming of consecutive sheets. For instance, changes in location as small as 0.1 millimeters can affect the heating, and therefore integrity, of the electronic component. Adhering glue may be used to bond electronic components on the plastic sheeting prior to forming. There is an issue where the glue can heat up, transfer heat, or otherwise combust, causing issues with electronic components. Certain conductive epoxies are used to encapsulate electronic components that are 3-dimensional, or otherwise extend beyond the flat surface of the plastic sheet. The amount of conductive epoxy used is imperative. Distortion may also occur upon forming and this must be taken into account when printing the various electronic components and circuitry on the plastic sheeting to accommodate the new 3-dimensional form. Various attributes will be managed such as the shape of the recess holes. For instance, a circular hole may be used as the recess or relief; however, a distorted hole, for instance a lunar shape may be necessary to provide for a more rounded shape in the final distorted form. As conductive ink bends in the deformation process, the movement of the circuit must be understood and repeatable from part-to-part on cycle-to-cycle so that the resistance of the circuitry remains within predefined requirements.

[0062] Referring to FIGS. 1 and 2, a male form core is show as a removable model piece that can be fit onto a base plate. Form core 20 includes features 21, or shape that can be customized in many shapes, particularly useful for boards, panels, covers, etc. Form core 20 includes side walls 24, which are shown sloping or angled from top surface 22. Form core 20 includes top edge 26 forming the boundary between top surface 22 and side wall 24. A further bottom edge 27 forms the lower end of form core and may provide for gap venting through a base plate as is known in the art. Registration bosses 28 may be provided on the bottom side 128 of form core to allow registration with the base plate (not shown). Top plateau 23 is shown flat, and will align mostly parallel with a platen surface. When a plastic sheet (not shown) is placed on the form core, the form core top plateau preferably will not mate with the top platen for heating, and a force, such as air pressure from below, or vacuum from the top, will the sheet to the platen. A reverse force will then draw the sheet down over the form core.

[0063] To avoid damaging electronic embedded, carried, glued, or otherwise along the sheet, recesses 60 will form one the top surface 22 of form core 20. Recess provide form a removed space form the top surface of the form core to allow space for portions of the sheet (not shown) to be removed from direct contact with the surface of the form core. Recesses 60 include a recess edge 62 defining the scope and/or shape of the recess. Recesses 60 include recess edges 62 that are shaped to mate with the sheet without causing damages to guarded electronics. Recess corners 61 may be other contours due to the air gap preventing the recess corner form mating with sheet (further depicted with reference to FIGS. 21-24).

[0064] Referring to FIGS. 3-6, the top platen used for heating is shown. Platen 10 includes cavity 12 located where a form core will sit, and where a sheet will meet platen 10. Platen 10 includes side edges 118. Perimeter surface 13 will meet with lower base plate (not shown) to provide for a seal. Through platen, mounting clamp sites, or probe holes 18, allow the platen to be mounted to a heating source (not shown). Further, when probe holes are used, a probe may be inserted into the platen to determine/monitor characteristics, such as the temperature of the platen. Heat energy can then be transferred to sheet for thermoforming. Air pressure is provided (and/or vacuum) via air pressure channel(s) 19. Platen 10 may include air holes 15 around perimeter 13 of cavity 12 to provide air pressure over the sheet. Air holes 15 are preferably sized approximately on the order of one-mm in diameter on exposure to cavity, but may be sourced from larger air pressure conduits. Air holes 15 may be placed on the platen cavity surface or placed over locations in the form core that will eventually be removed (cut away) form the final formed sheet product.

[0065] As shown in FIGS. 7 and 8, and alternative embodiment is shown for the female form core (or cavity). FIG. 7 demonstrates the lower body base plate 30 with a cavity 32 providing for the form core to form a plastic sheet. Cavity includes groove 33 though which air holes may be used to draw and push air so as to manipulate each sheet. Registration pin guides 35 are provided to register the sheet within cavity 32. Bolts 31 are provided to place and secure base plate 30 on a table. In this embodiment, form core may be used as a female cavity form core. FIG. 8 demonstrates the complementary alternative platen 10A with recesses 14 in cavity 12 to provide for protection of plastic sheet mounting/applied electronics. Perimeter surface 13 is provided wherein surface 137 with surface 139 on base plate to provide seal with plastic sheet set there between. Air channels 19 are provided as described above.

[0066] As can be seen in FIGS. 9-13, base plate 30 may be provided for a male form core. Form core 20 fits into base plate 30 within cavity 32. Form core 20 may be situated via registration indentations 35 on base plate 30 to mate with complementary registration bosses 28 on form core 20. In some instances, it is preferable to heat the base plate and/or the form core to provide for detailed forming of a sheet. In other embodiments, the material of the form core may be made of an air permeable material as is known in the art, such as a composite material made of aluminum granules and epoxy resin, aluminum crystals, matrices, etc., to allow for air flow through form core to provide for pressures to be directed to a sheet laid thereon and to provide more directed pressuring of sheet through form core. While the platen is preferably made of a heat conducting material, such as solid aluminum, the form core may be made from a metal, air permeable material, or any other rigid material, such as a hard plastic (3-D printed), etc.

[0067] Base plate 30 may include a variety of air pathways 119 accessing cavity 32 via air holes 38a spread over top surface of base plate. Preferably, all air holes 38a combine under surface 100 to join air pathways 119 along bottom surface 127. Under form core 20, base plate 30 may include larger air pathways 119 which may run along a gap vent 138 along the bottom edge 27 of form core 20. Recesses 60 may be formed in form core 20 to provide for access to electronics so as to prevent crushing electronics borne on a plastic sheet (for forming).

[0068] As can be seen particularly in FIGS. 10 and 11, air is vented from base plate 30 via air holes 102 which expand from front 106 of hole to hole width along center 103 of hole and onto wider air channel 119. By providing small front holes, the force of the air pathway vacuum/pressure may be mollified and/or better distributed throughout base plate so as not to unnecessarily distort sheet, and provide a uniform pressure/vacuum along sheet of forming, etc.

[0069] As can be seen more particularly in FIGS. 21-24, the recess is shown in cross-section in detail. Recess 60 may include a curved recess edge 62, so as not to cause crimping or otherwise leave fold marks, or tear the sheet at the recess location. The gradual rise of the recess edge 62 allows for proper forming around a three-dimensional mounted electronic unit, such as an LED 76 as shown in this example. An optional O-ring 66 may be included next to or instead of the gradual recess edge 62 to provide additional protection to electronics. The top of recess 60 may include harsher corners 61 which will not mate or otherwise directly interact with sheet. Insulation 57 may be provided around, under, over, the electronic component. Further, conductive inks 56 may be provided to attach LED to circuitry on board the plastic sheet. Conductive epoxy may be provided around the electronic component to encapsulate same and provide for better electrical contact. The space provided from recess top wall 84 to recess walls 86 and sheet or components thereon will typically be filled with ambient gas trapped thereon during the heating and/or forming process providing an air gap 82. Air gap 82 provides for temporary insulation to prevent heat transfer to locations on sheet relative to recesses.

[0070] As can be seen on the finished product model shown in FIGS. 14 and 15, formed sheet 71 includes electronics 70. Sheet may define an X-Y plane upon which locations of electronics disposed thereon may be understood (even though the electronics represent rising items in three-dimensions). Each component defines a specific location relative the X-Y plane. These locations can be used to identify the location on the platen or mold to form appropriate recesses in the mold/platen. The term location used herein is specific to the location of the electronic component on the sheet.

[0071] Circuity 74 may be printed via a conductive ink. Circuitry may be molded and/or deformed. It is important to compensate for the reshaping, stretching, and deformation of the sheet when determining the thickness and shape of the applied circuitry poor to formation on the raw sheets. Other components, such as LEDs 76 and resistors 80 may be protected by recesses in the form core or platen. A connector 74 may be used to control the various on-board, or off-board connected products. Capacitance strips 72, or embedded buttons may be used.

[0072] FIG. 16 demonstrates a top view of a raw (preferably planar) sheet with surface mounted components and other printed features (such as electronic conductive ink circuitry 174, etc.). The sheet is preferably made of a petroleum-based plastic, but may be comprised of any material useful for (de)formation into a final (or intermediate) product. The sheet must be deformable into a three-dimensional shape. Sheet 210 includes registration points 220 which may include apertures for receiving registration pins (such as registration pins on a base plate) (not shown). Mounted components 176 may include any of the various electronic components, but are not limited to electronic components when additional features are intended to be protected from heating and direct pressure. Other electronic features 172 may be included on sheet, such as an electronic connector 180 which may be useful to attach and connect a formed final product to further electronic devices.

[0073] FIG. 17 demonstrates a complimentary blanket 200 for use and placement over the sheet of FIG. 16 when the heating and/or forming process is applied to sheet. Similarly, blanket 200 includes registration points 220A. Preferably, registration points 220A correspond with the two-dimensional location of registration points of the sheet, thus a single pin may register through both the sheet and blanket and further serve to align components 176 with reliefs 214 found in blanket 200. Reliefs 214 may include apertures sitting over (and around) surface mounted components on the sheet. Reliefs may also include indentations on the underside of the blanket to provide a space into which the components may fit, or otherwise provide for protection against direct contact with a heating platen. Blanket may be formed of any material which is useful as a physical barrier between the sheet and heating platen. Preferably, blanket 200 is made from a thermally conductive, material, such as silicone rubber, polymers, elastomers, etc. that will allow the sheet portions in contact with the blanket to be heating via direct heat to the blanket, whereby the blanket directly contacts the sheet. The relief portions provide shielding, and prevent direct contact heat from reaching the corresponding locations on the sheet and any electronic components which may sit at those locations. For larger reliefs, blanket 200 may include support beams 225 which may or may not have the same uniform thickness with other portions of the blanket. Support beams 225 may also be positioned between larger (or more prominent) components mounted on the sheet (such as between electronic pin connectors). Further, blanket may be comprised of a thin-film layer including apertures, such as thermally conductive polyester. The blanket may be separately attached via registration, or adhered to the sheet, or otherwise held together via electrostatic attraction, or static cling (as is known in the art). The blanket may be peeled, or otherwise removed, from the sheet post-forming. Blanket may be laminated onto sheet, as is known in the art. Blanket may be adhered to sheet, preferably via low tack adhesive. In such a manner, the blanket may be a one-time use disposable blanket, as opposed to a more reusable blanket discussed above.

[0074] As can be seen in FIG. 18, blanket 200 fits above sheet 210 when the heating platen is provided from above. Blanket may include aperture reliefs 214 and registration points 220. Reliefs 214 correspond in two-dimensional location with on-board components 176 on sheet 210. Registration points 220 are provided to assist in aligning blanket and sheet, together, and may also provide for alignment with a form core or base plate (not shown).

[0075] As shown in FIGS. 19 and 20, blanket 200 fits over sheet 210. Heating platen 10 (shown only by direction) sits over blanket 200, while the form core 20 or base plate sits below. Blanket may include lower surface 230 for direct contact with top surface 231 of sheet 210. In some embodiments, the coefficient of thermal expansion will differ as between blanket and sheet. Therefore, blanket lower surface 230 may be adapted to slide in communication with sheet top surface 210 as may be necessary to retain position of relief(s) over sheet-mounted components. When the coefficient of thermal expansion of the blanket greatly differs from the coefficient of thermal expansion of the sheet, the size of the relief relative to the size of the sheet-mounted component may be modified accordingly so as to avoid tears in the blanket or prevent excessive relief area over portions of the sheet that are to be formed. Blanket 200 may include a first thickness 201 to provide for the physical barrier and transfer of heat energy to sheet 210 as intermediary from heating platen. A cap 202, or thin portion of sheet, may form over the corresponding sheet mounted component 176 to provide an air gap over the component to trap gas between blanket 200 and sheet 210, and thus form relief 214A. Cap 202 will have a thickness less than the main sheet thickness 201. A second blanket (with or without reliefs) may be included between the sheet and form core. When the reliefs are preferably on the underside formed sheet, a single blanket may be used under the sheet between sheet and form core.

[0076] In further embodiments, such as embodiment shown with a thinner sheet 210A in FIG. 20, blanket 200 may include a relief 214 as an aperture 204 in blanket 200. In such an instance, an air gap will form between platen and sheet, while blanket 200 provides physical barrier to remove the sheet 210A from the platen 10 and otherwise impart heat to portions of the sheet that are in direct contact with blanket 200. On board components 176 may include conductive inks 56 or other shielding or conductive features that may or may not exceed the width of the relief 214.

[0077] As shown in FIGS. 25-32, a lamination process may be utilized to prepare a sheet with on-board electronics that may later be thermoformed in the manner described above. Preferably a plastic sheet is used made of a polycarbonate material. Polycarbonate sheets of MAKROLON resins are preferred as these polycarbonate sheets are robust, lightweight, transparent and impact resistanteven at low temperatures. This polycarbonate formulations have high dimensional stability and are more easily molded than other plastics, and maintain a heat resistance until deformation temperatures starting around three hundred degrees Fahrenheit. Any clear transparent extruded polycarbonate film can be useful, especially with an acrylic functional layer.

[0078] The film may include a UV protection additive. The acrylic on the top surface offers improving scratch resistance while the polycarbonate back surface provides excellent printability. The combination of the acrylic functional layer and the polycarbonate layer overcomes the low impact resistance known in acrylic or polymethyl methacrylate (PMMA) films. The UV protection benefits a low change in the yellowness index. Preferred thickness is around 300 m, and may range from 175 to 635 m, with roughness preferably less than 0.5 m on a smooth side. Alternatively, a clear polyester sheet may be used that has high chemical and scratch resistance properties. A further type of sheet contemplated would be a high-strength clear acrylic film with thicknesses in the range of 50 to 750 m. The property sheet film type is determined based on the application and end product needs. Possible sheets with plasticization properties include rigid vinyl thermo-formed at (low to high) 220 to 250 F, acrylic PMMA formed at 290 to 320 F, polycarbonate formed at 305 to 350 F, and Polyester formed at 340 to 390 F.

[0079] When preparing a sheet with lamination, pressure sensitive adhesives, as are known in the art, are preferred. When working with the adhesive, a thin adhesive layer is preferably coated on both sides with a peel-away coating liner. A first liner is peeled off to adhere to the sheet, leaving a single liner available to protect a roller from adherence to the sheet. The roller compresses the PSA to the sheet while maintaining separation via the liner. The sheet is then placed over a mold with the second side of PSA layer exposed to the mold. The mold preferably includes cut-outs to house a pre-arranged electronic (such as an electronic circuit with electronics set thereupon. A roller causes the sheet with adhesive thereon to contact the underside of the electronics and thereby adheres the electronics to the sheet. A basic roll laminator may be used, preferably to provide constant pressure across the interface. The rolling may be conducted at room temperature, and no heating is required. The laminated sheet with electronics on board is then thermoformed with a top platen (or otherwise) with a relief profile matching the now adhered on-board electronics. Where a flat circuit is used, the reliefs in the platen or mold may not be required, however, with surface features and electronic components that substantially extend above the surface of the sheet (e.g. LEDs, boards, etc.), reliefs are preferred as described above.

[0080] FIG. 25-29 demonstrate a first lamination fixture 300 with pins 305 rising off fixture surface 301 to mate with apertures in a sheet. An aluminum lamination fixture with recess for holding and arranging selective adhesive. Recess depth in fixture matches adhesive thickness. Pins will be used to precisely and repeatably locate the sheet to the selective adhesive. Lamination fixture may include machined recess with machined indentations for circuit and surface mounted components. Pins may be used to precisely and repeatably locate the sheet to the circuit. Preferably, fixture 300 is made of aluminum and includes recess 310 with recess floor 312 and bound by recess edges 314. Recess 310 is sized to accommodate both the electronics or adhesive. A form-fitted adhesive 320 is set with a lined side down against recess floor 312, with an opposing exposed side revealed. FIG. 26 demonstrates fixture 300 with sheet 330 set thereupon. Sheet 330 is emplaced thereupon and apertures 335 in sheet 330 are paired with pins 305 to ensure proper placement of sheet on fixture. As shown in FIG. 27, roller 350 is then rolled over sheet 330 and fixture 300 to ensure adhesive 320 is pressure fitted onto sheet 330. FIG. 24 shows the sheet with adhesive set thereupon and second side liner 360 covering adhesive. Thereby, a selective adhesive mounted to the sheet in precise and repeatable location.

[0081] As shown in FIGS. 30-33, a second step in the sheet lamination preparation process is disclosed with a second fixture 400. Second fixture 400 includes recess 410 with recess surface 412 defined by recess edge 414 with indentations 416 (preferably machined) for a particular electronic 440 and pins 405. Indentation 416 match the particular configuration of the preferred electronic to be applied to the sheet. Electronic 440 is placed face down into recess 410 to match with complementary indentations. Liner 360 is removed from sheet 330. Sheet 330 with adhesive 320 emplaced thereon is placed face down (adhesive exposed to fixture 440 and fixture recess 410 to mate with electronic 440. Pins 405 ensure proper alignment of sheet 330 onto second fixture 400 via apertures 305 in sheet 335. As shown in FIG. 31, an example electronic 440 includes a circuit 441 with LEDs 442, wires 443, and driver 444. Other electronics may be used, and the second fixture will include appropriate indentations to match any specific electronic to be applied to the sheet. As shown in FIG. 32, electronic 440 is placed with flat side 417 face up and rising components 418 face down into indentations 416, with flat side 417 exposed to sheet 330 and adhesive 320. After a second round of lamination via roller, a final sheet with onboard electronics is completed.