Abstract
System on chips (SoCs) based on a microprocessor or a neural processor (e.g., brain-inspired processor) electrically coupled with electronic memory devices and/or optically coupled with an optical memory device, along with embodiment(s) of a building block (an element) of the microprocessor/neural processor, the electronic memory device and the optical memory device are disclosed. It should be noted that a microprocessor can be replaced by a graphical processor.
Claims
1. A system comprising: a neural processor, wherein the neural processor comprises memristors, wherein the neural processor is coupled with an optical memory device by an optical signal to electronic signal converter (OEC) device, wherein the optical signal to electronic signal converter (OEC) device is coupled with an optical device, wherein the optical device provides (i) a first wavelength for writing, (ii) a second wavelength for erasing, (iii) a third wavelength for reading, wherein the optical memory device is activated by (i) a first wavelength for writing, (ii) a second wavelength for erasing, (iii) a third wavelength for reading, wherein the neural processor is further coupled with an electronic memory device, wherein the electronic memory device comprises a phase change material of a nanoscaled dimension, or a phase transition material of a nanoscaled dimension, wherein the nanoscaled dimension is less than 1000 nanometers in any dimension.
2. The system according to claim 1, wherein the optical memory device comprises a phase change material, or a phase transition material.
3. The system according to claim 1, wherein the optical memory device comprises a phase change material of a nanoscaled dimension, or a phase transition material of a nanoscaled dimension, wherein the nanoscaled dimension is less than 1000 nanometers in any dimension.
4. The system according to claim 1, wherein the electronic memory device comprises Ag.sub.4In.sub.3Sb.sub.67Te.sub.26 (AIST) material.
5. A system on chip comprising: (a) an electronic memory device; and (b) a neural processor, wherein the neural processor comprises memristors, wherein the neural processor is coupled with the electronic memory device, wherein the neural processor is further coupled with an optical memory device by an optical signal to electronic signal converter (OEC) device and an optical waveguide, wherein the optical memory device is activated by (i) a first wavelength for writing, (ii) a second wavelength for erasing, (iii) a third wavelength for reading.
6. The system according to claim 5, wherein the optical memory device comprises a phase change material, or a phase transition material.
7. The system according to claim 5, wherein the optical memory device comprises a phase change material of a nanoscaled dimension, or a phase transition material of a nanoscaled dimension, wherein the nanoscaled dimension is less than 1000 nanometers in any dimension.
8. The system according to claim 5, wherein the electronic memory device comprises a phase change material of a nanoscaled dimension, or a phase transition material of a nanoscaled dimension, wherein the nanoscaled dimension is less than 1000 nanometers in any dimension.
9. The system according to claim 8, wherein the electronic memory device comprises Ag.sub.4In.sub.3Sb.sub.67Te.sub.26 (AIST) material of a nanoscaled dimension, wherein the nanoscaled dimension is less than 1000 nanometers in any dimension.
10. A system on chip comprising: a microprocessor, or a graphical processor, wherein the microprocessor, or the graphical processor is electrically coupled with an electronic memory device, wherein the electronic memory device comprises a selector device, wherein the electronic memory device comprises Ag.sub.4In.sub.3Sb.sub.67Te.sub.26 (AIST) material of a nanoscaled dimension, wherein the nanoscaled dimension is less than 1000 nanometers in any dimension, wherein Ag.sub.4In.sub.3Sb.sub.67Te.sub.26 (AIST) material is arranged in three-dimension (3-D), wherein the system is coupled with an optical memory device by an optical signal to electronic signal converter (OEC) device, or an optical waveguide, wherein the optical memory device is activated by (i) a first wavelength for writing, (ii) a second wavelength for erasing, (iii) a third wavelength for reading.
11. The system according to claim 10, wherein the microprocessor comprises carbon nanotube based field effect transistors, or phase transition based field effect transistors, or phase change based field effect transistors, wherein the carbon nanotube is metallurgically coupled with a source metal and a drain metal.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) FIG. 1A illustrates an embodiment of a first system on chip, wherein a microprocessor is electrically coupling with electronic memory devices.
(2) FIG. 1B illustrates another embodiment of the first system on chip, wherein the microprocessor is electrically coupling with electronic memory devices.
(3) FIG. 2 illustrates an embodiment of a building block (an element: phase transition (PT) based field effect transistor (FET)) of the microprocessor.
(4) FIG. 3 illustrates another embodiment of a building block (an element: carbon nanotube based (CNT) field effect transistor) of the microprocessor.
(5) FIG. 4 illustrates another embodiment of a building block (an element: hybrid phase transition-carbon nanotube (PT-CNT) based field effect transistor) of the microprocessor.
(6) FIG. 5 illustrates an embodiment of a building block (an element: based on a nanoscaled (wherein, the nanoscaled is defined as less than 1000 nanometers in any dimension) phase transition material in this utility patent application) of an electronic memory device.
(7) FIG. 6 illustrates another embodiment of a building block (an element: based on a nanoscaled phase transition material) of the electronic memory device.
(8) FIG. 7 illustrates another embodiment of a building block (an element: based on a nanoscaled phase transition material) of the electronic memory device.
(9) FIG. 8 illustrates another embodiment of a building block (an element: based on a nanoscaled phase change/nanoscaled phase transition material) of the electronic memory device.
(10) FIG. 9 illustrates an embodiment of a second system on chip, wherein a microprocessor is optically coupling with an optical memory device.
(11) FIG. 10 illustrates an embodiment of a third system on chip, wherein a microprocessor is optically coupling with the optical memory device and also electrically coupling with the electronic memory devices.
(12) FIG. 11 illustrates an embodiment of a fourth system on chip, wherein a neural processor is optically coupling with the optical memory device.
(13) FIG. 12 illustrates an embodiment of a fifth system on chip, wherein the neural processor is optically coupling with the optical memory device and also electrically coupling with the electronic memory devices.
(14) FIG. 13 illustrates an embodiment of a building block (an element: based on memristors and microprocessors) of the neural processor. It should be noted that a microprocessor can be replaced by a graphical processor.
(15) FIG. 14 illustrates another embodiment of a building block (an element: based on a metal oxide layer releasing oxygen ions) of the neural processor.
(16) FIG. 15 illustrates an embodiment of a building block (an element: based on a phase change material) of the optical memory device. It should be noted that a phase change material can be also replaced by a phase transition material. Additionally, the phase change material/phase transition material can be nanoscaled.
DETAIL DESCRIPTION OF THE DRAWINGS
(17) FIG. 1A illustrates an embodiment of 100Aa first system on chip. In FIG. 1A, 120Aa microprocessor is electrically coupled with 140sthe electronic memory devices through 160a metalized through-semiconductor via hole (TSV). Device ball grids (for electrically coupling 140sthe electronic memory devices with 120Athe microprocessor) is denoted by 180. Package ball grids (for electrically coupling 120Athe microprocessor to 220a package substrate) is denoted by 200.
(18) Furthermore, 120Athe microprocessor can be replaced by a graphical processor. The building block (the element) of 140sthe electronic memory device are illustrated in FIGS. 5, 6, 7 and 8.
(19) It should be noted that 140sthe electronic memory devices can integrate a combination of electronic memories as illustrated in FIGS. 5, 6, 7 and 8, depending on a particular performance need of 100Athe first system on chip.
(20) FIG. 1B illustrates another embodiment of 100Athe first system on chip, utilizing a common platforman interposer for electrically coupling 140sthe electronic memory devices onto a logic die-communicating via a physical layer connection (PHY) with 120Athe microprocessor on 220the package substrate.
(21) FIGS. 2-4 illustrate various embodiments of a building block (an element) of 120Athe microprocessor. The building block of 120Athe microprocessor can be a field effect transistor.
(22) FIG. 2 illustrates 240Aa phase transition material based field effect transistor. In FIG. 2, a silicon substrate is denoted by 260, a silicon dioxide dielectric is denoted by 280, a source metal is denoted by 300, a drain metal is denoted by 320, a phase transition material is denoted by 340A, a gate oxide (e.g., hafnium oxide) is denoted by 360 and a top gate metal is denoted by 380.
(23) FIG. 3 illustrates 240B, carbon nanotube based field effect transistor. In FIG. 3, the silicon substrate is denoted by 260, the silicon dioxide dielectric is denoted by 280, the source metal is denoted by 300, the drain metal is denoted by 320, a carbon nanotube is denoted by 340B, the gate oxide is denoted by 360 and the top gate metal is denoted by 380. 340Bthe carbon nanotube can be metallurgically coupled/connected/welded to the source metal 300 and the drain metal 320, utilizing a metal layer.
(24) FIG. 4 illustrates 240C, a hybrid phase transition material-carbon nanotube based field effect transistor. In FIG. 4, the silicon substrate is denoted by 260, the silicon dioxide dielectric is denoted by 280, the source metal is denoted by 300, the drain metal is denoted by 320, a phase transition material is denoted by 340A, the carbon nanotube is denoted by 340B, the gate oxide is denoted by 360 and the top gate metal is denoted by 380. 340Bthe carbon nanotube can be metallurgically coupled/connected/welded to the source metal 300 and the drain metal 320, utilizing a metal layer.
(25) Many types of electronic memory devices (e.g., a dynamic random access memory (DRAM)/NAND flash) are used in present computing systems. Dynamic random access memory is an electronic volatile memory device that stores each bit of data in a separate capacitor. The capacitor can be either charged or discharged. These two states can represent the two values of a bit, conventionally called 0 and 1. The capacitor will slowly discharge and the data eventually fades, unless the capacitor charge is refreshed periodically. NAND flash memory device is an electronic non-volatile memory device that can be electrically erased and reprogrammed. Present invention of an electronic memory device based on a phase change material which can replace dynamic random access electronic memory device.
(26) FIG. 5 illustrates an embodiment of a cross-sectional design of a cell of 400Aan electronic memory device based on a nanoscaled phase transition material. In FIG. 5, the silicon substrate is denoted by 260, the silicon dioxide dielectric is denoted by 280, a bottom metal is denoted by 420A, a nanoscaled phase transition material is denoted by 440 and a top metal is denoted by 420B.
(27) FIG. 6 illustrates another embodiment of a cross-sectional design of a cell of 440Bthe electronic memory device based on a nanoscaled phase transition material. In FIG. 6, the bottom metal is denoted by 420A, the silicon dioxide is denoted by 280, the nanoscaled phase transition material is denoted by 440 and the top metal is denoted by 420B.
(28) FIG. 7 illustrates another embodiment of a cross-sectional design of a cell of 400Cthe electronic memory device based on nanoscaled phase transition material. In FIG. 7, the silicon substrate is denoted by 260, the source metal is denoted by 300, the drain metal is denoted by 320, the silicon dioxide is denoted by 280, the nanoscaled phase transition material is denoted by 440, another silicon dioxide (e.g., fabricated/constructed by atomic layer deposition (ALD)) is denoted by 280 and the metal is denoted by 420.
(29) Furthermore, Hf.sub.0.5Zr.sub.0.5O.sub.2 ferroelectric ultra thin-film (of about 15 nanometers to 30 nanometers in thickness) can replace both the nanoscaled phase transition material 440 and another silicon dioxide 280.
(30) FIG. 8 illustrates another embodiment (stacked in a three-dimensional configuration) of a cross-sectional design of a cell of 400Dan electronic memory device based on a nanoscaled phase change (e.g., nanoscaled Ag.sub.4In.sub.3Sb.sub.67Te.sub.26 (AIST))/nanoscaled phase transition (e.g., nanoscaled vanadium dioxide) material. Here a cell of 400Dthe electronic memory device can be individually selected by a selector device. About 15 nanometers to 30 nanometers thick Ag.sub.4In.sub.3Sb.sub.67Te.sub.26 based phase change material in the cell of 400Dthe electronic memory device can replace dynamic random access memory electronic memory device. Ag.sub.4In.sub.3Sb.sub.67Te.sub.26 ultra thin-film (of about 15 nanometers to 30 nanometers thickness) can be excited by terahertz electrical pulses of few picoseconds in time duration and suitable (e.g., about 200 kV/cm) threshold electric field strength.
(31) Furthermore, Ag.sub.4In.sub.3Sb.sub.67Te.sub.26 (AIST) ultra thin-film (of about 15 nanometers to 30 nanometers thickness) can be also utilized as the selector device.
(32) FIG. 9 illustrates an embodiment of 100Ba second system on chip. In FIG. 9, 120Athe microprocessor is optically coupled with 520an optical memory device. In FIG. 9, the microprocessor is denoted by 120A, which is electrically coupled to the package substrate 220 with the package ball grids 200. 120Athe microprocessor is electro-optically coupled by 460, an optical to electrical converter (OEC) device.
(33) It should be noted that 140sthe electronic memory devices can integrate a combination of electronic memories as illustrated in FIGS. 5, 6, 7 and 8, depending on a particular performance need of 100Bthe second system on chip.
(34) An optical module (OM)/device is denoted by 480, which provides many wavelengths of controlled intensities. 480the optical module/device includes a light source of one or more wavelengths, or light sources of one or more wavelengths.
(35) 460the optical to electrical converter device, 480the optical module/device and 520the optical memory device are optically coupled by 500an optical waveguide. In FIG. 9, 120Amicroprocessor can be optically coupled with 520the optical memory device by 460the optical to electrical converter device or 480the optical module/device or 500the optical waveguide, or alternatively a combination of 460the optical to electronic converter device, 480the optical module/device and 500the optical waveguide. Details of 520the optical memory device are illustrated in FIG. 15.
(36) FIG. 10 illustrates an embodiment of 100C, a third system on chip. In FIG. 10, 120Athe microprocessor is optically coupled with 520the phase change material (PCM) based optical memory device. FIG. 10 is similar to FIG. 9 with exception that 120Athe microprocessor is additionally electrically coupled with 140sthe electronic memory devices. 120Athe microprocessor is electrically coupled with 140sthe electronic memory devices through 160, the metalized through-semiconductor via hole. Device ball grids (for electrically connecting 140the electronic memory devices with 120the microprocessor) is denoted by 180. The package ball grids (for electrically coupling 120-the microprocessor to 220the package substrate) is denoted by 200. In FIG. 10, 120Amicroprocessor can be optically coupled with 520the optical memory device by 460the optical to electrical converter device or 480the optical module/device or 500the optical waveguide, or alternatively a combination of 460the optical to electrical converter device, 480the optical module/device and 500the optical waveguide.
(37) It should be noted that 140sthe electronic memory devices can integrate a combination of electronic memories as illustrated in FIGS. 5, 6, 7 and 8, depending on a particular performance need of 100Cthe third system on chip.
(38) FIG. 11 illustrates an embodiment of 100Da fourth system on chip. In FIG. 11, a neural processor is denoted by 120B, which is electrically coupled to the package substrate 220 with the package ball grids 200. 120Bthe neural processor is electro-optically coupled by 460 the optical to electrical converter device. The optical module/device is denoted by 480, which provides many wavelengths of controlled intensities. 460the optical to electrical converter, 480the optical module/device and 520the optical memory device are optically coupled by 500the optical waveguide. In FIG. 11, 120Bneural processor can be optically coupled with 520the optical memory device by 460the optical to electrical converter device or 480the optical module/device or 500the optical waveguide, or alternatively a combination of 460the optical to electrical converter device, 480the optical module/device and 500the optical waveguide.
(39) It should be noted that 140sthe electronic memory devices can integrate a combination of electronic memories as illustrated in FIGS. 5, 6, 7 and 8, depending on a particular performance need of 100Dthe fourth system on chip.
(40) FIG. 12 illustrates an embodiment of 100Ea fifth system on chip. FIG. 12 is similar to FIG. 11 with exception that 120Bthe neural processor is additionally electrically coupled with 140sthe electronic memory devices. In FIG. 12, 120Bthe neural processor can be optically coupled with 520the optical memory device by 460the optical to electrical converter device or 480the optical module/device or 500the optical waveguide, or alternatively a combination of 460the optical to electronic converter device, 480the optical module/device and 500the optical waveguide.
(41) It should be noted that 140sthe electronic memory devices can integrate a combination of electronic memories as illustrated in FIGS. 5, 6, 7 and 8, depending on a particular performance need of 100Ethe fifth system on chip.
(42) FIG. 13 illustrates an embodiment of a building block (an element) of 120Bthe neural processor, which comprises microprocessors and memristors (e.g., a phase change/phase transition/ferroelectric/transition metal oxide (TMO)/silicon-rich oxide based material for the memristor) stacked in the three-dimensional (3-D) arrangement. Memristors can (a) save CPU processing bottleneck, (b) improve memory management, and (c) enable efficient in data processing due to interactions of memristors and transistors (of 120Athe microprocessor). In the transistor (of 120Athe microprocessor) once the flow of electrons is interrupted by, say, cutting the power, all information is lost. But a memristor can remember the amount of charge that was flowing through it and it has another fundamental difference compared with transistorsit can escape the rigid boundaries of microprocessor's digital binary codes. A memristor can also have multi-levels e.g., zero, one half, one quarter, one third and so on and that creates a very powerful memristive based smart neuromorphic computer, where it itself can adapt and learn/relearn. Alternatively, the building block (the element) of 120Bthe neural processor can include memristors and just one 120Athe microprocessor. It should be noted that, any material of the memristor can be nanoscaled and 120Athe microprocessor can be replaced by a graphical processor.
(43) FIG. 14 illustrates another embodiment of a building block (an element) of 120Bthe neural processor, which comprises a metal oxide layer releasing oxygen ions and field effect transistor, utilizing a two-dimensional material (e.g., graphene/indium selenide (InSe)), a source metal and a drain metal.
(44) FIG. 15 illustrates an embodiment of 520the optical memory device. In FIG. 15, 500the optical waveguide is fabricated on 540a substrate (e.g., silicon on insulator (SOI) substrate). 500the optical waveguide has 560-a patch of a phase change material. 560the patch of a phase change material is activated for writing, reading and erasing by various wavelengths of controlled optical intensities from 480the optical module/device. Write wavelength (a first wavelength) of a controlled first optical intensity is denoted by 580, erase wavelength (a second wavelength) of a controlled second optical intensity is denoted by 600 and read wavelength (a third wavelength) of a controlled third optical intensity is denoted by 620.
(45) Furthermore, 560the patch of the phase change material (e.g., germanium-antimony-tellurium (GST) or Ag.sub.4In.sub.3Sb.sub.67Te.sub.26) can be replaced by a phase transition material (e.g., vanadium dioxide). Additionally, it should be noted that the phase change material or the phase transition material can be nanoscaled.
(46) In the above disclosed specifications / has been used to indicate an or. Any example in the preferred best mode embodiments is by way of an example only and not by way of any limitation.
(47) The above disclosed specifications are the preferred best mode embodiments of the present invention. The specifications are not intended to be limiting only to the preferred best mode embodiments of the present invention. Numerous variations and/or modifications (e.g., electrically/optically coupled can be replaced by electrically/optically connected or an optical module can be replaced by an optical device) are possible within the scope of the present invention. Accordingly, the disclosed preferred best mode embodiments are to be construed as illustrative only. The inventors of the present invention are not required to describe each and every conceivable and possible future embodiment(s) in the preferred best mode embodiments of the present invention. A claim of this invention covers not only the literal elements in the claim, but also the equivalents of those elements. Thus, the scope and spirit of this invention shall be defined by the claims and the equivalents of the claims only. The exclusive use of all variations and/or modifications within the scope of the claims is reserved. Unless a claim term is specifically defined in the preferred best mode embodiments, then a claim term has an ordinary meaning, as understood by a person with an ordinary skill in the art, at the time of the present invention. Furthermore, the termmeans was not used nor intended nor implied in the disclosed preferred best mode embodiments of the present invention. Thus, the inventor has not limited the scope of the claims as mean plus function. Furthermore, the scope and spirit of the present invention shall be defined by the claims and the equivalents of the claims only.
