SENSOR MODULE, IN PARTICULAR FOR MEASURING THE AMBIENT TEMPERATURE, THE RELATIVE HUMIDITY AND A GAS CONCENTRATION IN THE ENVIRONMENT OF THE SENSOR MODULE

Abstract

The invention relates to a sensor module (1), comprising: a circuit board (2), at least one temperature sensor (3) arranged on the circuit board (2) for measuring an ambient temperature, at least one further sensor (4) arranged on the circuit board (2), which further sensor (4) generates waste heat when the further sensor (4) is operated. According to the invention, the sensor module (1) is designed for thermal decoupling of the temperature sensor (3) from the further sensor (4) and/or for dissipating the waste heat of the further sensor (4).

Claims

1. A sensor module (1), comprising: a circuit board (2), at least one temperature sensor (3) arranged on the circuit board (2) for measuring an ambient temperature at least one further sensor (4) arranged on the circuit board (2), which further sensor (4) generates waste heat when the further sensor (4) is operated, characterized in that the sensor module (1) is designed for thermal decoupling of the temperature sensor (3) from the further sensor (4) and/or for dissipating the waste heat of the further sensor (4).

2. The sensor module according to claim 1, characterized in that for thermal decoupling of the temperature sensor (3) from the further sensor (4) the temperature sensor (3) comprises a minimum distance (M) from the further sensor (4), wherein in particular the minimum distance is larger than 1.5 cm, in particular larger than 2 cm; and/or in that said minimum distance (M) is at least 60% of a maximum width of the circuit board (2).

3. The sensor module according to one of the preceding claims, characterized in that the temperature sensor (3) is arranged on the circuit board (2) diagonally and/or offset relative to the further sensor (4), in particular in order to further maximize a distance between the two sensors (3, 4).

4. The sensor module according to one of the preceding claims, characterized in that for thermal decoupling of the temperature sensor (3) from the further sensor (4) the circuit board (2) comprises one or more of the following slots: a first slot (5), which is arranged in particular between the temperature sensor (3) and the further sensor (4), a second slot (6), which is arranged in particular between the temperature sensor (3) and the further sensor (4), a third slot (50), which is arranged in particular between the temperature sensor (3) and the further sensor (4), a fourth slot (60).

5. The sensor module according to one of the preceding claims, characterized in that the circuit board (2) comprises a first section (20), a second section (21) and a third section (22), wherein the first and third sections (20, 22) are connected to each other via the second section (21).

6. The sensor module according to claim 5, characterized in that the further sensor (4) is arranged on the first section (20) of the circuit board (2) and/or that the temperature sensor (3) is arranged on the third section (22) of the circuit board (2).

7. The sensor module according to claims 4 and 6, characterized in that the first slot (5) is formed in the second section (21) of the circuit board (2), wherein the first slot (5) is arranged in particular at a transition to the third section (22).

8. The sensor module according to claim 4 and according to one of claims 5 to 7, characterized in that the second slot (6) is formed in the second section (21) of the circuit board (2), wherein the second slot (6) is arranged in particular at a transition to the first section (20).

9. The sensor module according to one of the preceding claims, characterized in that the temperature sensor (3) is electrically conductively connected to at least one conductive path (7) of the circuit board (2).

10. The sensor module according to claims 5 and 9, characterized in that the at least one conductive path (7) extends from the first section (20) of the circuit board (2) to the third section (22) of the circuit board (2).

11. The sensor module according to claim 4 and according to claim 9 or 10, characterized in that the at least one conductive path (7) extends around the first slot (5) so that the first slot (5) is arranged between two opposing sections (7a, 7b) of the at least one conductive path (7).

12. The sensor module according to claim 4 and according to one of claims 9 to 11, characterized in that the at least one conductive path (7) extends past the second slot (6).

13. The sensor module according to claim 4 or according to one of claims 5 to 12 if referring to claim 4, characterized in that the third slot (50) extends around a circuit board region (51) of the third section (22) of the circuit board (2), wherein the temperature sensor (3) is arranged on this circuit board region (51).

14. The sensor module according to one of the preceding claims, characterized in that the sensor module (1) further comprises a voltage transformer (8) for supplying the temperature sensor (3) and/or the further sensor (4) with an operating voltage, wherein the sensor module (1) is designed for thermal decoupling of the temperature sensor (3) from the voltage transformer (8).

15. The sensor module according to claims 5 and 14, characterized in that the voltage transformer (8) is arranged adjacent to the further sensor (4) on the first section (20) of the circuit board (2).

16. The sensor module according to claim 14 or 15, characterized in that for thermal decoupling of the temperature sensor (3) from the voltage transformer (8), the temperature sensor (3) comprises a minimum distance (M) from the voltage transformer (8), wherein in particular the minimum distance (M) is larger than 1.5 cm, in particular larger than 2 cm.

17. The sensor module according to claim 4 or 7 and according to one of claims 14 to 16, characterized in that the first slot (5) is also arranged between the temperature sensor (3) and the voltage transformer (8).

18. The sensor module according to one of the preceding claims, characterized in that the sensor module (1) comprises a plug connector part (9) for electrically contacting the sensor module (1), which plug connector part (9) is arranged on the circuit board (2).

19. The sensor module according to claim 18, characterized in that for thermal decoupling of the temperature sensor (3) from the further sensor (4), the plug connector part (9) is arranged between the temperature sensor (3) and the further sensor (4) on the circuit board (2).

20. The sensor module according to claim 14 and according to claim 18 or 19, characterized in that for thermal decoupling of the temperature sensor (3) from the voltage transformer (8), the plug connector part (9) is arranged between the temperature sensor (3) and the voltage transformer (8).

21. The sensor module according to claim 5 and according to one of claims 18 to 20, characterized in that the plug connector part (9) is arranged on the second section (21) of the circuit board (2).

22. The sensor module according to claim 4 and according to one of claims 18 to 21, characterized in that the fourth slot (60) is arranged under the plug connector part (9).

23. The sensor module according to claim 5 or according to one of claims 6 to 22 if referring to claim 5, characterized in that the circuit board (2) of the sensor module (1) comprises a plurality of conductive paths (7, 70), wherein a density of the conductive paths is larger in the first section (20) of the circuit board (2) than in the second and third sections (21, 22) of the circuit board (2).

24. The sensor module according to claim 5 and according to claim 18 or one of claims 19 to 23 is referring to claim 18, characterized in that waste heat generated in the first section (20) of the circuit board (2) can be dissipated via the plug connector part (9).

25. The sensor module according to claim 23 or according to one of the claims 19 to 23 if referring to claim 24, characterized in that for dissipating waste heat of the first section (20) of the circuit board (2), the circuit board (2) comprises in the first section (20) at least one metallic cooling element (71) which is arranged between adjacent conductive paths (70) of the first section (20) of the circuit board (2).

26. The sensor module according to claim 25, characterized in that the at least one metallic cooling element (71) comprises a region (72) which extends along an edge (20a) of the first section (20) of the circuit board (2), wherein this region (72) is exposed at least in sections to increase the emission of waste heat.

27. The sensor module according to one of the preceding claims, characterized in that the temperature sensor (3) is connected to a flat metal element (3a) for thermal coupling, which flat metal element (3a) is arranged on a lower side (2b) of the circuit board (2).

28. The sensor module according to one of the preceding claims, characterized in that the temperature sensor (3) is also designed to measure the relative humidity of air.

29. The sensor module according to one of the preceding claims, characterized in that the further sensor (4) is an environmental sensor.

30. The sensor module according to one of the preceding claims, characterized in that the further sensor (4) is a particulate matter sensor which is designed to measure a particulate matter concentration in an environment of the sensor module (1).

31. The sensor module according to one of the preceding claims, characterized in that the further sensor (4) is a gas sensor which is designed to measure a gas concentration in an environment of the sensor module (1).

32. A Device comprising a sensor module (1) according to one of the preceding claims, characterized in that the sensor module (1) is arranged in such a way that, with respect to an air flow (S) flowing in the device, the temperature sensor (3) is arranged upstream of the further sensor (4) and/or of the voltage transformer (8); or in that the air flow (S) flows over the circuit board (2) perpendicular to a circuit board axis (x), wherein the first and third sections (20, 22) of the circuit board (2) face each other in the direction of the circuit board axis (x).

Description

[0059] Further features, advantages and embodiments of the present invention shall be explained in the following on the basis of the figures, wherein:

[0060] FIG. 1 shows a side view of a sensor module according to the invention;

[0061] FIG. 2 shows a top view of an upper side of the sensor module shown in FIG. 1;

[0062] FIG. 3 shows another side view of the sensor module shown in FIGS. 1 and 2; and

[0063] FIG. 4 shows a top view of a bottom side of the sensor module shown in FIGS. 1 to 3.

[0064] FIGS. 1 to 4 show a sensor module 1 according to the invention. The sensor module 1 comprises a circuit board 2, at least one temperature sensor 3 arranged on the circuit board 2 for measuring an ambient temperature and at least one further sensor 4 arranged on the circuit board 2, which generates waste heat when the further sensor 4 is operated. The further sensor 4 is, for example, a gas sensor which is particularly designed to measure the concentration of at least one gas in the atmosphere surrounding the sensor module. The two sensors 3, 4 (and in particular the voltage transformer 8 and the plug connector part 9, see below) are preferably arranged on an upper side 2a of the circuit board 2, which faces away from a lower side 2b of the circuit board 2. The upper side 2a is also called the populated side; the lower side 2b can represent a non-populated side of the circuit board 2.

[0065] Since further sensors 4, such as a gas sensor, usually generate a relatively large amount of waste heat which could falsify the measurement result of the temperature sensor 3, it is provided according to the invention that the sensor module 1 is designed for thermal decoupling of the temperature sensor 3 from the further sensor or gas sensor 4 and/or for dissipating the waste heat of the further sensor 4.

[0066] Furthermore, the sensor module 1 can also comprise a voltage transformer 8 which also produces waste heat and which serves, for example, to provide an operating voltage for the temperature sensor 3 and/or for the additional sensor 4. The sensor module 1 is then preferably also designed for thermal decoupling of temperature sensor 3 from voltage transformer 8 or for dissipation of the waste heat of voltage transformer 8.

[0067] In order to achieve or improve said thermal decoupling, it can be provided that the temperature sensor 3 comprises a minimum distance M to the further sensor 4 or a minimum distance M to the voltage transformer 8.

[0068] As shown in FIGS. 1 to 4, the circuit board 2 can also comprise a first, a second and a third section 20, 21, 22, wherein the first section 20 or end section 20 is connected to the third section 22 or end section 22 via the second section 21.

[0069] For thermal decoupling of the temperature sensor 3 from the further sensor 4 or, if necessary, from the voltage transformer 8, it can also be provided that the circuit board 2 comprises, for example, a first slot 5, which is arranged between the temperature sensor 3 and the further sensor 4, in particular in the second section 21 of the circuit board, preferably at the transition from the second section 21 to the third section 22 of the circuit board 2. The circuit board 2 can also comprise a second slot 6. The two slots 5, 6 can be arranged parallel to each other, for example. Through such slots 5, 6, heat conduction is reduced from the first section 20 of the circuit board 2, on which the further sensor 4 and the voltage transformer 8 are arranged, to the third section 22 of the circuit board 2, on which the temperature sensor 3 to be protected against waste heat is located.

[0070] Furthermore, the temperature sensor 3 can be electrically conductively connected to at least one conductive path 7 of the circuit board 2, the at least one conductive path 7 being configured in such a way that it transports as little waste heat as possible from the further sensor 4 or the voltage transformer 8 to the temperature sensor 3. The at least one conductive path 7 can extend from the first section 20 of the circuit board 2 to the third section 22 of the circuit board 2. Furthermore, the at least one conductive path 7 can pass the second slot 6 and be routed around the first slot 5 so that the first slot 5 is located between two opposing sections 7a, 7b of the at least one conductive path 7 (see FIGS. 2 and 4). The relatively long length of at least one conductive path 7 allows waste heat generated in the first section 20 of the circuit board 2 to be easily dissipated during transport via the said conductive path 7 on its way to the temperature sensor 3. In particular, with regard to the first slot 5, there are two possible paths for the heat flow. This can be done, for example, around the first slot 5 via conductive path 7 or via the circuit board 2 along an edge of the circuit board 2 (dashed arrow in FIG. 2). The metal of conductive path 7 conducts heat better than the circuit board 2 itself, but the length and cross-section of conductive path 7 and the dimensions of the first slot 5 are chosen such that neither of the two possible paths of heat flow dominates strongly.

[0071] Furthermore, the circuit board 2 can comprise a third slot 50 in the third section 22, which extends around a circuit board region 51 of the third section 22 of the circuit board 2 (e.g. open ring-shaped), wherein the temperature sensor 3 is arranged on this circuit board region 51 (on the upper side 2a of the circuit board 2), whereas a flat metal element 3a of the temperature sensor 3 is arranged on this circuit board region 51 for rapid thermal coupling on the lower side 2b of the circuit board 2. Due to the third slot 50, said circuit board region 51 is connected to the rest of the circuit board 2 only via a bar 52, wherein this bar 52 extends between two ends of the third slot 50. The at least one conductive path 7 extends via this bar 52 to the temperature sensor 3, wherein the bar 52 is arranged on a side of the temperature sensor 3 which faces away from the first section 20 of the circuit board 2. Furthermore, the sensor module 1 can comprise a plug connector part 9 for electrically contacting the sensor module 1, which is arranged on the circuit board 2 preferably in the second or central section 21 of the circuit board, e.g. between the two slots 5, 6. The plug connector part 9 can be designed to make a plug connection with a further plug connector part (not shown) which can be provided e.g. at one end of a cable, so that an electrical connection can be established between the cable and the sensor module 1. Below the plug connector part 9, the circuit board 2 can comprise a fourth slot 60 in the second section 21 of the circuit board 2, which causes waste heat to be emitted via the plug connector part 9.

[0072] Due to the arrangement of the plug connector part 9 in the second section 21 of the circuit board 2 between the further sensor 4 and the voltage transformer 8 on the one hand and the temperature sensor 3 on the other hand, the plug connector part 9 forms a shield which shields the temperature sensor 3 from the waste heat (especially heat radiation) of the further sensor 4 and the voltage transformer 8, which are arranged on the first section 20 of the circuit board 2. Furthermore, waste heat from the first section 20 of the circuit board 2 can be dissipated via the plug connector part 9 (e.g. into a cable connected to the connector part 9).

[0073] Furthermore, the conductive paths 7, 70 of the sensor module 1 can have a maximum density in the first section 20 of the circuit board 2 (see particularly FIG. 4), so that in the first section 20 of the circuit board 2, waste heat generated by the further sensor 4 and/or the voltage transformer 8 can be concentrated there at first.

[0074] To dissipate waste heat from the first section 20 of the circuit board 2, the first section 20 can comprise at least one metallic cooling element 71, which is arranged between adjacent conductive paths 70 or next to a conductive path 70 of the first section 21 of the circuit board 2. The at least one metallic cooling element 71 can comprise a region 72 which extends along an edge 20a of the first section 21 of the circuit board 2, wherein this region 72 is at least partially exposed to increase the emission of waste heat.

[0075] According to a further aspect of the invention, a device is disclosed which comprises a sensor module 1 according to the invention, wherein this sensor module (cf. FIG. 2) is arranged in such a way that, with respect to an air flow S flowing in the device, the temperature sensor 3 is arranged upstream of the further sensor 4 and/or of the voltage transformer 8. Alternatively, the air flow S can flow across the circuit board 2 perpendicular to a circuit board axis x, wherein the first and third sections 20, 22 of the circuit board 2 face each other in the direction of the circuit board axis x.