Implementing reworkable strain relief packaging structure for electronic component interconnects

Abstract

A method and structure are provided for implementing enhanced reworkable strain relief packaging for electronic component interconnects. A plurality of custom strain relief pads is provided with a component footprint wiring layout on a component carrier or a component. The custom strain relief pads are disposed at component body perimeter locations. A solder mask is applied around these pad locations to provide a constrained area for a fusible surface coating. A fusible surface coating material is applied in the to the custom strain relief pads in the constrained area and then soldering of components is performed. Then a structural adhesive material is applied to the custom strain relief pad locations.

Claims

1. A method for implementing enhanced reworkable strain relief packaging for electronic component interconnects, the method comprising: providing a component carrier; providing, on the component carrier, a ball grid array (BGA) module footprint and further providing, at corner locations corresponding to corners of a placed BGA component, a plurality of first custom corner pads, the BGA module footprint positioned within the plurality of first custom corner pads; providing, on the BGA component, at locations corresponding to the corner locations, a plurality of second custom corner pads; applying a solder mask around the plurality of first custom corner pads and around the plurality of second custom corner pads, the solder mask providing a first constrained area and a second constrained area, respectively; depositing a fusible layer onto the plurality of first and the plurality of second custom corner pads, the fusible layer selected to have a melting temperature less than a melting temperature of solder used in BGA component solder joints formed between the BGA component and the component carrier; placing a solder paste onto BGA ball attach pads included in the BGA module footprint; placing the BGA component onto the component carrier so that solder attach balls of the BGA component contact the solder paste on the BGA ball attach pads; soldering the BGA component to the component carrier; and depositing a structural adhesive material onto the plurality of first and onto the plurality of second custom corner pads.

2. The method of claim 1, further comprising: applying local heating to the BGA component; removing the BGA component for rework; and removing the deposited structural adhesive material with local heating.

3. The method of claim 1 wherein providing the component carrier includes providing a printed circuit board (PCB) configured to accept the mounting of the BGA component.

4. The method of claim 1 wherein providing the component carrier includes providing a circuit carrier configured to accept the mounting of the BGA component.

5. The method of claim 1 wherein placing the BGA component on the component carrier and soldering the component to the BGA component carrier includes a solder reflow operation.

6. The method of claim 1 wherein placing the BGA component on the component carrier and soldering the component to the component carrier includes a surface-mount technology (SMT) assembly operation.

7. The method of claim 1 wherein depositing the structural adhesive material onto the plurality of first and onto the plurality of second custom corner pads includes an ultraviolet (UV) curing operation.

8. The method of claim 1 wherein depositing the structural adhesive material onto the plurality of first and onto the plurality of second custom corner pads includes a heat curing operation.

9. The method of claim 1, further comprising removing, by a local heating operation, the BGA component and the structural adhesive material deposited onto the plurality of first and onto the plurality of second custom corner pads.

10. The method of claim 9 wherein the structural adhesive material ruggedizes and provides strain relief for the BGA component and for component solder joints.

11. A method for implementing enhanced reworkable strain relief packaging for electronic component interconnects, the method comprising: providing a BGA component; providing a component carrier; providing, at corner locations corresponding to corners of a placed BGA component on the component carrier, a plurality of first custom corner pads, and further providing on the component carrier, a ball grid array (BGA) module footprint, the BGA module footprint positioned within the plurality of first custom corner pads; providing, at locations on the BGA component corresponding to the corner locations, a plurality of second custom corner pads; applying a solder mask around the plurality of first custom corner pads and around the plurality of second custom corner pads, the solder mask providing a first constrained area and a second constrained area, respectively; depositing a fusible layer onto the plurality of first and the plurality of second custom corner pads, the fusible layer selected to have a melting temperature less than a melting temperature of solder used in BGA component solder joints formed between the BGA component and the component carrier; placing a solder paste onto BGA ball attach pads included in the BGA module footprint; placing the BGA component onto the component carrier so that solder attach balls of the BGA component contact the solder paste on the BGA ball attach pads; soldering the BGA component to the component carrier; and depositing a structural adhesive material onto the plurality of first and onto the plurality of second custom corner pads.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The present invention together with the above and other objects and advantages may best be understood from the following detailed description of the preferred embodiments of the invention illustrated in the drawings, wherein:

(2) FIGS. 1A and 1B, and FIGS. 1C and 1D are respective top and side views illustrating example structures for implementing enhanced reworkable strain relief packaging for electronic component interconnects in accordance with the preferred embodiments;

(3) FIGS. 2A and 2B and FIGS. 2C and 2D are respective top and side views illustrating example structures for implementing enhanced reworkable strain relief packaging for electronic component interconnects in accordance with the preferred embodiments;

(4) FIGS. 3A and 3B and FIGS. 3C and 3D are respective top and side views illustrating example structures for implementing enhanced reworkable strain relief packaging for electronic component interconnects in accordance with the preferred embodiments;

(5) FIGS. 4A and 4B illustrate example package structures and process sequence for implementing enhanced reworkable strain relief packaging for electronic component interconnects in accordance with the preferred embodiments;

(6) FIGS. 5A and 5B illustrate example package structures and process sequence for implementing enhanced reworkable strain relief packaging for electronic component interconnects in accordance with the preferred embodiments; and

(7) FIG. 6 illustrates example package structures for implementing enhanced reworkable strain relief packaging for electronic component interconnects in accordance with preferred embodiments of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(8) In the following detailed description of embodiments of the invention, reference is made to the accompanying drawings, which illustrate example embodiments by which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the invention.

(9) The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms a, an and the are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms comprises and/or comprising, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

(10) In accordance with features of the invention, a method and structure are provided for implementing enhanced reworkable strain relief packaging for electronic component interconnects. A plurality of custom strain relief pads is provided with a component footprint wiring layout on a component carrier. The custom strain relief pads are disposed at component body perimeter locations. A solder mask is applied around these pad locations to provide a constrained area for a fusible surface coating. A fusible surface coating material is applied in the to the custom strain relief pads in the constrained area and then soldering of components is performed. Then a structural adhesive material is applied to the custom strain relief pad locations.

(11) In accordance with features of the invention, a method and structure are provided for implementing enhanced reworkable strain relief packaging providing solder ball wear out stress relief. The enhanced reworkable strain relief packaging structure for electronic component interconnects enables applying local heat for component removal, rework and replacement when required due to functional or damage issues, the fusible layer has a composition which is designed to melt at or below the melting temperature of the solder joints, providing an easy, clean separation of the component and the strain relief adhesive from the fusible release layer.

(12) Having reference now to the drawings, in 1A and 1B, and FIGS. 1C and 1D, there are shown example structures generally designated by reference characters 100, 120 for implementing enhanced reworkable strain relief packaging for electronic component interconnects in accordance with the preferred embodiment. Structures 100, 120 include a printed wiring board (PWB) 102 with an example footprint 104 of ball grid array (BGA) modules or connector components with a plurality of custom corner or edge pads 106 shown on PWB 102. In FIGS. 1C and 1D, the structure 120 includes a fusible layer 112 extending above and covering the custom corner or edge pads 106, and a fusible layer 114 extending around the custom corner or edge pads 106 in the example footprint 104.

(13) In accordance with features of the invention, the fusible layer 112, 114 has a composition which is designed to melt at or below a melting temperature of the component solder joints. Local heat is applied to a particular component using conventional rework tools. As a result, melting and liquid layer formation beneath the structural strain relief adhesive provides de-bonding, and an easy, clean separation and removal of the component and the strain relief adhesive from the fusible release layer coating present on the custom strain relief pads.

(14) In accordance with features of the invention, the novel packaging structures 100, 120 enable easy component removal and subsequent site rework and component replacement to be realized when a rigid structural adhesive is used on component corners or edges to ruggedize an assembly and provide component strain relief.

(15) Referring now to FIGS. 2A and 2B and FIGS. 2C and 2D, there are shown respective top and side views illustrating example structures generally designated by reference char200, 220 for implementing enhanced reworkable strain relief packaging for electronic component interconnects in accordance with the preferred embodiments. Structure 200 includes a printed wiring board (PWB) 202 with an example overmolded organic ball grid array (BGA) module 204 solder attached to PWB component site with a plurality of custom corner or edge pads 206 on PWB 202 and below a component laminate 208. In FIGS. 1C and 1D, the structure 220 includes a printed wiring board (PWB) 202 with an example HLGA connectors 212 solder attached to PWB component site with a plurality of custom corner or edge pads 206 on PWB 202 and below a component laminate 208.

(16) Referring now to FIGS. 3A and 3B and FIGS. 3C and 3D, there are shown respective top and side views illustrating example structures generally designated by reference characters 300, 320 for implementing enhanced reworkable strain relief packaging for electronic component interconnects in accordance with the preferred embodiments. Structures 300, 320 illustrate structures 200, 220 including an additional fusible layer 302 extending above and covering the custom corner or edge pads 206, of structures 200, 220 in accordance with features of the invention. The additional fusible layer 302 extending above and covering the custom corner or edge pads 206 are best seen in FIGS. 3B, and 3D.

(17) FIGS. 4A and 4B respectively schematically illustrate example package structures generally designated by reference characters 400, and process sequence steps for implementing enhanced reworkable strain relief packaging for electronic component interconnects in accordance with the preferred embodiments.

(18) Referring now to FIG. 4A and FIG. 4B, package structures are shown in FIG. 4A, and in FIG. 4B, there is shown a flow chart illustrating example process sequence steps corresponding to the package structures of FIG. 4A. In FIG. 4A, structure 402 illustrates a board component site footprint with array pads and custom pads for strain relief adhesive attach, and structure 404 illustrates the board component site footprint after solder paste and fusible layer applications the board component site footprint, as indicated at blocks 422 and 424 in FIG. 4B. Structure 406 illustrates a component placement onto the site and as indicated at block 426. Structure 408 illustrates component board assembly after solder reflow and component attach and as indicated at block 428. Structure 410 illustrates component board assembly after strain relief adhesive dispense and cure and as indicated at block 430. Structure 412 illustrates component board assembly site undergoing local heating for rework and component removal and as indicated at block 432. Structure 414 illustrates component removal after heat application including release of strain relief adhesive from liquid fusible coat present on custom pads and as indicated at block 434. Structure 416 illustrates board component site footprint solder redress and as indicated at block 436. Structure 418 illustrates new component placement onto reworked/redressed site and as indicated at block 438. Structure 420 illustrates component board assembly after solder reflow and component attach on the reworked site and as indicated at block 440. Structure 422 illustrates new component assembly after strain relief adhesive dispense and cure on the reworked site and as indicated at block 440.

(19) FIGS. 5A and 5B respectively schematically illustrate example package structures generally designated by reference characters 400, and process sequence steps for implementing enhanced reworkable strain relief packaging for electronic component interconnects in accordance with the preferred embodiments.

(20) Referring now to FIG. 5A and FIG. 5B, in FIG. 5A package structures are shown with high magnification of the custom pad area 106, 206, and in FIG. 5B, there is shown a flow chart illustrating example process sequence steps corresponding to the package structures of FIG. 5A. In FIG. 5A, structure 502 illustrates a local custom pad feature at component footprint perimeter for strain relief adhesive attach, and as indicated at block 518. Structure 504 illustrates the local custom pad feature at component footprint perimeter for strain relief adhesive attach after solder paste and fusible layer application, as indicated at a block 520. Structure 506 illustrates an optional reflowed fusible release layer as indicated at block 522. Structure 508 illustrates component board assembly after solder reflow and component attach and as indicated at block 524. Structure 510 illustrates component board assembly after component solder reflow and attach to board assembly and after strain relief adhesive dispense and cure as indicated at block 524. Note in structure 510 that the bulk of adhesive fillet resides on pad with adhesive material contained within the aperture of the solder mask opening surrounding the pad feature. Structure 512 illustrates component board assembly site after component removal for site rework after undergoing local heating for rework and component removal and bulk of the adhesive separates cleanly for the liquid fusible layer as indicated at block 528. Structure 514 illustrates rework, reflow and new component attachment after site redress as indicated at block 530. Structure 516 illustrates new component assembly after strain relief adhesive dispense and cure on the completed reworked site as indicated at block 534.

(21) Referring now to FIG. 6, there are shown package structures with high magnification of custom pad areas generally designated by reference characters 600, 610, and 620 in accordance with preferred embodiments of the invention. Each of the structures 600, 610, and 620 includes a component carrier 602, such as a printed wiring board (PWB) 602, and a component 604, such as a Ball Grid Array (BGA) component 604.

(22) In structure 600, pad features and fusible release layer 606 are provided on the PWB 602, such as illustrated and described above. In structure 610, custom pad features and fusible release layer 612 is provided on the BGA 604. The custom pad features 612 advantageously are provided on the bottom body perimeter of the BGA component 604 surrounding the array of solder attach balls, and are coated with similar release layers of fusible materials described above. The custom pad features and fusible release layer 612 are provided on the BGA 604 facilitate easily reworking the component as well by allowing for easy removal of the structural strain relief adhesive from the surface of the BGA component 604. In structure 620, custom pad features and fusible release layer 612 are provided on the BGA 604 as described with respect to structure 610, and custom pad features and fusible release layer 624 are provided on the PWB 602, as described above.

(23) While the present invention has been described with reference to the details of the embodiments of the invention shown in the drawing, these details are not intended to limit the scope of the invention as claimed in the appended claims.