METHOD AND SYSTEM FOR REMOVING L-FC IN PLASMA ETCHING PROCESS

Abstract

Proposed are a method and a system for removing L-FC in a plasma etching process, in which L-FC, which is condensed on a wafer, an electrode, a substrate, a head, or the like, is removed by using infrared or ultraviolet rays in a plasma etching process using an L-FC precursor.

Claims

1. A method for removing L-FC in a plasma etching process, comprising: removing L-FC condensed inside a chamber by irradiating infrared or ultraviolet rays inside the chamber where plasma etching is performed.

2. The method for removing L-FC in a plasma etching process according to claim 1, wherein the infrared rays have a wavelength of 780 nm or more.

3. The method for removing L-FC in a plasma etching process according to claim 1, wherein the ultraviolet rays have a wavelength of 10 to 380 nm.

4. The method for removing L-FC in a plasma etching process according to claim 1, the method further comprising: forming a window port on one side of the chamber; installing a light source that irradiates infrared or ultraviolet rays outside the chamber; and irradiating the inside of the chamber with infrared or ultraviolet rays generated from the light source through the window port in order to irradiate the inside of the chamber.

5. The method for removing L-FC in a plasma etching process according to claim 4, wherein equipment such as a head or an electrode installed inside the chamber or a wafer or a substrate for manufacturing a semiconductor is irradiated with the infrared or ultraviolet rays.

6. A system for removing L-FC in a plasma etching process, the system comprising: a chamber (10) into which an L-FC based gas is injected as a precursor; an electrode (20) which is installed in the chamber (10) and to which electric power for generating plasma is supplied; a window port (30) formed on one side of the chamber (10); and a light source (40) that irradiates the inside of the chamber (10) with infrared or ultraviolet rays through the window port (30).

7. The system for removing L-FC in a plasma etching process according to claim 6, wherein the light source (40) is a light source that emits infrared rays having a wavelength of 780 nm or more.

8. The system for removing L-FC in a plasma etching process according to claim 6, wherein the light source (40) is a light source that emits ultraviolet rays having a wavelength of 10 to 380 nm.

9. The system for removing L-FC in a plasma etching process according to claim 6, wherein equipment such as a head or an electrode installed inside the chamber or a wafer or a substrate for manufacturing a semiconductor is irradiated with the infrared or ultraviolet rays.

10. The system for removing L-FC in a plasma etching process according to claim 6, wherein, if the plasma etching system is an inductively coupled plasma (ICP) system, the light source (40) is a light source that irradiates an infrared or ultraviolet lamp through an insulating material (80) (quartz) on the lower side of an antenna coil (70) provided in the ICP system.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0022] FIG. 1 is a diagram illustrating a configuration of a plasma etching system implementing a method for removing L-FC of the present invention.

[0023] FIG. 2 is a detailed view of a chamber illustrated in FIG. 1.

[0024] FIG. 3 is a graph of amounts of pressure changes in the chamber in which the method for removing L-FC of the present invention is performed.

[0025] FIG. 4 is a diagram illustrating a configuration of a plasma etching system implementing method for removing L-FC according to another embodiment of the present invention.

[0026] FIG. 5 is a detailed view of a chamber illustrated in FIG. 4.

DESCRIPTION OF BEST EMBODIMENTS

[0027] The most preferred embodiment according to the present invention is a method for removing L-FC in a plasma etching process, and the method includes a configuration of irradiating with infrared or ultraviolet rays the inside of a chamber in which plasma etching is performed to remove L-FC condensed in the chamber.

DESCRIPTION OF EMBODIMENTS

[0028] Hereinafter, configurations of a method a system for removing L-FC in a plasma etching process of the present invention are described with reference to the drawings.

[0029] Here, the accompanied drawings are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the present invention is not limited to the drawings presented below and may be embodied in other aspects.

[0030] In addition, unless defined otherwise, the terms used in the present specification have the meaning commonly understood by those of ordinary skill in the art to which the present invention pertains, and in the following description and accompanying drawings, detailed descriptions of well-known functions and configurations that may be unnecessarily obscure the gist of the present invention will be omitted.

[0031] The method for removing L-FC of the present invention is configured to remove L-FC condensed on a head, an electrode, a wafer, or a substrate installed in a chamber by irradiating with infrared or ultraviolet rays the inside of the chamber in which the plasma etching is performed.

[0032] Here, the infrared rays are infrared rays having a wavelength of about 780 nm or more, and as the ultraviolet rays, ultraviolet rays having a wavelength of about 10 to 380 nm are used.

[0033] For the irradiation with the infrared or ultraviolet rays, a window port is formed on one side of the chamber, a light source irradiating infrared or ultraviolet rays is installed outside the chamber, and infrared or ultraviolet rays generated from the light source are applied into the chamber through the window port.

[0034] In particular, equipment such as a head or an electrode installed inside the chamber or a wafer or a substrate for manufacturing a semiconductor are irradiated with infrared or ultraviolet rays to remove L-FC neutral species and reaction by-products condensed on the head, the electrode, the wafer, or the substrate.

[0035] The method for removing L-FC according to an embodiment of the present invention can remove L-FC neutral species and reaction by-products adsorbed to the head, the electrode, the substrate and the wafer without affecting semiconductor device manufacturing process condition.

[0036] Accordingly, it is possible exhibit the effect of improving the yield in the semiconductor manufacturing process and increasing the reliability of the manufactured device.

[0037] Hereinafter, a system for implementing the method for removing L-FC of the present invention is described. FIG. 1 is a diagram illustrating a configuration of a plasma etching system implementing a method for removing L-FC of the present invention, and FIG. 2 is a detailed view of a chamber illustrated in FIG. 1.

[0038] Specifically, the plasma etching system of the present invention is configured to include: a chamber 10 into which L-FC (C5F8, C7F8, C7F14, C4F9I, CBr2F2, and C6F120) based gas is injected as a precursor; an electrode 20 which is installed in the chamber 10 and to which electric power for generating plasma is supplied; a window port 30 formed on one side of the chamber 10; and a light source 40 that irradiates the inside of the chamber 10 with infrared or ultraviolet rays through the window port 30.

[0039] The gas injected into the chamber 10 may become a plasma state by electric power supplied to the electrode 20 and etches a wafer 60 formed on the substrate 50 in the plasma etching system.

[0040] The light source 40 may be a light source that emits infrared rays having a wavelength of 780 nm or more. In addition, the light source 40 may be light source that emits ultraviolet rays having a wavelength of 10 to 380 nm.

[0041] An operation of the plasma etching system of the present invention having the above configuration is described as follows.

[0042] First of all, the wafer 60 to be used for manufacturing a semiconductor is introduced into the chamber 10, and the L-FC gas is injected into the chamber 10 under constant pressure and temperature conditions.

[0043] Then, power is applied to the electrode 20 installed in the chamber 10. The L-FC gas injected into the chamber 10 causes a plasma reaction according to the electric power applied to the electrode 20 to etch the wafer 60.

[0044] At this point, the light source 40 installed outside the chamber 10 is turned on, equipment such as a head or an electrode installed inside the chamber or a wafer or a substrate for manufacturing a semiconductor is irradiated with infrared or ultraviolet rays generated from the operated light source 40 through the window port 30 formed on one side of the chamber 10, and L-FC neutral species and reaction by-products condensed on the head, the electrode, the wafer or the substrate are removed by the irradiated infrared or ultraviolet rays.

[0045] The plasma etching system in which L-FC removal is performed according to the embodiment of the present invention can remove L-FC neutral species and reaction by-products adsorbed to the head, the electrode, the substrate, and the wafer without affecting the semiconductor device manufacturing process conditions.

[0046] FIG. 3 is a graph of amounts of pressure changes in the chamber in which the method for removing L-FC according to the embodiment of the present invention is performed, and is a graph illustrating a comparison between the case where the inside of the chamber 10 to which the C5F8 gas is supplied as a precursor is irradiated with the ultraviolet light source 40 and the case where the ultraviolet ray is not irradiated.

[0047] According to the graph, it can be seen that the pressure inside the chamber in the case where the inside of the chamber 10 is irradiated with ultraviolet rays is about 1.5 Torr higher than the pressure inside the chamber 10 in the case where the inside of the chamber 10 is not irradiated with ultraviolet rays. This is because, the L-FC gas neutral species and reaction by-products are removed due to the ultraviolet rays irradiated to the inside of the chamber 10 so that the L-FC is not condensed and is continuously present in a gaseous state.

[0048] Therefore, the plasma etching system of the present invention which is operated as described above can remove L-FC gas neutral species and reaction by-products adsorbed to the head, the electrode, the substrates, and the wafer without affecting the semiconductor device manufacturing process conditions.

[0049] In addition, FIG. 4 is a diagram illustrating a configuration of a plasma etching system implementing the method for removing L-FC according to another embodiment of the present invention, and FIG. 5 is a detailed view of the chamber illustrated in FIG. 4. Here, the same parts as described in FIGS. 1 and 2 are described using the same reference numerals.

[0050] Referring to FIGS. 4 and 5, the method for removing L-FC of the present invention is applicable to not only a capacitively coupled plasma (CCP) system but also an inductively coupled plasma (ICP) system.

[0051] That is, the light source 40 for irradiating an infrared or ultraviolet lamp through an insulating material 80 (quartz) on the lower side of an antenna coil 70 provided in the chamber 10 of the ICP system illustrated in FIGS. 4 and 5 is installed, and L-FC gas neutral species and reaction by-products are removed by infrared or ultraviolet rays irradiated from the light source 40.

REFERENCE SIGNS LIST

[0052] 10; chamber [0053] 20; electrode [0054] 30; window port [0055] 40; light source [0056] 50; substrate [0057] 60; wafer [0058] 70; antenna coil [0059] 80; insulating material