AN IMAGING DEVICE FOR MOTOR VEHICLE
20200333619 ยท 2020-10-22
Inventors
Cpc classification
H04N23/55
ELECTRICITY
B60R11/04
PERFORMING OPERATIONS; TRANSPORTING
H04N23/54
ELECTRICITY
G02B5/208
PHYSICS
G02B27/62
PHYSICS
B60K35/00
PERFORMING OPERATIONS; TRANSPORTING
G02B13/16
PHYSICS
International classification
G02B27/62
PHYSICS
B60K35/00
PERFORMING OPERATIONS; TRANSPORTING
B60R11/04
PERFORMING OPERATIONS; TRANSPORTING
H04N17/00
ELECTRICITY
Abstract
An imaging device suitable for a motor vehicle and a method of providing the same is disclosed herein. The imaging device has an optical assembly arranged using a plurality of lenses and an image sensor to convert light rays received by the optical assembly. Specifically, the optical assembly comprises of a plurality of lenses stacked together. The optical assembly and image sensor are aligned using an active alignment process with six degrees of freedom in a x, y and z-axis, which determines a position of the optical assembly relative to the image sensor.
Claims
1. An imaging device for a motor vehicle, comprising: an optical assembly comprising a plurality of lenses; and an image sensor configured to convert light rays received by the optical assembly into electrical signals.
2. The imaging device of claim 1, wherein the optical assembly and the image sensor are aligned using an active alignment process with six degrees of freedom in a x, y and z-axis.
3. The imaging device of claim 2, wherein the six degree of freedom in the x, y and z-axis determines a position of the optical assembly relative to the image sensor.
4. The imaging device of claim 1, wherein the plurality of lenses are spherical lenses, aspherical lenses or a combination thereof.
5. The imaging device of claim 1, wherein the optical assembly further comprises a casing for housing the plurality of lenses.
6. The imaging device according to claim 1, wherein the optical assembly comprises a bandpass filter to allow a selected frequency range to pass through to the image sensor.
7. The imaging device according to claim 6, wherein the bandpass filter is an infrared bandpass filter.
8. (canceled)
9. The imaging device according to claim 2, wherein an adhesive force is applied between the plurality of lenses and the image sensor to retain the alignment of the optical assembly and the image sensor.
10. The imaging device according to claim 1, wherein the imaging device further comprises a processing circuitry to electronically convert electrical signals from the image sensor into images.
11. An instrument cluster of a motor vehicle having an imaging device according to claim 1.
12. A mobile communication device having an imaging device according to claim 1.
13. A method of providing an imaging device for a motor vehicle according to claim 1, the method comprising: supplying an optical assembly for receiving light rays; supplying an image sensor for converting the received light rays into electrical signals; and actively aligning the optical assembly relative to the image sensor with six degrees of freedom in a x, y and z-axis.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0017] Other objects and aspects will become apparent from the following description of embodiments with reference to the accompany drawings in which:
[0018]
[0019]
[0020]
DETAILED DESCRIPTION OF EMBODIMENTS
[0021] Hereinafter, exemplary embodiments of this disclosure be discussed in details.
[0022] With reference to
[0023] Each degree of freedom represents the freedom to move along or rotate about each Cartesian coordinate axis, i.e. x, y and z-axis. In this sense, the maximum amount of freedom is at six degrees of freedom, to move along each axis, and freedom to rotate about each of the axis.
[0024] In theory, to prevent optical aberration, the optical assembly 102 and the image sensor 110 are aligned as accurately as possible, to ensure quality of images captured. However, during manufacturing process, a perfect alignment is not possible due to tolerance in the optical assembly 102 and image sensor 110. In order to maximise the performance and accuracy of the imaging device, an alignment process is required to calibrate the optical assembly 102, i.e. the plurality of lenses 104, 106, 108, over the imaging sensor 110. Such optical alignment process may be passive or active. In a preferred embodiment, an active alignment process is applied to align the plurality of lenses 104, 106 and 108 to the image sensor 110 during mounting process. An active alignment process may be done by a machine or by an operator, to adjust the optical assembly 102 and the image sensor 110, to maximise imaging device performance, i.e. sharpest image possible. This alignment is done by moving the optical assembly 102 in each of the Cartesian coordinate axis, i.e. x, y and z-axis and also rotating about each of the aforesaid axis until a sharpest image is achieved, to determine a position of the optical assembly 102 relative to the image sensor 110.
[0025] An adhesive force 112, for example glue, may be pre-applied before commencing the active alignment process. Thereafter, the adhesive force 112 is cured by applying UV curing process. The adhesive force 112 may be applied around the perimeter of the optical assembly 102 and also around the perimeter of the image sensor 110. The aforesaid steps ensures the position of the optical assembly 102 is kept in place.
[0026] For prevention of dust from environment, a casing is used to house the optical assembly 102. In a preferred embodiment, the optical assembly 102 includes a bandpass filter 114, to allow light rays within a desired spectrum to pass through. One example is to use an infrared (IR) bandpass filter, such that only wavelengths within the infrared spectrum are received by the optical assembly 102.
[0027] To increase imaging device performance, a vibration absorption means (not shown) is included in the optical assembly 102 to absorb or isolate vibrations.
[0028] Once the image sensor 110 receives and convert light rays received by the optical assembly 102 into electrical signals, a processing circuitry electronically converts the electrical signals into images. In a preferred embodiment, the processing circuitry 116 is a printed circuit board (PCB) connected directly to the imaging device 100.
[0029] In an alternative embodiment, the processing circuitry is a main printed circuit board (PCB) of an instrument cluster, as shown in
[0030] Turning now to