Manufacturing method for IGZO active layer and oxide thin film transistor

Abstract

A manufacturing method for an IGZO active layer is disclosed. The method comprises steps of: after depositing a first metal layer and a gate insulation layer on a substrate, depositing an IGZO material on the gate insulation layer, and forming an IGZO film; and performing a plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas to adjust element contents on the surface of the IGZO film, and forming an IGZO active layer. The present invention also correspondingly discloses a manufacturing method for an oxide thin film transistor. By implementing the embodiments of the present invention, the elements on the film surface of the IGZO active layer can be adjusted to improve electrical properties.

Claims

1. A manufacturing method for an IGZO active layer, comprising steps of: after depositing a first metal layer and a gate insulation layer on a substrate, depositing an IGZO material on the gate insulation layer, and forming an IGZO film; and performing a plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas to adjust element contents on the surface of the IGZO film to form an IGZO active layer; wherein the plasma cleaning treatment uses a power of 30004000 watts; a gas pressure of 3050 mTorr; a gas flow rate of 5001000 standard milliliter/min, and a processing time of 520 seconds.

2. The manufacturing method according to claim 1, wherein the method further includes a step of: photoresist coating, exposing, developing, and etching the surface of the IGZO film after the plasma cleaning treatment in order to complete an IGZO patterning in order to form the IGZO active layer.

3. A manufacturing method for an oxide thin film transistor, comprising steps of: providing a substrate, and depositing a first metal layer on the substrate to form a gate electrode; depositing a gate insulation layer on the first metal layer; depositing an IGZO material on the gate insulation layer to form an IGZO film, and performing a plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas to form an IGZO active layer; and depositing a second metal layer on the IGZO active layer and etching the second metal layer to form a source electrode and a drain electrode; wherein the step of performing plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas includes a step of: performing a plasma cleaning treatment to a film surface of the IGZO active layer using the argon gas or the helium gas, wherein a power adopted in the plasma cleaning treatment is 10006000 watts; a gas pressure is 3070 mTorr, and the gas flow rate is 2002000 standard milliliter/min; a processing time is 0120 seconds.

4. The manufacturing method according to claim 3, wherein the step of depositing an IGZO material on the gate insulation layer to form an IGZO film, and performing a plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas to form an IGZO active layer comprises steps of: depositing an IGZO material on the gate insulation layer by physical vapor deposition to form the IGZO film; performing the plasma cleaning treatment to the surface of the IGZO film by the argon gas or the helium gas; and photoresist coating, exposing, developing, and etching the surface of the IGZO film after performing the plasma cleaning treatment to the IGZO film in order to complete an IGZO patterning to form the IGZO active layer.

5. The manufacturing method according to claim 3, wherein the step of depositing an IGZO material on the gate insulation layer to form an IGZO film, and performing a plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas to form an IGZO active layer comprises steps of: depositing an IGZO material on the gate insulation layer by physical vapor deposition to form the IGZO film; and performing the plasma cleaning treatment to the surface of the IGZO film by the argon gas or the helium gas in order to form the IGZO active layer.

6. The manufacturing method according to claim 5, wherein the step of depositing a second metal layer on the IGZO active layer and etching the second metal layer to form a gate electrode and a drain electrode comprises steps of: depositing a second metal layer on the IGZO active layer; coating a photoresist on the second metal layer; etching a peripheral of the second metal layer and the IGZO film; and thinning the photoresist, and through a wet etching to form the gate electrode and the drain electrode on the second metal layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) In order to more clearly illustrate the technical solution in the present invention or in the prior art, the following will illustrate the figures used for describing the embodiments or the prior art. It is obvious that the following figures are only some embodiments of the present invention. For the person of ordinary skill in the art without creative effort, it can also obtain other figures according to these figures.

(2) FIG. 1 is a schematic structural diagram of an oxide thin film transistor in the prior art;

(3) FIG. 2 is a schematic diagram of a main flow of a manufacturing method for an IGZO active layer provided by an embodiment of the present invention.

(4) FIG. 3 is a schematic diagram of a main flow of a manufacturing method for an oxide thin film transistor provided by an embodiment of the present invention.

(5) FIG. 4 is a schematic diagram showing more detailed steps of the manufacturing process corresponding to an embodiment of FIG. 3;

(6) FIG. 5 is a schematic structural diagram of the finally formed oxide thin film transistor of FIG. 3.

(7) FIG. 6 is a schematic diagram showing more detailed steps of the manufacturing process corresponding to an embodiment of FIG. 3

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

(8) The technical solutions in the embodiments of the present invention are clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the protection scope of the present invention.

(9) Here, it should also be noted that in order to avoid obscuring the invention by unnecessary detail, only the structures and/or processing steps closely related to the solution according to the invention are shown in the drawings, and the other details that are not relevant to the present invention are omitted.

(10) FIG. 2 is a schematic diagram of a main flow of manufacturing method for an IGZO active layer provided by an embodiment of the present invention; in this embodiment, the method includes the following steps:

(11) Step S10, after depositing a first metal layer and a gate insulation layer on a substrate, depositing an IGZO material on the gate insulation layer, and forming an IGZO film;

(12) Step S11, performing a plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas to adjust element contents on the surface of the IGZO film, for example, forming a certain amount of oxygen holes in the IGZO active layer in order to form an IGZO active layer.

(13) Wherein, the step of performing a plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas specifically includes:

(14) performing a plasma cleaning treatment to a film surface of the IGZO active layer using the argon gas or the helium gas, wherein a power adopted in the plasma cleaning is 10006000 watts; a gas pressure is 3070 mTorr, and a gas flow rate is 2002000 standard milliliter/min; and a processing time is 0120 seconds.

(15) In a more specific example, the plasma cleaning treatment uses a power of 30004000 watts; a gas pressure of 3050 mTorr; a gas flow rate of 5001000 standard milliliter/min, and a processing time of 520 seconds.

(16) It can be understood that, in some examples, the following steps are further included in the step S11:

(17) photoresist coating, exposing, developing, and etching the surface of the IGZO film after the plasma cleaning treatment in order to complete an IGZO patterning to form the IGZO active layer.

(18) It can be understood that performing the plasma cleaning treatment to the film surface of the IGZO active layer by the argon gas or the helium gas can adjust the content of each element of the film surface of the IGZO active layer, as shown in Table 2 below. In one embodiment, a schematic table of the change of each element after treating by the argon gas is shown.

(19) TABLE-US-00002 IGZO surface initially manufactured by PVD process IGZO surface treated Peak without any treatment with the Ar gas Ga 2p 12.53 26.12 Zn 2p 14.77 15.66 O 1s 56.98 43.53 In 3d 15.72 14.69

(20) Wherein, the blank sample is IGZO film deposited by physical vapor deposition (PVD). After cleaning by the argon gas (Ar), a content percentage of Ga on the surface increases from 12.53 to 26.12, and a content percentage of Zn increases from 14.77 to 15.66, a content percentage of O decreased from 56.98 to 43.53, and a content percentage of In decreased from 15.72 to 14.69. Comparing to the data shown in Table 1 above, it can be known that the adjustment direction of film surface of the IGZO film after the argon gas or the helium gas treatment is opposite to the adjustment direction of the film surface of the IGZO film by the etching solution. Accordingly, treating the IGZO film by using the argon gas or the helium gas can improving the electrical performance of the IGZO active layer in a BCE type oxide thin film transistor.

(21) FIG. 3 is a schematic diagram of a main flow of a manufacturing method for an oxide thin film transistor provided by an embodiment of the present invention; in this embodiment, the method includes the following steps:

(22) Step S20, providing a substrate, and depositing a first metal layer on the substrate to form a gate electrode;

(23) Step S21, depositing a gate insulation layer on the first metal layer;

(24) Step S22, depositing an IGZO material on the gate insulation layer to form an IGZO film, and performing a plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas to form an IGZO active layer;

(25) Wherein, the step of performing plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas specifically includes:

(26) performing a plasma cleaning treatment to a film surface of the IGZO active layer using the argon gas or the helium gas, wherein a power adopted in the plasma cleaning treatment is 10006000 watts; a gas pressure is 3070 mTorr, and the gas flow rate is 2002000 standard milliliter/min; a processing time is 0120 seconds.

(27) In a more specific example, the plasma cleaning treatment uses a power of 30004000 watts; a gas pressure of 3050 mTorr; a gas flow rate of 5001000 standard cc/min, and a processing time of 520 seconds.

(28) Step S23, depositing a second metal layer on the IGZO active layer and etching the second metal layer to form a source electrode and a drain electrode.

(29) Specifically; in an example; the step S22 specifically includes:

(30) depositing an IGZO material on the gate insulation layer by physical vapor deposition to form the IGZO film;

(31) performing the plasma cleaning treatment to the surface of the IGZO film by the argon gas or the helium gas;

(32) photoresist coating, exposing, developing, and etching the surface of the IGZO film after performing the plasma cleaning treatment to the IGZO film in order to complete an IGZO patterning to form the IGZO active layer.

(33) Specifically; in another example, the step S22 specifically includes:

(34) depositing an IGZO material on the gate insulation layer by physical vapor deposition to form an IGZO film;

(35) performing a plasma cleaning treatment to the surface of the IGZO film with an argon gas or a helium gas in order to form an IGZO active layer.

(36) The step S23 is specifically:

(37) depositing a second metal layer on the IGZO active layer;

(38) coating a photoresist on the second metal layer;

(39) etching a peripheral of the second metal layer and the IGZO film;

(40) thinning the photoresist, and through a wet etching to form the source electrode and the drain electrode on the second metal layer.

(41) In order to facilitate the understanding of the two examples referred to above, the following description will be respectively made with specific examples.

(42) FIG. 4 is a schematic diagram showing more detailed steps of the manufacturing method corresponding to an embodiment of FIG. 3;

(43) In the illustrated embodiment, a process for manufacturing an oxide thin film transistor using five masks is shown. Specifically, the following steps are included:

(44) Step S30, forming a first metal, that is, depositing a first metal layer on a substrate 10 (such as a glass substrate) to form a gate electrode 11;

(45) Step S31, depositing a gate insulation layer 12 on the gate electrode 11;

(46) Step S32, depositing an IGZO material by physical vapor deposition (PVD) on the gate insulation layer 12 to form an IGZO film 13; at this time, the surface of the IGZO thin film needs to perform a plasma cleaning treatment with an argon gas or a helium gas, for specific processing conditions and methods, reference may be made to the foregoing description of FIG. 3;

(47) Step S33, photoresist coating, exposing, developing, and etching the surface of the IGZO film after performing the plasma cleaning treatment to the IGZO film in order to complete an IGZO patterning to form an IGZO active layer 130;

(48) Step S34, depositing a second metal layer 14 on the IGZO active layer 130;

(49) In step S35, through a wet etching method, etching the second metal layer 14 to form a gate electrode 140 and a drain electrode 141.

(50) The structure of the finally formed oxide thin film transistor is as shown in FIG. 5, wherein the IGZO film in the B region is treated only by the argon gas or the helium gas, and the conductivity of the IGZO film is improved, and the contact resistance is decreased; and the IGZO film in the A region is treated by the argon gas or the helium gas in advance, then, followed by etching through an etching solution; wherein the content of Ga, Zn, O and In elements is redistributed, which is beneficial to electrical improvement.

(51) FIG. 6 is a schematic diagram showing more detailed steps of the manufacturing method corresponding to another embodiment of FIG. 3;

(52) Step S40, forming a first metal, that is, depositing a first metal layer on a substrate 10 (such as a glass substrate) to form a gate electrode 11;

(53) Step S41, depositing a gate insulation layer 12 on the gate electrode 11;

(54) Step S42, depositing an IGZO material by physical vapor deposition (PVD) on the gate insulation layer 12 to form an IGZO film 13; at this time, the surface of the IGZO thin film needs to perform a plasma cleaning treatment with an argon gas or a helium gas, for specific processing conditions and methods, reference may be made to the foregoing description of FIG. 3;

(55) Step S43, depositing a second metal layer 14 on the IGZO film 13;

(56) Step S44, coating a photoresist 15 on the second metal layer 14;

(57) Step S45, etching a peripheral of the second metal layer 14 and the IGZO film 13 to form the IGZO active layer 130;

(58) Step S46, thinning the photoresist 15 in the middle position to expose a part of the surface of the second metal layer 14;

(59) In step S47, using a wet etching method to etch the second metal layer 14 in order to form the source electrode 140 and the drain electrode 141.

(60) The structure of the finally formed oxide thin film transistor is as shown in FIG. 6, wherein, two terminals of the IGZO active layer 130 is treated only by the argon gas or the helium gas, the conductivity is improved, and the contact resistance is decreased; and the film layer in the middle position is treated by the argon gas or the helium gas in advance; and then; etching by the etching solution. The content of Ga, Zn, O and In elements is redistributed, which is beneficial to electrical improvement.

(61) Embodiments of the present invention have the following beneficial effects:

(62) The manufacturing method for an IGZO active layer and the manufacturing method for an oxide thin film transistor provided by the present invention, after forming an IGZO film, performing a plasma cleaning treatment on the surface of the IGZO film by using argon gas or helium gas such that the Ga content and the Zn content in the film surface of the IGZO active layer are increased, and the O content and the In content are decreased, thereby reducing the performance impact caused by the wet etching process for forming the source and drain electrodes.

(63) It should be noted that, herein, relational terms such as first and second, and the like are only used to distinguish one entity or operation from another entity or operation. It is not required or implied that these entities or operations exist any such relationship or order between them. Moreover, the terms comprise, include, or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a series of elements including the process, method, article or device that includes not only those elements but also other elements not expressly listed or further comprising such process, method, article or device inherent elements. Without more constraints, by the statement comprises one . . . element defined does not exclude the existence of additional identical elements in the process, method, article, or apparatus.

(64) The above description is only a specific embodiment of the present application, and it should be noted that those skilled in the art can also make some improvements and retouching without departing from the principle of the present application, should be considered as the protection scope of the present application.