Mounting an LED element on a flat carrier

Abstract

A lighting device and a method of manufacturing a lighting device are described. A lighting device includes a flat carrier that has a front surface and a rear surface opposite the front surface. The flat carrier includes a cutout and multiple carrier-side electrical contacts on the rear surface. A mounting element is provided on the rear surface of the flat carrier and includes multiple mount-side electrical contacts electrically coupled to the multiple carrier-side electrical contacts and an elevated portion projecting into the cutout. Multiple LED elements are provided on the elevated portion of the mounting element and electrically coupled to the mounting element on the same side as the multiple mount-side side electrical contacts. A heat sink element is thermally coupled to the mounting element on a side of said mounting element opposite the flat carrier.

Claims

1. A lighting device comprising: a flat carrier comprising a front surface and a rear surface opposite the front surface, said flat carrier comprising a cutout and multiple carrier-side electrical contacts on the rear surface; a mounting element on the rear surface of the flat carrier, the mounting element being an insulating body comprising peripheral flat mounting portions and an elevated portion, the elevated portion projecting into the cutout of the flat carrier; multiple mount-side electrical contacts on a mount-side of the mounting element and electrically coupled to said multiple carrier-side electrical contacts of the flat carrier; a plurality of LED elements on the elevated portion of the mounting element and electrically coupled to the mounting element on the same side as the multiple mount-side side electrical contacts; and and a heat sink element thermally coupled to the mounting element on a side of said mounting element opposite the flat carrier.

2. The lighting device according to claim 1, wherein: the multiple carrier-side electrical contacts comprise at least a first carrier-side electrical contact and a second carrier-side electrical contact, the multiple mount-side electrical contacts comprise at least a first mount-side electrical contact and a second mount-side electrical contact, the first carrier-side electrical contact is electrically coupled to the first mount-side electrical contact, the second carrier-side electrical contact is electrically coupled to the second mount-side electrical contact, and said first carrier-side electrical contact and said first mount-side electrical contact are separated from said second carrier-side electrical contact and said second mount-side electrical contact.

3. The lighting device according to claim 1, wherein said mounting element is made of a ceramic material.

4. The lighting device according to claim 1, wherein said heat sink is made of a metal material.

5. The lighting device according to claim 1, wherein said flat carrier is made of a plastic material.

6. The lighting device according to claim 1, wherein said mount-side electrical contacts are electrically coupled to said carrier-side electrical contacts by a solder connection.

7. The lighting device according to claim 1, further comprising electrical conductor portions on said rear surface electrically coupled to said carrier-side contacts.

8. The lighting device according to claim 1, further comprising an electrical circuit on said rear surface, electrically connected to said carrier-side contacts, said electrical circuit comprising at least one of an electrical component and an electrical plug connector.

9. The lighting device according to claim 1, wherein said heat sink element is fixed to said carrier.

10. The lighting device according to claim 1, wherein said mounting element comprises a plane rear surface larger than said cutout, and said heat sink element covers said rear surface.

11. A method of manufacturing a lighting device, the method comprising: providing a flat carrier that comprises a front surface, a rear surface-opposite the front surface, a cutout, and multiple carrier-side electrical contacts on said rear surface; providing a mounting element, the mounting element being an insulating body comprising peripheral flat mounting portions and an elevated portion, with multiple mount-side electrical contacts electrically coupled to said multiple carrier-side electrical contacts, and a plurality of LED elements on the elevated portion electrically coupled to the mounting element on the same side as the multiple mount-side electrical contacts, arranging said mounting element on said rear surface of said flat carrier such that said elevated portion projects into said cutout; forming an electrical contact between said multiple carrier-side electrical contacts and said mount-side electrical contacts.

12. The method according to claim 11, further comprising: forming a solder connection between said carrier-side electrical contact portions and said mount-side electrical contact portions.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows a perspective view of a lighting device according to a first embodiment;

(2) FIG. 2 shows a cross-section of the lighting device of FIG. 1 along A . . . A;

(3) FIG. 3a, 3b show stages of assembly of the lighting device of FIG. 1, FIG. 2;

(4) FIG. 4 shows a cross-sectional view of a lighting device according to a second embodiment;

(5) FIG. 5 shows a cross-sectional view of a lighting device according to a third embodiment.

DETAILED DESCRIPTION OF EMBODIMENTS

(6) A lighting device 10 shown in FIG. 1 comprises multiple separate LEDs 12 arranged in an array (52 in the example shown) mounted on a printed circuit board PCB 14 as a flat carrier.

(7) The PCB 14 has a front surface 16 and a rear surface 18. The flat light emitting surfaces of the LEDs 12 face into the front direction, i.e. outward from the front surface 16.

(8) As shown in the cross-sectional view of FIG. 2, an electrical circuit for the LEDs 12 is provided on the rear surface 18 of the PCB 14, including a plug connector 22 (shown schematically only) and conductor tracks (24) provided as a copper layer on the rear surface 18.

(9) The LEDs 12 are mounted on a ceramic (AlN) mounting element 30, which includes peripheral flat mounting portions 32 and a central elevated portion 34 projecting from the flat mounting portions 32 into the front direction. The LEDs 12 are mounted on the elevated portion 34.

(10) A cutout 40 is formed in the PCB 14, connecting the front surface 16 and rear surface 18. In the example shown, the cutout 40 is formed as a rectangular window bordered by four straight edges.

(11) The mounting element 30 is positioned with its mounting portions 32 on top of the rear surface 18 of the PCB 14 such that the central portion 34, which in the example shown is elevated, is arranged within the window formed by the cutout 40. The LEDs 12 are oriented into the front direction, i.e. the light emitting surface is parallel to the front surface 16. Thus, the LEDs 12, if supplied with electrical operating power, emit light into the front direction.

(12) The LEDs 12 are electrically connected to contact pads 36 provided on the mounting portions 32 of the mounting element 30. The contact pads 36 are referred to as mount-side contact portions. They are provided on the same side of the mounting element 30 as the LEDs 12. The electrical connection to the LEDs 12 is provided by flat conductors on the surface of the mounting element 30 (not shown).

(13) In the preferred example, the mounting element 30 is made of AlN as electrically insulating ceramic material with relatively good heat conduction to dissipate heat generated by the LEDs 12 in operation.

(14) The mounting element 30 is positioned on the rear surface 18 of the PCB 14 such that the mount-side contact pads 36 are arranged directly opposed to carrier-side contact pads 26 on the rear surface 18 of the PCB 14. The carrier-side contact pads 26 are electrically connected or formed as parts of the conductor tracks 24 provided on the rear surface 18.

(15) The mount-side contact pads 36 and carrier-side contact pads 26 are arranged on top of each other forming contact pairs. They are electrically connected by solder layers 42 provided in between.

(16) The plug connector 22 also comprises contact pads 44 arranged opposite to contact pads 46 formed as part of the conductor tracks 24 on the rear surface 18 of the PCB 14. Here also, a solder connection 48 is formed.

(17) Thus, the LEDs 12 are electrically connected via the solder connection between the mount-side and carrier-side contact pads 36, 26, the conductor tracks 24, and the solder connection 48 to the plug connector 44. The LEDs may thus be operated by supplying electrical operating power from the plug connector 44 through the described connection path. As each of the LEDs 12 is connected to one of the mount-side contact pads 36 (with a common ground connection), the LEDs 12 are each separately operable. The array of LEDs 12 may e.g. be used in a vehicle headlight as matrix or ADB (adaptive driving beam) light.

(18) Heat generated by the LEDs 12 in operation is dissipated through the thermally conductive mounting element 30 and further through the heat sink 20 mounted to the backside of the mounting element 30 and connected by a heat-conducting layer 50 e.g. of heat conductive paste or glue.

(19) The heat sink 20 is fixed to the PCB 14 by screws 52.

(20) FIG. 3a, 3b show steps of manufacturing the lighting device 10. The PCB 14 is provided with the conductor tracks 24 forming contact pads 26, 46 on the rear surface 18 on both sides of the cutout 40. Solder paste 42, 48 is provided on the contact pads 26, 46. The mounting element 30 is reverse mounted on the rear surface 18 of the PCB 14 with both the LEDs 12 and the mount-side contact pads 36 facing in front direction.

(21) The mounting element is placed onto the rear surface 18 of the PCB 14 such that the mount-side and carrier-side contact pads 26, 36 are placed directly on top of each other, with the solder paste 42 in between. The placement of the mounting element 30 is such that the central portion 34 on which the LEDs 12 are mounted is placed within the window formed by the cutout 40.

(22) The plug connector 22 is also placed on the rear surface 18 of the PCB 14 with the contact pads 44 and 46 facing each other with interposed solder paste 48.

(23) The entire assembly 10 is then subjected to reflow soldering, such that the solder paste 42, 48 melts and provides solder connections between the opposed contact pads 26, 36, 44, 46, thus fixing the mounting element 30 in the reverse mounted position.

(24) In a further step (not shown), the heat sink 20 is placed on the rear surface 18 of the PCB 14 with the interposed layer 50 and fixed by screws 52 such that the back surface of the mounting element 30 is in thermal contact with the heat sink 20.

(25) FIG. 4, 5 show alternative second and third embodiments of lighting devices. The second and third embodiment correspond to the lighting device 10 according to the first embodiment. In the following, only differences will be explained. Like reference numerals refer to like parts.

(26) In the second embodiment shown in FIG. 4, the mounting element 30 is entirely flat, i.e. the central portion where the LEDs 12 are mounted is not raised. The LEDs 12 are provided over the cutout 40 to emit light through the window formed by the cutout 40 into the front direction.

(27) According to the third embodiment shown in FIG. 5, the mounting element 30 is provided with a mounting portion 32 only on one side of the cutout 40, not on both sides as in the first embodiment 10.

(28) While the invention has been illustrated and described in detail in the drawings and forgoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive; the invention is not limited to the disclosed embodiments.

(29) For example, the 52 array of LEDs 12 shown in FIG. 1 is only one example of an arrangement of LEDs 12 on the mounting element 30. In different embodiments, lighting devices may comprise more or fewer LEDs, and the LEDs 12 may be arranged differently.

(30) While in the embodiments shown the rear surface 18 of the PCB 14 only comprises an electrical circuit including conductor tracks 24 and the plug connector 22, it is also possible to provide further electrical components forming a different electrical circuit on the PCB 14.

(31) While the cutout 40 in the example shown is a rectangular hole in the PCB 14 entirely bordered on four edges of the PCB 14, the cutout 40 may be shaped differently, and may e.g. be formed at an outer edge of the PCB 14, such that it may not be entirely surrounded by the PCB 14 to all sides.

(32) In alternative embodiments, the mounting element 30 may be made of different material or different materials. In particular, the mounting element may comprise a portion, e.g. a core, made of a material of good heat conduction, e.g. a metal such as Aluminum, Copper or other metals, including alloys containing Copper. If the core is electrically conductive, it may preferably be fully or partially covered by an insulating body or layer, such that the LEDs 12 and/or conductors connecting the LEDs to the mount-side contact pads 36 may be electrically insulated from the core. The insulating body or layer may be designed to still achieve good heat conduction, e.g. by choosing a low thickness and/or an insulating material of good heat conduction, e.g. a ceramic material.

(33) In the claims, any reference signs shall not be construed as limiting the claims. The word comprising does not exclude the presence of elements or steps other than those listed in the claims. The indefinite article a or an preceding an element does not exclude the presence of a plurality of such elements. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.