Semiconductor structure having a single or multiple layer porous graphene film and the fabrication method thereof

Abstract

A semiconductor structure having a multiple-porous graphene layer includes a sapphire substrate, a single or multiple layer porous graphene film, and a gallium nitride layer. A fabrication method for forming the semiconductor structure having a single or multiple layer porous graphene film, includes: firstly, growing up the graphene on the copper foil; then, using the acetone and isopropyl alcohol to wash the sapphire substrate, and then using the nitrogen flow to dry up; transferring the graphene onto the semiconductor substrate, using the Poly(methyl methacrylate) to fix the single or multiple layer porous graphene film, and using the acetone to wash up; using the photolithography process to etch the whole surface of the multiple-porous graphene layer; and, using the metalorganic chemical vapor deposition to deposit gallium nitride on the single or multiple layer porous graphene film and the sapphire substrate.

Claims

1. A semiconductor structure having a single-layer porous graphene film with a thickness of about 0.34 nm, formed by a low pressure chemical vapor deposition (LPCVD) and a metalorganic chemical vapor deposition (MOCVD), comprising: a sapphire substrate; wherein said single-layer porous graphene film having the thickness of about 0.34 nm is provided on said sapphire substrate, said single-layer porous graphene film being formed on a metal foil by the low pressure chemical vapor deposition (LPCVD) at 900 C. to 1100 C. via passing through methane (CH.sub.4) and hydrogen (H.sub.2), wherein said metal foil is selected from a group consisting of a Cu foil or Ni foil; and wherein a gallium nitride layer is formed on said single-layer porous graphene film, said gallium nitride being deposited on said single-layer porous graphene film and said sapphire substrate by using the metalorganic chemical vapor deposition (MOCVD) at 900 C. to 1100 C.

2. A semiconductor structure having a two-layer porous graphene film with a thickness of about 0.7 nm, formed by a low pressure chemical vapor deposition (LPCVD) and a metalorganic chemical vapor deposition (MOCVD), comprising: a sapphire substrate; said two-layer porous graphene film having the thickness of about 0.7 nm is provided on said sapphire substrate, said two-layer porous graphene film being formed on a metal foil by the low pressure chemical vapor deposition (LPCVD) at 900 C. to 1100 C. via passing through methane (CH.sub.4) and hydrogen (H.sub.2), wherein said metal foil is selected from a group consisting of a Cu foil or Ni foil; and wherein a gallium nitride layer is formed on said two-layer porous graphene film, said gallium nitride being deposited on said two-layer porous graphene film and said sapphire substrate by using the metalorganic chemical vapor deposition (MOCVD) at 900 C. to 1100 C.

3. A semiconductor structure having a three-layer porous graphene film with a thickness of about 1 nm, formed by a low pressure chemical vapor deposition (LPCVD) and a metalorganic chemical vapor deposition (MOCVD), comprising: a sapphire substrate; said three-layer porous graphene film having the thickness of about 1 nm is provided on said sapphire substrate, said three-layer porous graphene film being formed on a metal foil by the low pressure chemical vapor deposition (LPCVD) at 900 C. to 1100 C. via passing through methane (CH.sub.4) and hydrogen (H.sub.2), wherein said metal foil is selected from a group consisting of a Cu foil or Ni foil; and wherein a gallium nitride layer is formed on said three-layer porous graphene film, said gallium nitride being deposited on said three-layer porous graphene film and said sapphire substrate by using the metalorganic chemical vapor deposition (MOCVD) at 900 C. to 1100 C.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The foregoing aspects and many of the attendant advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:

(2) FIG. 1 illustrates the cross-sectional diagram for a semiconductor structure having a multi-layer porous graphene film of the present invention;

(3) FIG. 2 illustrates the flow diagram for the fabrication method for forming the semiconductor structure having a multi-layer porous graphene film of an embodiment of the present invention; and

(4) FIG. 3 illustrates the X-ray diffraction result of the present invention, which shows that the fabrication method of forming a porous graphene buffer film yields x-ray diffraction results that match those of a conventional structure without the graphene buffer layer.

DESCRIPTION OF THE PREFERRED EMBODIMENT

(5) The attached figures should be used to describe the implement way of the present invention. In the figures, the same element symbol is used to represent the same element, in order to describe the element more clearly, its size or thickness might be scaled.

(6) Please refer to FIG. 1 that illustrates the cross-sectional diagram for a sapphire structure 101 having a multi-layer porous graphene film 102 of the present invention. FIG. 1 shows the sapphire substrate 101, herein after the silicon sapphire substrate 101 can also be used. The single or multi-layer porous graphene film 102 is formed on the sapphire substrate 101. The gallium nitride layer 103 is formed on the single or multi-layer porous graphene film 102, wherein when the porous graphene film 102 is a single-layer porous graphene film, the thickness of the multi-layer porous graphene film 102 is 0.345 nm.

(7) FIG. 2 illustrates that the flow diagram for a fabrication method for forming the semiconductor structure having a multi-layer porous graphene film 102 of an embodiment of the present invention. As shown in Step 201 of FIG. 2, firstly, growing up the graphene on the metal foil by the Low Pressure chemical vapor deposition (LPCVD) at 900 C. to 1100 C., preferably at 1000 C. via passing through the methane (CH.sub.4) and hydrogen (H.sub.2) as the precursor, wherein, the metal foil might be Cu foil or Ni foil.

(8) As shown in Step 202 of FIG. 2, using the acetone and isopropyl alcohol (IPA) to wash the sapphire substrate 101, and then using the nitrogen flow to dry up.

(9) As shown in Step 203 of FIG. 2, transferring the abovementioned graphene onto the sapphire substrate 101 to become the multi-layer porous graphene film 102, using the ferric chloride as the copper etchant to etch the copper foil, using the Poly(methyl methacrylate to fix the multi-layer porous graphene film 102, and using the acetone to wash up.

(10) As shown in Step 204 of FIG. 2, using the photolithography process to etch the whole surface of the multi-layer porous graphene film 102 to form about 50 g m pores for follow-up GaN growth. The thickness of the multi-layer porous graphene film 102 here is about the thickness of a single-layer porous graphene film 102, which is about 0.3 nm to 0.4 nm (better thickness is about 0.345 nm). The present invention normally can form one layer, two layers, three layers, and multiple layers of the multi-layer porous graphene film 102 structure. For instance, when the single-layer porous graphene film 102 is formed, the thickness is about 0.3 nm to 0.4 nm. When the two-layer porous graphene film 102 is formed, the thickness is about 0.6 nm to 0.8 nm. When the three-layer porous graphene film 102 is formed, the thickness is about 1 nm to 2 nm. When the multi-layer porous graphene film 102 are formed, the thickness will be depended on the number of layers.

(11) Finally, as shown in Step 205 of FIG. 2, about 4 m gallium nitride layer 103 is deposited on the multi-layer porous graphene film 102 and the sapphire substrate 101 by the MOCVD under at 900 C. to 1100 C., preferably at 1000 C.

(12) FIG. 3 shows that the X-ray diffraction results of the present method for forming the semiconductor structure having a porous graphene buffer film 102 match those of a semiconductor structure without the graphene buffer film, verifying that the present fabrication method is practical. The multiple-porous graphene buffer layer comprises but not limited to single layer or multiple layers.

(13) The graphene of the present invention has very high thermal conductivity, except there is the advantage of easy heat dissipation, and it can be extensively applied in the fields of LED, solar cell, and high-electron-mobility transistor (HEMT) etc. In addition, what is worth mentioning, another advantage of the present invention is because the multi-layer porous graphene film is quite transparent, thus, when the sandwich structure is made, light still can transport out along the multi-layer porous graphene film, remain the light emitting effect of LED constantly.

(14) The present invention uses the multi-layer porous graphene film as buffer layer, which is formed between the gallium nitride 103 and the sapphire substrate 101, to increase the quality of gallium nitride epilayer. Due to high thermal conductivity of multi-layer porous graphene film 102 itself, it the graphene film 102 can significantly contribute to the heat dissipation efficiency of the gallium nitride 103 and the sapphire substrate 101. And because the present invention has very high thermal conductivity, it can reduce the defect density caused by lattice mismatch, and the lattice defect caused by different thermal expansion coefficient. Therefore, the light emitting efficiency of gallium nitride light emitting diode (LED) can be increased effectively.

(15) It is understood that various other modifications will be apparent to and can be readily made by those skilled in the art without departing from the scope and spirit of this invention. Accordingly, it is not intended that the scope of the claims appended hereto be limited to the description as set forth herein, but rather that the claims be construed as encompassing all the features of patentable novelty that reside in the present invention, including all features that would be treated as equivalents thereof by those skilled in the art to which this invention pertains.