TIME-OF-FLIGHT OPTICAL SYSTEMS INCLUDING A FRESNEL SURFACE
20200191919 ยท 2020-06-18
Inventors
Cpc classification
G02B5/188
PHYSICS
H01L31/02327
ELECTRICITY
G01S17/894
PHYSICS
G02B5/208
PHYSICS
International classification
G01S7/481
PHYSICS
Abstract
In various embodiments, the present disclosure provides devices, time-of-flight sensors, and optical sensor packages. One such device includes a light sensor, a first lens, and a second lens. The first lens is positioned along a light receiving path of the light sensor, and the first lens has a first surface and a second surface opposite the first surface. The second lens is positioned along the light receiving path and positioned between the first lens and the light sensor. The second lens has a third surface facing the second surface of the first lens and a fourth surface opposite the third surface. The fourth surface faces the light sensor. At least one of the first, second, third, and fourth surfaces is a Fresnel surface.
Claims
1. A device, comprising: a light sensor; a first lens positioned along a light receiving path of the light sensor, the first lens having a first surface and a second surface opposite the first surface; a second lens positioned along the light receiving path and positioned between the first lens and the light sensor, the second lens having a third surface facing the second surface of the first lens and a fourth surface opposite the third surface, the fourth surface facing the light sensor, wherein at least one of the first, second, third, and fourth surfaces is a Fresnel surface.
2. The device of claim 1, further comprising an optical filter between the second lens and the light sensor.
3. The device of claim 2 wherein the optical filter is a bandpass filter.
4. The device of claim 3 wherein the bandpass filter is configured to block light having a wavelength outside of a range from 920 nm to 960 nm.
5. The device of claim 1 wherein the light sensor comprises an array of single-photon avalanche diodes.
6. The device of claim 1 wherein more than one of the first, second, third, and fourth surfaces are Fresnel surfaces.
7. The device of claim 1 wherein the fourth surface is a Fresnel surface.
8. The device of claim 7 wherein the third surface is a Fresnel surface.
9. The device of claim 1, further comprising a third lens positioned along the light receiving path of the light sensor.
10. A time-of-flight (TOF) sensor, comprising: a light-emitting device which, in operation, transmits an optical pulse; a light sensor which, in operation, receives a reflected portion of the optical pulse; and an optical lens system positioned in a light receiving path of the light sensor, the optical lens system including: a first lens having a first surface and a second surface opposite the first surface, and a second lens positioned between the first lens and the light sensor, the second lens having a third surface facing the second surface of the first lens and a fourth surface opposite the third surface, the fourth surface facing the light sensor, wherein at least one of the first, second, third, and fourth surfaces is a Fresnel surface.
11. The TOF sensor of claim 10 wherein the fourth surface is a Fresnel surface.
12. The TOF sensor of claim 10 wherein the third surface is a Fresnel surface.
13. The TOF sensor of claim 10 wherein the third surface and the fourth surface are Fresnel surfaces.
14. The TOF sensor of claim 10 wherein the light-emitting device comprises at least one of a vertical cavity surface emitting laser (VCSEL) and a light-emitting diode (LED).
15. The TOF sensor of claim 10, further comprising an optical bandpass filter positioned between the second lens and the light sensor.
16. The TOF sensor of claim 10, further comprising: a reference light sensor; and range detection circuitry which, in operation, determines a distance to an object based on signals received from the light sensor and the reference light sensor.
17. An optical sensor package comprising: a substrate; a light-emitting device coupled to the substrate; an image sensor coupled to the substrate; a first lens positioned along a light receiving path of the image sensor, the first lens having a first surface and a second surface opposite the first surface; and a second lens positioned along the light receiving path and positioned between the first lens and the image sensor, the second lens having a third surface facing the second surface of the first lens and a fourth surface opposite the third surface, the fourth surface facing the sensor die, wherein at least one of the first, second, third, and fourth surfaces is a Fresnel surface.
18. The optical sensor package of claim 17 wherein the light-emitting device comprises at least one of a vertical cavity surface emitting laser (VCSEL) and a light-emitting diode (LED).
19. The optical sensor package of claim 17, further comprising a cap coupled to the substrate, the cap defining a first opening over the light-emitting device and a second opening over the first lens, the second lens, and the image sensor.
20. The optical sensor package of claim 19 wherein the cap includes an inner wall that optically separates the light-emitting device from the image sensor.
Description
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0010] In the drawings, identical reference numbers identify similar elements or acts. The sizes and relative positions of elements in the drawings are not necessarily drawn to scale. For example, the shapes of various elements and angles are not necessarily drawn to scale, and some of these elements are arbitrarily enlarged and positioned to improve drawing legibility. Further, the particular shapes of the elements as drawn are not necessarily intended to convey any information regarding the actual shape of the particular elements, and have been solely selected for ease of recognition in the drawings.
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DETAILED DESCRIPTION
[0022] In the following description, certain specific details are set forth in order to provide a thorough understanding of various disclosed embodiments. However, one skilled in the relevant art will recognize that embodiments may be practiced without one or more of these specific details, or with other methods, components, materials, etc. In other instances, well-known structures associated with portable electronic devices and head-worn devices, have not been shown or described in detail to avoid unnecessarily obscuring descriptions of the embodiments.
[0023] Throughout the specification and claims which follow, the word comprise and variations thereof, such as, comprises and comprising are to be construed in an open, inclusive sense, that is, as including, but not limited to.
[0024] Reference throughout this specification to one embodiment or an embodiment means that a particular feature, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
[0025] As used in this specification and the appended claims, the singular forms a, an, and the include plural referents unless the content clearly dictates otherwise. It should also be noted that the term or is generally employed in its broadest sense, that is, as meaning and/or unless the content clearly dictates otherwise.
[0026] The headings and Abstract of the Disclosure provided herein are for convenience only and do not interpret the scope or meaning of the embodiments.
[0027] Turning now to
[0028] As shown in
[0029] An optical barrier 110 is included in the TOF range detection device 100, and reflects a first portion 106 of the optical pulse toward a reference sensor array 112, which may be, for example, a single-photon avalanche diode (SPAD) array. Other light sensors may be employed as the reference sensor array 112 in various embodiments, including, for example, avalanche diodes, charge-coupled device (CCD) or CMOS imagers. A second portion 108 of the optical pulse 104 is reflected off of the object 120 in the image scene, and is received at a return sensor array 114, which may also be a SPAD array.
[0030] The return sensor array 114 may include, for example, an array of between four and several hundred SPAD cells. As will be appreciated by those skilled in the art, SPAD arrays can be used for a variety of applications, including for ranging, for 2D or 3D gesture recognition and for 3D imaging. Each SPAD cell in the return sensor array 114 will provide an output pulse or detectable SPAD event when a photon in the form of the reflected second portion 108 of the optical pulse 104 is detected by that cell, and by monitoring these SPAD events an arrival time of the return pulse can be estimated or detected by the range detection circuitry 116.
[0031] The reference sensor array 112 may be, for example, of the same dimensions or of smaller dimensions than the return sensor array 114, and receives an internal reflection (e.g., reflected by the optical barrier 110) 106 of the transmitted optical pulse 104. In some embodiments, the reference sensor array 112 is a mono-dimensional array, for example, having only a row or column of SPAD cells.
[0032] The range detection circuitry 116 is coupled to the return sensor array 114 and the reference sensor array 112 and estimates the distance between the TOF sensor device 100 and the object 120 in the image scene against which the optical pulses reflect. For example, the range detection circuitry 116 may estimate the delay between each transmitted optical pulse 104 and the return optical pulse 108 received by the return sensor array 114 in order to provide a range estimate in the form of the detected distance to the object 120. The range detection circuitry 116 determines the time of flight based upon the difference between the transmission time of the transmitted optical pulse 104 and the arrival time of the returned optical pulse 108. The range detection circuitry 116 utilizes suitable circuitry, such as time-to-digital converters or time-to-analog converters that generate an output indicative of a time difference that may then be used to determine the time of flight of the transmitted optical pulse 104 and thereby the distance to the object 120, as will be appreciated by those skilled in the art.
[0033] In one or more embodiments, the range detection circuitry 116 includes a digital counter 115, which counts a number of photons received at the return sensor array 114 and the reference sensor array 112 within preset windows or bins of time. Then, by analysis of the photon counts received at the return sensor array 114 and the reference sensor array 112, the range detection circuitry 116 may determine a distance to the object.
[0034] The TOF range detection device 100 further includes a driver 118 that generates a driving signal for driving the light-emitting device 102, e.g., by specifying or otherwise controlling an output power of the optical pulse 104 generated by the light-emitting device 102. The driver 118 may be controlled by a controller 117 that is coupled to the range detection circuitry 116 and the driver 118.
[0035] The TOF sensor device 100 further includes optical lenses 130. The optical lenses 130 receive the reflected second portion 108 of the optical pulse, and focus the reflected second portion 108 on the reference sensor array 112. As will be discussed in further detail herein, the optical lenses 130 may be an optical system having two or more lenses, with one or more surfaces of the lenses being a Fresnel surface.
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[0038] The 3-lens system 230 includes a first lens 231, a second lens 232, and a third lens 233, each of which have opposite surfaces that are conventional curved optical surfaces. Light 201 is received by the system 230 and directed through the first, second, and third lenses 231, 232, 233 toward a sensor surface 250. The light 201 may be, for example, the return optical pulse 108 (see
[0039] The light 201 is shown as many lines having different positions and/or angles, which represents some of the various optical paths for incident light that may be received by the system 230.
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[0041] The modulus of the optical transfer function, which may also be known as the modulation transfer function, may be referred to herein as MTF. The resolution and performance of an optical lens system can be characterized by the MTF, which may generally be described as a measurement of the ability of the lens system to transfer contrast from the imaged object to an image plane (e.g., the sensor surface 250) at a specific resolution.
[0042] For the purposes of the present discussion, it should be understood that in an ideal optical lens system, all of the curves shown in
[0043] As seen in
[0044] While the 3-lens system 230 of
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[0046] The 2-lens system 330 includes a first lens 331 and a second lens 332, each of which have opposite surfaces that are conventional curved optical surfaces. More particularly, the first lens 331 includes a first curved surface 333 and a second curved surface 334 that is opposite to the first curved surface 333. Similarly, the second lens 332 includes a third curved surface 335 and a fourth curved surface 336 that is opposite to the third curved surface 334.
[0047] Light 301 is received by the system 330 and directed through the first and second lenses 331, 332 toward the sensor surface 250. The sensor surface 250 may be a surface of the return sensor array 114. A filter 340, such as a bandpass filter, may be positioned between the second lens 332 and the sensor surface 250.
[0048] Similar to the illustration of
[0049]
[0050] As seen in
[0051] As can be seen from a comparison of
[0052] The optical characteristics of the 2-lens system 330 therefore may be undesirable for use in certain applications, such as TOF sensors. In particular, the aberrations of the 2-lens system 330, for example, as may be due to excessive field curvature and astigmatism, may be undesirable in TOF sensors and other imaging applications. One way to reduce these aberrations is to introduce a negative power, such as be introducing a negative optical surface or negative optical element. However, this generally means adding another lens to the optical system. For example, the 3-lens system 230 shown in
[0053] Another way to reduce the aberrations of the 2-lens system 330, in accordance with various embodiments of the present disclosure, is to introduce one or more Fresnel surfaces into a 2-lens optical system. In a Fresnel surface, the physical curvature of an optical lens surface is made flat, or substantially flat, which results in flattened field curvature.
[0054] Fresnel lenses, i.e., a lens having one or more Fresnel surfaces, are known to those skilled in the relevant art, and are typically used in single lens systems, for example, to replace a conventional spherical or cylindrical lens with a spherical or cylindrical Fresnel lens that has a plurality of ring-shaped segments that all focus light on a single point or single line. The Fresnel lens reduces the amount of material compared to a conventional lens by dividing the lens into a plurality of annular sections. In each section, the overall thickness is decreased compared to an equivalent curved or conventional lens. The Fresnel lens, or a Fresnel surface, thus divides an otherwise continuous surface of a conventional curved lens into a set of surfaces of the same curvature, with stepwise discontinuities between them.
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[0056] The 2-lens system 430 includes a first lens 431 and a second lens 432. The first lens 431 includes first and second surfaces 433, 434 that are opposite one another, and each of which are Fresnel surfaces, as opposed to the conventional curved optical surfaces of the lenses in the system 330 of
[0057] Light 401 is received by the system 430 and directed through the first and second lenses 431, 432 toward the sensor surface 250. The sensor surface 250 may be a surface of the return sensor array 114. A filter 440, such as a bandpass filter, may be positioned between the second lens 432 and the sensor surface 250.
[0058] Similar to the illustration of
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[0060] As can be seen from a comparison of
[0061] While the 2-lens system 430 including Fresnel surfaces provides significant improvements in optical performance as compared to the 2-lens system 330 of
[0062] In order to determine which surface of a 2-lens optical system to be made a Fresnel surface, the inventors of the present disclosure developed models and conducted a variety of optical experiments using the 2-lens system 330 shown in
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[0065] As can be seen from a comparison of
[0066]
[0067] As best shown in
[0068] Generally described, the substrate 612 includes one or more insulative and conductive layers. An upper surface of the substrate 612 may include conductive pads for electrically coupling the substrate 612 to the sensor die 614, and a lower surface of the substrate 612 may include conductive pads or lands for electrically coupling the substrate 612 and/or the sensor die 614 to external circuitry or components, such as an external circuit board. Conductive traces and/or vias may be formed in the substrate 612, and may electrically couple pads on the upper surface with one or more lands on the lower surface of the substrate 612. The lower surface of the substrate 612 forms an outer surface of the TOF sensor package 610.
[0069] The sensor die 614 is secured to the upper surface of the substrate 612, such as by an adhesive material, which may be any material suitable for securing the sensor die 614 to the substrate 612, such as tape, paste, glue, or any other suitable material.
[0070] The sensor die 614 is made from a semiconductor material, such as silicon, and includes one or more electrical components, such as integrated circuits. The integrated circuits may be analog or digital circuits implemented as active devices, passive devices, conductive layers, and dielectric layers formed within the die and electrically interconnected according to the electrical design and function of the die. In particular, the sensor die 614 may include electrical components that form an Application Specific Integrated Circuit (ASIC). Thus, the sensor die 614 includes circuitry to send, receive, and analyze electrical signals as is well known in the art.
[0071] An image sensor 622 is formed in or otherwise coupled to the upper surface of the sensor die 614. The image sensor 622 may be or otherwise correspond to the return sensor array 114 shown in the block diagram of
[0072] The first and second lenses 631, 632 correspond to the optical lenses 130 shown in the block diagram of
[0073] The first lens 631 has opposing first and second surfaces 633, 634, and the second lens 632 has opposing third and fourth surfaces 635, 636. At least one of the first through fourth surfaces 633 to 636 is a Fresnel surface, and in some embodiments, more than one of the first through fourth surfaces 633 to 636 may be Fresnel surfaces. For example, any one or more of the first through fourth surfaces 633 to 636 may be a Fresnel surface respectively corresponding to the first through fourth surfaces 433 to 436 of the 2-lens system 430 shown in
[0074] In some embodiments, only one of the first through fourth surfaces 633 to 636 is a Fresnel surface, while the other surfaces are conventional, curved optical surfaces. For example, the first and second lenses 631, 632 of the TOF sensor package 610 may correspond to the first and second lenses 531, 532 of the 2-lens system 530 shown in
[0075] The first and second lenses 631, 632 may be formed of any optically transparent or transmissive materials, including glass, plastics, and the like. In some embodiments, the lenses 631, 632 are plastic lenses which are formed by injection molding.
[0076] An optical filter 640 may be positioned between the second lens 632 and the image sensor 622. The optical filter 640 may be a bandpass filter that only allows light within a particular range of wavelengths to pass through, while filtering out light outside of the particular wavelength range. In one embodiment, the optical filter 640 is a bandpass filter that passes light having wavelengths of 940 nm20 nm. That is, the filter 640 may pass light having a wavelength within a range of 920 nm to 960 nm, inclusive.
[0077] The light-emitting device 616 may emit radiation in response to an electrical signal received from the sensor die 614, and the image sensor 622 may receive the reflected radiation, after passing through the lenses 631, 632 and the filter 640, and provide electrical signals to the sensor die 614 for processing. The light-emitting device 616 corresponds to the light-emitting device 102 shown in the block diagram of
[0078] The light-emitting device 616 is secured to the upper surface of the substrate 612 using, for example, an adhesive material. The light-emitting device 616 is electrically coupled to the sensor die 614 (e.g., directly electrically coupled to the sensor die 614 and/or indirectly coupled to the sensor die 614 through the substrate 612) and is configured to receive electrical signals, such as a power signal from the sensor die 614, and in response to receiving the signal, to emit the radiation at a particular frequency or wavelength range.
[0079] The cap 618 has outer sidewalls, an upper surface, and an inner wall, as shown for example in
[0080] In some embodiments, the TOF sensor package 610 may further include a light transmissive element 650 positioned over the light-emitting device 616. The light transmissive element 650 may be positioned in a first opening 661 of the cap 618. The light transmissive element 650 may be attached to the cap 618 by any suitable means, including an adhesive, and the light transmissive element 650 may prevent moisture, particles or other contaminants from entering the TOF sensor package 610 through the first opening 661 of the cap 618.
[0081] Although not shown in
[0082] Additional components shown in the block diagram of
[0083] In operation, the ASIC of the sensor die 614 is configured to cause the light-emitting device 616 to emit light through the first opening 661. The light is reflected by a nearby object and travels through the second opening 662, and is focused by the first and second lenses 631, 632 onto the image sensor 622, which senses the received light. The ASIC of the sensor die 614 receives the signals from the image sensor 622 and is configured to process signals generated by the image sensor 622 upon receiving the reflected light.
[0084] As described herein, the present disclosure provides various embodiments which may be suitable for use in various applications, including, for example, in TOF sensors. The embodiments provided herein, which include optical systems having one or more Fresnel surfaces, provide several advantages over optical systems having lenses with conventional curved surfaces. For example, the optical systems including at least one Fresnel surface, as provided herein, facilitate a reduction in a total number of optical elements or lenses in an assembly. This is because the optical systems including one or more Fresnel surfaces provided herein have improved optical performance, and may have an optical performance that is comparable to that of a conventional optical system having one additional lens.
[0085] The various embodiments described above can be combined to provide further embodiments. These and other changes can be made to the embodiments in light of the above-detailed description. In general, in the following claims, the terms used should not be construed to limit the claims to the specific embodiments disclosed in the specification and the claims, but should be construed to include all possible embodiments along with the full scope of equivalents to which such claims are entitled. Accordingly, the claims are not limited by the disclosure.