Organic electronic device

Abstract

The present application relates to an organic electronic device, a method for preparing same, and a lighting apparatus and a display device comprising same. The present application enables an organic electronic device to show excellent moisture-blocking properties and have flexibility as well as excellent and reliable durability at high temperature and high humidity.

Claims

1. An organic electronic device comprising a substrate in which an organic electronic element is formed on a first surface of said substrate and an adhesive layer formed on a second surface of said substrate and comprising a polymer derived from butylene and a curable oligomer.

2. The organic electronic device according to claim 1, wherein the polymer derived from butylene is a homopolymer of a butylene monomer; a copolymer obtained by copolymerizing another monomer polymerizable with a butylene monomer; a reactive oligomer using a butylene monomer; or a mixture thereof.

3. The organic electronic device according to claim 2, wherein another monomer polymerizable with a butylene monomer is isoprene, styrene or butadiene.

4. The organic electronic device according to claim 2, wherein the reactive oligomer using a butylene monomer comprises a butylene polymer having a reactive functional group, and said butylene polymer is associated with another polymer having a reactive functional group.

5. The organic electronic device according to claim 1, wherein the polymer derived from butylene has a weight average molecular weight in a range of 10,000 to 2,000,000.

6. The organic electronic device according to claim 1, wherein the curable oligomer is a hydrogenated compound.

7. The organic electronic device according to claim 1, wherein the curable oligomer is an aromatic compound.

8. The organic electronic device according to claim 1, wherein the curable oligomer has a weight average molecular weight in a range of 400 to 10,000.

9. The organic electronic device according to claim 1, wherein the curable oligomer is a hydrogenated aromatic epoxy compound.

10. The organic electronic device according to claim 1, wherein the curable oligomer has an epoxy equivalent in a range of 100 to 1500 g/eq.

11. The organic electronic device according to claim 1, wherein the curable oligomer is included in an amount of 15 to 100 parts by weight, relative to 100 parts by weight of the polymer derived from butylene.

12. The organic electronic device according to claim 1, further comprising a curable monomer.

13. The organic electronic device according to claim 12, wherein the curable monomer has a weight average molecular weight of less than 400.

14. The organic electronic device according to claim 12, wherein the curable monomer has a cyclic structure in which ring constituent atoms in the molecular structure are in a range of 3 to 10.

15. The organic electronic device according to claim 12, wherein the curable monomer is included in an amount of 20 to 80 parts by weight, relative to 100 parts by weight of the polymer derived from butylene.

16. The organic electronic device according to claim 12, wherein the curable monomer and the curable oligomer are included in ratios of 10 to 50 parts by weight and 20 to 70 parts by weight, respectively.

17. The organic electronic device according to claim 1, wherein the adhesive layer comprises no tackifier.

18. The organic electronic device according to claim 1, wherein the adhesive layer has a storage elastic modulus, as measured in conditions of a temperature of 25 C., a strain of 5% and a frequency of 1 Hz after curing, in a range of 10.sup.5 Pa to 10.sup.9 Pa.

19. The organic electronic device according to claim 1, comprising at least one folding portion satisfying Equation 1 below:
X10%[Equation 1] wherein, X is a luminance change rate before and after a folding test in which a process of folding the folding portion of said organic electronic device to a curvature radius of 1 R (1 mm) at a temperature of 25 C. and a relative humidity of 50%, is repeated 100,000 times.

20. The organic electronic device according to claim 1, further comprising an encapsulating layer covering the entire surface of the organic electronic element.

21. A method for manufacturing the organic electronic device according to claim 1, comprising steps of forming the adhesive layer comprising a polymer derived from butylene and a curable oligomer on a second surface of said substrate, forming an organic electronic element on a first surface of said substrate, and curing said adhesive layer.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIGS. 1 and 2 are cross-sectional views illustrating exemplary organic electronic devices.

EXPLANATION OF REFERENCE NUMERALS

(2) 1: substrate 2: organic electronic element 3: adhesive layer or adhesive film 4: encapsulation layer 5: cover substrate

BEST MODE

(3) Hereinafter, the present invention will be described in more detail with reference to Examples complying with the present invention and Comparative Examples not complying with the present invention, but the scope of the present invention is not limited by the following examples.

Example 1

(4) A styrene-isobutylene copolymer (SIBS 102T, Mw: 100,000, Kaneka) as a polymer derived from butylene, a hydrogenated bisphenol A epoxy resin (YX8000, epoxy equivalent: 201 g/eq, Mitsubishi Chemical) as a curable oligomer, and a silane-modified epoxy resin (KSR-177, Kukdo Chemical) as a curable monomer were introduced into a reaction vessel at a weight ratio of 60:15:25 (SIBS 102T: YX8000: KSR-177), respectively, and Irgacure290 (Ciba) as a cationic photoinitiator was added thereto in an amount of 0.1 parts by weight, relative to 100 parts by weight of the polymer, and then diluted with toluene to a solid content of about 15% by weight to prepare an adhesive composition coating solution.

(5) An adhesive film was produced by coating the prepared solution on the releasing surface of the releasing PET and drying it in an oven at 100 C. for 15 minutes to form an adhesive layer having a thickness of 50 m.

Example 2

(6) An adhesive composition and an adhesive film were produced in the same manner as in Example 1, except that a styrene-isobutylene copolymer (SIBS 102T, Mw: 100,000, Kaneka) as a polymer derived from butylene, a hydrogenated bisphenol A epoxy resin (YX8000, epoxy equivalent: 201 g/eq, Mitsubishi Chemical) as a curable oligomer, and an alicyclic epoxy compound (Celloxide 2021P, Mw: 250, Daicel corporation) as a curable monomer were introduced into a reaction vessel at a weight ratio of 60:15:25 (SIBS 102T: YX8000: Celloxide 2021P), respectively.

Comparative Example 1

(7) Polyisobutylene (B50, BASF) as a polymer derived from butylene, a hydrogenated petroleum resin (SU90, Kolon), and 1,6-hexandediol diacrylate (M200, Miwon Commercial Co., Ltd.) were introduced into a reaction vessel at a weight ratio of 60:30:10 (B50: SU90: M200), respectively, and Irgacure651 (Ciba) as a radical initiator was added thereto in an amount of 0.1 parts by weight, relative to 100 parts by weight of the polymer, and then diluted with toluene to a solid content of about 15% by weight to prepare an adhesive composition coating solution.

(8) An adhesive film was produced by coating the prepared solution on the releasing surface of the releasing PET and drying it in an oven at 100 C. for 15 minutes to form an adhesive layer having a thickness of 50 m.

Comparative Example 2

(9) An adhesive composition and an adhesive film were produced in the same manner as in Comparative Example 1, except that polyisobutylene (B50, BASF) as a polymer derived from butylene, a hydrogenated petroleum resin (SU90, Kolon), and 1,6-hexandediol diacrylate (M200, Miwon Commercial Co., Ltd.) were introduced into a reaction vessel at a weight ratio of 50:40:10 (B50: SU90: M200), respectively.

Comparative Example 3

(10) An adhesive composition and an adhesive film were produced in the same manner as in Example 1, except that a styrene-isobutylene copolymer (SIBS 062M, Kaneka) as a polymer derived from butylene, a hydrogenated petroleum resin (SU90, Kolon), and an alicyclic epoxy compound (Celloxide 2021P, Mw: 250, Daicel corporation) were introduced into a reaction vessel at a weight ratio of 50:30:20 (SIBS 062M: SU90: Celloxide 2021P), respectively.

Experimental Example 1Storage Elastic Modulus after Curing

(11) After curing the adhesive film prepared in Examples and Comparative Examples with a UV dose of 1000 mJ/cm.sup.2 or at 110 C. for 1 hour, the film was laminated to a thickness of 600 m, and physical properties were measured using ARES equipment as follows.

(12) The storage elastic modulus was measured in conditions of a temperature of 25 C., a strain of 5% and a frequency of 1 Hz.

Experimental Example 2Viscosity Before Curing

(13) Before curing the adhesive film prepared in Examples and Comparative Examples, the film was laminated to a thickness of 600 m, and physical properties were measured using ARES equipment as follows. The viscosity was measured depending on shear stress in conditions of a temperature of 65 C., a strain of 5% and a frequency of 1 Hz.

Experimental Example 3Step Filling Property

(14) In a simple substrate on which steps of 10 m are formed, the adhesive film prepared in Examples and Comparative Examples was adhered to the center portion by using a roll laminator. A glass having the same size as the prepared specimen is pressed in the vertical direction and bonded together by applying a vacuum of 100 pa and a pressure of 0.5 MPa under a temperature condition of 65 C. with a vacuum bonding machine. The cohesiveness was determined depending on looseness of the step forming region in the front side of the adhesive and classified as 0 when the loosed portion of the step formation region is 10% or less of the total area, A when it is 30% or less and X when it is 50% or more.

Experimental Example 4Heat Resistance Holding Ability

(15) A sample in which the pressure-sensitive adhesive layer prepared in Examples and Comparative Examples was formed to a thickness of 50 m on one surface of a polyimide substrate was attached to a glass with an adhesion area of 1 cm1 cm, and the holding ability of the pressure-sensitive adhesive layer was measured, when a load of 1 kg was applied to the substrate in the direction of gravitational force at 80 C. for 24 hours.

(16) It was classified as O when the pressure-sensitive adhesive layer is adhered to the glass for 12 hours or more and X when it falls.

(17) TABLE-US-00001 TABLE 1 Storage elastic Viscosity modulus at 65 C. Step after curing before curing filling Heat resistance (MPa) (Pa .Math. s) property holding ability Example 1 2.1 5000 Example 2 2.0 4000 C. Example 1 0.3 20000 X X C. Example 2 0.1 15000 X X C. Example 3 1.0 1500 X (C. Example: Comparative Example)