All-optical, optically addressable liquid crystal-based light valve employing photoswitchable alignment layer for high-power and/or large aperture laser applications
11581691 · 2023-02-14
Assignee
Inventors
- Kenneth L. Marshall (Rochester, NY)
- Stavros G. Demos (Rochester, NY, US)
- Tanya Kosc (Rochester, NY, US)
Cpc classification
C09K2323/02
CHEMISTRY; METALLURGY
G02F1/133753
PHYSICS
H01S3/0057
ELECTRICITY
H01S3/0085
ELECTRICITY
International classification
H01S3/00
ELECTRICITY
Abstract
A beam shaping system including an all-optical liquid crystal beam shaper, the beam shaper including a photoswitchable alignment material including at least one of a PESI-F, SPMA:MMA 1:5, SPMA:MMA 1:9, ora SOMA:SOMA-p:MMA 1:1:6 material, at least some of the liquid crystals of the beam shaper including at least one of a phenylcyclohexane, cyclo-cyclohexane, or a perfluorinated material.
Claims
1. A beam shaping system, comprising: (a) a liquid crystal beam shaper, the beam shaper comprising liquid crystals and a photoswitchable alignment layer, the photoswitchable alignment layer comprising at least one material from the group of PESI-F, SPMA:MMA 1:5, SPMA:MMA 1:9, or SOMA:SOMA-p:MMA 1:1:6; and (b) an optical writing and erasing sub-system configured to write, erase, and rewrite a plurality of optical patterns in the photoswitchable alignment layer; wherein PESI-F is a poly(esterimide) comprising the repeat unit: ##STR00007## wherein SPMA:MMA 1:5 and SPMA:MMA 1:9 are copolymers comprising the repeat unit: ##STR00008## wherein n is 5 or 9, respectively; wherein SOMA:SOMA-p:MMA 1:1:6 is a copolymer comprising the repeat unit: ##STR00009## wherein n is 6.
2. The beam shaping system of claim 1, wherein the photoswitchable alignment layer possesses an N-on-1 laser induced damage threshold of 80-100 J/cm.sup.2 at 1053 nm.
3. The beam shaping system of claim 1, wherein at least some liquid crystals of the beam shaper comprise at least one of partially saturated liquid crystals, fully saturated liquid crystals, partially fluorinated liquid crystals, or perfluorinated liquid crystals.
4. The beam shaping system of claim 1, wherein at least some liquid crystals of the beam shaper comprise at least one of a phenylcyclohexane, a perfluorinated material, or saturated cyclohexane rings.
5. The beam shaping system of claim 1, wherein the liquid crystal beam shaper comprises an all-optical liquid crystal beam shaper.
6. The beam shaping system of claim 5, wherein the liquid crystal beam shaper comprises: (i) a first transparent glass substrate comprising a first coating on an inner surface of the substrate, the first coating comprising the photoswitchable alignment layer; (ii) a second transparent glass substrate comprising a second alignment coating on an inner surface of the substrate, the second alignment coating comprising either a buffed alignment layer or a layer that has been permanently oriented using polarized UV light; (iii) the liquid crystals of the beam shaper located between the first and second substrates; and (iv) a polarizer.
7. The beam shaping system of claim 6, wherein the beam shaping system is configured such that writing an optical pattern into the photoswitchable alignment layer causes a localized change in configuration of the liquid crystals, such that a laser beam passing through the liquid crystal beam shaper undergoes a localized change in polarization state.
8. The beam shaping system of claim 7, wherein the polarizer is configured to pass or reject portions of the laser beam depending on the localized change in polarization state.
9. The beam shaping system of claim 6, wherein the first and second transparent glass substrates comprise fused silica.
10. The beam shaping system of claim 9, wherein the second alignment coating comprises an alignment coating having a fixed alignment state.
11. The beam shaping system of claim 10, wherein the second alignment coating comprises at least one of a poly(N,N′-hexamethyleneadipinediamide), a cinnamate photopolymer, a coumarin-based photoalignment layer material, or an azobenzene photoswitchable alignment layer.
12. The beam shaping system of claim 6, wherein the optical writing and erasing sub-system comprises: (i) a UV light source and a spatial light modulator configured to write an optical pattern in the photoswitchable alignment layer; or (ii) a raster-scanned UV laser source configured to write the optical pattern in the photoswitchable alignment layer.
13. The beam shaping system of claim 12, wherein the optical writing and erasing sub-system is configured to erase the written optical pattern by application of UV light having a different polarization than the UV light used to write the optical pattern, or by application of visible light.
14. A beam shaping system, comprising: (a) a liquid crystal beam shaper, the beam shaper comprising liquid crystals and a photoswitchable polymer command surface; and (b) an optical writing and erasing sub-system; the photoswitchable polymer command surface and the optical writing and erasing sub-system configured to write, erase, and rewrite a plurality of optical patterns in the photoswitchable alignment layer; wherein at least one of the components in a beam path of the liquid crystal beam shaper have an N-on-1 laser induced damage threshold using a small beam damage testing configuration exceeding: (i) 40 J/cm.sup.2 at 1053 nm and 1500 ps pulse width; or (ii) 5 J/cm.sup.2 at 1053 nm and 100 ps pulse width; or (iii) 1 J/cm.sup.2 at 1053 nm and 10 ps pulse width; or (iv) 0.8 J/cm.sup.2 at 1053 nm and 0.6 ps pulse width.
15. The beam shaping system of claim 14, wherein at least some liquid crystals of the beam shaper comprise at least one of partially saturated liquid crystals, fully saturated liquid crystals, partially fluorinated liquid crystals, or perfluorinated liquid crystals.
16. The beam shaping system of claim 15, wherein the liquid crystal beam shaper comprises an all-optical liquid crystal beam shaper.
17. A beam shaping system, comprising: (a) an all-optical liquid crystal beam shaper, the beam shaper comprising: (i) a first transparent glass substrate comprising a first coating on an inner surface of the substrate, the first coating comprising a photoswitchable alignment material comprising at least one of a SPMA:MMA 1:5, SPMA:MMA 1:9, or a SOMA:SOMA-p:MMA 1:1:6 material; (ii) a second transparent glass substrate comprising a fixed alignment coating on an inner surface of the substrate; (iii) liquid crystals between the first and second glass substrates, wherein at least some liquid crystals of the beam shaper comprise at least one of a phenylcyclohexane, a perfluorinated material, or saturated cyclohexane rings; and (iv) a polarizer; and (b) an optical writing and erasing sub-system configured to write, erase, and rewrite a plurality of optical patterns in the first coating; wherein SPMA:MMA 1:5 and SPMA:MMA 1:9 are copolymers comprising the repeat unit: ##STR00010## wherein n is 5 or 9, respectively; wherein SOMA:SOMA-p:MMA 1:1:6 is a copolymer comprising the repeat unit: ##STR00011## wherein n is 6.
18. The beam shaping system of claim 17, wherein the beam shaping system is configured such that writing an optical pattern into the first coating causes a localized change in configuration of the liquid crystals, such that a laser beam passing through the liquid crystal beam shaper undergoes a localized change in polarization state.
19. The beam shaping system of claim 18, wherein the polarizer is configured to pass or reject portions of the laser beam depending on the localized change in polarization state.
20. The beam shaping system of claim 17, wherein the optical writing and erasing sub-system comprises: (i) a UV light source and a spatial light modulator configured to write an optical pattern in the first coating; or (ii) a raster-scanned UV laser source configured to write the optical pattern in the first coating.
21. The beam shaping system of claim 1, wherein at least one of the components in a beam path of the liquid crystal beam shaper have an N-on-1 laser induced damage threshold using small beam damage testing configuration exceeding: (i) 40 J/cm.sup.2 at 1053 nm and 1500 ps pulse width; or (ii) 5 J/cm.sup.2 at 1053 nm and 100 ps pulse width; or (iii) 1 J/cm.sup.2 at 1053 nm and 10 ps pulse width; or (iv) 0.8 J/cm.sup.2 at 1053 nm and 0.6 ps pulse width.
22. The beam shaping system of claim 17, wherein the beam shaping system is configured to shape a laser beam of a laser additive manufacturing system.
23. A laser additive manufacturing system, comprising: (a) a laser beam source configured to generate a laser beam for additive manufacturing; and (b) a beam shaping system configured to repeatedly vary a profile of the laser beam, the beam shaping system comprising: (i) an all-optical, optically addressable beam shaper, comprising liquid crystals and a photoswitchable alignment layer; and (ii) an optical writing and erasing sub-system configured to repeatedly write and erase a plurality of optical patterns in the photoswitchable alignment layer to cause a localized change in alignment of the liquid crystals.
24. The additive manufacturing system of claim 23, wherein the liquid crystals comprise at least one of partially saturated liquid crystals, fully saturated liquid crystals, partially fluorinated liquid crystals, or per-fluorinated liquid crystals.
25. The additive manufacturing system of claim 23, wherein the liquid crystals comprise at least one of a phenylcyclohexane, a per-fluorinated material, or saturated cyclohexane rings.
26. The additive manufacturing system of claim 24, wherein the beam shaper comprises: (i) a first transparent glass substrate and a first coating on an inner surface of the substrate, the first coating comprising the photoswitchable alignment layer; (ii) a second transparent glass substrate and a second alignment coating on an inner surface of the substrate, the second alignment coating having a fixed alignment state; (iii) the liquid crystals of the beam shaper located between the two alignment layers and substrates; and (iv) a polarizer configured to reflect a first polarization state and transmit a second polarization state that is complimentary of the first polarization state.
27. The additive manufacturing system of claim 26, wherein the first and second coatings are electrically non-conductive.
28. The additive manufacturing system of claim 23, wherein the liquid crystals comprise an absorption edge of less than 330 nm.
29. The additive manufacturing system of claim 28, wherein the photoswitchable alignment layer comprises at least one of a PESI-F, SPMA:MMA 1:5, SPMA:MMA 1:9, or a SOMA:SOMA-p:MMA 1:1:6 material; wherein PESI-F is a poly(esterimide) comprising the repeat unit: ##STR00012## wherein SPMA:MMA 1:5 and SPMA:MMA 1:9 are copolymers comprising the repeat unit: ##STR00013## wherein n is 5 or 9, respectively; wherein SOMA:SOMA-p:MMA 1:1:6 is a copolymer comprising the repeat unit: ##STR00014## wherein n is 6.
30. The additive manufacturing system of claim 23, wherein at least one of the components in a beam path of the beam shaper have an N-on-1 laser induced damage threshold using small beam damage testing configuration exceeding: (i) 40 J/cm.sup.2 at 1053 nm and 1500 ps pulse width; or (ii) 5 J/cm.sup.2 at 1053 nm and 100 ps pulse width; or (iii) 1 J/cm.sup.2 at 1053 nm and 10 ps pulse width; or (iv) 0.8 J/cm.sup.2 at 1053 nm and 0.6 ps pulse width.
Description
BRIEF DESCRIPTION OF DRAWINGS
(1) The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
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DETAILED DESCRIPTION
(22) Optically Addressable Light Valve Design
(23) A major limitation in current OALV designs is the use of conductive coatings that are known to reduce the damage threshold and increase absorption.
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(25) The device shown in
(26) In
(27) Unlike earlier OALV devices, the written state in these photoswitchable alignment layers requires no applied electrical or optical fields to remain stable for extended periods of time (weeks or longer) under normal ambient conditions, provided that background UV or visible light intensity remains below the threshold intensity required to change the orientation of the command surface. This switching threshold is a function of the molecular structure of the command-surface material and can be controlled by molecular design to be as low or high as necessary to suppress switching by ambient effects. Write-erase times are dependent on the incident UV energy, and can be as fast as 10 ms.
(28) The pendants on this photoswitchable command surface are switched optically between two different alignment states, which in turn redirects the orientation of the LC material in contact with the coating surface in response to wavelength of the polarized “write” (UV) or “erase” (visible) incident light.
(29) Although not specifically shown in
(30) For the all-optical near IR LC laser beam shaper (light valve) shown in
(31) The ability to reversibly write high-resolution optical patterns into an LC device containing azobenzene photoswitchable alignment layers has been known and investigated for a number of optics and photonics applications other than laser beam shaping since the early 2000's. In August of 2018, Marshall et al. demonstrated the ability to write optical patterns at a resolution of 28.5 line pairs/mm using a UV light source and a photolithographic mask into a LC device employing commercial PAAD 27 azobenzene photoswitchable alignment layers, but several problems affecting device operational lifetime were encountered: (1) devices could only be written and erased up to six times before significant resolution degradation was observed, and (2) “image sticking” (reappearance of multiple patterns from previous exposures) occurs after several sequential patterning cycles. [See “Optically Addressable Liquid Crystal Laser Beam Shapers Employing Photoalignment Layer Materials and Technologies”, K. L. Marshall, J. Smith, A. Callahan, H. Carder, M. Johnston, and M. Ordway, presented at the SPIE Optics and Photonics Liquid Crystals XXII Symposium, San Diego, Calif., 19-23 August 2018.]
(32) In order for an all-optical LC beam shaper device to realize its full applications potential and advance the state of the art for high-power beam shaping applications such as additive manufacturing, new photo switchable alignment layer materials are needed whose molecular structures and switching mechanisms will provide (1) excellent near IR laser damage threshold; (2) the ability to reproducibly write, store and erase high-resolution optical patterns; (3) minimal loss of resolution and contrast after multiple write/erase cycles, and (4) be resistant to image-sticking and burn-in of previously written patterns. In addition, the LC materials ideally will provide a similarly high damage threshold.
(33) Photoswitchable Alignment Layer Materials for High-Power Laser Beam Shaping
(34) The inventor has developed several unique photoswitchable LC alignment polymer coatings based on azobenzene, spiropyran and spiroxazane photoactive pendants. Spiropyrans and spiroxazanes differ fundamentally from the azobenzene photoswitchable coatings in that photoswitching occurs due to a reversible photomediated ring opening/closing reaction upon absorption of UV and visible light rather than through photomechanical trans-cis isomerization, in which no chemical bonds are broken.
(35) The generalized schematic diagram for these new materials is shown in
(36) Specifically, three photoswitchable alignment material families were developed:
(37) 1. PESI-F
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(40) 2. SPMA:WA (1:5 and 1:9)
(41) These materials are methacrylate copolymers containing spiropyran chromophores with a NO.sub.2 terminal group attached to a methacrylate backbone through a 6-carbon alkyl spacer. The general molecular structure is shown in
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(43) 3. SOMA:SOMA-PWA (1:1:6)
(44) These materials (shown in
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(46) 4. Suitability for Photoswitchable Alignment Layers
(47) Materials from these three families of photoswitchable alignment layers are ideally suited for all-optical photoswitchable LC beam shapers for high power laser applications such as additive manufacturing due to their exceptionally high laser damage thresholds at 1053 nm. The 1053 nm, 1.4 ns damage thresholds of several examples of these materials compared to existing data on other LC alignment materials (buffed layers, write-once photoalignment layers, and photoswitchable alignment layers) are summarized in
(48) The ability to spontaneously align LC materials is an important factor in achieving beam shaper devices with high contrast ratios.
(49) Liquid Crystal Materials for High Power Laser Beam Shaping
(50) Several nematic LC materials were selected to explore the effect of varying degrees of π-electron delocalization and electron density on their damage thresholds. The aim was to provide baseline measurements on the LIDT's of currently available LC's as a function of their chemical structure and extend the limited available knowledge on LC damage thresholds for nanosecond pulses at 1053 nm to both the sub-nanosecond and nanosecond pulse length regimes at 527 nm and 351 nm. Delocalized π-electrons are found in unsaturated (e.g., benzene-like) carbon rings with double bonds, and their presence shifts the electronic absorption edge toward longer wavelengths. Saturated compounds have carbon rings with only single bonds, which essentially eliminate electron delocalization and cause the absorption edge to be shifted toward shorter wavelengths. The wide range of LC materials evaluated are shown in Table 1. LC materials with the highest degree of π-electron delocalization include the well-known cyanobiphenyl (two unsaturated hydrocarbon rings) LC materials such as 5CB (4-pentyl-cyanobiphenyl or K-15) and the eutectic mixture E7. Compounds composed of both unsaturated (benzene) and saturated (cyclohexane) rings including a 60/40 mixture of two unsaturated phenyl benzoate ester compounds (PPMeOB and PPPOB) used on the OMEGA laser and the partially saturated phenylcyclohexane-based mixture ZLI-1646 (Merck). Other materials evaluated included a saturated alkyl LC mixture (Merck MLC-6601) and a perfluorinated alkyl LC mixture (Merck MLC-2037). Finally, a saturated isothiocyanate LC compound, which includes some π-electron delocalization within the isothicyanate N═C═S group) was tested. Laser induced damage threshold values of commercially available LC compounds and mixtures determined in 1988 (using nanosecond laser pulses at 1053 nm) were re-evaluated to take into account significant improvements in purity since that time [See “Liquid-Crystal Laser Optics: Design, Fabrication, and Performance,” S. D. Jacobs, K. A. Cerqua, K. L. Marshall, A. Schmid, M. J. Guardalben, and K. J. Skerrett, J. Opt. Soc. Am. B 5, 1962-1979 (1988)]. The initial work that compared an unsaturated LC compound, 5CB, to its saturated analog, ZLI-S-1185 (4-octylcyanobicyclohexyl), is expanded [See T. Z. Kosc, S. Papernov, A. A. Kozlov, K. Kafka, and K. L. Marshall, and S. G. Demos, “Laser-Induced-Damage Thresholds of Nematic Liquid Crystals at 1 ns and Multiple Wavelengths,” presented at Laser Damage 2018, Boulder, Colo., 23-26 Sep. 2018].
(51) TABLE-US-00001 TABLE 1 Absorp- tion Name Supplier Edge
(52) In Table 1, materials are designated as saturated and unsaturated with the symbol S or O, respectively, in the molecular structures in the first column. Note that the ZLI-1646 mixture contains contain compounds with both saturated and unsaturated ring structures. Here, the absorption edge is defined at T=98%.
(53) Pulse Length Dependence at 1053 nm
(54) The LIDT dependence at 1053 nm as a function of laser pulse duration was investigated at six different pulse lengths: 600 fs, 2.5 ps, 10 ps, 50 ps, 100 ps, and 1.5 ns. The 1-on-1 and N-on-1 LIDT values plotted as a function of each material's UV-absorption edge (and therefore the linear absorption cross section) are shown in
(55) The compounds are identified in
(56) A clear pulse-length dependence emerges from the N-on-1 LIDT results plotted in
(57) To better quantify the relative difference in damage thresholds between saturated and unsaturated LC materials, their value at each laser pulse length was normalized to the LIDT's of the cyanobiphenyl LC mixture E7, one of the most commonly used unsaturated LC mixture formulations. Results shown in
(58) The LIDT results were also examined as a function of the laser peak intensity at each pulse length. The results, shown in
(59) At the shortest pulse lengths, both types of materials undergo a similar ˜3× reduction in damage threshold intensity between 600 ps and 2.5 ps. Similarly, as the pulse duration increases from 50 ps to 100 ps and from 100 ps to 1.5 ns, the average damage intensity changes by similar amounts in each increment for both saturated and unsaturated materials (˜1.5× and ˜2.5×, respectively). However, around 10 ps, the damage intensity changes by differing amounts for the two materials types. Specifically, between 2.5 ps and 10 ps, the change in the damage threshold intensity is lower for the saturated materials than for the unsaturated materials (1.7× and 2.6×, respectively). This difference is reversed between 10 ps and 50 ps, where the change in the damage threshold intensity is 2.9× and 1.8× for the saturated and unsaturated materials, respectively.
(60) Wavelength Dependence at about 1 ns Pulse Duration
(61) The excitation process is dependent on the electronic structure of the material and, as such, should depend strongly on the laser wavelength. Nematic LC materials were tested using nanosecond laser excitation at 351-nm (third harmonic, 3ω) and 527-nm (second harmonic, 2ω) to compliment the results obtained at the fundamental 1053-nm (1ω) wavelength presented above. This multiple-wavelength investigation aims to probe the correlation between the electronic structure of each material and its laser-induced damage behavior via altering the excitation photon energy.
(62) The electronic excitation pathways in LC materials are generally known and involve a singlet ground state (S.sub.0) and excited singlet (S.sub.1, S.sub.2, . . . S.sub.n) and triplet states. The time scale of the transition from the singlet states to the corresponding triplet states during relaxation, or intersystem crossing, is typically >1 ns, which has been confirmed for several unsaturated LC compounds [See (1) F. H. Loesel, M. H. Niemz, J. F. Bille, and T. Juhasz, “Laser-induced optical breakdown on hard and soft tissues and its dependence on the pulse duration: experiment and model,” IEEE J Quant Elect, 32 (10), 1717-1722 1996; and (2) A. Oraevsky, L. B. Da Silva, A. Rubenchik, M. Feit, M. E. Glinsky, M. Perry, B. M. Mammini, W. Small IV, and B. C. Stuart, “Plasma mediated ablation of biological tissues with nanosecond-to-femtosecond laser pulses: Relative role of linear and nonlinear absorption,” IEEE J. Sel. Top. Quantum Electron. 2, 801-809 (1997)]. Because the excitation leading to laser induced damage (breakdown) occurs during the laser pulse, transitions with lifetimes longer that the pulse duration (in our case ˜1 ns) will not have any effect on laser damage mechanisms. Consequently we consider only the transitions between the singlet states. The accordingly modified Jablonski energy diagram in
(63) The wavelengths designating the onset of linear absorption for each LC material given in Table 1 are used as a guide to suggest the order of photon absorption required for the S.sub.0.fwdarw.S.sub.1 electronic state transition for unsaturated and saturated materials. Under 1053-nm laser irradiation, the unsaturated materials require three-photon absorption for the S.sub.0.fwdarw.S.sub.1 transition, while the saturated materials require four-photon absorption. This difference in the order of the absorption process required to generate excited-state electrons is captured clearly by the difference in the damage threshold between the two types of materials, where the saturated materials have 2× to 3× higher damage threshold across all pulse lengths tested (
(64) The LIDT results shown in
(65) The LIDT results under irradiation with 527-nm and 1.2-ns pulses are shown in
(66) The LIDT results under irradiation with 1053-nm, 1.5-ns pulses were shown previously in
(67) What Was Learned from This Study
(68) The results demonstrate that the LIDT values exhibit a strong dependence on the incident laser wavelength, which indicates that damage initiation is sensitive to the energy separation between the ground and excited states. In order to deposit a sufficient amount of energy to initiate damage, electrons might be excited to a level S.sub.n≥S.sub.2. Among all probable pathways for the S.sub.0.fwdarw.S.sub.n transition, the one that involves the lowest order excitation processes (through existing intermediate states) is expected to be the dominant mechanism. In our system, this principle implies that the electrons will first undergo the S.sub.0.fwdarw.S.sub.1 transition, followed by the S.sub.1.fwdarw.S.sub.2 transition, and then followed by possible single photon transitions to reach higher excited states (due to smaller energy separations).
(69) Upon excitation of electrons to the first excited state, additional excited-state absorption will require a lower-order absorption process, because the energy separation between S.sub.1 and S.sub.n states is smaller compared to that between S.sub.0 and S.sub.1 states [See (1) R. Sander, V. Herrmann, and R. Menzel, “Transient absorption spectra and bleaching of 4′-n-pentyl-4-cyanoterphenyl in cyclohexane—determination of cross sections and recovery times,” J. Chem. Phys. 104, 4390-4395 (1996); and (2) G. E. O'Keefe, J. C. De Mello, G. J. Denton, K. J. McEwan, and S. J. Till, “Transient excited-state absorption of the liquid crystal CB15 [4-(2-methylbutyl)-4-cyanobiphenyl] in its isotropic phase,” Liq. Cryst. 21, 225-232 (1996)]. This smaller energy separation, in turn, yields a higher absorption cross section for excited-state absorption (ESA) and is therefore critical in the context of laser damage. Because the lifetime of the Si state is of the order of 1 ns or longer, in this work, the excited electrons do not return to the ground state during the laser pulse [See (1) R. Sander, V. Herrmann, and R. Menzel, “Transient absorption spectra and bleaching of 4′-n-pentyl-4-cyanoterphenyl in cyclohexane—determination of cross sections and recovery times,” J. Chem. Phys. 104, 4390-4395 (1996); and (2) G. E. O'Keefe, J. C. De Mello, G. J. Denton, K. J. McEwan, and S. J. Till, “Transient excited-state absorption of the liquid crystal CB15 [4-(2-methylbutyl)-4-cyanobiphenyl] in its isotropic phase,” Liq. Cryst. 21, 225-232 (1996)]. Consequently, ESA is a more effective energy-deposition mechanism, but is limited by the available excited-state electron population. Therefore, two general governing mechanisms that contribute to absorption of energy by the laser pulse can be considered: (a) direct absorption by ground-state electrons and (b) absorption by excited-state electrons involving only the singlet states. The excited-state electrons can, in principle, undergo multiple absorption cycles by either reaching the higher excited state (S.sub.2) and returning to the Si state during the laser pulse to repeat the process or continuing with additional absorption toward higher excited states (S.sub.2.fwdarw.S.sub.m).
(70) Laser-induced damage experiments exploring pulse length scaling provide insight into energy-deposition mechanisms. Of particular interest is the change in the normalized LIDT between the two types of materials at 10 ps (
(71) To better capture the relative difference in the measured LIDT at different wavelengths and their relationship to the electronic structure of each type of material (summarized in
(72) Comparing LIDT results obtained under 351-nm and 1053-nm excitation, the difference in LIDT for unsaturated materials is ˜150× but only ˜8× for saturated materials. The dramatic variation in LIDT differences for the two material types is arguably related to the different order of the absorption process required for the S.sub.0.fwdarw.S.sub.1 transition. The order changes from linear absorption to a 3-photon absorption process in unsaturated materials, while for saturated materials a nonlinear process is required at both wavelengths (2-photon and 4-photon processes for 351-nm and 1053-nm excitation, respectively).
(73) Laser conditioning (N-on-1 LIDT>1-on-1 LIDT) was only observed under a subset of conditions: (a) both material types at 50 ps, 100 ps, and 1.5 ns at 1053 nm and (b) saturated materials at 527 nm and 351 nm. The LIDT results for unsaturated LC's (5CB, E7 and the PPMeOB/PPPOB mixture) and saturated LC's (1550C, MLC-2037, and the partially saturated ZLI-1646) were averaged at each wavelength and plotted as a function of the pulse length in
(74) The highlighted data associated with observations of laser conditioning shown in
(75) In summary, this study demonstrate that the LIDT values show strong dependence on wavelength and electronic structure, which in turn provides information about the excitation pathways leading to laser induced damage. Experimental data suggest that key components in the laser-induced damage mechanisms in LC's involve a complex interplay of both multiphoton absorption and excited-state absorption, where their relative contributions vary with both pulse length and wavelength. In general, saturated materials are shown to provide a higher LIDT at all wavelengths and pulse lengths.