ASSORTMENT OF RADAR SENSORS

Abstract

An assortment of radar sensors in different variant embodiments. Each radar sensor has: a housing terminated by a radome, a circuit board that is equipped on the side facing away from the radome with at least one radio-frequency module, and an antenna structure on the side of the circuit board facing the radome. The housing is realized identically in all variant embodiments. The antenna structure has a planar antenna structure in at least one variant embodiment, and has a hollow conductor structure in at least one variant embodiment.

Claims

1. An assortment of radar sensors in different variant embodiments, each radar sensor of the different variant embodiments comprising: a housing terminated by a radome; a circuit board that is equipped on a side facing away from the radome with at least one radio-frequency module; and an antenna structure on a side of the circuit board facing the radome; wherein the housing identical in all of the variant embodiments, and the antenna structure has a planar antenna structure in at least one of the variant embodiments, and has a hollow conductor structure in at least one of the variant embodiments.

2. The assortment as recited in claim 1, wherein, in all of the variant embodiments, the radar sensors have an identical interface for an exchange of data with a control device.

3. The assortment as recited in claim 1, wherein, in all variant embodiments, the radar sensors have an identical heat distributor plate inside the housing.

4. The assortment as recited in claim 1, wherein the hollow conductor structure is a one-layer hollow conductor structure.

5. The assortment as recited in claim 1, wherein, in at least one of the variant embodiments having a planar antenna structure, in the housing, an absorber or shielding structure is situated in an intermediate space between the circuit board and the radome.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In the following, exemplary embodiments of the present invention are explained in more detail on the basis of the figures.

[0020] FIG. 1 shows a section through a radar sensor in a first variant embodiment of the present invention.

[0021] FIG. 2 shows a section through a radar sensor in a second variant embodiment of the present invention.

[0022] FIGS. 3 and 4 show modifications of the variant embodiment according to FIG. 2, according to the present invention.

[0023] FIG. 5 shows a section through a radar sensor according to a further variant embodiment of the present invention.

[0024] FIG. 6 shows a section through a base module that is uniform for all radar sensors of the assortment, in accordance with an example embodiment of the present invention.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

[0025] FIG. 1 shows a schematic sectional view of a first variant embodiment 10 of a radar sensor for motor vehicles. The radar sensor has a housing 12 that is terminated by a radome 14 on one side, the upper side in FIG. 1. In the interior, housing 12 forms a number of support domes 16 on which a circuit board 18 is fastened. On its upper side, circuit board 18 bears a microwave substrate 20, and is equipped on the lower side with at least one radio-frequency module 22 (MMIC), as well as further electronic components 24. The electronic components, which produce heat during operation, are in thermal contact, via a heat-conducting medium 26, with a heat distributor plate 28 that dissipates the heat into the base of housing 12, which forms a group of cooling ribs 30.

[0026] Circuit board 18 and microwave substrate 20 are connected both electrically and thermally, as well as mechanically, with housing 12 and with heat distributor plate 28 via press-in pins (at right in FIG. 1). Housing 12 can be metallic (with the exception of radome 14), thus forming a shielding for the electronic components.

[0027] At the left side in FIG. 1, the circuit board is contacted by press-in pins 34 that at the same time form contacts of a plug that forms an interface 36 for the exchange of data with a control device (not shown).

[0028] On microwave substrate 20, on the upper side of circuit board 18 a one-layer hollow conductor structure 38 is situated in a flat intermediate space between circuit board 18 and radome 14. This hollow conductor structure forms a plurality of hollow conductors 40 situated at the same height, which are connected, via radio-frequency connections (not shown), to signal inputs and outputs of radio-frequency module 22, and that form on the upper side radiation windows through which the microwave power 42 is radiated through the radome. Hollow conductor structure 38 can be formed for example by a metallic plastic block that is soldered onto a ground electrode 44 that covers microwave substrate 20. This ground electrode is connected to corresponding contacts of radio-frequency module 22 by vias 46, and at the same time forms the lower termination of hollow conductor 40.

[0029] FIG. 2 shows a section through a radar sensor in a second variant embodiment 50. Housing 12, heat distributor plate 28, press-in pins 32, 34, and the entire interface 36 are identical in design, i.e., in shape and material, with the corresponding components in FIG. 1. Circuit board 18, radio-frequency module 22, and the other electronic components 24 can be at least largely identical with the corresponding components in FIG. 1.

[0030] Instead of the hollow conductor antenna formed by hollow conductor structure 38 in FIG. 1, in variant embodiment 50 the radar sensor has, however, a planar antenna structure 52 that is formed by microstrip conductors 54, 56 on radio-frequency substrate 20. Microstrip conductors 54, 56 are connected, in a conventional manner, to corresponding contacts of radio-frequency module 22 by vias.

[0031] The manufacturing processes for variant embodiments 10 and 50 essentially differ only in that in the one case the circuit board is equipped with hollow conductor structure 38, and in the other case the planar antenna structure 52 is formed on the circuit board in microstrip technology. Further differences may be that different materials are used for circuit board 18, or radio-frequency substrate 20. In addition, there may be some differences in the equipping with electronic components.

[0032] The components that are identical in the two variant embodiments, such as housing 12, can be produced in large piece counts, and thus efficiently, for the complete assortment. Because the required steps for the assembly of the components are also largely identical, with some differences in the equipping of circuit board 18, the two variant embodiments can be manufactured on the same production line.

[0033] FIG. 3 shows a modification 50′ of second variant embodiment 50 according to FIG. 2. In this modification, the flat hollow space between circuit board 18 and radome 14 is used to house an absorber structure 58 that suppresses interfering radiation. Absorber structure 58 is here fastened to the underside of radome 14, for example by gluing.

[0034] FIG. 4 shows a further variant embodiment 50″, in which an absorber or shielding structure 58′ is fastened on the upper side of circuit board 18, for example by soldering.

[0035] FIG. 5 shows a third variant embodiment 60 having a hybrid antenna structure, formed partly by planar antenna elements 52′ and partly by a hollow conductor structure 38′. For example, in a bistable radar sensor the transmit antennas can be made planar and the receive antennas can be realized as hollow conductor antennas, or vice versa.

[0036] FIG. 6 once again shows a base module 70, containing all those components of the radar sensors that are identical in all variant embodiments described above.