SINGLE-PIECE MULTI-FREQUENCY INFRARED LIGHT-EMITTING-DIODE (LED) AND MULTI- FREQUENCY HIGH-PRECISION OBJECT RECOGNITION SYSTEM FORMED BY USING THE SAME

Abstract

A single-piece multi-frequency infrared light-emitting-diode (LED) and a multi-frequency high-precision object recognition system formed by using the same. The LED mentioned is formed by a first infrared light-emitting-die and a second infrared light-emitting-die space apart, having two different wavelengths with their ranges between 850 nm and 1050 nm, to serve as light source for the multi-frequency high-precision object recognition system, to obtain a 3-dimension stereoscopic relief image speedily. In addition, the system is less liable to be affected by the variations of ambient lights, so that the recognition precision for the entire object can be raised effectively. The single-piece multi-frequency infrared light-emitting-diode (LED) can be used extensively in security monitoring, industrial monitoring, human face recognition, image recognition for door opening of a vehicle.

Claims

1. A single-piece multi-frequency infrared light-emitting-diode (LED), comprising: a carrier; an electrical circuit board, enclosed by the carrier; a plurality of light-emitting-diodes (LEDs), disposed on the electric circuit board, and are spaced apart from each other; a plurality of metal pins, disposed corresponding to and connected electrically with the plurality of light-emitting-diodes (LEDs), and are extended outside the carrier in protrusion; and a light emitting port, located on an upper portion of the carrier, and corresponds to the plurality of light-emitting-diodes (LEDs), and it is characterized in that, the plurality of light-emitting-diodes (LEDs) on the electrical circuit board all emit infrared lights, and the plurality of light-emitting-diodes (LEDs) each includes a first infrared light-emitting-die and a second infrared light-emitting-die, and the lights emitted are both between wavelength 850 nm and 1050 nm and spaced apart.

2. The single-piece multi-frequency infrared light-emitting-diode (LED) as claimed in claim 1, wherein light emitting port is of a cone shape, lights emitted by the first infrared light-emitting-die and the second infrared light-emitting-die are of wavelengths selected from two of the following: 850 nm, 940 nm, and 1050 nm.

3. The single-piece multi-frequency infrared light-emitting-diode (LED) as claimed in claim 1, wherein a total of two infrared light-emitting-dies are provided on the electrical circuit board 2, the electrical circuit board 2 is cross divided into four copper separation regions, and two die fixing parts are disposed respectively on two copper adjacent separation regions adjacent to each other.

4. The single-piece multi-frequency infrared light-emitting-diode (LED) as claimed in claim 1, wherein the first infrared light-emitting-die emits light of wavelength 850 nm, the second infrared light-emitting-die emits light of wavelength 940 nm, and a third infrared light-emitting-die disposed on the electrical circuit board, and it emits light of wavelength 1050 nm.

5. A multi-frequency high-precision object recognition system, comprising: at least a multi-frequency light-emitted-unit, a multi-frequency image sensor unit, and an image calculation processing unit, wherein the multi-frequency light-emitted-unit emits lights of different wavelengths onto an object-to-be-tested, the multi-frequency image sensor unit senses and fetches images of the lights of different wavelengths reflected by the object-to-be-tested, and transmits the images to the image calculation processing unit, and it is characterized in that: the at least a multi-frequency light-emitted-unit is formed by a single-piece multi-frequency infrared light-emitting-diode (LED), and lights emitted includes at least two infrared lights, having their wavelengths each between 850 nm and 1050 nm and spaced apart; the multi-frequency image sensor unit senses and fetches at least two reflected infrared lights of a narrow range image signal, having their wavelengths between 850 nm and 1050 nm and are spaced apart, and their wavelength widths between 10 nm and 60 nm; and the image calculation processing unit is adapted to dispose a single-piece planar image in its X axis and its Y axis, the lights of different wavelengths in a Z axis indicate an image depth, wherein sample wavelength in the Z axis includes at least two infrared narrow range image signals having their wavelengths between 850 nm and 1050 nm and spaced apart and corresponding to that of the multi-frequency image sensor unit, and their wavelength widths are between 10 nm and 60 nm, then calculate to obtain a plurality of single-piece planar images in the X axis and the Y axis as sampled by different wavelength widths in the Z axis, superimpose the plurality of single-piece planar images into a 3-dimension stereoscopic relief image for precise comparison and recognition.

6. The multi-frequency high-precision object recognition system as claimed in claim 5, wherein the multi-frequency image sensor unit is formed by a plurality of image sensors of different frequencies or a single-piece multi-frequency image sensor, the single-piece multi-frequency image sensor includes: a light sensing pixel array; a packaging circuit, connected to the light sensing pixel array, to drive the light sensing pixel array to capture outside light and convert it into a combined image signal for output, the light sensing pixel array captures RGB full color visible light, and IR infrared invisible light to perform photoelectric conversion; and an image enhancing processor unit, embedded in the packaging circuit, to control and regulate image captured by the light sensing pixel array, the image includes: a full color RGB visible light wide range image signal having its wavelength range between 400 nm and 700 nm, and at least two infrared invisible light narrow range image signals and having their wavelength ranges between 850 nm and 940 nm, a wavelength width for each of the two infrared invisible light narrow range image signals is between 10 nm and 60 nm, the full color RGB visible light wide range image signal and the two infrared invisible light narrow range image signals are superimposed and combined, to produce a clear output image having a stereoscopic sense of a front layer and a back layer.

7. The multi-frequency high-precision object recognition system as claimed in claim 5, wherein the object-to-be-tested is a human face.

8. The multi-frequency high-precision object recognition system as claimed in claim 5, wherein the object-to-be-tested is a human face or a human eye iris.

9. The multi-frequency high-precision object recognition system as claimed in claim 5, wherein the multi-frequency high-precision object recognition system is installed on an intelligent mobile device.

10. The multi-frequency high-precision object recognition system as claimed in claim 5, wherein the multi-frequency high-precision object recognition system is installed on a vehicle.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The related drawings in connection with the detailed descriptions of the present invention to be made later are described briefly as follows, in which:

[0026] FIG. 1 is a perspective view of a single-piece multi-frequency infrared light-emitting-diode (LED) according to the present invention;

[0027] FIG. 2A is a top view of a single-piece multi-frequency infrared light-emitting-diode (LED) according to the present invention;

[0028] FIG. 2B is an equivalent circuit diagram of a single-piece multi-frequency infrared light-emitting-diode (LED) according to the present invention;

[0029] FIG. 2C is a circuit layout of a single-piece multi-frequency infrared light-emitting-diode (LED) according to the present invention;

[0030] FIG. 3 is a block diagram of a multi-frequency high-precision object recognition system according to the present invention;

[0031] FIG. 4 is a schematic diagram of a 3-dimension stereoscopic relief images produced by a recognition system according to the present invention;

[0032] FIG. 5 is a schematic diagram of a single-piece multi-frequency image sensor according to the present invention;

[0033] FIG. 6 is a spectrum diagram of image signals received by a single-piece multi-frequency image sensor according to the present invention;

[0034] FIG. 7 is a schematic diagram of a recognition system utilized in an intelligent handset according to the present invention;

[0035] FIG. 8 is a schematic diagram of an Apple iPhone X equipped to perform human face recognition according to the Prior Art; and

[0036] FIG. 9 is another spectrum diagram of image signals received by a single-piece multi-frequency image sensor according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0037] The purpose, construction, features, functions and advantages of the present invention can be appreciated and understood more thoroughly through the following detailed descriptions with reference to the attached drawings.

[0038] Refer to FIGS. 1 to 2C respectively for a perspective view of a single-piece multi-frequency infrared light-emitting-diode (LED) according to the present invention; a top view of a single-piece multi-frequency infrared light-emitting-diode (LED) according to the present invention; an equivalent circuit diagram of a single-piece multi-frequency infrared light-emitting-diode (LED) according to the present invention; and a circuit layout of a single-piece multi-frequency infrared light-emitting-diode (LED) according to the present invention.

[0039] As shown in FIGS. 1 to 2C, the present invention provides a single-piece multi-frequency infrared light-emitting-diode (LED) 1, comprising: a carrier 10; an electrical circuit board 2, enclosed by the carrier 10; a plurality of light-emitting-diodes (LEDs) 3, disposed on the electric circuit board 2, and are spaced apart from each other; a plurality of metal pins 21, disposed corresponding to and connected electrically with the plurality of light-emitting-diodes (LEDs) 3 respectively, and are extended outside the carrier 10 in protrusion; and a light emitting port 11, located on an upper portion of the carrier 10, and corresponds to the plurality of light-emitting-diodes (LEDs) 3, and it is characterized as follows.

[0040] The plurality of light-emitting-diodes (LEDs) 3 on the electrical circuit board 2 all emit infrared light, and the plurality of light-emitting-diodes (LEDs) 3 each includes a first infrared light-emitting-die 31 and a second infrared light-emitting-die 32, and the lights emitted are both between wavelength 850 nm and 1050 nm and are spaced apart.

[0041] The light emitting port 11 is of a cone shape, lights emitted by the first infrared light-emitting-die 31 and the second infrared light-emitting-die 32 are of wavelengths selected from two of the following: 850 nm, 940 nm, and 1050 nm.

[0042] A total of two infrared light-emitting-dies 31, 32 are provided on the electrical circuit board 2. The electrical circuit board 2 is cross-divided into four copper separation regions 22, and two die fixing parts 23 are disposed respectively on the two copper adjacent separation regions 22 adjacent to each other. The first infrared light-emitting-die 31 emits light of wavelength 850 nm, the second infrared light-emitting-die 32 emits light of wavelength 940 nm.

[0043] Refer to FIGS. 3 and 4 for a block diagram of a multi-frequency high-precision object recognition system according to the present invention; and a schematic diagram of a 3-dimension stereoscopic relief images produced by a recognition system according to the present invention. As shown in FIGS. 3 and 4, the present invention further provides a multi-frequency high-precision object recognition system 100, comprising: at least a multi-frequency light-emitted-unit 101 a multi-frequency image sensor unit 102, and an image calculation processing unit 103. Wherein the multi-frequency light-emitted-unit 101 emits lights of different wavelengths onto an object-to-be-tested 90, the multi-frequency image sensor unit 102 senses and fetches images of the lights of different wavelengths reflected by the object-to-be-tested 90, and transmits the images to the image calculation processing unit 103, and it is characterized as follows.

[0044] The at least a multi-frequency light-emitted-unit 101 is formed by a single-piece multi-frequency infrared light-emitting-diode (LED) 1, and the lights emitted includes at least two infrared lights, having their wavelengths each between 850 nm and 1050 nm and spaced apart. The light emitted by the first infrared light-emitting-die 31 is of wavelength 850 nm, and the light emitted by the second infrared light-emitting-die 32 is of wavelength 940 nm.

[0045] The multi-frequency image sensor unit 102 senses and fetches at least two reflected infrared lights of narrow range image signals 301 and 302, having their wavelengths between 850 nm and 940 nm and are spaced apart, and having their wavelength widths between 10 nm and 60 nm.

[0046] The image calculation processing unit 103 is adapted to dispose a single-piece planar image 91 in its X axis and its Y axis, the lights of different wavelengths in a Z axis indicate an image depth. Wherein, sample wavelength in the Z axis includes at least two infrared narrow range image signals 301, 302 having their wavelengths between 850 nm and 940 nm and spaced apart and corresponding to that of the multi-frequency image sensor unit 102, and their wavelength widths are between 10 nm and 60 nm. Then, calculate to obtain a plurality of single-piece planar images 91 in the X axis and the Y axis as sampled by different wavelength widths in the Z axis. Then, superimpose the plurality of single-piece planar images 91 into a 3-dimension stereoscopic relief image 95 for precise comparison and recognition.

[0047] Then, refer to FIGS. 5 and 6 for a schematic diagram of a single-piece multi-frequency image sensor according to the present invention; and a spectrum diagram of image signals received by a single-piece multi-frequency image sensor according to the present invention. As shown in FIGS. 3 to 6, the multi-frequency image sensor unit 102 is formed by a plurality of image sensors 502 of different frequencies or a single-piece multi-frequency image sensor 5. The single-piece multi-frequency image sensor 5 includes: a light sensing pixel array 50, a packaging circuit 51, and an image enhancing processor unit 52. The packaging circuit 51 is connected to the light sensing pixel array 50, to drive the light sensing pixel array 50 to capture outside light and convert it into a combined image signal for output, the light sensing pixel array 50 captures RGB full color visible light, and IR infrared invisible light to perform photoelectric conversion. The image enhancing processor unit 52 is embedded in the packaging circuit 51, to control and regulate image captured by the light sensing pixel array 50. The image includes: a full color RGB visible light wide range image signal 305 having its wavelength range between 400 nm and 700 nm, and at least two infrared invisible light narrow range image signals 301, 302 and having their wavelength ranges between 850 nm and 940 nm, a wavelength width for each of the two infrared invisible light narrow range image signals 301, 302 is between 10 nm and 60 nm. The full color RGB visible light wide range image signal 305 and the two infrared invisible light narrow range image signals 301, 302 are superimposed and combined, to produce a clear output image having a stereoscopic sense of a front layer and a back layer.

[0048] In the present invention, in order to achieve better recognition, the image signal formed by superimposing the wide range image signal 305 and at least two narrow range image signals 301, 302 is used, to realize clearness of layers and to give a sense of depth and layer. And this can be used to calculate precisely the 3-dimension characteristics of the object-to-be-tested 90, such as distance of depth, hand gesture, getting around an obstacle, etc. That is quite important for 3-dimension image depth and distance measurement applications, such as Virtual Reality/Augmented Reality (VR/AR), drone, people/things counting. Further, it is capable of performing depth measurements for object-to-be-tested 90 and its surroundings. As such, the technology of the present invention can also be used in the fields of Artificial Intelligence (AI), and Computer Vision. For example, the recognition system 100 can be installed in a vehicle (not shown), and is used for face recognition door opening for an automobile, or fatigue detection for a motor cyclist, but the present invention is not limited to this.

[0049] In the descriptions above, the object-to-be-tested 90 can be a human face, and that is used quite often in face recognition turn-on of a mobile device, or face recognition turn-on of an automatic payment device. The multi-frequency high-precision object recognition system of the present invention can be put on an intelligent mobile device, such as an intelligent handset or a tablet, etc., yet the present invention is not limited to this. The recognition system 100 may also be put on a desk top computer or a notebook computer.

[0050] Refer to FIG. 7 for a schematic diagram of a recognition system utilized in an intelligent handset according to the present invention. As shown in FIG. 7, in this case, all the equipment required is a single-piece multi-frequency infrared light-emitting-diode (LED) 1, a single-piece multi-frequency infrared image sensor 5, and an ambient light sensor 7. For the case that the intelligent handset is an iPhone X handset of Apple, the overall structure and design is able to achieve cost and space saving, while raising the recognition precision significantly. Further, refer to FIG. 8 for a schematic diagram of an Apple iPhone X equipped to perform human face recognition according to the Prior Art. As shown in FIG. 8, in this respect, it basically requires the following devices to achieve face recognition: an infrared lens a1, a seven-million-pixel lens a2, a flood illuminator a3, a proximity sensor a4, an ambient light sensor a5, and a dot projector a6. In addition, high precision assembly is required to achieve face recognition. The disadvantages of this design are that it requires to use quite a lot of devices to induce high cost, while it occupies a rather large space. Compared with the Prior Art, it is evident that, the present invention does have a competitive edge in the market.

[0051] Moreover, as shown in FIG. 4, in the present invention, the image enhancing processor unit 52 can be realized through a software or a firmware, to facilitate revising or increasing the amount of the narrow range image signals captured, or adjusting the transmittance of the image signal to a range between 30% and 95%. As shown in FIGS. 1 and 9, in case it is required, a third infrared light-emitting-die (not shown) can be put on the electric circuit board 2, having its light emitting wavelength of 1050 nm. As such, in fetching image signals, a narrow range image signal 303 of wavelength of 1050 nm can be added. Therefore, the image signals obtained through superimposing three narrow range image signals 301, 302, 303 having wavelengths of 850 nm, 940 nm, and 1050 nm respectively, the recognition of layers and depths can be more evident, to raise the stereoscopic sense and clearness of the overall image effectively.

[0052] In the descriptions above, only one infrared light-emitting-die is added, however, the present invention is not limited to this. In fact, the amount of infrared light-emitting-die added can be classified into various grades corresponding to different recognition precisions. As such, it can be customized to use extensively in various applications, such as security monitoring, industrial monitoring, face recognition, webcam, drone, robot, and vehicle backup auxiliary image fetching.

[0053] The above detailed description of the preferred embodiment is intended to describe more clearly the characteristics and spirit of the present invention. However, the preferred embodiments disclosed above are not intended to be any restrictions to the scope of the present invention. Conversely, its purpose is to include the various changes and equivalent arrangements which are within the scope of the appended claims.