Hybrid power supply circuit, use of a hybrid power supply circuit and method for producing a hybrid power supply circuit

Abstract

A hybrid power supply circuit, a method using a hybrid power supply circuit and method for producing a hybrid power supply circuit are disclosed. In an embodiment a hybrid power-supply circuit includes a first energy-storage device and a second energy-storage device, wherein the first and second energy-storage devices are combined in a module and electrically interconnected, and wherein the first energy-storage device is a solid-state accumulator.

Claims

1. A hybrid power-supply circuit comprising: a first energy-storage device; a second energy-storage device, wherein the first and second energy-storage devices are combined in a module and electrically interconnected, wherein the first energy-storage device is a solid-state accumulator, wherein the second energy-storage device is a ceramic capacitor, a multilayer capacitor, a multilayer ceramic capacitor or a double-layer capacitor, wherein the first energy-storage device is a first SMD component and the second energy-storage device is a second SMD component, wherein the first and second SMD components are arranged one above the other or side by side, and wherein the first energy-storage device and the second energy-storage device are integrated monolithically as a multilayer system; and a varistor and/or a Zener diode configured to limit a voltage to a minimum value, wherein the hybrid power supply circuit is configured to supply power to an RF transmitter, an RF receiver and/or an RF transceiver, and wherein the solid-state accumulator is suitable for reflow.

2. The power-supply circuit according to claim 1, further comprising an ASIC chip configured to control or regulate a charging process or discharging process.

3. The power-supply circuit according to claim 1, wherein the varistor and/or the Zener diode is configured to limit a voltage to a maximum value.

4. The power-supply circuit according to claim 1, wherein the first energy-storage device and the second energy-storage device are directly soldered together.

5. The power-supply circuit according to claim 1, wherein the solid-state accumulator comprises materials that are compatible with a co-firing process.

6. A method for producing a hybrid power-supply circuit, the method comprising: combining of a capacitor and a solid-state accumulator in a compact module, wherein the capacitor is a ceramic capacitor, a multilayer capacitor, a multilayer ceramic capacitor or a double-layer capacitor, wherein the solid-state accumulator is a first SMD component and the capacitor is a second SMD component, wherein the first and second SMD components are arranged one above the other or side by side, and wherein the solid-state accumulator and the capacitor are integrated monolithically as a multilayer system; and further combining a varistor and/or a Zener diode into the compact module, the varistor and/or the Zener diode being configured to limit a voltage to a minimum value, wherein the hybrid power supply circuit is configured to supply power to an RF transmitter, an RF receiver and/or an RF transceiver, and wherein the solid-state accumulator is suitable for reflow.

7. The method according to claim 6, further comprising merging a layer system for the capacitor and a layer system for the solid-state accumulator in a multilayer process to form a monolithic module.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Important functional principles and details of preferred embodiments are elucidated in greater detail in the schematic figures:

(2) FIG. 1 shows an equivalent circuit diagram of a hybrid power-supply circuit;

(3) FIG. 2 shows a possible arrangement of the energy-storage devices side by side;

(4) FIG. 3 shows a possible arrangement of the energy-storage devices one above the other;

(5) FIG. 4 shows the use of a varistor;

(6) FIG. 5 shows the use of an ASIC;

(7) FIG. 6 shows a cross-section through a corresponding component;

(8) FIG. 7 shows a cross-section through an alternative embodiment of the component;

(9) FIG. 8 shows a perspectival view of a multilayer component;

(10) FIG. 9 shows a possible interconnection with an external circuit; and

(11) FIG. 10 shows a possible interconnection with a charging circuit.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

(12) FIG. 1 shows an equivalent circuit diagram of a hybrid power-supply circuit HEVS which exhibits a first energy-storage device ES1 and a second energy-storage device ES2. The first energy-storage device ES1 and the second energy-storage device ES2 have been interconnected parallel to one another. Both energy-storage devices have been interconnected a first terminal A1 and with a second terminal A2. Via the two terminals A1, A2 the hybrid power-supply circuit can deliver electrical energy to an external circuit environment or accept electrical energy from an external circuit environment.

(13) The first energy-storage device ES1 is a solid-state accumulator. The second energy-storage device ES2 is preferentially a capacitor.

(14) Both the first energy-storage device ES1 and the second energy-storage device ES2 may preferentially exhibit as multilayer component with electrode layers as structured elements in metallization layers and with dielectric layers or electrolytic layers arranged in between in the case of the accumulator.

(15) FIG. 2 shows a possible side-by-side arrangement of the first energy-storage device ES1 relative to the second energy-storage device ES2. It is preferred to arrange the energy-storage devices relative to one another in such a way that a structure is obtained that is overall as small as possible. Both the first energy-storage device and the second energy-storage device are preferentially multilayer components with a planar structure, in which the width and the depth may each be distinctly greater than the height.

(16) FIG. 3 shows a possible arrangement of the two energy-storage devices one above the other.

(17) Particularly when the two energy-storage devices have been realized as planar components, it is advantageous to arrange the two components one above the other.

(18) In this way, both the first energy-storage device ES1 and the second energy-storage device ES2 can be manufactured as individual components with SMD capability. Subsequently they can be arranged one above the other and soldered together and thereby interconnected in an electrically conducting manner and firmly connected mechanically.

(19) FIG. 4 shows a possible equivalent circuit diagram of a hybrid power-supply circuit HEVS in which a varistor V has been interconnected parallel to the first energy-storage device ES1 and parallel to the second energy-storage device ES2. The varistor constitutes a protection against overcharging when the power-supply circuit is being charged via the terminals A1, A2.

(20) Brief voltage spikes or charge spikes can be easily intercepted by the second energy-storage device ES2.

(21) FIG. 5 shows the use of an ASIC (application-specific integrated circuit). The ASIC has been connected to the energy-storage devices and to the two terminals A1, A2 and can be utilized for controlling the process of charging or the process of discharging.

(22) The ASIC may have been embedded in an ASIC chip and designed to have an energy consumption that is as low as possible—that is to say, to operate in as energy-efficient a manner as possible.

(23) FIG. 6 shows a cross-section through a component in which the first energy-storage device ES1 and the second energy-storage device ES2 have been embedded in a carrier substrate TS. An ASIC chip has been arranged on the upper side of the carrier substrate. Further circuit elements SE may have been embedded in the carrier substrate. The various components may have been interconnected via metallized signal lines in the carrier substrate or on the upper side of the carrier substrate and by virtue of through-connections through the carrier substrate.

(24) Alternatively, it is also possible that the first and/or the second energy-storage device or further circuit elements has/have been arranged on the upper side of the carrier substrate TS and interconnected.

(25) FIG. 7 shows, in a cross-section, the possibility of integrating the components of the first energy-storage device ES1 and the components of the second energy-storage device ES2 monolithically in a carrier substrate TS.

(26) By way of carrier substrate in this case, in particular a ceramic multilayer substrate, for example an LTCC substrate or an HTCC substrate, may enter into consideration.

(27) FIG. 8 shows a basic structure of a multilayer component in a perspectival view of an element that has been cut open for better visualization and that, for example, may represent the first energy-storage device ES1 or the second energy-storage device ES2. Metallization layers ML have been arranged in a dielectric material DM. The metallization layers ML make material available for structured electrode layers. The electrode layers have been arranged one above the other. Adjacent electrode layers have been connected and interconnected with respectively opposing electrodes EL1, EL2 as external electrodes.

(28) FIG. 9 shows the possibility of supplying external circuits or external circuit environments ES with electrical energy via the two terminals A1, A2. A continuous permanent load can be dealt with substantially by the first energy-storage device ES1. Additional loads that necessitate a high power can be handled by the second energy-storage device ES2.

(29) FIG. 10 shows the possibility of supplying the energy-storage devices with electrical energy via a charging circuit LS via the terminals A1 and A2. The charging circuit may include thermal, photovoltaic or piezoelectric generators. The second energy-storage device ES2 helps for the purpose of accommodating an irregular charging current.

(30) The external circuit may include, for instance, a transceiver RXTX and an antenna ANT, in order to communicate with an external radio environment.

(31) The hybrid power-supply circuit is not restricted to the details of the embodiments that are shown; it may exhibit further circuit elements, such as further energy-storage devices, further integrated circuits and further switches, as well as further terminals.