Cleaning agent composition for glass hard disk substrate

Abstract

A cleaning composition for a glass hard disk substrate has high detergency and can reduce the deterioration of the surface roughness of a substrate. In an embodiment, the present disclosure relates to a cleaning composition for a glass hard disk substrate, which contains an amine (component A) expressed by the formula (I) and a surface active agent (component B) expressed by the formula (II). ##STR00001##

Claims

1. A method for cleaning a glass substrate, comprising: a cleaning process of cleaning a substrate to be cleaned with a cleaning composition, the cleaning composition comprising: an amine (component A) expressed by the following formula (I); and a surface active agent (component B) expressed by the following formula (II), wherein ##STR00008## in the formula (I), R.sub.1 represents a hydrogen atom, a methyl group, an ethyl group, or an aminoethyl group, R.sub.2 represents a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group, or an ethyl group, and R.sub.3 represents an aminoethyl group, a hydroxyethyl group, or a hydroxypropyl group, or in the formula (I), R.sub.1 represents a methyl group, an ethyl group, an aminoethyl group, a hydroxyethyl group, or a hydroxypropyl group, and R.sub.2 and R.sub.3 are bonded to each other to form a pyrrolidine ring or a piperazine ring with a nitrogen atom in the formula (I), and wherein ##STR00009## in the formula (II), R represents a linear or branched alkyl group having 6 or more and 18 or less carbon atoms, and M.sup.1 and M.sup.2 each independently represent a hydrogen atom, a metal atom, NH.sub.4, or organic ammonium, and wherein a content of component A in the cleaning composition is 0.01% by mass or more and 0.28% by mass or less.

2. The method for cleaning a glass substrate according to claim 1, wherein the substrate to be cleaned is a substrate that has been polished with a polishing composition.

3. The method for cleaning a glass substrate according to claim 1, wherein the cleaning composition further comprises water (component C).

4. The method for cleaning a glass substrate according to claim 1, wherein a mass ratio A/B of the component A to the component B in the cleaning composition is 1 or more and 20 or less.

5. The method for cleaning a glass substrate according to claim 1, wherein a content of the component A with respect to a total mass of components other than water in the cleaning composition is 40% by mass or more and 90% by mass or less.

6. The method for cleaning a glass substrate according to claim 1, wherein a content of the component A in the cleaning composition is 0.01% by mass or more and 0.22% by mass or less, and a content of the component B in the cleaning composition is 0.008% by mass or more and 0.2% by mass or less.

7. The method for cleaning a glass substrate according to claim 1, wherein the cleaning composition further comprises a chelating agent (component D).

8. The method for cleaning a glass substrate according to claim 1, wherein the cleaning composition further comprises an anionic polymer (component E).

9. The method for cleaning a glass substrate according to claim 1, wherein the cleaning composition is prepared by using a kit in which the component A and the component B are stored so as not to be mixed with each other.

10. A method for producing a glass hard disk substrate, comprising: (1) a polishing process of polishing a substrate to be polished with a polishing composition; and (2) a cleaning process of cleaning a substrate to be cleaned with a cleaning composition, the cleaning composition comprising: an amine (component A) expressed by the following formula (I); and a surface active agent (component B) expressed by the following formula (II), wherein ##STR00010## in the formula (I), R represents a hydrogen atom, a methyl group, an ethyl group, or an aminoethyl group, R.sub.2 represents a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group, or an ethyl group, and R.sub.3 represents an aminoethyl group, a hydroxyethyl group, or a hydroxypropyl group, or in the formula (I), R.sub.1 represents a methyl group, an ethyl group, an aminoethyl group, a hydroxyethyl group, or a hydroxypropyl group, and R.sub.2 and R.sub.3 are bonded to each other to form a pyrrolidine ring or a piperazine ring with a nitrogen atom in the formula (I), and wherein ##STR00011## in the formula (II), R represents a linear or branched alkyl group having 6 or more and 18 or less carbon atoms, and M.sup.1 and M.sup.2 each independently represent a hydrogen atom, a metal atom, NH.sub.4, or organic ammonium, and wherein a content of the component A in the cleaning composition is 0.01% by mass or more and 0.22% by mass or less, and a content of the component B in the cleaning composition is 0.008% by mass or more and 0.2% by mass or less.

11. The method for producing a glass hard disk substrate according to claim 10, wherein the substrate to be cleaned is a substrate that has been polished with a polishing composition.

12. The method for producing a glass hard disk substrate according to claim 10, wherein the cleaning composition further comprises water (component C).

13. The method for producing a glass hard disk substrate according to claim 10, wherein a mass ratio A/B of the component A to the component B in the cleaning composition is 1 or more and 20 or less.

14. The method for producing a glass hard disk substrate according to claim 10, wherein a content of the component A with respect to a total mass of components other than water in the cleaning composition is 40% by mass or more and 90% by mass or less.

15. The method for producing a glass hard disk substrate according to claim 10, wherein a content of the component A in the cleaning composition is 0.01% by mass or more and 0.28% by mass or less.

16. The method for producing a glass hard disk substrate according to claim 10, wherein the glass hard disk substrate is a substrate for heat-assisted magnetic recording.

17. The method for producing a glass hard disk substrate according to claim 10, wherein the cleaning composition is prepared by using a kit in which the component A and the component B are stored so as not to be mixed with each other.

18. A method for cleaning a glass substrate, comprising: a cleaning process of cleaning a substrate to be cleaned with a cleaning composition, the cleaning composition comprising: an amine (component A) expressed by the following formula (I); and a surface active agent (component B) expressed by the following formula (II), wherein ##STR00012## in the formula (I), R.sub.1 represents a hydrogen atom, a methyl group, an ethyl group, or an aminoethyl group, R.sub.2 represents a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group, or an ethyl group, and R.sub.3 represents an aminoethyl group, a hydroxyethyl group, or a hydroxypropyl group, or in the formula (I), R.sub.1 represents a methyl group, an ethyl group, an aminoethyl group, a hydroxyethyl group, or a hydroxypropyl group, and R.sub.2 and R.sub.3 are bonded to each other to form a pyrrolidine ring or a piperazine ring with a nitrogen atom in the formula (I), and wherein ##STR00013## in the formula (II), R represents a linear or branched alkyl group having 6 or more and 18 or less carbon atoms, and M.sup.1 and M.sup.2 each independently represent a hydrogen atom, a metal atom, NH.sub.4, or organic ammonium, and wherein the cleaning composition further comprises an anionic polymer (component E).

19. A method for producing a glass hard disk substrate, comprising: (1) a polishing process of polishing a substrate to be polished with a polishing composition; and (2) a cleaning process of cleaning a substrate to be cleaned with a cleaning composition, the cleaning composition comprising: an amine (component A) expressed by the following formula (I); and a surface active agent (component B) expressed by the following formula (II), wherein ##STR00014## in the formula (I), R.sub.1 represents a hydrogen atom, a methyl group, an ethyl group, or an aminoethyl group, R.sub.2 represents a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group, or an ethyl group, and R.sub.3 represents an aminoethyl group, a hydroxyethyl group, or a hydroxypropyl group, or in the formula (I), R.sub.1 represents a methyl group, an ethyl group, an aminoethyl group, a hydroxyethyl group, or a hydroxypropyl group, and R.sub.2 and R.sub.3 are bonded to each other to form a pyrrolidine ring or a piperazine ring with a nitrogen atom in the formula (I), and wherein ##STR00015## in the formula (II), R represents a linear or branched alkyl group having 6 or more and 18 or less carbon atoms, and M.sup.1 and M.sup.2 each independently represent a hydrogen atom, a metal atom, NH.sub.4, or organic ammonium, and wherein the glass hard disk substrate is a substrate for heat-assisted magnetic recording.

Description

EXAMPLES

(1) [Preparation of concentrated solution of cleaning composition (Examples 1 to 11 and Comparative Examples 1 to 6)]

(2) According to each composition in Table 1, the components were mixed in the proportions (% by mass) as shown in Table 1, thereby providing concentrated solutions of cleaning compositions in Examples 1 to 11 and Comparative Examples 1 to 6. Table 1 shows the pH of each of the concentrated solutions of the cleaning compositions at 25 C. The pH was measured by a pH meter (HM-30G, manufactured by DKK-TOA CORPORATION) after a 3-minutes immersion of the electrode in the cleaning composition.

(3) TABLE-US-00001 TABLE 1 Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6 Ex. 7 Ex. 8 Concen- Amine N-(- Added 15.00 10.00 10.00 5.00 20.00 15.00 trated (compo- aminoethyl) amount (% solution nent ethanolamine by mass) of A) Monoisopropanolamine Added 5.00 cleaning amount (% compo- by mass) sition N- Added 15.00 methylmonoethanol- amount (% amine by mass) Diethylenetriamine Added 15.00 amount (% by mass) Hydroxyethylpiperazine Added amount (% by mass) Triethanolamine (non- Added component A) amount (% by mass) Surface Disodium dodecyl Added 5.65 5.65 5.65 5.65 5.65 5.65 5.65 2.00 active diphenyl amount (% (2.825) (2.825) (2.825) (2.825) (2.825) (2.825) (2.825) (1.00) agent ether disulfonate by mass) (compo- Sodium polyoxyethylene Added nent (3) lauryl ether sulfate amount (% B) (non-component B) by mass) Water Ultrapure water Added 73.85 78.85 73.85 73.85 73.85 83.85 68.85 77.50 (compo- amount (% nent by mass) C) Chelating HEDP Added 2.50 2.50 2.50 2.50 2.50 2.50 2.50 2.50 agent amount (% (1.50) (1.50) (1.50) (1.50) (1.50) (1.50) (1.50) (1.50) (compo- by mass) nent D) Anionic AA/AMPS Added 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 polymer amount (% (1.20) (1.20) (1.20) (1.20) (1.20) (1.20) (1.20) (1.20) (compo- by mass) nent E) Alkali Potassium hydroxide Added metal amount (% hydroxide by mass) pH 10.9 10.5 10.8 11.1 10.3 10.0 10.9 10.7 Comp. Comp. Comp. Comp. Comp. Comp. Ex. 9 Ex. 10 Ex. 11 Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6 Concen- Amine N-(- Added 15.00 15.00 15.00 2.00 15.00 trated (compo- aminoethyl) amount (% solution nent ethanolamine by mass) of A) Monoisopropanol- Added cleaning amine amount (% compo- by mass) sition N- Added methylmonoethanol- amount (% amine by mass) Diethylenetriamine Added amount (% by mass) Hydroxyethylpiperazine Added 10.00 amount (% by mass) Triethanolamine (non- Added 15.00 component A) amount (% by mass) Surface Disodium dodecyl Added 10.00 5.65 5.65 5.65 5.65 5.65 active diphenyl amount (% (5.00) (2.825) (2.825) (2.825) (2.825) (2.825) agent ether disulfonate by mass) (compo- Sodium polyoxyethylene Added 11.30 nent (3) lauryl ether sulfate amount (% (2.825) B) (non-component B) by mass) Water Ultrapure water Added 69.50 76.85 78.85 79.50 88.85 85.80 91.99 73.85 68.20 (compo- amount (% nent by mass) C) Chelating HEDP Added 2.50 2.50 2.50 2.50 2.50 2.50 2.50 2.50 2.50 agent amount (% (1.50) (1.50) (1.50) (1.50) (1.50) (1.50) (1.50) (1.50) (1.50) (compo- by mass) nent D) Anionic AA/AMPS Added 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 polymer amount (% (1.20) (1.20) (1.20) (1.20) (1.20) (1.20) (1.20) (1.20) (compo- by mass) nent E) Alkali Potassium hydroxide Added 3.05 0.51 metal amount (% (1.464) (0.2448) hydroxide by mass) pH 10.8 10.8 10.0 10.5 2.4 10.4 9.0 8.7 10.7 The value in parentheses indicates a solid content (% by mass).

(4) [Preparation of Cleaning Composition to be used in Cleaning Process (i.e., Cleaning Composition for use in Cleaning)]

(5) The concentrated solution of the cleaning composition was diluted to 100 times with ultrapure water, so that the cleaning composition for use in cleaning was obtained. The pH was measured in the same manner as the pH of the concentrated solution of the cleaning composition.

(6) [Measurement of Alkali Metal Ion Concentration]

(7) The concentration of alkali metal ions in the cleaning composition was measured in the following manner. First, 0.1 g of the cleaning composition was precisely weighed in a quartz crucible and subjected to dry carbonization. Then, the cleaning composition was dissolved in 4 mL of 6N hydrochloric acid, and the volume of this solution was adjusted to 50 mL with ultrapure water. Subsequently, this solution was diluted to 25 times with ultrapure water and used as a measurement sample. The concentration of alkali metal ions in the measurement sample was measured by an atomic absorption spectrophotometer (Varian Spectra AA 220, manufactured by Agilent Technologies Japan, Ltd.). The concentration (% by mass) of sodium ions and the concentration (% by mass) of potassium ions were calculated each. Then, the total concentration (% by mass) was converted to a ppm value, which was the alkali metal ion concentration.

(8) The following components were used to prepare the cleaning compositions.

(9) [Amine]

(10) N-(-aminoethyl)ethanolamine (Amino alcohol EA, manufactured by NIPPON NYUKAZAI CO., LTD.): component A

(11) Monoisopropanolamine (manufactured by The Dow Chemical Company): component A

(12) N-methylmonoethanolamine (Amino alcohol MMA, manufactured by NIPPON NYUKAZAI CO., LTD.): component A

(13) Diethylenetriamine (manufactured by NACALAI TESQUE, INC.): component A

(14) 1-(2-hydroxyethyl)piperazine (Hydroxyethyl Piperazine, manufactured by NIPPON NYUKAZAI CO., LTD.): component A

(15) Triethanolamine (manufactured by Tokyo Chemical Industry Co., Ltd.): non-component A

(16) [Surface Active Agent]

(17) Disodium dodecyl diphenyl ether disulfonate (with a solid content of 50% by mass and a molecular weight of 542): component B

(18) Sodium polyoxyethylene (3) lauryl ether sulfate (EMAL 20C with a solid content of 25% by mass and a molecular weight of 420, manufactured by Kao Corporation): non-component B

(19) [Water: Component C]

(20) Ultrapure water produced by a continuous water purifying apparatus (Pureconti PC-2000VRL) and a subsystem (Makuace KC-05H), both of which are manufactured by Kurita Water Industries Ltd.

(21) [Chelating Agent: Component D]

(22) 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP) (Dequest 2010 with a solid content of 60% by mass, manufactured by Italmatch Japan Ltd.)

(23) [Anionic Polymer: Component E]

(24) An aqueous solution (with a solid content of 40% by mass) of sodium salt of a copolymer compound (with a weight average molecular weight of 12,000) of acrylic acid and 2-acrylamide-2-methylpropanesulfonic acid (AA/AMPS) (molar ratio: 92/8)

(25) [Alkali Metal Hydroxide]

(26) Potassium hydroxide (with a solid content of 48% by mass, guaranteed reagent, manufactured by KANTO CHEMICAL CO., INC.)

(27) [Detergency Test Method]

(28) A substrate was polished with a polishing liquid slurry (polishing composition) having the following composition. Then, the substrate that was contaminated by, e.g., abrasive grains derived from the polishing liquid slurry and polishing debris derived from the substrate material was prepared as a substrate to be cleaned. Using the substrate to be cleaned, the detergency of the cleaning composition was evaluated.

(29) (Substrate for Evaluation)

(30) Heat-resistant amorphous glass substrates (with an outer diameter of 65 mm, an inner diameter of 20 mm, and a thickness of 0.635 mm) were prepared as substrates for evaluation in Examples 1 to 11 and Comparative Examples 1 to 6.

(31) (Polishing Condition)

(32) Polishing machine: double side 9B polisher (manufactured by HAMAI CO., LTD.)

(33) Polishing pad: suede pad for final polishing (manufactured by FILWEL CO., LTD.)

(34) Polishing composition: colloidal silica slurry (in which the number average particle diameter of colloidal silica particles was 24 nm, the concentration of colloidal silica particles was 8% by mass, and the medium was water, manufactured by Kao Corporation)

(35) Pre-polishing: the load was 40 g/cm.sup.2, the time was 60 sec, and the flow rate of a polishing liquid was 100 mL/min.

(36) Main polishing: the load was 100 g/cm.sup.2, the time was 1200 sec, and the flow rate of a polishing liquid was 100 mL/min.

(37) Water rinsing: the load was 40 g/cm.sup.2, the time was 60 sec, and the flow rate of water for rinsing was about 2 L/min.

(38) (Cleaning)

(39) Five substrates after polishing (i.e., the substrates to be cleaned) were cleaned by a cleaning apparatus under the following conditions. Two sets of a cleaning tank and a rinsing tank were prepared.

(40) (1) Cleaning-1: 150 g of a concentrated solution of a cleaning composition was diluted to 100 times with ultrapure water to prepare 15000 g of the cleaning composition that was to be used for cleaning. The cleaning composition thus prepared was placed in a cleaning tank (a), and the temperature of the liquid in the cleaning tank (a) was set to 40 C. Then, the substrate to be cleaned was immersed in the cleaning composition in the cleaning tank (a), and cleaned for 120 seconds while ultrasonic waves (40 kHz) was being applied.

(41) (2) Rinsing-1: Ultrapure water was placed in a rinsing tank (b), and the temperature of the liquid in the rinsing tank (b) was set to 40 C. Then, the substrate to be cleaned was transferred from the cleaning tank (a) to the rinsing tank (b), immersed in the ultrapure water in the rinsing tank (b), and rinsed for 120 seconds while ultrasonic waves (40 kHz) was being applied.

(42) (3) Using a cleaning tank (c) containing a cleaning composition that was prepared under the same conditions as the cleaning tank (a) and a rinsing tank (d) containing ultrapure water that was prepared under the same conditions as the rinsing tank (b), the steps (1) and (2) were repeated again.

(43) (4) Cleaning-2: The substrate to be cleaned in the rinsing tank (d) was transferred to a scrub cleaning unit (A) in which cleaning brushes were mounted. Then, a cleaning composition of 25 C. was injected into each of the cleaning brushes, and the cleaning brushes were pressed against both surfaces of the substrate in the presence of the cleaning composition while rotating the cleaning brushes at 400 rpm so that the substrate was cleaned at 25 C. for 5 seconds. The cleaning composition had the same composition as that of the cleaning composition used in the cleaning-1 of the step (1).

(44) (5) Rinsing-2: The substrate to be cleaned was transferred to a scrub cleaning unit (B) that was prepared under the same conditions as the scrub cleaning unit (A). Then, ultrapure water of 25 C. was injected, and the cleaning brushes were pressed against both surfaces of the substrate while rotating the cleaning brushes at 400 rpm in the same manner as the step (4) so that the substrate was rinsed at 25 C. for 5 seconds.

(45) (6) A scrub cleaning unit (C) was prepared under the same conditions as the scrub cleaning unit (A), and a scrub cleaning unit (D) was prepared under the same conditions as the scrub cleaning unit (B). Using the scrub cleaning units (C) and (D), the steps (4) and (5) were repeated again.

(46) (7) Rinsing-3: Ultrapure water was placed in a rinsing tank (e), and the temperature of the liquid in the rinsing tank (e) was set to 25 C. Then, the substrate to be cleaned was transferred to the rinsing tank (e), immersed in the ultrapure water in the rinsing tank (e), and rinsed for 600 seconds while ultrasonic waves (170 kHz) was being applied.

(47) (8) Drying: The substrate to be cleaned was transferred to a rising tank (f) containing hot pure water of 30 C. and immersed in the hot pure water in the rinsing tank (f) for 60 seconds. Then, the substrate was drawn up from the water at a rate of 90 mm/min, and the surface of the substrate was completely dried.

(48) [Method for Evaluating Detergency]

(49) The cleaned substrate was rotated at 10000 rpm and irradiated with a laser using MODE Q-Scatter of an optical microdefect inspection apparatus (Candela 6100, manufactured by KLA-Tencor Corporation) to measure the number of defects (i.e., the number of foreign matter on the substrate). This measurement was performed on 10 substrates for each of the cleaning compositions in Examples 1 to 11 and Comparative Examples 1 to 6, and the average of the measured values was calculated. Table 2 shows the relative values when the value of Example 1 is defined as 100. As shown in Table 2, it can be evaluated that the detergency is better as the relative value is smaller, since the number of defects is reduced.

(50) [Method for Evaluating Surface Roughness]

(51) Two substrates were randomly selected from five substrates that had been polished by the same polishing method, as described above. Then, the two substrates were cleaned with the cleaning compositions in Examples 1 to 11 and Comparative Examples 1 to 6, and the surface roughness of each of the substrates was measured. The results of this measurement were represented by surface roughness 1. Moreover, the surface roughness was measured in the same manner, except that the immersion time was changed from 120 seconds to 60 minutes in the step (1), and the step (3) was skipped (i.e., the step (1) and the step (2) were each performed only once). The results of this measurement were represented by surface roughness 2. To determine the surface roughness, both surfaces of the cleaned substrate were measured by an atomic force microscope (AFM) (Digital Instrument Nano Scope IIIa Multimode AFM, manufactured by Bruker AXS K.K.) under the following conditions. Each of the five substrates was measured to obtain the average value, from which the surface roughness Ra was calculated. Table 2 shows the relative values of the surface roughness 1 and the surface roughness 2 when the values of Example 1 are defined as 100, respectively. As shown in Table 2, it can be evaluated that the smoothness is better as the relative value is smaller.

(52) (AFM Measurement Condition)

(53) Mode: Tapping Mode

(54) Area: 11 m

(55) Scan rate: 1.0 Hz

(56) Cantilever: NCH-10V

(57) Line: 512512

(58) Table 2 shows the content of each component with respect to the total mass of the components other than water in the cleaning composition, the physical properties (dilution ratio, pH, and alkali metal ion concentration) of the cleaning composition for use in cleaning, and the evaluation results of the detergency and the smoothness in Examples 1 to 11 and Comparative Examples 1 to 6.

(59) TABLE-US-00002 TABLE 2 Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6 Ex. 7 Ex. 8 Cleaning Amine N-(- Content with 73.08 64.41 48.72 47.51 78.35 80.21 compo- (compo- aminoethyl) respect to total sition nent ethanolamine mass of A) components other than water (% by mass) Monoisopropanol- Content with 24.36 amine respect to total mass of components other than water (% by mass) N- Content with 73.08 methylmonoethanol- respect to total amine mass of components other than water (% by mass) Diethylenetriamine Content with 73.08 respect to total mass of components other than water (% by mass) Hydroxyethyl- Content with piperazine respect to total mass of components othert han water (% by mass) Triethanolamine (non- Content with component A) respect to total mass of components other than water (% by mass) Surface Disodium dodecyl Content with 13.76 18.20 13.76 13.76 13.76 26.84 11.07 5.35 active diphenyl ether respect to total agent disulfonate mass of (compo- components nent other than water B) (% by mass) Sodium Content with polyoxyethylene respect to total (3) lauryl ether sulfate mass of (non-component B) components other than water (% by mass) Chelating HEDP Content with 7.31 9.66 7.31 7.31 7.31 14.25 5.88 8.02 agent respect to total (compo- mass of nent components D) other than water (% by mass) Anionic AA/AMPS Content with 5.85 7.73 5.85 5.85 5.85 11.40 4.70 6.42 polymer respect to total (compo- mass of nent components E) other than water (% by mass) Alkali Potassium hydroxide Content with metal respect to total hydrox- mass of ide components other than water (% by mass) Mass ratio A/B 5.31 3.54 5.31 5.31 5.31 1.77 7.08 15.00 Cleaning Dilution ratio (times) 100 100 100 100 100 100 100 100 compo- pH 10.5 10.4 10.8 10.4 10.4 9.8 10.5 10.4 sition Alkali metal ion concentration (ppm) 50 50 50 50 50 50 50 34 to be used in cleaning process Evalu- Deter- Number of defects 100 102 100 90 80 105 95 105 ation gency Smooth- Surface roughness 1 100 100 103 110 110 100 105 100 ness Surface roughness 2 107 107 110 118 118 107 112 107 Comp. Comp. Comp. Comp. Comp. Comp. Ex. 9 Ex. 10 Ex. 11 Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6 Cleaning Amine N-(- Content with 66.08 77.62 84.75 40.45 73.08 compo- (compo- aminoethyl) respect to total sition nent ethanolamine mass of A) components other than water (% by mass) Monoisopropanol- Content with amine respect to total mass of components other than water (% by mass) N- Content with methylmonoethanol- respect to total amine mass of components other than water (% by mass) Diethylenetriamine Content with respect to total mass of components other than water (% by mass) Hydroxyethyl- Content with 64.41 piperazine respect to total mass of components other than water (% by mass) Triethanolamine Content with 73.08 (non-component A) respect to total mass of components other than water (% by mass) Surface Disodium dodecyl Content with 22.03 14.62 18.20 51.13 40.42 13.76 active diphenyl ether respect to total agent disulfonate mass of (compo- components nent other than water B) (% by mass) Sodium Content with 13.76 polyoxyethylene respect to total (3) lauryl mass of ether sulfate components (non-component B) other than water (% by mass) Chelating HEDP Content with 6.61 7.76 9.66 8.47 27.15 21.46 30.33 7.31 7.31 agent respect to total (compo- mass of nent components D) other than water (% by mass) Anionic AA/AMPS Content with 5.29 7.73 6.78 21.72 17.17 24.27 5.85 5.85 polymer respect to total (compo- mass of nent components E) other than water (% by mass) Alkali Potassium hydroxide Content with 20.95 4.95 metal respect to total hydrox- mass of ide components other than water (% by mass) Mass ratio A/B 3.00 5.31 3.54 0 0 0 0 0 0 Cleaning Dilution ratio (times) 10.4 10.4 9.5 10.5 3.5 10.6 9.0 8.5 10.4 compo- pH 68 10 50 26 50 266 62 50 50 sition Alkali metal ion concentration (ppm) to be used in cleaning process Evalu- Deter- Number of defects 100 103 105 129 232 161 126 105 130 ation gency Smooth- Surface roughness 1 100 100 100 106 105 110 107 110 105 ness Surface roughness 2 107 107 107 113 112 154 139 118 112

(60) As shown in Table 2, the use of the cleaning compositions in Examples 1 to 11 can achieve higher detergency and higher smoothness than the use of the cleaning compositions in Comparative Examples 1 to 6.