METHOD FOR MANUFACTURING A PAVED STRUCTURE

Abstract

A method for manufacturing a paved structure comprising: a) providing a vignetted structure comprising a rigid frame, vignettes bonded in a spaced manner on the rigid frame provided with an UV-sensitive adhesive film, b) bonding the vignettes to a support substrate through a mineral-based paste so as to form a stack, c) applying a pressure on the stack so that the mineral-based paste fills the space between the vignettes, d) insolating the UV-sensitive adhesive film, e) separating the rigid frame and the vignettes integral with the support substrate, and f) applying a thermal treatment so as to transform the mineral-based paste into a cohesive mineral material to obtain the paved structure.

Claims

1. A method for manufacturing a paved structure comprising: a) providing a vignetted structure comprising a rigid frame, vignettes bonded in a spaced manner on the rigid frame provided with an UV-sensitive adhesive film, b) bonding the vignettes to a support substrate through a mineral-based paste so as to form a stack, c) applying a pressure on the stack so that the mineral-based paste fills the space between the vignettes, d) insolating the UV-sensitive adhesive film, e) separating the rigid frame and the vignettes integral with the support substrate, and f) applying a thermal treatment so as to transform the mineral-based paste into a cohesive mineral material to obtain the paved structure.

2. The method for manufacturing a paved structure according to claim 1, comprising, after step f), a step g) of planarizing the upper surface of all the vignettes, so that the vignettes collectively form a flat surface.

3. The method for manufacturing a paved structure according to claim 2, comprising, after planarization step g), a step h) of performing a selective chemical etching on the exposed face of the paved structure, so as to etch the cohesive mineral material faster than the exposed surface of the vignettes.

4. The method for manufacturing a paved structure according to claim 1, comprising, before step a): a step i) of bonding in a detachable manner between a source substrate of vignettes and a handle substrate, a step ii) of vignetting the source substrate bonded to the handle substrate, so as to singularize the vignettes, a step iii) of fastening the vignettes in a spaced manner on the rigid frame provided with the UV-sensitive adhesive film, and a step iv) of removal the handle substrate from the vignettes, so as to obtain the vignetted structure provided in step a).

5. The method for manufacturing a paved structure according to claim 1, comprising, before step a): a step j) of laser treating a source substrate bonded on a bearing frame provided with an UV-sensitive adhesive tape so as to preform cut lines within the source substrate, the cut lines being intended to form the vignettes, a step jj) of extending the adhesive tape so as to cause the source substrate to break along the preformed cut lines and form the vignettes, and a step jjj) of fastening the vignettes on the rigid frame provided with an UV-sensitive adhesive film, and a step jjjj) of separating the bearing frame and the vignettes comprising the insolation of the UV-sensitive adhesive tape, so as to obtain the vignetted structure provided in step a).

6. The method for manufacturing a paved structure according to claim 4, wherein the rigid frame and the UV-sensitive adhesive film respectively used in step iii) or in step jjj) have a diameter greater than that of the source substrate, and wherein step iii) or step jjj) comprises fastening vignettes by increasing the space between the vignettes, by modifying the initial position of the vignettes and/or by fastening vignettes of several source substrates on a single rigid frame of a diameter greater than that of the source substrate.

7. The method for manufacturing a paved structure according to claim 1, further comprising, after step f): a step k) of implanting ionic species in the vignettes of the paved structure so as to create an embrittlement plane in each vignette delimiting a thin film between the implanted face and said embrittlement plane, a step l) of performing a molecular bonding of the implanted face of the vignettes on a receiver substrate, a step m) of fracture at the level of the embrittlement plane, so as to collectively transfer the thin film of each vignette onto the receiver substrate and obtain a negative comprising the support substrate and the vignettes.

8. The method for manufacturing a paved structure according to claim 7, wherein steps k, 1 and m) are repeated n times on the negative obtained at the end of step m), the negative comprising the support substrate and the vignettes, so as to carry out n new collective transfers of the thin film of each vignette onto a receiver support.

9. The method for manufacturing a paved structure according to claim 1, wherein the mineral-based paste comprises a mineral powder, a binder and a homogenization solvent.

10. The method for manufacturing a paved structure according to claim 9, wherein the mineral powder comprises grains having a size less than or equal to one tenth of the inter-chip space between the adjacent vignettes so as to facilitate the filling of the inter-chip space during step c).

Description

[0084] FIG. 1 is a schematic view illustrating steps i) and ii) of the method according to one embodiment of the invention.

[0085] FIG. 2 is a schematic view illustrating a step iii) of the method according to the embodiment of FIG. 1 and the provision of the vignetted structure a).

[0086] FIG. 3 is a schematic view illustrating steps b) to d) of the method according to the embodiment of FIG. 1.

[0087] FIG. 4 is a schematic view illustrating steps e) and f) of the method of the embodiment of FIG. 1.

[0088] FIG. 5 is a schematic view illustrating steps g) and h) then step k) of implantation according to one embodiment of the invention.

[0089] FIG. 6 is a schematic view illustrating steps I) and m) of the method according to one embodiment of the invention.

[0090] FIG. 7 is a schematic view illustrating a step j) of the method according to one possible embodiment of the invention.

[0091] FIG. 8 is a schematic view illustrating steps jj) to jjjj) of the method according to the embodiment of FIG. 7.

[0092] FIG. 9 is a schematic view illustrating a step jjj) or iii) of transferring vignettes of several source substrates onto a single frame of larger diameter according to one variant of the invention.

[0093] As illustrated in FIGS. 1 to 6, the method according to the invention comprises the preparation of a vignetted structure 50, the transfer of vignettes 1 onto a support substrate S3 so as to obtain a paved structure 100, steps of functionalizing the vignettes 1, and/or carrying out a collective transfer of a thin film 2 taken from each of the vignettes 1 onto a receiver substrate S4.

[0094] The method for manufacturing a paved structure 100 firstly comprises a step of detachable bonding a source substrate S1 on a handle substrate S2 (FIG. 1step i) followed by a vignetting step comprising a photolithography of the surface of the source substrate S1 then an etching in the source substrate S1 forming trenches 3 to delimit spaced vignettes 1 (FIG. 1step ii). A rigid frame 4 provided with an UV-sensitive adhesive film 5 is provided to fasten the vignettes 1 to it (FIG. 2step iii). The handle substrate S2 is then detached at the level of the removable bonding interface so as to obtain the vignetted structure 50 which will be provided in step a) of the method (FIG. 2step iv).

[0095] The vignettes 1 are then bonded on a support substrate S3 covered with a mineral-based paste 6 to form a stack 7 (FIG. 3). A pressure is applied on either side of the stack 7 so as to ensure the filling of the space 3 between the vignettes 1 by the mineral-based paste 6 (FIG. 3, steps b and c). A step d) of insolating the UV-sensitive adhesive film 5 is then carried out (FIG. 3) before separating the rigid frame 4 from the vignettes 1 integral with the support substrate S3, (FIG. 4step e).

[0096] A thermal treatment is applied to: [0097] allow the elimination of the organic components from the mineral-based paste 6, [0098] densify the mineral paste 6 by aggregation and/or sintering of the mineral grains.

[0099] At the end of the thermal treatment, only the mineral part of the paste 6 remains (FIG. 4, step f). The paved structure 100 is then obtained. This thermal treatment and this structuring of the cohesive mineral material 6 also make it possible to increase the energy of adhesion of the vignettes 1 on the support substrate S3. A step g) of planarizing the upper surface 8 of all the vignettes 1 is then performed so that the vignettes 1 collectively form a flat surface (FIG. 5). Depending on the materials used and the performed planarization method, step g) is not sufficient to obtain a removal of the cohesive mineral material 6 with respect to the surface of the vignettes 1 (or it is deliberately limited to reduce the costs), which risks hindering a future collective transfer by Smart Cut of the vignettes 1 onto a receiver substrate S4. A selective chemical etching step h) is then carried out so as to obtain a removal comprised between 10 and 20 nm of the cohesive mineral material 6 derived from the mineral-based paste 6 in the space 3 between the vignettes 1 (FIG. 5).

[0100] The paved structure 100 thus prepared is advantageously used for a collective transfer of the thin film 2 originating from the vignettes 1 onto a receiver substrate S4. To do this, a step k) of implanting ionic species is carried out in the vignettes 1 so as to create an embrittlement plane 9 delimiting a thin film 2 in each vignette 1, the thin film 2 being comprised between the implanted surface and the embrittlement plane 9 (FIG. 5). The implanted paved structure 100 is then used for a molecular bonding on a receiver substrate S4 according to step I) of the method (FIG. 6). There follows a step m) of fracture at the level of the embrittlement plane 9 so as to collectively transfer the thin film 2 of each vignette 1 onto the receiver substrate S4 and obtain a new paved structure by direct bonding (FIG. 6). The negative 11 obtained at the end of the fracture of the paved structure 100 comprises the support substrate S3 and the thinned vignettes 1. This negative 11 is advantageously reused after planarization, polishing, etc., in a new collective transfer of the thin film 2 of the vignettes 1 onto a new receiver substrate S4 (FIG. 5).

[0101] One variant of the method according to the invention differs from that described above in that the vignetted structure 50 is prepared according to a stealth dicing technology (FIG. 7). This variant comprises: [0102] a step j) of laser treating a source substrate S1 bonded on a bearing frame 12 provided with an UV-sensitive adhesive tape 13, so as to preform cut lines 14 within the source substrate S1, the cut lines 14 being intended to form the vignettes 1 (FIG. 7), [0103] a step jj) of extending the adhesive tape 13 so as to cause the source substrate S1 to break along the preformed cut lines 14 and form the vignettes 1, (FIG. 8), [0104] a step jjj) of fastening the vignettes 1 on a rigid frame 4 provided with an UV-sensitive adhesive film 5, and a step jjjj) of separating the bearing frame 12 and the plurality of vignettes 1 comprising the insolation of the UV-sensitive adhesive tape 13 (FIG. 8) so as to obtain the vignetted structure 50 provided in step a).

[0105] According to yet another variant which differs from the method described above, the method comprises in step iii) or jjj) the provision respectively of a bearing frame 12 or of a rigid frame 4 provided with an UV-sensitive adhesive film 5 having a diameter greater than that of the source substrate S1, for example 300 nm and 100 nm respectively, so as to fasten vignettes 1 of several source substrates S1 on the same and unique rigid frame 4 or bearing frame 12 (FIG. 9). The fastening according to step iii) or jjj) is then advantageously carried out by a device for manipulating and transferring vignettes (Pick and Place) allowing the independent manipulation of each of the vignettes 1 or of a plurality of vignettes 1 at the same time. The following steps are carried out as previously described by using a support substrate S3 and a receiver substrate S4 with a diameter at least equal to the diameter of the disc defined by the vignettes 1 on the rigid frame 4/bearing frame 12 (not illustrated).

[0106] Detailed example embodiments of the method according to the invention follow below.

EXAMPLE 1

[0107] A removable layer 16 of a fluoropolymer (Novec 2702) is formed by spreading on a handle substrate S2 made of silicon (200 mm in diameter and 725 m in thickness), and the whole is annealed at 150 C. for 30 min. The thickness of the fluoropolymer film is about 10 nm.

[0108] An adhesive layer 15 is formed by spreading 40 m of a adhesive resin BrewerBOND 305 on a source substrate S1 made of silicon (200 mm in diameter and 725 m in thickness) before performing a bonding with the handle substrate S2 at 210 C. so as to obtain a detachable bonding at the interface between the adhesive layer 15 and the fluoropolymer removable layer 16 (FIG. 1step i).

[0109] The source substrate S1 is thinned by mechanical abrasion by means of a diamond wheel until it reaches a thickness of 500 m. The surface is then wet cleaned. A photolithography of the source substrate S1 makes it possible to define vignettes 1 of 88 mm.sup.2 with a space 3 of 100 m between adjacent vignettes 1 (FIG. 1, step ii).

[0110] The vignettes 1 thus obtained have a thickness of 500 micrometers. They are then bonded on a metallic DISCO rigid frame 4 by means of an UV-sensitive SP-537T-230 adhesive film 5 available from the company Furukawa (FIG. 2, step iii). The handle substrate S2 is then detached by inserting a wedge at the interface between the adhesive layer 15 and the removable layer 16 (step iv). The adhesive layer 15 is removed by cleaning with D-limonene and then isopropanol. The vignetted structure 50 comprising vignettes 1 bonded by an adhesive film 5 on a rigid frame 4 is thus obtained (FIG. 2) and may be provided according to step a) of the method of the invention.

[0111] On a silicon support substrate S3 (200 mm in diameter and 725 m in thickness), approximately 100 m of mineral-based paste 6 glass frit FX-11-036 from the company Ferro is spread by screen printing. The UV-sensitive adhesive film of the vignetted structure 50 is insolated by UV irradiation (step d) then the support substrate S3 is brought into contact with the vignettes 1 so as to form a stack 7 (step b) while applying a pressure of 5 kN (FIG. 3, step c). Alternatively, it is possible to insolate the UV-sensitive adhesive film 5 (step d) after contacting.

[0112] The rigid frame 4 is separated from the stack 7 consisting of the support substrate S3 and of the vignettes 1 (FIG. 4, step e). An annealing by applying a thermal treatment at 125 C. for 30 min, then 300 C. for 60 min and 425 C. for 90 min (FIG. 4, step f) allows the transformation of the mineral-based paste 6 into cohesive mineral material 6 and the obtaining of the paved structure 100. The vignettes 1 are integral with the support substrate S3 and the space 3 between the vignettes 1 is filled. The surface of the vignettes 1 is planarized by a mechanical lapping step then an in-depth chemical mechanical polishing step (step g). The polishing speed of the cohesive mineral material 6 resulting from glass frit is greater than the polishing speed of silicon, which leads to a removal of the cohesive mineral material 6 of approximately 20 nm with respect to the surface of the vignettes 1 made of silicon (FIG. 5).

[0113] The paved structure 100 thus prepared is subjected to a hydrogen ion implantation with an energy of 150 keV and a dose of 5.10.sup.16 ions/cm.sup.2 (FIG. 5, step k). A receiver substrate S4 made of silicon (200 mm in diameter and 725 m in thickness) is oxidized so as to form a 500 nm SiO.sub.2 film at its surface (not represented). The receiver substrate S4 is then prepared so as to carry out a direct bonding with the implanted face of the vignettes 1 (FIG. 6, step l). An annealing at 500 C. makes it possible to obtain a fracture at the level of the embrittlement plane 9 and a thin film 2 with a thickness of 1.2 m originating from each of the vignettes 1 is transferred onto the receiver substrate S4 (FIG. 6, step m). A chemical mechanical polishing of the negative 11 obtained at the end of step m) comprising the support substrate S3 and the vignettes 1 allows a new use in a method for transferring the thin film 2 as previously described according to steps k to m).

EXAMPLE 2

[0114] A removable layer 16 of 10 nm of fluoropolymer (Novec 1720) is formed by spreading on a handle substrate S2 made of silicon (200 mm in diameter and 725 m in thickness), and the whole is annealed at 135 C. for 15 min.

[0115] An adhesive layer 15 is formed by spreading 40 m of an adhesive resin BrewerBOND 305 on a source substrate S1 made of silicon (200 mm in diameter and 725 m in thickness) before performing a bonding with the handle substrate S2 at 210 C. so as to obtain a detachable bonding at the interface between the adhesive layer 15 and the fluoropolymer layer 16 (FIG. 1, step i).

[0116] A photolithography in the silicon of the source substrate S1 makes it possible to define vignettes 1 of 2020 mm.sup.2 with a space 3 of 200 m between the adjacent vignettes 1 (step ii).

[0117] The vignettes 1 thus obtained are bonded to a metallic DISCO frame by means of an adhesive film 5 SP-537T-230 available from the company Furukawa (step iii). The handle substrate S2 is then detached by inserting a wedge at the interface between the adhesive layer 15 and the removable layer (FIG. 2, step iv). The adhesive layer 15 is then removed by cleaning with D-limonene and then isopropanol so as to obtain the vignetted structure 50.

[0118] On a silicon support substrate S3 (200 mm in diameter and 725 m in thickness) approximately 100 m of mineral-based paste 6 glass frit FX-11-036 of the company Ferro is spread by screen printing (FIG. 3). The UV-sensitive adhesive film 5 of the vignetted structure 50 is insolated by UV irradiation (step d) then the vignettes 1 at the edge of the rigid frame 4 which do not have the desired shape (for example square) are removed by means of a suitable tool for manipulating and transferring vignettes (Pick and Place).

[0119] The support substrate S3 is then brought into contact with the vignettes 1 so as to form a stack 7 (FIG. 3 step b) while applying a pressure of 5 kN (step c).

[0120] The rigid frame 4 is separated from the stack 7 consisting of the support substrate S3 and the vignettes 1 (FIG. 4, step e). An annealing by applying a thermal treatment at 125 C. for 30 min, then 300 C. for 60 min and 425 C. for 90 min (step f) allows the transformation of the mineral-based paste into cohesive mineral material 6 and the obtaining of the paved structure 100. The vignettes 1 are integral with the support substrate S3 and the space 3 between the vignettes 1 is filled. The surface of the vignettes 1 is planarized by a mechanical lapping step then a chemical mechanical polishing step (FIG. 5, step g) is applied lightly to avoid a significant wear of the consumables. However, the light polishing does not allow asufficient removal of the cohesive mineral material 6 to be achieved, so a selective chemical attack completes it with an aqueous solution of HF at 10% vol. for 1 min (step h) and makes it possible to achieve a sufficient removal of the cohesive mineral material 6 resulting from glass frit, for example 10 nm with respect to the surface of the silicon. The paved structure 100 thus prepared may be used as a donor substrate of the thin film 2 of Si in a Smart Cut transfer method (implantation, bonding, fracture).

EXAMPLE 3

[0121] The Stealth Dicing technology is used to cut ten source substrates S1 of InP of 100 mm in diameter into chips of 1010 mm.sup.2. To do this, the source substrates S1 are each disposed on an UV-sensitive adhesive tape 13 disposed on a bearing frame 12. A laser treatment step is performed in each of the source substrates so as to preform cut lines 14 within the source substrate (step j-FIG. 7). The adhesive tape 13 is then stretched so as to cause the source substrate to break along the preformed cut lines 14 and form the vignettes 1 (FIG. 8, step jj).

[0122] A rigid frame 4 of a size suitable for plates with a diameter of 300 mm and provided with an UV-sensitive adhesive film 5 is used to transfer the vignettes 1 of the ten source substrates S1 (FIG. 9) by means of a suitable tool for manipulating and transferring vignettes (Pick and Place). The non-square vignettes 1 at the edge of the frame have been removed beforehand (not illustrated).

[0123] On a silicon support substrate S3 (300 mm in diameter and 725 m in thickness), approximately 100 m of mineral-based paste 6 glass frit FX-11-036 of the company Ferro is spread by screen printing. The support substrate S3 is brought into contact with the vignettes 1 so as to form a stack 7 (as in FIG. 3, step b) while applying a pressure of 10 kN (step c).

[0124] The UV-sensitive adhesive film 5 is insolated by UV and the rigid frame 4 is separated from the stack 7 consisting of the support substrate S3 and of the vignettes 1 (FIG. 4, step e). An annealing by applying a thermal treatment at 125 C. for 30 min, then 300 C. for 60 min and 350 C. for 300 min (step f) allows the transformation of the mineral-based paste 6 into cohesive mineral material 6 and the obtaining of the paved structure 100. The vignettes 1 are integral with the support substrate S3 and the space 3 between the vignettes 1 is filled. The surface of the vignettes 1 is planarized by a mechanical lapping step then a light chemical mechanical polishing step (step g).

[0125] In order to increase the removal obtained by the chemical mechanical polishing of step g), it is completed by a selective chemical attack with an aqueous solution of HF at 10% vol. for 1 min (FIG. 5step h). This allows a removal of cohesive mineral material 6 resulting from frit glass of approximately 10 nm with respect to the surface of the InP.

[0126] The paved structure 100 thus prepared is subjected to a hydrogen ion implantation with an energy comprised between 60 and 100 keV and a dose comprised between 6 and 7.10.sup.16 ions/cm.sup.2 depending on the thickness of the InP film to be transferred (FIG. 6, step k). A receiver substrate S4 made of silicon (300 mm in diameter and 725 m in thickness) is oxidized so as to form a 200 nm SiO.sub.2 film on its surface. The receiver substrate S4 is then prepared so as to achieve a direct bonding with the implanted face of the vignettes 1 (FIG. 6, step I). An annealing at 280 C. makes it possible to obtain a fracture at the level of the embrittlement plane 9 and a thin film 2 coming from each of the vignettes 1 is transferred onto the receiver substrate S4 (step m). A chemical mechanical polishing of the negative 11 obtained at the end of step m) comprising the support substrate S3 and the vignettes 1 allows a new use in a method for transferring the thin film 2 as previously described according to steps k to m).

EXAMPLE 4

[0127] An adhesive dry film made of SPIS DFTA23 (Shin Etsu) is deposited by spreading on a handle substrate S2 made of silicon of 200 mm in diameter (725 m in thickness),

[0128] A detachable bonding of the handle substrate S2 with a source substrate S1 of 200 mm in diameter made of germanium is carried out at 90 C. (FIG. 1, step i). A photolithography of the source substrate S1 made of germanium makes it possible to define vignettes 1 of 212 mm.sup.2 with a space 3 between the adjacent vignettes 1 of 200 m (step ii).

[0129] The vignettes 1 thus obtained are bonded to a metallic DISCO rigid frame 4 by means of an adhesive film 5 SP-537T-230 available from the company Furukawa (FIG. 2, step iii). The handle substrate S2 is then detached by inserting a wedge at the interface of the detachable bonding (FIG. 2, step iv).

[0130] The adhesive dry film made of SPIS DFTA23 is then removed by cleaning with p-menthol and then isopropanol. The vignetted structure 50 comprising vignettes 1 bonded by an adhesive film 5 made of SP-537T-230 on a rigid frame 4 is thus obtained. Said UV-sensitive adhesive film 5 is insolated by UV irradiation (FIG. 3, step d).

[0131] A mineral-based paste 6 based on silica is prepared by mixing 5 g of silica (Aerosil R 202) 0.5 g of ethyl cellulose (Sigma-Aldrich) and 5 g of terpinol (Sigma-Aldrich). Approximately 100 m of this mineral-based paste 6 is spread by screen printing on a silicon support substrate S3 (200 mm in diameter and 725 m in thickness) before being brought into contact with the vignettes 1 so as to form a stack 7 (FIG. 3, step b) while applying a pressure of 5 kN (step c).

[0132] The rigid frame 4 is separated from the stack 7 consisting of the support substrate S3 and of the vignettes 1 (FIG. 4, step e). An annealing by applying a thermal treatment at 100 C. for 60 min, then 425 C. for 120 min (step f) allows the transformation of the mineral-based paste 6 into cohesive mineral material 6 and the obtaining of the paved structure 100. The vignettes 1 are integral with the support substrate S3 and the space 3 between the vignettes 1 is filled. The surface of the vignettes 1 is planarized by a mechanical lapping step then a chemical mechanical polishing step (step g).

[0133] After this step g) a selective chemical attack with an aqueous solution of HF at 10% vol. for 1 min makes it possible to remove the cohesive mineral material 6 by approximately 10 nm with respect to the surface of the silicon (FIG. 5, step h). The paved structure 100 thus prepared may be used as a donor substrate of the thin film 2 of Ge in a collective transfer method by the Smart Cut technology (implantation, bonding and fracture).

EXAMPLE 5

[0134] Silicon plates of 200 mm in diameter and of 725 m in thickness are used.

[0135] A removable layer 16 of fluoropolymer (Optool Daikin) is formed by spreading on a handle substrate S2 made of silicon (200 mm in diameter and 725 m in thickness) (FIG. 1).

[0136] An adhesive layer 15 is formed by spreading 40 m of an adhesive resin BrewerBOND 305 on a source substrate S1 made of silicon (200 mm in diameter and 725 m in thickness) before performing a bonding with the handle substrate S2 at 210 C. so as to obtain a detachable bonding at the interface between the adhesive layer 15 and the fluoropolymer layer 16 (FIG. 1, step i).

[0137] A photolithography in the silicon of the source substrate S1 makes it possible to define vignettes 1 of 88 mm.sup.2 with a space 3 of 100 m between the adjacent vignettes 1 (step ii).

[0138] The vignettes 1 thus obtained are bonded on a metallic DISCO frame by means of an adhesive film 5 SP-537T-230 available from the company Furukawa (FIG. 2, step iii). The handle substrate S2 is then detached by inserting a wedge at the interface between the adhesive layer 15 and the removable layer (step iv). The adhesive layer 15 is removed by cleaning with D-limonene and then isopropanol. The vignetted structure 50 comprising vignettes 1 bonded by an adhesive film 5 on a rigid frame 4 is thus obtained.

[0139] On a silicon support substrate S3 (200 mm in diameter and 725 m in thickness), approximately 100 m of mineral-based paste 6 glass frit FX-11-036 of the company Ferro is spread by screen printing. The UV-sensitive adhesive film 5 of the vignetted structure 50 is insolated by UV irradiation (FIG. 3, step d) then the support substrate S3 is brought into contact with the vignettes 1 so as to form a stack 7 (step b) while applying a pressure of 5 kN (step c).

[0140] The rigid frame 4 is separated from the stack 7 consisting of the support substrate S3 and of the vignettes 1 due to the prior insolation of the film 5 (FIG. 4, step e). An annealing by applying a thermal treatment at 125 C. for 30 min, then 300 C. for 60 min and 425 C. for 90 min (step f) allows the transformation of the mineral-based paste 6 into cohesive mineral material 6 and the obtaining of the paved structure 100. The vignettes 1 are integral with the support substrate S3 and the space 3 between the vignettes 1 is filled. The surface of the vignettes 1 is planarized by a mechanical lapping step then a chemical mechanical polishing step (FIG. 5, step g). The polishing speed of the cohesive mineral material 6 resulting from glass frit is greater than the polishing speed of silicon, which leads to a removal of the cohesive mineral material 6 of approximately 20 nm with respect to the surface of the vignettes 1 made of silicon (no completion of step h) in this example).

[0141] The paved structure 100 thus prepared may be used as a donor substrate of the thin film 2 of Si in a Smart Cut transfer method (implantation, bonding, fracture) as described above.

[0142] Thus the present invention proposes a method for manufacturing a paved structure 100 comprising vignettes made of semiconductor material and configured to be used as a donor substrate and to collectively transfer the thin film of each vignette onto a receiver substrate by Smart Cut, while limiting the number of surface cleaning steps and the cycle time.