SEMICONDUCTOR MODULE COMPRISING A FIRST AND SECOND CONNECTING ELEMENT FOR CONNECTING A SEMICONDUCTOR CHIP, AND ALSO PRODUCTION METHOD

Abstract

A semiconductor module includes a substrate, a semiconductor chip arranged on the substrate, and a first connecting element for electrically connecting the semiconductor chip to a conductor track and/or to a further component of the semiconductor module. At least part of the first connecting element lies in surface contact with the semiconductor chip and the substrate and also the conductor track and/or the further component. The semiconductor module includes a second connecting element for electrically connecting the semiconductor chip to the conductor track and/or to the further component. The second connecting element is configured in the form of a wire or a strip,

Claims

1.-9. (canceled)

10. A semiconductor module, comprising: a substrate; a semiconductor chip arranged on the substrate; a first connecting element configured to electrically connect the semiconductor chip to a further semiconductor chip of the semiconductor module, at least part of the first connecting element lying in surface contact with the semiconductor chip and the substrate and the further semiconductor chip, said first connecting element comprising an electrically insulating film and a metal layer applied to the film; and a second connecting element configured to electrically connect the semiconductor chip to the further semiconductor chip, said second connecting element being in the form of a wire.

11. The semiconductor module of claim 10, wherein the first connecting element has a side facings away from the semiconductor chip, said second connecting element being arranged on said side of the first connecting element.

12. The semiconductor module of claim 10, wherein the first connecting element is formed flexibly.

13. The semiconductor module of claim 10, wherein at least part of the second connecting element has a predetermined curvature.

14. The semiconductor module of claim 10, further comprising an insulating element arranged between the semiconductor chip and the first connecting element.

15. The semiconductor module of claim 10, wherein the substrate has a side facing away from the semiconductor chip, and further comprising a baseplate connected to the substrate on said side of the substrate.

16. A method for producing a semiconductor module, comprising: arranging a semiconductor chip on a substrate; applying a metal layer to an electrically insulating film for establishing a first connecting element: electrically connecting by the first connecting element the semiconductor chip to a further semiconductor chip of the semiconductor module such that at least part of the first connecting element lies in surface contact with the semiconductor chip and the substrate and the further semiconductor chip; and electrically connecting the semiconductor chip to the further semiconductor chip by a second connecting element in the form of a wire.

17. The method of claim 16, wherein initially at least part of the first connecting element is applied to the semiconductor chip and the substrate and the further semiconductor chip, and then at least part of the second connecting element is applied to the first connecting element.

18. The method of claim 16, wherein the metal layer is applied to the electrically insulating film by sintering, soldering and/or electroplating.

Description

[0024] The invention is now explained in more detail with reference to preferred exemplary embodiments and with reference to the attached drawings, which show:

[0025] FIG. 1: a semiconductor module according to the prior art in a first embodiment;

[0026] FIG. 2: a semiconductor module according to the prior art in a further embodiment; and

[0027] FIG. 3: a semiconductor module according to an embodiment of the present invention.

[0028] In the figures, elements which are the same or have the same functions are given the same reference characters.

[0029] FIG. 1 shows a semiconductor module 1 according to the prior art in a first embodiment. Herein, the semiconductor module 1 is shown in a sectional side view. The semiconductor module 1 comprises a substrate 2 formed from an electrically insulating material. For example, the substrate 2 can be formed from a ceramic. Furthermore, the semiconductor module comprises 1 a baseplate 3, connected to an underside 4 of the substrate 2. The baseplate 3 can be formed of a metal. Located on an upper side 5 of the substrate 2, there is a semiconductor chip 6. The semiconductor chip 6 can also be referred to in the plural. Moreover, a conductor track 7 is located on the upper side 5 of the substrate 2. Herein, the semiconductor chip 6 is electrically connected to the conductor track by means of a bonding wire 8. Herein, the bonding wire 8 is arranged on an upper side 9 of the semiconductor chip 6. The semiconductor chip 6 can also be electrically connected to a conductive layer on its underside. The semiconductor chip 6 can be connected to a further component, or activate the same, by this conductive layer.

[0030] FIG. 2 shows a semiconductor module 1 according to the prior art in a further embodiment. Compared to the semiconductor module 1 in FIG. 1, the semiconductor chip 6 and the conductor track 7 are connected to one another by a flexible connecting element 10. This flexible connecting element 10 lies in surface contact with the semiconductor chip 6, the substrate 2 and the conductor track 7. The connecting element 10 can, for example, be provided in that that a film is applied to the conductor track 7, the substrate 2 and the semiconductor chip 6. This film can then be structured accordingly. Then, a metal layer can be applied to the structured film. It can also be provided that the connecting element 10 is applied in the form of a flexible electrically conductive plate, which is applied to the conductor track 7, the substrate 2 and the semiconductor chip 6. Moreover, insulating elements 11 are provided, which are arranged between the semiconductor chip 6 and the connecting element 10. These insulating elements 11 are used for edge insulation.

[0031] FIG. 3 shows a semiconductor module 1 according to an embodiment of the invention. Herein, the semiconductor module comprises a first connecting element 12 similar to the connecting element 11 shown in FIG. 2. Herein, the first connecting element 12 has a lower layer thickness than the connecting element 11. In addition, the semiconductor module 1 comprises a second connecting element 13, which in the present case is in the form of a bonding wire 8. It can also be provided that the second connecting element 13 is in the form of a strip. Herein, the second connecting element is applied to an upper side 14 of the first connecting element 12.

[0032] Thus, the second connecting element 13 or the bonding wire 8 represents a parallel current path above the flexible plate or the first connecting element 12. Herein, the first connecting element 12 forms a low-inductance commutation path, which provides for frictionless commutation in the semiconductor chip 6. The second connecting element 13 or the bonding wire 6 can increase the current-carrying capacity. Thus, a reliable and robust electrical connection can be provided between the semiconductor chip 6 and the conductor track 7. This connection can also be used to connect the semiconductor chip 6 to further components of the semiconductor module 1.