ADHESIVE TAPE FOR SEMICONDUCTOR DEVICE PRODUCTION

Abstract

The present invention aims to provide an adhesive tape for semiconductor device production which exhibits excellent chip component separability and can reduce adhesive deposits on chip components. Provided is an adhesive tape for semiconductor device production, including: a substrate; an ablation layer; a barrier layer; and a first adhesive layer in this order.

Claims

1. An adhesive tape for semiconductor device production, comprising: a substrate; an ablation layer; a barrier layer; and a first adhesive layer in this order.

2. The adhesive tape for semiconductor device production according to claim 1, wherein the substrate is a resin film.

3. The adhesive tape for semiconductor device production according to claim 2, wherein the resin film is a polyester film.

4. The adhesive tape for semiconductor device production according to claim 1, wherein the ablation layer has an UV absorbance at a wavelength of 365 nm of 90% or higher.

5. The adhesive tape for semiconductor device production according to claim 1, wherein the ablation layer has a storage modulus G at 23 C. of 110.sup.4 Pa or more and 210.sup.5 Pa or less.

6. The adhesive tape for semiconductor device production according to claim 1, wherein the barrier layer has a thickness of 25 m or less.

7. The adhesive tape for semiconductor device production according to claim 6, wherein the barrier layer has a thickness of 6 m or less.

8. The adhesive tape for semiconductor device production according to claim 1, wherein the barrier layer is a polyester film.

9. The adhesive tape for semiconductor device production according to claim 1, wherein the barrier layer has an easy-adhesion resin layer on a surface in contact with the first adhesive layer.

10. The adhesive tape for semiconductor device production according to claim 1, wherein the first adhesive layer has a breaking strength of 1 MPa or more.

11. The adhesive tape for semiconductor device production according to claim 1, wherein the first adhesive layer has a storage modulus G at 23 C. of 110.sup.4 Pa or more and 210.sup.5 Pa or less.

12. The adhesive tape for semiconductor device production according to claim 1, wherein the first adhesive layer contains an ABA block copolymer.

13. The adhesive tape for semiconductor device production according to claim 12, wherein the ABA block copolymer includes a block A containing a structure derived from an aromatic vinyl monomer and a block B containing a structure derived from a (meth)acrylic monomer.

14. The adhesive tape for semiconductor device production according to claim 12, wherein the block B has a structure derived from a crosslinkable functional group-containing monomer.

15. The adhesive tape for semiconductor device production according to claim 1, wherein the first adhesive layer has a gel fraction of 70% by weight or more and 95% by weight or less.

16. The adhesive tape for semiconductor device production according to claim 1, wherein the first adhesive layer has a thickness of 5 m or more and 30 m or less.

17. The adhesive tape for semiconductor device production according to claim 1, wherein the adhesive tape for semiconductor device production has a ball tack value of 5 or higher.

18. The adhesive tape for semiconductor device production according to claim 1, wherein the first adhesive layer in the adhesive tape for semiconductor device production has a surface peel strength of 1 MPa or less.

19. The adhesive tape for semiconductor device production according to claim 1, wherein an adhesion between the substrate and the ablation layer is 6 N/25 mm or more.

20. The adhesive tape for semiconductor device production according to claim 1, wherein an adhesion between the ablation layer and the barrier layer is 6 N/25 mm or more.

21. The adhesive tape for semiconductor device production according to claim 1, wherein the first adhesive layer is a curable adhesive layer.

22. The adhesive tape for semiconductor device production according to claim 1, further comprising a second adhesive layer, wherein the adhesive tape for semiconductor device production includes the second adhesive layer, the substrate, the ablation layer, the barrier layer, and the first adhesive layer in this order.

23. The adhesive tape for semiconductor device production according to claim 1, which is for use in production of a semiconductor device, the production including a step of irradiation with laser light.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0218] FIG. 1 shows a cross-sectional view schematically illustrating an exemplary step of separating chip components on an adhesive layer by laser ablation using a conventional adhesive tape.

[0219] FIG. 2 shows a cross-sectional view schematically illustrating an example of the adhesive tape for semiconductor device production of the present invention.

[0220] FIG. 3 shows a cross-sectional view schematically illustrating an example of a step of separating chip components on the first adhesive layer by laser abrasion using the adhesive tape for semiconductor device production of the present invention.

[0221] FIG. 4 shows a cross-sectional view schematically illustrating an example of the adhesive tape for semiconductor device production of the present invention including a second adhesive layer.

DESCRIPTION OF EMBODIMENTS

[0222] The embodiments of the present invention will be described in more detail below with reference to, but not limited to, examples.

(Adhesive A)

(1) Preparation of Acrylic Copolymer (1)

[0223] A reactor equipped with a thermometer, a stirrer, and a condenser was charged with 52 parts by weight of ethyl acetate and purged with nitrogen. The reactor was then heated to start reflux. Thirty minutes after the ethyl acetate came to a boil, 0.08 parts by weight of azobisisobutyronitrile as a polymerization initiator was added. Then, a monomer mixture containing 98 parts by weight of butyl acrylate (BA) and 2 parts by weight of acrylic acid (AAc) was dripped into the reactor uniformly and gradually over one and a half hours to perform reaction. Thirty minutes after the dripping was finished, 0.1 parts by weight of azobisisobutyronitrile was added to perform polymerization reaction for another five hours, followed by cooling while adding ethyl acetate into the reactor for dilution. Thus, a solution of an acrylic copolymer (1) having a solid content of 30% by weight was obtained.

[0224] The weight average molecular weight of the obtained acrylic copolymer (1) was measured by GPC. The measurement was performed using 2690 Separations Module available from Waters as a measuring instrument, GPC KF-806L available from Showa Denko K. K. as a column, and ethyl acetate as a solvent, under the conditions of a sample flow rate of 1 mL/min and a column temperature of 40 C.

[0225] The SP value of the entire polymer of the obtained acrylic copolymer (1) was calculated by the Fedors method.

(2) Preparation of Adhesive Solution

[0226] The obtained acrylic copolymer (1) was dissolved in ethyl acetate so that the solid content was 15% by weight. To 100 parts by weight of the acrylic copolymer (1) were added 3.6 parts by weight of Coronate L (available from Tosoh Corporation) as an isocyanate crosslinking agent and 8 parts by weight of Tinuvin 928 (benzotriazole UV absorber, available from BASF Japan) as an UV absorber, followed by sufficient stirring. Thus, an adhesive solution of an adhesive A was obtained.

(Adhesive B)

(1) Preparation of ABA Block Copolymer (1)

[0227] An autoclave was charged with 500 parts by weight of degassed, dehydrated cyclohexane, 0.13 parts by weight of n-butyllithium (n-BuLi), and tetrahydrofuran (THF) at a molar ratio of n-BuLi/THF=40. Next, 4.5 parts by weight of a styrene monomer was added and polymerized at 40 C. Thus, a copolymer (block A) was obtained. After the polymerization conversion rate of the styrene monomer reached about 100%, 91 parts by weight of a 1,3-butadiene monomer was added and polymerized. Thus, an AB block copolymer was obtained. After the polymerization conversion rate reached almost 100%, 4.5 parts by weight of a styrene monomer was further added and polymerized at 40 C. until the polymerization conversion rate reached about 100%. Thus, an ABA block copolymer (before hydrogenation) was obtained.

[0228] The ABA block copolymer was diluted with purified and dried cyclohexane to a polymer concentration of 5% by weight, and subjected to hydrogenation. The hydrogenation was started at a hydrogen gas supply pressure of 0.7 MPa-Gauge and a reaction temperature of 80 C. with stirring. When the absorption of hydrogen was completed, the temperature and pressure of the reaction solution were returned to normal temperature and normal pressure, and the reaction solution was taken out from the reaction vessel.

[0229] Thus, an ABA block copolymer (1) was obtained. The weight average molecular weight of the obtained ABA block copolymer (1) was measured by GPC. The measurement was performed using 2690 Separations Module available from Waters as the measuring instrument, GPC KF-806L available from Showa Denko K. K. as the column, and ethyl acetate as the solvent, under the conditions of a sample flow rate of 1 mL/min and a column temperature of 40 C.

[0230] Measurement was performed on the obtained ABA block copolymer (1) using a differential scanning calorimeter (available from Hitachi High-Tech Science Co., Ltd., SII Exstar 6000/DSC6220) under a nitrogen atmosphere at a heating rate of 10 C./min. The glass transition temperature of the block B was obtained using the value obtained in the second run. A peak derived from the block A and a peak derived from the block B were obtained. The peak on the low temperature side was taken as the peak derived from the block B, and the glass transition temperature of the block B was determined.

[0231] For the obtained ABA block copolymer (1), the ratio of ethylene and butylene was calculated from the peak area ratio of ethylene and butylene components measured by 1H-NMR, and the SP values of the entire polymer and the block B were calculated.

(2) Preparation of Adhesive Solution

[0232] The obtained ABA block copolymer (1) was dissolved in toluene so that the solid content was 20% by weight. To 100 parts by weight of the ABA block copolymer (1) was added 8 parts by weight of Tinuvin 928 (benzotriazole UV absorber, available from BASF Japan) as an UV absorber, and the mixture was thoroughly stirred. Thus, an adhesive solution of an adhesive B was obtained.

(3) Confirmation of Phase Separation Structure

[0233] An adhesive layer alone was produced in the same manner as in the examples and comparative examples described later. A small piece obtained by trimming the adhesive layer was dyed with a 2% osmic acid aqueous solution at 60 C. for 12 hours, and then washed. Using a cryomicrotome (ULTRACUT FC7, available from LEICA), the small piece was cut in the thickness direction of the adhesive layer at a small-piece temperature of 100 C., whereby a section with a thickness of less than 100 nm was cut out. The cut section was placed on a sheet mesh covered with a support film. Thus, a measurement sample was prepared. Observation of the resulting measurement sample at a magnification of 5,000 times using a transmission electron microscope (JEM-2100, available from JEOL Ltd.) revealed that the measurement sample had a spherical phase separation structure.

(Adhesive C)

(1) Preparation of ABA Block Copolymer (2)

[0234] A two-necked flask was charged with 0.902 g of 1,6-hexanedithiol, 1.83 g of carbon disulfide, and 11 mL of dimethylformamide, followed by stirring at 25 C. To the flask was added dropwise 2.49 g of triethylamine over 15 minutes, followed by stirring at 25 C. for three hours. Thereto was added dropwise 2.75 g of methyl--bromophenylacetate over 15 minutes, followed by stirring at 25 C. for four hours. Then, 100 mL of an extraction solvent (n-hexane:ethyl acetate=50:50) and 50 mL of water were added to the reaction solution for extraction by separation. The organic layers obtained in the first and second extraction by separation were mixed and washed with 50 mL of 1 M hydrochloric acid, 50 mL of water, and 50 mL of saturated saline in the stated order. To the washed organic layer was added sodium sulfate for drying, and the sodium sulfate was filtered off and the filtrate was concentrated using an evaporator to remove the organic solvent. The obtained concentrate was purified by silica gel column chromatography to obtain a RAFT agent.

[0235] A two-necked flask was charged with 15 parts by weight of styrene (St), 2 parts by weight of acrylic acid (AAc), 1.9 parts by weight of the RAFT agent, and 2,2-azobis(2-methylbutyronitrile) (ABN-E), and purged with nitrogen gas while the temperature inside was raised to 85 C. The mixture was stirred at 85 C. for six hours for polymerization reaction (first stage reaction).

[0236] After completion of the reaction, 4,000 parts by weight of n-hexane was added to the flask and stirred to precipitate the reaction product. Unreacted monomers and the RAFT agent were filtered off, and the reaction product was dried under reduced pressure at 70 C. Thus, a copolymer (block A) was obtained.

[0237] A two-necked flask was charged with a mixture containing 81 parts by weight of butyl acrylate (BA), 2 parts by weight of acrylic acid (AAc), 0.058 parts by weight of ABN-E, and 50 parts by weight of ethyl acetate, and the copolymer (block A) obtained above, and purged with nitrogen gas while the temperature inside was raised to 85 C. The mixture was stirred at 85 C. for six hours for polymerization reaction (second stage reaction) to obtain a reaction liquid containing a block copolymer including block A and block B.

[0238] To a portion sampled from the reaction solution was added 4,000 parts by weight of n-hexane, followed by stirring for precipitation of the reaction product. Unreacted monomers and the solvent were then filtered off, and the reaction product was dried under reduced pressure at 70 C. Thus, an ABA block copolymer (2) was obtained.

[0239] The weight average molecular weight of the obtained ABA block copolymer (2) was measured by GPC. The measurement was performed using 2690 Separations Module available from Waters as the measuring instrument, GPC KF-806L available from Showa Denko K. K. as the column, and ethyl acetate as the solvent, under the conditions of a sample flow rate of 1 mL/min and a column temperature of 40 C.

[0240] Measurement was performed on the obtained ABA block copolymer (2) using a differential scanning calorimeter (SII Exstar 6000/DSC6220, available from Hitachi High-Tech Science Co., Ltd.) in a nitrogen atmosphere under the condition of a heating rate of 10 C./min. The glass transition temperature of the block B was obtained using the value obtained in the second run. A peak derived from the block A and a peak derived from the block B were obtained. The peak on the low temperature side was taken as the peak derived from the block B, and the glass transition temperature of the block B was determined.

[0241] For the obtained ABA block copolymer (2), the SP values of the entire polymer and the block B were calculated by the Fedors method.

(2) Preparation of Adhesive Solution

[0242] The obtained ABA block copolymer (2) was dissolved in ethyl acetate so that the solid content was 15% by weight. To 100 parts by weight of the ABA block copolymer (2) were added 1 part by weight of Tetrad C (available from Mitsubishi Chemical Corporation) as an epoxy crosslinking agent and 8 parts by weight of Tinuvin 928 (benzotriazole UV absorber, available from BASF Japan), followed by sufficient stirring. Thus, an adhesive solution of an adhesive C was obtained.

(3) Confirmation of Phase Separation Structure

[0243] An adhesive layer alone was produced in the same manner as in the examples and comparative examples described later. A small piece obtained by trimming the adhesive layer was dyed with a 2% osmic acid aqueous solution at 60 C. for 12 hours, and then washed. Using a cryomicrotome (ULTRACUT FC7, available from LEICA), the small piece was cut in the thickness direction of the adhesive layer at a small-piece temperature of 100 C., whereby a section with a thickness of less than 100 nm was cut out. The cut section was placed on a sheet mesh covered with a support film. Thus, a measurement sample was prepared. Observation of the resulting measurement sample at a magnification of 5,000 times using a transmission electron microscope (JEM-2100, available from JEOL Ltd.) revealed that the measurement sample had a spherical phase separation structure.

(Adhesives D to E, J to O, and R)

[0244] Adhesive solutions were prepared as in the case of the adhesive C, except that the composition of the ABA block copolymer, the type or amount of the UV absorber, and the type or amount of the crosslinking agent were changed as shown in Table 1 or 2.

(Adhesives F to I, P, and Q)

[0245] Adhesive solutions were prepared as in the case of the adhesive A, except that the composition of the acrylic copolymer, the type or amount of the UV absorber, and the type or amount of the crosslinking agent were changed as shown in Table 1 or 2. In the case of the adhesive H, Tinuvin 460 (hydroxyphenyltriazine UV absorber, available from BASF Japan) was used as the UV absorber.

[0246] Alphabetical symbols in the tables are the abbreviations of the following compounds, respectively. [0247] St: styrene [0248] AAc: acrylic acid [0249] BA: butyl acrylate [0250] 2-EHA: 2-ethylhexyl acrylate [0251] LA: lauryl acrylate [0252] MA: methyl acrylate [0253] MOEA: methoxyethyl acrylate [0254] 2-HEA: 2-hydroxyethyl acrylate

TABLE-US-00001 TABLE 1 Adhesive A B C Base polymer Type Acrylic A-B-A block A-B-A block copolymer (1) copolymer (1) copolymer (2) Block A Aromatic vinyl monomer St 9 15 (parts by weight) Crosslinkable functional group- AAc 2 containing monomer HEA (parts by weight) Block B (Meth)acrylic monomer BA 98 81 (parts by weight) 2-EHA LA MA MOEA Crosslinkable functional group- AAc 2 2 containing monomer HEA (parts by weight) Conjugated diene monomer 1,3-Butadiene 91 (parts by weight) (Ethylene:Butylene = 40:51 after hydrogenation) Mw (10.sup.4) 80 23 25 Glass transition temperature of block B ( C.) 50 52 SP value of entire polymer 9.84 8.5 9.92 SP value of block B 8.4 9.85 UV absorber Tinuvin 928 (benzotriazole) 8 8 8 (parts by weight) Tinuvin 460 (hydroxyphenyltriazine) Crosslinking agent Coronate L 3.6 (parts by weight) Tetrad C 1 Phase separation structure spherical spherical Adhesive D E F Base polymer Type A-B-A block A-B-A block Acrylic copolymer (3) copolymer (4) copolymer (1) Block A Aromatic vinyl monomer St 15 15 (parts by weight) Crosslinkable functional group- AAc 2 2 containing monomer HEA (parts by weight) Block B (Meth)acrylic monomer BA 20 40 98 (parts by weight) 2-EHA 61 LA 41 MA MOEA Crosslinkable functional group- AAc 2 2 containing monomer HEA 2 (parts by weight) Conjugated diene monomer 1,3-Butadiene (parts by weight) Mw (10.sup.4) 31 29 80 Glass transition temperature of block B ( C.) 64 38 SP value of entire polymer 9.57 9.66 9.84 SP value of block B 9.44 9.55 UV absorber Tinuvin 928 (benzotriazole) 8 8 0.5 (parts by weight) Tinuvin 460 (hydroxyphenyltriazine) Crosslinking agent Coronate L 1 3.6 (parts by weight) Tetrad C 1 Phase separation structure spherical spherical Adhesive G H I Base polymer Type Acrylic Acrylic Acrylic copolymer (1) copolymer (1) copolymer (2) Block A Aromatic vinyl monomer St (parts by weight) Crosslinkable functional group- AAc containing monomer HEA (parts by weight) Block B (Meth)acrylic monomer BA 98 98 (parts by weight) 2-EHA 50 LA 49.6 MA MOEA Crosslinkable functional group- AAc 2 2 0.3 containing monomer HEA 0.1 (parts by weight) Conjugated diene monomer 1,3-Butadiene (parts by weight) Mw (10.sup.4) 80 80 50 Glass transition temperature of block B ( C.) SP value of entire polymer 9.84 9.84 9.2 SP value of block B UV absorber Tinuvin 928 (benzotriazole) 20 8 (parts by weight) Tinuvin 460 (hydroxyphenyltriazine) 8 Crosslinking agent Coronate L 3.6 3 (parts by weight) Tetrad C 0.05 Phase separation structure

TABLE-US-00002 TABLE 2 Adhesive J K L Base polymer Type A-B-A block A-B-A block A-B-A block copolymer (4) copolymer (5) copolymer (6) Block A Aromatic vinyl monomer St 15 28 22 (parts by weight) Crosslinkable functional group- AAc 2 4 3 containing monomer HEA (parts by weight) Block B (Meth) acrylic monomer BA 40 66 73 (parts by weight) 2-EHA LA 41 MA MOEA Crosslinkable functional group- AAc 2 2 2 containing monomer HEA (parts by weight) Conjugated diene monomer 1,3-Butadiene (parts by weight) Mw (10.sup.4) 29 10 15 Glass transition temperature of block B ( C.) 38 52 53 SP value of entire polymer 9.65 9.99 9.95 SP value of block B 9.53 9.87 9.86 UV absorber Tinuvin 928 (benzotriazole) 8 8 8 (parts by weight) Tinuvin 460 (hydroxyphenyltriazine) Crosslinking agent Coronate L (parts by weight) Tetrad C 0.75 0.75 0.75 Phase separation structure spherical cylindrical cylindrical Adhesive M N O Base polymer Type A-B-A block A-B-A block A-B-A block copolymer (7) copolymer (8) copolymer (9) Block A Aromatic vinyl monomer St 15 15 15 (parts by weight) Crosslinkable functional group- AAc 2 2 2 containing monomer HEA (parts by weight) Block B (Meth) acrylic monomer BA 40 20 (parts by weight) 2-EHA LA 41 41 MA 41 MOEA 40 20 Crosslinkable functional group- AAc 2 2 2 containing monomer HEA (parts by weight) Conjugated diene monomer 1,3-Butadiene (parts by weight) Mw (10.sup.4) 25 43 37 Glass transition temperature of block B ( C.) 25 35 36 SP value of entire polymer 10.22 9.78 9.71 SP value of block B 10.23 9.69 9.61 UV absorber Tinuvin 928 (benzotriazole) 8 8 8 (parts by weight) Tinuvin 460 (hydroxyphenyltriazine) Crosslinking agent Coronate L (parts by weight) Tetrad C 0.75 0.75 0.75 Phase separation structure spherical spherical spherical Adhesive P Q R Base polymer Type Acrylic Acrylic A-B-A block copolymer (1) copolymer (3) copolymer (10) Block A Aromatic vinyl monomer St 15 (parts by weight) Crosslinkable functional group- AAc 1.8 containing monomer HEA 0.2 (parts by weight) Block B (Meth) acrylic monomer BA 98 39 81 (parts by weight) 2-EHA 55 LA MA 3 MOEA Crosslinkable functional group- AAc 2 2 2 containing monomer HEA (parts by weight) Conjugated diene monomer 1,3-Butadiene (parts by weight) Mw (10.sup.4) 80 90 25 Glass transition temperature of block B ( C.) 52 SP value of entire polymer 9.84 9.55 9.92 SP value of block B 9.85 UV absorber Tinuvin 928 (benzotriazole) (parts by weight) Tinuvin 460 (hydroxyphenyltriazine) Crosslinking agent Coronate L 3.6 2.1 2.9 (parts by weight) Tetrad C Phase separation structure spherical

Example 1

(1) Production of Adhesive Tape

[0255] The obtained adhesive solution of the adhesive A was applied to a corona-treated polyethylene terephthalate (PET) film having a thickness of 50 m and a haze of 3.8% as a substrate, using an applicator so that the dry film thickness was 16 m, followed by drying at 110 C. for three minutes. Thus, an ablation layer was formed. The resulting laminate was used as a laminated film (a). Next, to the ablation layer side of the laminated film (a) was bonded a corona-treated PET film having a thickness of 4 m as a barrier layer. The resulting laminate was used as a laminated film (b).

[0256] Separately, the obtained adhesive solution of the adhesive A was applied to a release-treated surface of a release-treated release PET film having a thickness of 75 m, using an applicator so that the dry film thickness was 10 m, followed by drying at 110 C. for three minutes. Thus, an adhesive layer was formed. This adhesive layer was bonded to the barrier layer side of the laminated film (b). The resulting laminate was allowed to stand under heating at 40 C. for 48 hours. Thus, an adhesive tape including a substrate, an ablation layer, a barrier layer, a first adhesive layer, and a release PET film in this order was obtained.

(2) Measurement of Breaking Strength of First Adhesive Layer

[0257] A 500-m-thick sheet consisting only of the first adhesive layer was prepared separately. This adhesive layer was pulled at a tensile speed of 500 mm/min in an environment of a temperature of 23 C. and a relative humidity of 50% in conformity with JIS K7161 using Autograph (available from Shimadzu Corporation). The breaking strength was calculated from the stress at break.

(3) Measurement of Gel Fractions of First Adhesive Layer and Ablation Layer

[0258] The first adhesive layer (adhesive composition) alone in an amount of 0.1 g and the ablation layer (ablation layer composition) alone in an amount of 0.1 g were taken out from the adhesive tape. They were separately immersed in 50 mL of ethyl acetate, and shaken using a shaker under the conditions of a temperature of 23 C. and 200 rpm for 24 hours. After the shaking, ethyl acetate and the composition swollen by absorbing ethyl acetate were separated using a metal mesh (#200 mesh). The separated composition was dried under the condition of 110 C. for one hour. The weight of each composition including the metal mesh after drying was measured, and the gel fractions of the first adhesive layer and the ablation layer were calculated using the following equation.

Gel fraction (% by weight)=100(W.sub.1W.sub.2)/W.sub.0

(W.sub.0: the initial weight of the composition, W.sub.1: the weight of the composition including the metal mesh after drying, W.sub.2: the initial weight of the metal mesh)

[0259] For the ablation layer of Example 3 and the first adhesive layer of Example 4, toluene was used instead of ethyl acetate to measure the gel fraction.

(4) Measurement of Storage Modulus (Shear Storage Modulus) G at 23 C. and 1 Hz of Ablation Layer and Storage Moduli (Shear Storage Moduli) at 20 C., 23 C., and 140 C. and 1 Hz of First Adhesive Layer

[0260] A 1-mm-thick sheet consisting only of the ablation layer and a 1-mm-thick sheet consisting only of the first adhesive layer were separately prepared. For the ablation layer and the first adhesive layer, the storage moduli G at 20 C., 23 C., and 140 C. were determined in measurement of a dynamic viscoelasticity spectrum from 40 C. to 160 C. under the conditions 1 Hz in a simple heating mode of a heating rate of 5 C./min using a viscoelastic spectrometer DVA-200 (available from IT Keisoku Seigyo Co., Ltd.).

(5) Measurement of UV Absorbance of Ablation Layer and First Adhesive Layer

[0261] The UV absorbances of the ablation layer and the first adhesive layer at a wavelength of 365 nm were measured in conformity with JIS L1925 using a spectrophotometer (UV-2600i, available from Shimadzu Corporation).

(6) Measurement of Ball Tack Value of Adhesive Tape

[0262] The ball tack value of the adhesive tape was measured using a ball tack tester (available from Yasuda Seiki Seisakusho Co., Ltd.) in conformity with JIS Z0237 in an environment of a temperature of 23 C. and a relative humidity of 50%.

(7) Surface Peel Strength of First Adhesive Layer of Adhesive Tape

[0263] To the surface of the first adhesive layer of the adhesive tape was bonded one face of a 10-mm-side SUS cube, and pressure-bonded at 0.3 MPa for 10 seconds in an environment of a temperature of 23 C. and a relative humidity of 50%. Then, the SUS cube was pulled at a tensile speed of 1,000 mm/min to be separated with the substrate side of the adhesive tape fixed, in an environment of a temperature of 23 C. and a relative humidity of 50% using Autograph (available from Shimadzu Corporation). The maximum stress at the time of removal was measured as the surface peel strength.

Examples 2 to 18, and 22 to 24, Comparative Examples 1 to 4

[0264] Adhesive tapes were obtained in the same manner as in Example 1, except that the layers were changed as shown in Tables 3, 4, and 5. In Examples 15 to 18 and 22 to 24, the substrate used was a PET film having a thickness of 50 m and a haze of 0.3% and the barrier layer used was a 5.5-m-thick PET film with an easy-adhesion resin layer (modulus of elasticity of easy-adhesion resin layer by nanoindentation: 5850 MPa).

Example 19

(1) Production of Double-Sided Adhesive Tape

[0265] The adhesive solution of the adhesive P was applied to a polyethylene terephthalate film one surface of which was release-treated, using an applicator so that the dry film thickness was 10 m, followed by drying at 110 C. for three minutes. Thus, a laminated film (p) including an adhesive layer on the release-treated surface of the polyethylene terephthalate film was produced.

[0266] Next, an adhesive tape was produced as in Example 1 except that the layers were changed as shown in Table 4. The adhesive layer side of the laminated film (p) was laminated on the surface of the substrate of the adhesive tape, on the side opposite to the side on which the ablation layer, the barrier layer, the first adhesive layer, and the release PET film were laminated in this order. The adhesive layer of the laminated film (p) was transferred to be integrated with the substrate. In this manner, a double-sided adhesive tape provided with a second adhesive layer having the thickness and gel fraction shown in Table 4 was obtained.

[0267] The following were measured in the same manner as in Example 1: the breaking strength of the first adhesive layer; the gel fractions of the first adhesive layer and the ablation layer; the storage modulus (shear storage modulus) G of the ablation layer at 23 C. and 1 Hz and the storage moduli (shear storage moduli) G of the first adhesive layer at 20 C., 23 C., and 140 C. and 1 Hz; UV absorbances of the ablation layer and the first adhesive layer; ball tack value of the adhesive tape; and surface peel strength of the first adhesive layer of the adhesive tape.

[0268] The gel fraction of the second adhesive layer was measured by the same method as in (3) Measurement of gel fractions of first adhesive layer and ablation layer.

Examples 20 and 21

[0269] Adhesive tapes were obtained as in Example 19, except that the layers were changed as shown in Table 4.

(2) Adhesion of Second Adhesive Layer of Adhesive Tape

[0270] The double-sided adhesive tape obtained by the above method was cut to a width of 25 mm. To the surface of the first adhesive layer of the double-sided adhesive tape was bonded a 25-m-thick PET film cut to a width of 30 mm. The surface of the second adhesive layer was bonded to a glass plate at a speed of 300 mm/min using a 2-kg pressure rubber roller at a room temperature of 23 C. and a relative humidity of 50%. Using Autograph (available from Shimadzu Corporation), the second adhesive layer side of the double-sided adhesive tape was peeled off in a 180 direction at a speed of 300 mm/min in an environment of a temperature of 23 C. and a relative humidity of 50% to measure the 180 adhesion.

<Evaluation>

[0271] The adhesive tapes obtained in the examples and comparative examples were evaluated as follows. The results are shown in Tables 3, 4 and 5.

(1) Laser Ablation Evaluation

(1-1-1) Chip Component Holdability and Chip Component Separability

[0272] A wafer on which 10 Si chips (500 m500 m square, 50 m thick) were arranged were provided. To the Si chip side surface of the wafer was bonded the resulting adhesive tape. The Si chips were arranged on the adhesive tape by separating the wafer. A semiconductor solid-state laser was used to irradiate each Si chip with laser light at 365 nm with an output of 4 W and 4 kHz from the substrate side of the adhesive tape, whereby the Si chips were separated from the adhesive tape.

[0273] The evaluation on the chip component holdability was carried out based on the following criteria: o (Good) indicates that all Si chips were arranged on the adhesive tape from the wafer; (Fair) indicates that 8 to 9 Si chips were arranged on the adhesive tape; and x (Poor) indicates that only 7 or less Si chips were arranged on the adhesive tape.

[0274] The evaluation on the chip component separability was carried out based on the following criteria: oo (Excellent) indicates that all 10 Si chips were separated from the adhesive tape; o (Good) indicates that 8 to 9 Si chips were separated from the adhesive tape; (Fair) indicates that 7 Si chips were separated from the adhesive tape; and x (Poor) indicates that only 6 or less Si chips were separated from the adhesive tape. When the adhesive tape included the second adhesive layer, the evaluation was performed with the second adhesive layer bonded to a 2-mm-thick glass support.

(1-1-2) Adhesive Deposits

[0275] After the evaluation of the chip component holdability and the chip component separability, the surface of the Si chip separated from the adhesive tape was observed under a microscope to determine the presence or absence of adhesive deposits. The evaluation on the adhesive deposits was carried out based on the following criteria: oo (Excellent) indicates that no adhesive deposits were observed; o (Good) indicates that adhesive deposits were observed in less than 20% of the area of the surface of the chip component; and x (Poor) indicates that adhesive deposits were observed in 20% or more of the area of the surface of the chip component.

(1-2-1) Small-Sized Chip Component Holdability and Small-Sized Chip Component Separability

[0276] A wafer on which 10 small-sized Si chips (30 m40 m square, thickness 10 m) were arranged was provided. To the Si chip side surface of the wafer was bonded each of the adhesive tapes obtained in Examples 1 and 15 to 23. The Si chips were arranged on the adhesive tape by separating the wafer. A semiconductor solid-state laser was used to irradiate the Si chips with laser light at 365 nm with an output of 4 W and 4 kHz from the substrate side of the adhesive tape, whereby the Si chips were separated from the adhesive tape.

[0277] The evaluation on the chip component holdability was carried out based on the following criteria: o (Good) indicates that all Si chips were arranged on the adhesive tape from the wafer; (Fair) indicates that 8 to 9 Si chips were arranged on the adhesive tape; and x (Poor) indicates that only 7 or less Si chips were arranged on the adhesive tape.

[0278] The evaluation on the (small-sized) chip component separability was carried out based on the following criteria: oo (Excellent) indicates that all 10 Si chips were separated; o (Good) indicates that 8 to 9 Si chips were separated; and x (Poor) indicates that only 7 or less Si chips were separated from the adhesive tape. When the adhesive tape had a second adhesive layer, the evaluation was carried out with the second adhesive layer bonded to a 2-mm-thick glass support.

(1-2-2) Adhesive Deposits on Small-Sized Chip Components

[0279] After the evaluation of the small-sized chip component holdability and the small-sized chip component separability, the surface of the Si chip separated from the adhesive tape was observed under a microscope to determine the presence or absence of adhesive deposits. The evaluation on the adhesive deposits was carried out based on the following criteria: oo (Excellent) indicates that no adhesive deposits were observed; o (Good) indicates that adhesive deposits were observed in less than 20% of area of the surface of the chip component; and x (Poor) indicates that adhesive deposits were observed in 20% or more of area of the surface of the chip component.

(1-2-3) Detachment from Glass Support

[0280] For Examples 19 to 21, after the evaluation on the small-sized chip component holdability and the small-sized chip component separability, the interface between the adhesive tape and the glass support was observed under a microscope to determine whether the second adhesive layer was detached from the support. The evaluation on the detachment from the support was carried out based on the following criteria: o (Good) indicates that no detachment was observed; and x (Poor) indicates that detachment was observed.

(2) Measurement of 180 Adhesion and Evaluation of End Detachment

[0281] This evaluation was carried out only for the adhesive tapes obtained in Examples 5, 6, 8, 12, 13 and 14.

[0282] Using Autograph (available from Shimadzu Corporation), the substrate layer was peeled off from the barrier layer in a 180 direction at a tensile speed of 300 mm/min in an environment of a temperature of 23 C. and a relative humidity of 50% in conformity with JIS Z0237 to measure the 180 adhesion (N/25 mm). The 180 adhesion between the substrate and the ablation layer and the 180 adhesion between the ablation layer and the barrier layer were measured.

[0283] An adhesive tape roll having a width of 1,000 mm and a length of 20 m was produced in the same manner as in each example. The roll was cut (slit) in the length direction to have a tape width of 300 mm. The presence or absence of detachment (end detachment) between the substrate and the barrier layer at the end (cut surface) of the adhesive tape after cutting was determined with an optical microscope (available from Keyence Corporation). The evaluation on the end detachment was carried out based on the following criteria: o (Good) indicates that no end detachment was observed; and x (Poor) indicates that end detachment was observed.

TABLE-US-00003 TABLE 3 Example 1 Example 2 Example 3 Example 4 Second Adhesive adhesive layer Thickness Gel fraction Substrate Material PET PET PET PET Thickness 50 m 50 m 50 m 50 m Haze 3.8% 3.8% 3.8% 3.8% Ablation layer Adhesive A A B A Thickness 16 m 16 m 16 m 16 m Gel fraction 40% 40% 0% 40% Storage modulus G 5.8 10.sup.4 Pa 5.8 10.sup.4 Pa 3.0 10.sup.5 Pa 5.8 10.sup.4 Pa UV absorbance 99% 99% 99% 99% Barrier layer Material PET PET PET PET Thickness 4 m 12 m 4 m 4 m Easy-adhesion Thickness resin layer First adhesive Adhesive A A A B layer Thickness 10 m 10 m 10 m 10 m Gel fraction 89% 89% 89% 0% Breaking strength 0.4 MPa 0.4 MPa 0.4 MPa 3.5 MPa Storage modulus G at 23 C. 5.8 10.sup.4 Pa 5.8 10.sup.4 Pa 5.8 10.sup.4 Pa 3.0 10.sup.5 Pa Storage modulus G at 20 C. 4.7 10.sup.5 Pa 4.7 10.sup.5 Pa 4.7 10.sup.5 Pa 8.8 10.sup.5 Pa Storage modulus G at 140 C. 2.0 10.sup.4 Pa 2.0 10.sup.4 Pa 2.0 10.sup.4 Pa 7.1 10.sup.4 Pa UV absorbance 99% 99% 99% 99% Ball tack value of adhesive tape 8 8 8 4 Surface peel strength of first adhesive layer of adhesive tape 0.74 MPa 0.75 MPa 0.74 MPa 0.62 MPa Adhesion of second adhesive layer of adhesive tape Evaluation 500 m 500 Chip component holdability m square Chip component separability Adhesive deposits 30 m 40 Chip component holdability m square Chip component separability Adhesive deposits Detachment from glass support 180 adhesion between substrate and ablation layer between ablation layer and barrier layer End detachment Example 5 Example 6 Example 7 Example 8 Second Adhesive adhesive layer Thickness Gel fraction Substrate Material PET PET PET PET Thickness 50 m 50 m 50 m 50 m Haze 3.8% 3.8% 3.8% 3.8% Ablation layer Adhesive A C C D Thickness 16 m 16 m 16 m 16 m Gel fraction 40% 90% 90% 88% Storage modulus G 5.8 10.sup.4 Pa 1.7 10.sup.5 Pa 1.7 10.sup.5 Pa 5.9 10.sup.4 Pa UV absorbance 99% 99% 99% 99% Barrier layer Material PET PET PET PET Thickness 4 m 4 m 4 m 4 m Easy-adhesion Thickness resin layer First adhesive Adhesive C C C D layer Thickness 10 m 10 m 25 m 10 m Gel fraction 92% 92% 92% 88% Breaking strength 2.0 MPa 2.0 MPa 2.0 MPa 1.4 MPa Storage modulus G at 23 C. 1.7 10.sup.5 Pa 1.7 10.sup.5 Pa 1.7 10.sup.5 Pa 5.9 10.sup.4 Pa Storage modulus G at 20 C. 6.5 10.sup.6 Pa 6.5 10.sup.6 Pa 6.5 10.sup.6 Pa 4.8 10.sup.5 Pa Storage modulus G at 140 C. 1.0 10.sup.4 Pa 1.0 10.sup.4 Pa 1.0 10.sup.4 Pa 3.3 10.sup.4 Pa UV absorbance 99% 99% 99% 99% Ball tack value of adhesive tape 7 6 10 10 Surface peel strength of first adhesive layer of adhesive tape 0.69 MPa 0.70 MPa 0.81 MPa 0.69 MPa Adhesion of second adhesive layer of adhesive tape Evaluation 500 m 500 Chip component holdability m square Chip component separability Adhesive deposits 30 m 40 Chip component holdability m square Chip component separability Adhesive deposits Detachment from glass support 180 adhesion between substrate 18.1 N/25 mm 5.5 N/25 mm 6.6 N/25 mm and ablation layer between ablation layer 18.1 N/25 mm 5.5 N/25 mm 6.6 N/25 mm and barrier layer End detachment x Example 9 Example 10 Example 11 Example 12 Second Adhesive adhesive layer Thickness Gel fraction Substrate Material PET PET PET PET Thickness 50 m 50 m 50 m 50 m Haze 3.8% 3.8% 3.8% 3.8% Ablation layer Adhesive E F A G Thickness 16 m 16 m 16 m 8 m Gel fraction 72% 40% 40% 40% Storage modulus G 2.9 10.sup.4 Pa 5.8 10.sup.4 Pa 5.8 10.sup.4 Pa 5.8 10.sup.4 Pa UV absorbance 99% 85% 99% 99% Barrier layer Material PET PET OPP PET Thickness 4 m 4 m 20 m 4 m Easy-adhesion Thickness resin layer First adhesive Adhesive E F A C layer Thickness 10 m 10 m 10 m 8 m Gel fraction 65% 89% 89% 92% Breaking strength 0.7 MPa 0.4 MPa 0.4 MPa 2.0 MPa Storage modulus G at 23 C. 2.9 10.sup.4 Pa 5.8 10.sup.4 Pa 5.8 10.sup.4 Pa 1.7 10.sup.5 Pa Storage modulus G at 20 C. 1.0 10.sup.5 Pa 4.7 10.sup.5 Pa 4.7 10.sup.5 Pa 6.5 10.sup.6 Pa Storage modulus G at 140 C. 1.8 10.sup.4 Pa 2.0 10.sup.4 Pa 2.0 10.sup.4 Pa 1.0 10.sup.4 Pa UV absorbance 99% 70% 99% 99% Ball tack value of adhesive tape 6 8 8 7 Surface peel strength of first adhesive layer of adhesive tape 0.66 MPa 0.78 MPa 0.79 MPa 0.67 MPa Adhesion of second adhesive layer of adhesive tape Evaluation 500 m 500 Chip component holdability m square Chip component separability Adhesive deposits 30 m 40 Chip component holdability m square Chip component separability Adhesive deposits Detachment from glass support 180 adhesion between substrate 10.5 N/25 mm and ablation layer between ablation layer 10.5 N/25 mm and barrier layer End detachment Example 13 Example 14 Second Adhesive adhesive layer Thickness Gel fraction Substrate Material PET PET Thickness 23 m 50 m Haze 3.2% 3.8% Ablation layer Adhesive G H Thickness 8 m 8 m Gel fraction 40% 61% Storage modulus G 5.8 10.sup.4 Pa 5.8 10.sup.4 Pa UV absorbance 99% 99% Barrier layer Material PET PET Thickness 4 m 4 m Easy-adhesion Thickness resin layer First adhesive Adhesive C C layer Thickness 8 m 8 m Gel fraction 92% 92% Breaking strength 2.0 MPa 2.0 MPa Storage modulus G at 23 C. 1.7 10.sup.5 Pa 1.7 10.sup.5 Pa Storage modulus G at 20 C. 6.5 10.sup.6 Pa 6.5 10.sup.6 Pa Storage modulus G at 140 C. 1.0 10.sup.4 Pa 1.0 10.sup.4 Pa UV absorbance 99% 99% Ball tack value of adhesive tape 7 7 Surface peel strength of first adhesive layer of adhesive tape 0.68 MPa 0.68 MPa Adhesion of second adhesive layer of adhesive tape Evaluation 500 m 500 Chip component holdability m square Chip component separability Adhesive deposits 30 m 40 Chip component holdability m square Chip component separability Adhesive deposits Detachment from glass support 180 adhesion between substrate 9.8 N/25 mm 6.8 N/25 mm and ablation layer between ablation layer 9.8 N/25 mm 6.8 N/25 mm and barrier layer End detachment

TABLE-US-00004 TABLE 4 Example 15 Example 16 Example 17 Example 18 Second Adhesive adhesive layer Thickness Gel fraction Substrate Material PET PET PET PET Thickness 50 m 50 m 50 m 50 m Haze 0.3 0.3 0.3 0.3 Ablation layer Adhesive J J J J Thickness 8 m 8 m 8 m 8 m Gel fraction 82% 82% 82% 82% Storage modulus G 4.3 10.sup.4 Pa 4.3 10.sup.4 Pa 4.3 10.sup.4 Pa 4.3 10.sup.4 Pa UV absorbance 99% 99% 99% 99% Barrier layer Material PET PET PET PET Thickness 5.5 m 5.5 m 5.5 m 5.5 m Easy-adhesion Thickness 0.12 m 0.12 m 0.12 m 0.12 m resin layer First adhesive Adhesive C K L M layer Thickness 8 m 8 m 8 m 8 m Gel fraction 92% 86% 91% 94% Breaking strength 2.0 MPa 6.3 MPa 4.4 MPa 6.1 MPa Storage modulus G at 23 C. 1.7 10.sup.5 Pa 1.1 10.sup.6 Pa 2.7 10.sup.5 Pa 1.1 10.sup.6 Pa Storage modulus G at 20 C. 6.5 10.sup.6 Pa 1.3 10.sup.7 Pa 1.3 10.sup.7 Pa 5.2 10.sup.6 Pa Storage modulus G at 140 C. 1.0 10.sup.4 Pa 9.2 10.sup.4 Pa 8.8 10.sup.4 Pa 1.8 10.sup.5 Pa UV absorbance 99% 99% 99% 99% Ball tack value of adhesive tape 7 less than 4 less than 4 less than 4 Surface peel strength of first adhesive layer of adhesive tape 0.68 MPa 0.45 MPa 0.51 MPa 0.71 MPa Adhesion of second adhesive layer of adhesive tape Evaluation 500 m 500 Chip component holdability m square Chip component separability Adhesive deposits 30 m 40 Chip component holdability m square Chip component separability Adhesive deposits Detachment from glass support 180 adhesion between substrate and ablation layer between ablation layer and barrier layer End detachment Example 19 Example 20 Example 21 Example 22 Second Adhesive P Q R adhesive layer Thickness 10 m 10 m 10 m Gel fraction 40% 37% 43% Substrate Material PET PET PET PET Thickness 50 m 50 m 50 m 50 m Haze 0.3 0.3 0.3 0.3 Ablation layer Adhesive J J J N Thickness 8 m 8 m 8 m 8 m Gel fraction 82% 82% 82% 80% Storage modulus G 4.3 10.sup.4 Pa 4.3 10.sup.4 Pa 4.3 10.sup.4 Pa 4.3 10.sup.4 Pa UV absorbance 99% 99% 99% 99% Barrier layer Material PET PET PET PET Thickness 5.5 m 5.5 m 5.5 m 5.5 m Easy-adhesion Thickness 0.12 m 0.12 m 0.12 m 0.12 m resin layer First adhesive Adhesive K K K L layer Thickness 8 m 8 m 8 m 8 m Gel fraction 86% 86% 86% 91% Breaking strength 6.3 MPa 6.3 MPa 6.3 MPa 4.4 MPa Storage modulus G at 23 C. 1.1 10.sup.6 Pa 1.1 10.sup.6 Pa 1.1 10.sup.6 Pa 2.7 10.sup.5 Pa Storage modulus G at 20 C. 1.3 10.sup.7 Pa 1.3 10.sup.7 Pa 1.3 10.sup.7 Pa 1.3 10.sup.7 Pa Storage modulus G at 140 C. 9.2 10.sup.4 Pa 9.2 10.sup.4 Pa 9.2 10.sup.4 Pa 8.8 10.sup.4 Pa UV absorbance 99% 99% 99% 99% Ball tack value of adhesive tape less than 4 less than 4 less than 4 less than 4 Surface peel strength of first adhesive layer of adhesive tape 0.45 MPa 0.45 MPa 0.45 MPa 0.51 MPa Adhesion of second adhesive layer of adhesive tape 3.3 N/25 mm 6.4 N/25 mm 14.2 N/25 mm Evaluation 500 m 500 Chip component holdability m square Chip component separability Adhesive deposits 30 m 40 Chip component holdability m square Chip component separability Adhesive deposits Detachment from x glass support 180 adhesion between substrate and ablation layer between ablation layer and barrier layer End detachment Example 23 Example 24 Second Adhesive adhesive layer Thickness Gel fraction Substrate Material PET PET Thickness 50 m 50 m Haze 0.3 0.3 Ablation layer Adhesive O I Thickness 8 m 8 m Gel fraction 83% 73% Storage modulus G 4.3 10.sup.4 Pa 1.8 10.sup.4 Pa UV absorbance 99% 99% Barrier layer Material PET PET Thickness 5.5 m 5.5 m Easy-adhesion Thickness 0.12 m 0.12 m resin layer First adhesive Adhesive L I layer Thickness 8 m 8 m Gel fraction 91% 73% Breaking strength 4.4 MPa 0.1 MPa Storage modulus G at 23 C. 2.7 10.sup.5 Pa 1.8 10.sup.4 Pa Storage modulus G at 20 C. 1.3 10.sup.7 Pa 1.8 10.sup.5 Pa Storage modulus G at 140 C. 8.8 10.sup.4 Pa 1.4 10.sup.4 Pa UV absorbance 99% 99% Ball tack value of adhesive tape less than 4 12 Surface peel strength of first adhesive layer of adhesive tape 0.51 MPa 0.33 MPa Adhesion of second adhesive layer of adhesive tape Evaluation 500 m 500 Chip component holdability m square Chip component separability Adhesive deposits 30 m 40 Chip component holdability m square Chip component separability Adhesive deposits Detachment from glass support 180 adhesion between substrate and ablation layer between ablation layer and barrier layer End detachment

TABLE-US-00005 TABLE 5 Comparative Comparative Comparative Comparative Example 1 Example 2 Example 3 Example 4 Second Adhesive adhesive layer Thickness Gel fraction Substrate Material PET PET PET PET Thickness 50 m 50 m 50 m 50 m Haze 3.8% 3.8% 3.8% 3.8% Ablation layer Adhesive A Thickness 16 m Gel fraction 40% Storage modulus G 5.8 10.sup.4 Pa UV absorbance 99% Barrier layer Material Thickness Easy-adhesion resin Thickness First adhesive Adhesive A A A K layer Thickness 20 m 10 m 100 m 8 m Gel fraction 89% 89% 89% 86% Breaking strength 0.4 MPa 0.4 MPa 0.4 MPa 6.3 MPa Storage modulus G at 23 C. 5.8 10.sup.4 Pa 5.8 10.sup.4 Pa 5.8 10.sup.4 Pa 1.1 10.sup.6 Pa Storage modulus G at 20 C. 4.7 10.sup.5 Pa 4.7 10.sup.5 Pa 4.7 10.sup.5 Pa 1.3 10.sup.7 Pa Storage modulus G at 140 C. 2.1 10.sup.4 Pa 2.1 10.sup.4 Pa 2.1 10.sup.4 Pa 9.2 10.sup.4 Pa UV absorbance 99% 99% 99% 99% Ball tack value of adhesive tape 6 10 14 less than 4 Surface peel strength of first adhesive layer of adhesive tape 0.79 MPa 0.82 MPa 1.05 MPa 0.51 MPa Adhesion of second adhesive layer of adhesive tape Evaluation 500 m 500 m Chip component holdability square Chip component separability Adhesive deposits x x x 30 m 40 m Chip component holdability square Chip component separability Adhesive deposits Detachment from glass support 180 adhesion between substrate and ablation layer between ablation layer and barrier layer End detachment

INDUSTRIAL APPLICABILITY

[0284] The present invention can provide an adhesive tape for semiconductor device production which exhibits excellent chip component separability and can reduce adhesive deposits on chip components.

REFERENCE SIGNS LIST

[0285] 1 chip component [0286] 1a electrode [0287] 4 adhesive layer [0288] 4a first adhesive layer [0289] 4b second adhesive layer [0290] 5 substrate [0291] 7 drive circuit board [0292] 7a electrode [0293] 8 laser light irradiation device [0294] 8a laser light [0295] 9 laminate of substrate and adhesive layer [0296] 10 ablation layer [0297] 11 barrier layer [0298] 12 adhesive tape for semiconductor device production