Component with component reinforcement and feedthrough
10454079 ยท 2019-10-22
Assignee
Inventors
Cpc classification
Y02E60/10
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y02E60/13
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01M50/186
ELECTRICITY
International classification
H01G11/82
ELECTRICITY
Abstract
A component has a component thickness and at least one feedthrough opening, wherein a conductor, such as a substantially pin-shaped conductor, is inserted through the feedthrough opening in a glass or glass ceramic material having a glass material outside dimension and a glazed length, wherein the component has a reinforcement in the region of the feedthrough opening with a component feedthrough opening thickness, wherein the component feedthrough opening thickness is greater than the component thickness and wherein the reinforcement has a reinforcement material outside dimension.
Claims
1. A device, comprising: a component having a component thickness and at least one feedthrough opening and defining a region of said feedthrough opening, said component having a reinforcement in said region that has a component feedthrough opening thickness that is greater than said component thickness and a single reinforcement material outside dimension; and a conductor inserted through said feedthrough opening in one of a glass material and a glass ceramic material having a glass material outside dimension and a glazed length and wherein said one of said glass material and said glass ceramic material contacts said component at said at least one feedthrough opening, wherein said single reinforcement material outside dimension is in a range of 1.2 to 2.2 times said glass material outside dimension.
2. The device according to claim 1, wherein said conductor is a substantially pin-shaped conductor.
3. The device according to claim 1, wherein said component feedthrough opening thickness of said reinforcement is consistent with said glazed length.
4. The device according to claim 1, wherein said component comprises a base body having said component thickness and a separate reinforcement component having a reinforcement component thickness, said reinforcement component thickness and said component thickness adding up to equal said component feedthrough opening thickness.
5. The device according to claim 1, wherein said component comprises a base body having said component thickness and a reinforcement component forming a single component with said base body, wherein said component feedthrough opening thickness is provided in said region of said component feedthrough opening.
6. The device according to claim 1, wherein said glazing length is greater than 1.5 mm.
7. The device according to claim 1, wherein said glazing length is in a range of 1.5 mm to 8 mm.
8. The device according to claim 1, wherein said component thickness is at least as large as said glazing length.
9. The device according to claim 8, wherein said component thickness is equal to said glazing length plus 2 mm.
10. The device according to claim 9, wherein said component thickness is in a range of 3.5 mm to 10 mm.
11. The device according to claim 1, wherein said component includes at least partially a light metal having at least one of a specific weight of <5 kg/dm.sup.3, a melting point in a range of 350 C. to 800 C., an electric conductivity in a range of 5.Math.10.sup.6 S/m to 50.Math.10.sup.6 S/m, and a coefficient of expansion (20 C. to 300 C.) in a range of 18.Math.10.sup.6 / K to 30.Math.10.sup.6 / K.
12. The device according to claim 11, wherein said light metal is one of aluminum, an aluminum alloy, magnesium, a magnesium alloy, titanium or a titanium alloy.
13. The device according to claim 1, wherein said device is a housing.
14. The device according to claim 13, wherein said housing is a part of at least one of an electric storage device, a battery, and a capacitor.
15. The device according to claim 1, wherein said component forms a housing cover.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The above-mentioned and other features and advantages of this invention, and the manner of attaining them, will become more apparent and the invention will be better understood by reference to the following description of embodiments of the invention taken in conjunction with the accompanying drawings, wherein:
(2)
(3)
(4)
(5) Corresponding reference characters indicate corresponding parts throughout the several views. The exemplifications set out herein illustrate embodiments of the invention and such exemplifications are not to be construed as limiting the scope of the invention in any manner.
DETAILED DESCRIPTION OF THE INVENTION
(6)
(7) Conductors 7.1, 7.2, shown as pins, are fed through feedthrough openings 3.1, 3.2 in a glass material 9.1, 9.2.
(8) The thickness of the component is BD, the component feedthrough opening thickness is BDD and the thickness of the separate reinforcement components 10.1, 10.2 is VD.
(9) As seen in
(10) The outside dimension of glass material 9.1, 9.2 is GA. With a circular or oval glass material, this is consistent with the diameter of the glass plug.
(11) The reinforcement material outside dimensions VA, of the separate reinforcement component, which can be circular or annular, are 1.2-times the outside dimensions GA of the glass material. In other words, with circular or, respectively, round glass plugs and circular or, respectively, round reinforcement material, the diameter of the reinforcement material is at least 1.2-times the diameter of the glass material.
(12) Also shown in
(13) It is also possible that the glazing length EL is shorter than the component thickness BD, but not vice versa.
(14) As material for base body 20 that represents primarily a housing component, such as a cover part, for example for a storage device such as a battery, a light metal having a specific weight of <5 kg/dm3 and/or a melting point in the range of 350 C. to 800 C. and/or an electric conductivity in the range of 5.Math.10.sup.6S/m to 50.Math.10.sup.6 S/m and/or a coefficient of expansion a (20 C. to 300 C.) in the range of 18.Math.10.sup.6/K to 30.Math.10.sup.6/K can be used. The light metals can be aluminum, aluminum alloys, magnesium, magnesium alloys. The material of conductor pins 7.1, 7.2 can be a metal, such as copper, Cusic, a copper alloy, ASC, silver, a silver alloy, gold or a gold alloy or also aluminum or an aluminum alloy.
(15) As a glass material for glazing 9.2, a phosphate glass can be used, with one such glass described in WO 2012/110247 whose disclosure content is included in its entirety by reference.
(16)
(17) The component is again identified with 1, however, in contrast to
(18) Thickness BDD is always greater than thickness BD of the component. Due to forming by deep drawing and subsequent upsetting, the shape of reinforcement illustrated in
(19) With a thickness BDD, the thickness of the upset reinforced region is also greater than thickness BD of the base material. The width of the upset reinforced region is identified with SBD.
(20) The treatment in the region of the reinforcement can be made visible, since the structure flow lines, in contrast to a component treated in a machining process, in the region of the upsetting treatment are bent by the forming process.
(21) An additional alternative arrangement according to the present invention is illustrated in
(22) The component is again identified with 1. Identical components as in
(23) The thickness of the reinforced region with a thickness of approximately 2BD is greater than the thickness of the base material BD. Instead of the single fold, a multiple fold, for example a 3-time or 4-time fold, is also possible in order to adjust the thickness in the region of the reinforcement.
(24) The treatment in the region of the reinforcement can be made visible since the structure flow lines, in contrast to a component treated in a machining process, in the region of the upsetting treatment or, respectively, folding are bent by the forming process.
(25) The material of the component, in other words of the base body including the reinforcement region, can be a light metal as already described for the base body in
(26) The second and third alternative that are previously described do not require the attachment of an additional component, namely the reinforcement ring.
(27) Glass materials that include the following components in mol-% can be used:
(28) TABLE-US-00001 P.sub.2O.sub.5 35-50 mol-%, such as 39-48 mol-% Al.sub.2O.sub.3 0-14 mol-%, such as 2-12 mol-% B.sub.2O.sub.3 2-10 mol-%, such as 4-8 mol-% Na.sub.2O 0-30 mol-%, such as 0-20 mol-% M.sub.2O 0-20 mol-%, such as 12-20 mol-%, where M can be K, Cs, or Rb PbO 0-10 mol-%, such as 0-9 mol-% Li.sub.2O 0-45 mol-%, such as 0-40 mol-%, or 17-40 mol-% BaO 0-20 mol-%, such as 5-20 mol-% Bi.sub.2O.sub.3 0-10 mol-%, such as 1-5 mol-%, or 2-5 mol-%
(29) The glass material can be composed such that it has a coefficient of expansion a in the range of 20 C. to 300 C.13.Math.10.sup.6/K that can be 13.Math.10.sup.6/K to 25.Math.10.sup.6/K.
(30) The invention provides a thin housing component, such as for a housing of a storage device, that has a very thin material thickness BDD and thus a low weight and large cell volume, as well as a hermitically sealed glazing having a glazing length EL in the region of the feedthrough opening for the conductors.
(31) In particular, it is possible to also provide sufficient compression for a hermetically sealed feedthrough due to a forming process, even in the case of a single-part component.
(32) On the one hand, the necessary mechanical strength with thin materials that are utilized in housings, for examples as lids, is increased and, on the other hand, provides the necessary pressures or respectively radial forces for the hermetically sealed glazing.
(33) While this invention has been described with respect to at least one embodiment, the present invention can be further modified within the spirit and scope of this disclosure. This application is therefore intended to cover any variations, uses, or adaptations of the invention using its general principles. Further, this application is intended to cover such departures from the present disclosure as come within known or customary practice in the art to which this invention pertains and which fall within the limits of the appended claims.