METAL-INSULATOR-POLY CAPACITOR IN A HIGH-K METAL GATE PROCESS AND METHOD OF MANUFACTURING

Abstract

A method of forming an integrated circuit with a metal-insulator-poly (MIP) capacitor formed in a high-k metal gate (HKMG) process and the resulting device are provided. Embodiments include a device including a metal gate; a high-k dielectric layer formed around side walls of the metal gate, and a dummy polysilicon gate adjacent to at least one portion of the high-k dielectric layer. The device also includes a capacitor including the HK layer as an insulator, wherein the insulator is between a dummy as one electrode and the metal gate as another electrode.

Claims

1. A device comprising: a metal gate; a high-k dielectric layer formed around side walls of the metal gate, and a portion of a dummy polysilicon gate adjacent to at least one portion of the high-k dielectric layer, wherein the portion of the dummy polysilicon gate is preserved in a replacement metal gate process of forming the metal gate.

2. The device according to claim 1, further comprising a capacitor that includes a portion of the high-k dielectric layer as an insulator.

3. The device according to claim 2, wherein the insulator is between the polysilicon gate as one electrode and the metal gate as another electrode.

4. The device according to claim 2, wherein the capacitor has a capacitance density in the range of 5 fF/m.sup.2 to 15 fF/m.sup.2.

5. (canceled)

6. The device according to claim 1, wherein the dummy polysilicon gate has a width of 0.03 m to 0.06 m in parallel with a substrate.

7. The device according to claim 6, wherein the metal gate has a width of 0.03 m to 0.06 m in parallel with the substrate.

8. The device according to claim 6, wherein the high-k dielectric layer has a thickness of 10 to 40 in parallel with the substrate.

9. The device according to claim 3, further comprising a work function metal layer formed between the metal gate and the high-k dielectric layer.

10. The device according to claim 9, wherein the work function metal layer is formed as a part of the other electrode of the capacitor.

11. The device according to claim 9, wherein the work function metal layer has a thickness of 5 to 10 in parallel with the substrate.

12-20. (canceled)

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present disclosure is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawing and in which like reference numerals refer to similar elements and in which:

[0015] FIGS. 1A, 1C, 1E, 1G and 1I schematically illustrate sequential steps of a method of forming a MIP capacitor over a substrate in a replacement metal gate (RMG) process, in accordance with an exemplary embodiment;

[0016] FIGS. 1B, 1D, 1F, 1H and 1J schematically illustrate sequential steps of a method of forming a MIP capacitor over a shallow trench isolation (STI) region in a RMG process, in accordance with an exemplary embodiment;

[0017] FIG. 2A schematically illustrates a cross-sectional view of an MIP capacitor array, in accordance with an exemplary embodiment; and

[0018] FIG. 2B schematically illustrates a top view of the MIP capacitor array depicted in FIG. 2A, in accordance with an exemplary embodiment.

DETAILED DESCRIPTION

[0019] In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of exemplary embodiments. It should be apparent, however, that exemplary embodiments may be practiced without these specific details or with an equivalent arrangement. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring exemplary embodiments. In addition, unless otherwise indicated, all numbers expressing quantities, ratios, and numerical properties of ingredients, reaction conditions, and so forth used in the specification and claims are to be understood as being modified in all instances by the term about.

[0020] The present disclosure addresses and solves the current problems of MIM capacitors in integrated circuits. The problems are solved, inter alia, by forming a MIP capacitor in a HKMG process. Methodology in accordance with embodiments of the present disclosure includes forming a device including a metal gate formed above a substrate and a HK layer, wherein the high-k dielectric layer is formed around side walls of the metal gate, and a capacitor including the high-k dielectric layer as an insulator, wherein the insulator is sandwiched between a preserved dummy gate as one electrode and the metal gate as another electrode.

[0021] Still other aspects, features, and technical effects will be readily apparent to those skilled in this art from the following detailed description, wherein preferred embodiments are shown and described, simply by way of illustration of the best mode contemplated. The disclosure is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

[0022] FIGS. 1A, 1C, 1E, 1G and 1I schematically illustrate sequential steps of a method of forming a metal-insulator-poly (MIP) capacitor over a substrate in a RMG process in accordance with an aspect of the present disclosure. As shown in FIG. 1A, a dummy gate oxide 115 and a poly/dummy 117 are formed on substrate 111. An interlayer dielectric (ILD) 113 is formed (e.g., deposited) over poly/dummy gate 117. As illustrated in FIG. 1C, extra ILD 113 is removed via chemical mechanical planarization (CMP). Dummy gate oxide 115 can be e.g., silicon dioxide (SiO.sub.2), aluminum oxide (Al.sub.2O.sub.3), hafnium oxide (HfO.sub.2), silicon oxynitride (SiON), silicon-carbon-boron-nitrogen (SiCBN), silicon-carbon-oxynitride (SiCON), silicon carbon nitride (SiCN), or silicon boron nitride (SiBN). Dummy polysilicon gate 117 may be formed of polysilicon as at a thickness of about 400 to about 600 .

[0023] A dummy poly gate in accordance with an exemplary embodiment is provided during the manufacturing process of a transistor to define a space of a gate of the transistor via self-alignment, yet is partially preserved around side walls of the gate in the transistor. As shown in FIG. 1E, a portion of dummy gate oxide 115 and a part of dummy poly gate 117 are removed (e.g., via etching). In FIG. 1G, a high-k dielectric layer 131 and silicon (aSi) 133 are added over the structure including the remaining portion of dummy gate oxide 115 and the remaining portion of poly/dummy gate 117. High-k dielectric layer 131 may include silicon nitride (SiN), silicon-oxynitrite (SiOxNy), hafnium oxide (HfO), hafnium silicon oxide (HfSiO), hafnium aluminum oxide (HfAlO), or hafnium tantalum oxide (HfTaO). High-k dielectric layer 131 is formed around side walls of the poly/dummy gate 117.

[0024] As shown in FIG. 1I, -Si 133 is removed, for example, via wet etch by H.sub.3PO.sub.4 and a work function (WF) layer 139 (as at a thickness of about 5 to about 10 ) is formed, as by deposition, over HK layer 131, which may have a dielectric constant greater than 3.9. In one example, the WF layer 139 may be a metal material or any other suitable material. A metal gate 141 is deposited over WF layer 139 (with the remaining portion of dummy gate oxide 115 and the remaining portion of dummy polysilicon gate 117 thereunder). The resulting MIP capacitor contains HK layer 131 as an insulator (as at a thickness of about 10 to about 40 ) between metal gate 141 (as an electrode of a thickness of 400 A to 600 A) and the remaining portion of dummy poly gate 117 (as another electrode of a thickness of 400 A to 600 A). The width of the remaining portion of poly/dummy gate 117 may be 0.03 m to 0.06 m, the width of HK layer 131 may be 10 to 40 , the width of WF layer 139 may be 5 to 10 , and the width of metal gate 141 may be 0.03 m to 0.06 m in parallel with substrate 111. The thickness of the remaining portion of the poly/dummy gate 117 and a thickness of the metal gate 141 can range from 400 to 600 perpendicular to substrate 111. The resulting MIP capacitor has a capacitance density in the range of 5 fF/m.sup.2 to 15 fF/m.sup.2.

[0025] Such a MIP capacitor is applicable for high voltage (e.g., 5V) applications if the dielectric between the Metal gate and dummy poly is re-using the thicker OX ranging from 100 A200 A, which is available in process with High voltage devices.

[0026] FIGS. 1B, 1D, 1F, 1H and 1J schematically illustrate sequential steps of a method of forming a metal-insulator-poly (MIP) capacitor over a STI region in a RMG process in accordance with another aspect of the present disclosure. FIGS. 1B, 1D, 1F, 1H and 1J are the same as FIGS. 1A, 1C, 1E, 1G and 1I, except that an MIP capacitor is formed above a shallow trench isolation (STI) region 129 instead of above a substrate 121. As shown in FIG. 1B, dummy gate oxide 125 and poly/dummy 127 are formed on substrate 121. An interlayer dielectric (ILD) 123 is formed (e.g., deposited) over poly/dummy gate 127. As shown in FIG. 1D, extra ILD 123 is removed, as by chemical mechanical planarization (CMP).

[0027] As shown in FIG. 1F, a portion of dummy gate oxide 125 and a portion of poly/dummy gate 127 are removed (e.g., via etching). In FIG. 1H, HK layer 135 and silicon (-Si) 137 are added (e.g., via annealing) over structure 121 (including the remaining portion of dummy gate oxide 125 and the remaining portion of poly/dummy gate 127 there under). As shown in FIG. 1J, -Si 137 is removed, as via chemical mechanical planarization, and a work function (WF) metal 143 is deposited over HK layer 135. Metal gate 145 is deposited over WF layer 143 (with the remaining portion of dummy gate oxide 125 and the remaining portion of poly/dummy gate 127 thereunder). The resulting MIP capacitor includes HK layer 135 as an insulator between metal gate 145 (as one electrode) and the remaining portion of dummy poly gate 127 (as another electrode).

[0028] FIG. 2A schematically illustrates a cross-sectional view of an MIP capacitor array, in accordance with an exemplary embodiment. MIP capacitor array 200 includes a plurality of MIP capacitors (e.g., three) arranged to improve device density. A shallow trench isolation (STI) region 203 is formed on substrate 201. An interlayer dielectric (ILD) 205 and three sets of HKMG/MIP structures are formed over shallow trench isolation (STI) region 203. Each HKMG includes HK layer 207, a WF layer 209, and a metal gate 211. Each MIP capacitor includes metal gate 211, HK layer 207, and poly/dummy gate 215. Dummy gate oxide 213 remains between poly/dummy gate 215 and STI 203. Each metal gate 211 is connected to a conductive layer 217 via one or more through holes 221, while each poly/dummy gate 215 is connected to a conductive layer 219 via one or more through holes 223. FIG. 2B schematically illustrates a top view of the MIP capacitor array depicted in FIG. 2A.

[0029] The embodiments of the present disclosure are capable of achieving several technical effects, such as a capacitance density in the range of 5 fF/m.sup.2 to 15 fF/m.sup.2. In addition, MIP capacitors in accordance with embodiments of the present disclosure require shorter development time and fewer masks for advanced nodes, such as 7 nm nodes, than conventional MIM capacitors. Moreover, MIP capacitors in accordance with embodiments of the present disclosure are suitable for high voltage (e.g., 5V) applications by re-using thick oxide available in process with High voltage devices. Embodiments of the present disclosure enjoy utility in various industrial applications as, for example, microprocessors, smartphones, mobile phones, cellular handsets, set-top boxes, DVD recorders and players, automotive navigation, printers and peripherals, networking and telecom equipment, gaming systems, and digital cameras. The present disclosure is particularly applicable to 28 nm technology nodes and beyond.

[0030] In the preceding description, the present disclosure is described with reference to specifically exemplary embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the present disclosure, as set forth in the claims. The specification and drawings are, accordingly, to be regarded as illustrative and not as restrictive. It is understood that the present disclosure is capable of using various other combinations and embodiments and is capable of any changes or modifications within the scope of the inventive concept as expressed herein.