ELECTRONIC PACKAGE

Abstract

An electronic package includes an antenna structure and an adjustment structure arranged on a carrier structure. The antenna structure includes an antenna body and a feed line that are disposed on different layers and a conductive pillar that interconnects the layers to electrically connect the antenna body and the feed line. The adjustment structure extends from the feed line to improve the bandwidth of the antenna body.

Claims

1. An electronic package, comprising: a carrier structure; an antenna structure bonded to the carrier structure and including an antenna body, a feed line, and a conductive pillar electrically connecting the antenna body with the feed line; and an adjustment structure bonded to the carrier structure and extending from the feed line for adjusting a bandwidth of the antenna body.

2. The electronic package of claim 1, wherein the feed line has a first end as a port.

3. The electronic package of claim 2, wherein the feed line has a second end connected with the conductive pillar and the adjustment structure.

4. The electronic package of claim 1, wherein the adjustment structure and the feed line are formed on a same plane.

5. The electronic package of claim 1, wherein the adjustment structure and the feed line are formed integrally.

6. The electronic package of claim 1, wherein the adjustment structure and the feed line are composed of a same metal layer.

7. The electronic package of claim 1, wherein the adjustment structure includes a conductive wire connected with the feed line and a functional portion connected with the conductive wire.

8. The electronic package of claim 7, wherein the conductive wire has one end forking into the functional portion and an extension portion.

9. The electronic package of claim 8, wherein the functional portion is a short end stub, and the extension portion is an open end stub.

10. The electronic package of claim 1, further comprising a grounding structure bonded to the carrier structure.

11. The electronic package of claim 10, wherein the grounding structure includes a plurality of grounding layers and a plurality of conductive blind vias connected with the grounding layers.

12. The electronic package of claim 10, wherein the adjustment structure is electrically connected with the grounding structure.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] FIG. 1A is a cross-sectional schematic view of a traditional wireless communication module;

[0016] FIG. 1B is a partial top view of a traditional wireless communication module;

[0017] FIG. 2A is a cross-sectional schematic view of an electronic package in accordance with the present disclosure;

[0018] FIG. 2B is a bottom schematic plane view of FIG. 2A;

[0019] FIG. 2C is a partial schematic plane view of an interlayer of FIG. 2A; and

[0020] FIG. 2C is another embodiment of FIG. 2C.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The technical content of present disclosure is described using the following specific embodiments. One of ordinary skill in the art can readily appreciate the advantages and technical effects of the present disclosure upon reading the disclosure of this specification. It should be noted that the structures, ratios, sizes shown in the drawings appended to this specification are to be construed in conjunction with the disclosure of this specification in order to facilitate understanding of those skilled in the art. They are not meant, in any way, to limit the implementations of the present disclosure, and therefore have no substantial technical meaning. Without affecting the effects created and objectives achieved by the present disclosure, any modifications, changes or adjustments to the structures, ratio relationships or sizes, are to be construed as fall within the range covered by the technical contents disclosed herein. Meanwhile, terms, such as above, a, an, and the like, are for illustrative purposes only, and are not meant to limit the range implementable by the present disclosure. Any changes or adjustments made to their relative relationships, without modifying the substantial technical contents, are also to be construed as within the range implementable by the present disclosure.

[0022] FIGS. 2A to 2C are schematic diagrams depicting an electronic package 2 in accordance with the present disclosure. In an embodiment, the electronic package 2 is, for example, a System-in-Package (SiP) wireless communication module.

[0023] The electronic package 2 includes: a carrier structure 20, an electronic component (not shown) disposed on the carrier structure 20, an antenna structure 22, an adjustment structure 24, and a grounding structure 25.

[0024] As shown in FIG. 2A, the carrier structure 20 may be rectangular. In an embodiment, the carrier structure 20 can be, for example, a package substrate with a core layer and circuit structures or a coreless circuit structure. The carrier structure 20 includes a plurality of insulating layers 23a, 23b and 23c and a plurality of circuit layers formed on the insulating layers 23a, 23b and 23c, such as fan-out redistribution layers (RDLs).

[0025] In an embodiment, the insulating layers 23a, 23b and 23c can be made of dielectric materials, polyimide (PI), dry films, epoxy or molding compounds, etc., but the present disclosure is not limited to these.

[0026] The electronic component may be an active element, a passive element, or a combination of both. The active element can be, for example, a semiconductor chip, and the passive element can be, for example, a resistor, a capacitor or an inductor. In an embodiment, the electronic component is electrically connected with the circuit layers via a plurality of wires by wire bonding. In an embodiment, the electronic component can be disposed on the circuit layers via a plurality of conductive bumps made of solder materials in a flip-chip manner. In another embodiment, the electronic component can be in direct contact with the circuit layers. It can be appreciated that there are numerous ways of electrically connecting the electronic component with the carrier structure 20, and the present disclosure is not limited to those described above.

[0027] The antenna structure 22 is bonded to the carrier structure 20 and electrically connected with the circuit layers of the carrier structure 20. The antenna structure 22 includes an antenna body 220 disposed at the upper insulating layer 23a, a feed line 221 disposed at the lower insulating layer 23c, and a conductive pillar 222 penetrating the insulating layers 23a, 23b, and 23c for electrically connecting the antenna body 220 with the feed line 221.

[0028] In an embodiment, the antenna structure 22 can be formed by coating of a metal layer (e.g., copper material), for example, through sputtering, vaporing, electroplating or electroless plating (chemical plating). Alternatively, the antenna structure 22 can be formed by lamination or foiling.

[0029] As shown in FIG. 2C, one end of the feed line 221 is a port 221a for electrically connected with the circuit layers of the carrier structure 20, while the other end of the feed line 221 is a pad section 221b for connecting with the conductive pillar 222 and the adjustment structure 24. In an embodiment, the conductive pillar 222 extends from the pad section 221b in a longitudinal direction (perpendicular to the plane of the pad section 221b).

[0030] The adjustment structure 24 extends from the feed line 221 to be used as a stepped impedance resonator (SIR) for matching and adjustment.

[0031] In an embodiment, the adjustment structure 24 and the feed line 221 are on the same insulating layer 23b. In another embodiment, the adjustment structure 24 and the feed line 221 can be simultaneously formed as the same metal layer through a patterning process (e.g., electroplating of metal or etching of metal), or even simultaneously formed with the circuit layers of the carrier structure 20, such as a RDL process.

[0032] Furthermore, the adjustment structure 24 includes a conductive wire 240 connected with the pad section 221b and a functional portion 241 connected with the conductive wire 240. As shown in FIG. 2C, the conductive wire 240 of the adjustment structure 24 extends along the same plane as the pad section 221b, such that the other end of the conductive wire 240 forms the functional portion 241.

[0033] The grounding structure 25 is bonded to the carrier structure 20 and includes two grounding layers 25a and 25b disposed on the carrier structure 20 and a plurality of conductive blind vias 250 connected with the grounding layers 25a and 25b and arranged around the feed line 221 and the adjustment structure 24.

[0034] In an embodiment, the grounding layers 25a and 25b are isolated from each other, and arranged on two opposite sides of the insulating layers, such as on the insulating layers 23b and 23c, respectively. In another embodiment, the grounding structure 25 can be formed by coating of a metal layer (e.g., a copper material), for example, by sputtering, vaporing, electroplating or electroless plating. In yet another embodiment, these grounding layers 25a and 25b can be formed by lamination or foiling.

[0035] In an embodiment, these grounding layers 25a and 25b can selectively cover the vertical projected range of the surface region of the carrier structure 20 as needed, such as the entire surface shown in FIG. 2B, so that the its vertical projected range is larger than the vertical projected range of the antenna body 220.

[0036] As shown in FIG. 2C, the adjustment structure 24 may include an extension portion 242 connected with the conductive wire 240 in order to connect to one of the conductive blind vias 250. In an embodiment, one end of the conductive wire 240 is forked into two paths, one of which is used as the functional portion 241 or called a short end stub, and the other of which is the extension portion 242 or called an open end stub. In theory, a stepped impedance resonator with a shorted end can be seen as an equivalent structure of a capacitor and an inductor at a resonant frequency, such that the functional portion 241 and the extension portion 242 can also be seen as an equivalent structure of a capacitor and an inductor that achieves the same effect as an SIR after appropriate design adjustments.

[0037] In summary, the electronic package 2 according to the present disclosure improves the bandwidth of the antenna body 220 and its practicality by providing the adjustment structure 24 that extends from the feed line 221.

[0038] In an embodiment, the adjustment structure 24 extending from the feed line 221 is configured such that the adjustment structure 24 and the feed line 221 are formed on the same insulating layer 23b, and that the adjustment structure 24 and the feed line 221 can be formed simultaneously and integrally. Therefore, compared to the traditional design where the adjustment structure is provided on top of the antenna body, the electronic package according to the present disclosure is capable of manufacturing the adjustment structure 24 without any additional manufacturing steps, thereby improving yield, reducing cost and thickness of the overall structure of the electronic package 2.

[0039] The above embodiments are only set forth to illustrate the principles of the present disclosure, and should not be interpreted as to limit the present disclosure in any way. The above embodiments can be modified by one of ordinary skill in the art without departing from the scope of the present disclosure as defined in the appended claims.