Vertical microfluidic probe head with large scale surface processing apertures
10717078 ยท 2020-07-21
Assignee
Inventors
- Govind Kaigala (Rueschlikon, CH)
- Robert Lovchik (Schoenenberg, CH)
- David P. Taylor (Thalwil, CH)
- Ismael Zeaf (Lausanne, CH)
Cpc classification
B01L3/0255
PERFORMING OPERATIONS; TRANSPORTING
B01L2300/0861
PERFORMING OPERATIONS; TRANSPORTING
B01L3/5027
PERFORMING OPERATIONS; TRANSPORTING
International classification
B01L3/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
One or more embodiments of the present invention are directed to a method for processing a surface with a vertical microfluidic probe head. The method includes positioning the microfluidic probe head so as for the edge surface to face a surface to be processed. Next, the method dispenses processing liquid via each orifice of the first one of the sets of n orifices, so as for the dispensed processing liquid to process the surface; and aspirates liquid via each orifice of the second one of the sets of n orifices.
Claims
1. A method for processing a surface with a vertical microfluidic probe head having a middle layer of material; two outer layers, wherein each of the middle layer and the two outer layers are distinct from each other; wherein the middle layer comprises two opposite, main surfaces, a first main surface and a second main surface, which are, each, grooved up to a same edge surface that adjoins each of the main surfaces, so as to form two sets of n microchannel cavities, n1, on each of the main surfaces wherein a first set of the n microchannel cavities on the first main surface is not in fluidic communication with a second set of the n microchannel cavities on the second main surface except at the same edge surface; and wherein the middle is arranged between the two outer layers, the latter at least partly closing the microchannel cavities grooved on the two main surfaces, so as to form two sets of n microchannels that are, each, open on the edge surface, such that two opposite sets of n orifices are formed on the edge surface, the method comprising: positioning the microfluidic probe head so as for the edge surface to face a surface to be processed; dispensing processing liquid via each orifice of a first one of the sets of n orifices, so as for the dispensed processing liquid to process the surface; and aspirating liquid via each orifice of a second one of the sets of n orifices.
2. The method of claim 1, wherein aspirating liquid comprises aspirating, via an orifice of the second one of the sets of n orifices, at least some of the processing liquid dispensed through an orifice of the first one of the sets of n orifices.
3. The method of claim 1, wherein the method further comprises: providing an immersion liquid on the surface to be processed; wherein the microfluidic probe head is positioned so as to subsequently dispense processing liquid within the immersion liquid.
4. The method of claim 1, wherein the method further comprises moving the microfluidic probe head opposite to the surface to be processed while dispensing processing liquid.
5. The method of claim 4, wherein the microfluidic probe head is moved opposite to the surface to be processed, along a direction forming an angle with respect to an average direction of flows of processing liquid dispensed from orifices of the first set of orifices, wherein the angle is between 30 and 60.
Description
BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS
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(4) In
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(9) The accompanying drawings show simplified representations of devices or parts thereof, as involved in one or more embodiments. Technical features depicted in the drawings are not necessarily to scale. Similar or functionally similar elements in the figures have been allocated the same numeral references, unless otherwise indicated.
DETAILED DESCRIPTION
(10) One or more embodiments of the present invention are directed to vertical MFPs suited for large surface processing.
(11) Microchannels and orifices of vertical MFPs are, in the prior art, formed at an interface between two layers, i.e., a body (e.g., a Si wafer) and a lid. The length of the apertures corresponds to the depth of the channels grooved in the body of the MFP head. The length accordingly extends transversely to the main surfaces of the body. The width of an aperture is parallel to the main surfaces of the body.
(12) Thus, and as it may be realized, scaling up the surface processing capability of the prior art, vertical MFPs is a priori difficult. On the one hand, the length of the apertures can hardly be increased, as the maximal length of the apertures is determined by the depth of microchannels, which is necessarily limited by the thickness of the body on which the microchannels are grooved. For instance, in current vertical MFP heads, the injection and aspiration channels are etched on a same face of a Si wafer. The lengths of the apertures is thus determined by the depth of the corresponding channels which is in turn limited by the thickness of the substrate (typically 300 m, if a Si wafer is used). Long apertures (e.g., on the order of the mm- or cm-scale) can therefore not be obtained with the current fabrication processes.
(13) On the other hand, and as discovered by the present disclosure, scaling up the width of the apertures results in tremendous waste of reagents because only a small fraction of the dispensed liquid interacts with the surface. As they concluded, it is therefore necessary to maintain a reasonable width of the aperture (e.g., in the micrometer length-scale). They have therefore devised a new fabrication concept for vertical MFP heads, which allows large slits (or rows of multiple apertures) to be obtained.
(14) Referring generally to
(15) Namely, the middle layer 12 comprises two opposite, main surfaces 12ms (see e.g.,
(16) The middle layer 12 may be a wafer or a portion of wafer. It may for instance comprise (or consist of) a silicon waver of a portion of silicon wafer, if necessary chemically/mechanically processed, as known per se. The outer layers 11, 13 may be glass layers bonded, e.g., by anodic bonding, onto the layer 12.
(17) The edge surface 12es will form part of the processing surface 14 of the device. It adjoins each of the main surfaces 12ms (via an edge thereof). The edge surfaces 11es, 13es (
(18) As explained below in detail, two classes of one or more embodiments can notably be contemplated. In the first class (
(19) In all cases, the middle layer 12 is arranged, e.g., sandwiched between the two outer layers 11, 13. The middle layer may be between and in contact (possibly everywhere) with an inner surface of each of the two outer layers. In variants, intermediate layers or layer portions may be involved, e.g., due to fabrication constraints. The outer layers 11, 13 at least partly close the microchannel cavities 15, 16 grooved on the two main surfaces 12ms of the layer 12, so as to form two sets of n microchannels. Here, grooved means that the middle layer 12 is physically and/or chemically processed so as to form grooves, i.e., cuts or depressions on each side of the layer 12. Thus, the microchannel cavities 15, 16 are grooves. The latter may have portions of constant cross-sectional dimensions, as illustrated in
(20) The microchannels are, each, open on the edge surface 12es. As a result, two opposite sets of n orifices 17, 18, or apertures, are formed on the edge surface 12es, which allows to dispense and aspirate liquid and, if necessary, to form an HFC. The terms aperture and orifice are used herein are synonymous.
(21) Relevant geometrical parameters of vertical MFPs are the following. As illustrated in
(22) In the present approach, the channels (or channel portions) 15, 16 are formed at two interfaces, i.e., between the middle layer 12 and the two outer layers 11, 13 (lids), instead of being formed at a single interface, as in prior vertical MFPs. Thus, the length of the apertures is not anymore limited by the thickness of the middle layer, as was the case with prior vertical MFPs. Accordingly, opposite apertures (or set of apertures) can be fabricated that have a large footprint. As a result, it is possible to simply fabricate large scale surface processing devices, while still enabling HFC.
(23) Owing to the present approach, this is the spacing between opposite orifices 17, 18 that is now constrained by the thickness of the middle layer 12. In fact, the spacing between opposite orifices 17, 18 depends on both the thickness of the layer 12 and the desired depth of the channels 15, 16. Thus, if the thickness of the middle layer 12 is imposed (as when using a standard Si wafer), the deeper the channel, the smaller the spacing. Still, one will generally try to obtain a spacing that is between 50 and 1000 m, in order to maintain suitable properties for the liquid dispensed. Meanwhile, the footprint of the rows of apertures (or the lengths of the opposite slits) can be scaled up to optimize the geometry for large scale surface processing. Each set of orifices can have a long footprint, irrespective of the thickness of the middle layer 12. The latter only need be thick enough to groove channel cavities and provide mechanical stability.
(24) Other materials than silicon, for example plastics, elastomers, ceramics, glass, metals can be contemplated for the middle layer 12, so that the spacing between apertures 17, 18 is not necessarily constrained. Thus, most generally, the spacing between injection and aspiration apertures may be between 0.5 m and 10 mm, and preferably between 1.0 m and 2.0 mm, in order to obtain stable liquid flows. The spacing depends in fact on a number of parameters, which may need to be jointly optimized, such parameters including notably: the desired liquid flow characteristics, the depth of the channels (which determines the apertures' width, or diameter, see below) and the desired mechanical properties for the middle layer.
(25) For instance, as depicted in
(26) As noted earlier, the orifices 17, 18 may have all the same width, which simplifies not only the fabrication process but also the parametrization of the injection and aspiration flow rates. As defined earlier, the width is measured on the edge surface 12es, perpendicularly to the main surfaces 12ms, for the sake of consistency when comparing the geometry of present apertures 17, 18 to the geometry of apertures of prior art devices. For the same reasons, the lengths of the apertures are measured on the edge surface 12es, but parallel to each of the main surfaces 12ms. The orifices 17, 18 may for instance have a width between 20 m and 200 m, for example of 50 m, especially if a standard Si wafer is used for the layer 12, which constrains the apertures' widths and spacing. However, other materials may be used for the layer 12, such that the average width of the apertures may, more generally, be between 0.5 and 1000 m.
(27) In some specific embodiments, the ejection aperture 17 may, however, be designed small enough to enable a liquid confinement having a small diameter, e.g., of about 150 m. Such a confinement is best obtained using apertures 17 having an average diameter of about 20 to 50 m (the diameter is approximately equal to the width and length of an aperture, when using a design such as depicted in
(28) In the first class of one or more embodiments (
(29) Each orifice 17 of the first set may be arranged vis--vis (i.e., face to face in relation to) an orifice 18 of a second one of the sets of n orifices. Thus, a head with a symmetric array of apertures is obtained in that case. The array may scan the surface in diagonal in order to obtain a more uniform pattern on the processed surface. In variants, the orifices may be shifted, so as to create slanted liquid trails, and the head moved perpendicularly to its main surfaces, above the surface 2 to be processed, resulting in the same effect. A symmetric array such as depicted in
(30) The second class of one or more embodiments is now described in detail, in reference to
(31) However, and as realized by the present disclosure, the use of slits of equal lengths may, under certain circumstances, lead to a loss of contact between the liquid flow dispensed (e.g., a HFC) and the surface. I.e., long slit apertures may cause the HFC to not interact well with the surface.
(32) This problem is tentatively explained as follows. When using devices according to the first class of one or more embodiments (e.g., opposite sets of square apertures), the liquid flow of liquid aspirated into the aspiration apertures comes from all four sides of the aspiration aperture. Loosely stated, processing liquid is essentially aspirated from the side of the aspiration aperture 18 that is the closest to the injection aperture 17 while essentially immersion liquid gets aspirated from the three other sides. By defining a flow rate ratio of Q.sub.i:Q.sub.a as, e.g., 1:3 (where Q.sub.a denotes the aspiration flow rate and Q.sub.i the injection flow rate), a flow confinement of the processing liquid can be obtained. However, in the case of slit apertures, the length of the slits is (much) larger than the width, and the aspirated immersion liquid may not be sufficient to accommodate the flow rate difference (Q.sub.aQ.sub.i). As the injection flow rate Q.sub.i of the processing liquid is typically set smaller than the aspiration flow rate Q.sub.a (Q.sub.a<Q.sub.i), the aspiration aperture need aspirate additional immersion liquid, coming from the side facing the injection aperture 17. For this to happen, a sheath of immersion liquid forms below the processing liquid flow, resulting in loss of contact between the HFC and the surface.
(33) A solution to this problem is to differentiate the lengths of the slits 17, 18. Thus, as illustrated in
(34) The two classes of one or more embodiments as discussed above are now compared. A probe head such as depicted in
(35) Referring now to
(36) The orifices 17, 18, the liquid dispensers 25, 35 and the liquid asperators 26, 36 may be jointly designed for the system to be able to aspirate, via orifices 18, liquid dispensed through opposite orifices 17, in operation. I.e., orifices may be dimensioned and positioned at a distance so as to make it possible for the probe to aspirate at apertures 18 processing liquid delivered through the apertures 17, for a given ratio of flow rates. This way, a HFC, or multiple parallel HFCs can be achieved.
(37) As illustrated in
(38) Various changes to the above one or more embodiments may be made and equivalents may be substituted without departing from the scope of the present invention.
(39) For example, dual aspiration slit aperture designs can be contemplated, where two middle layers are present (not shown). For instance, a first Si wafer may be grooved on each side, to provide both an injection and a first aspiration channel. The first Si wafer is sandwiched between a second Si wafer (closing the injection channel) and a glass panel (closing the first aspiration channel). The second Si wafer may itself be grooved, oppositely to the injection channel of the first Si wafer, to provide a second aspiration channel, which can be closed by a second glass layer. Providing additional middle layers allows to effectively increase the aspiration volume, so that the aspiration slits and the injection slit may not necessarily need to differ in length in that case. The fabrication is, however, more challenging, and this design requires an additional silicon layer. Furthermore, the injection channel is not be visible (from the main surfaces) because it is hidden by the second silicon wafer.
(40) While standard Si wafer are typically 300 m thick, one may want to use thicker materials for the middle layer 12, in order to obtain larger aperture spacings and/or larger widths. Indeed, and as concluded by the present disclosure based on various analytical studies performed based on the teachings herein, the time to scan a large surface and the reagent usage are directly linked to the aperture spacing. Thus, using a larger aperture spacing will result in faster scans and consume less reagents. However, a larger aperture spacing makes it more difficult to confine the liquid flow.
(41) The fabrication of present MFP heads and MFPs is straightforward. The same fabrication techniques as used in known vertical MFP heads can be used in the present context. The main difference is that the layer 12 need be processed and bonded on each of its two main surfaces, instead of one of these surfaces. All structured elements, like microchannels, or parts and/or devices integrated in the layer 12 may be manufactured on-chip (using standard lithography processes, for example).
(42) Referring now to
(43) As specifically seen in
(44) The flow rates may be adjusted so as to reach a laminar flow of dispensed liquid 5, which in turn enables a HFC. This is more easily achieved with devices according to the first class of one or more embodiments, comprising two rows of multiple apertures 17, 18 (n2) as, in this case, multiple, parallel laminar flows of processing liquid 5 are formed. To that aim, orifices need be suitably spaced, in each row of apertures. In the schematical representation of
(45) As noted earlier, the method may further comprise moving the microfluidic probe head 10, 10a opposite to the surface 2 to be processed while dispensing processing liquid, to process a large surface area.
(46) The head may for instance be moved diagonally, i.e., along a direction d.sub.s forming an angle with respect to an average direction of liquid flows, wherein the angle is typically between 30 and 60, e.g., of 45, as assumed in
(47) Present vertical MFPs, MFP heads and methods preserve key advantages of known MFP techniques and can be embodied as non-contact devices and techniques, where the probe head does not contact the surface to be processed. A typical working distance between the apex of the MFP head and the surface is 10-50 um. However, it can work using a spacing that is between 5 m and 200 m. The liquid environment (or immersion liquid) is typically an aqueous environment.
(48) Using a probe head 10 as depicted in
(49) In detail,
(50) The external aspiration orifices 19 may be at the level of, i.e., aligned with the aspiration orifices 18, to most efficiently deflect the inwardly bent liquid flows. The appropriate aspiration flow rates (for channels 19) can be refined, e.g., by trial and error, based on other relevant experimental parameters (geometry of orifices, aspiration and injection flow rates Q.sub.a and Q.sub.i, etc.).
(51) While the present invention has been described with reference to a limited number of embodiments, variants and the accompanying drawings, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the present invention. In particular, a feature (device-like or method-like) recited in a given embodiment, variant or shown in a drawing may be combined with or replace another feature in another embodiment, variant or drawing, without departing from the scope of the present invention. Various combinations of the features described in respect of any of the above embodiments or variants may accordingly be contemplated, that remain within the scope of the appended claims. In addition, many minor modifications may be made to adapt a particular situation or material to the teachings of the present invention without departing from its scope. Therefore, it is intended that the present invention not be limited to the particular embodiments disclosed, but that the present invention will include all embodiments falling within the scope of the appended claims. In addition, many other variants than explicitly touched above can be contemplated. In particular, other materials than those explicitly mentioned can be contemplated and the present vertical heads are not necessarily limited to three layers 11-13, i.e., additional middle layers 12 may be provided to form additional aspiration orifices or slits.