Method for encasing an electric unit and electrical structural element

Abstract

A method for encasing an electrical unit includes connecting the electrical unit to a leadframe and encasing the electrical unit with a first plastic material to form an inner molded body, so that a plurality of contacts of the electrical unit project from the inner molded body. The inner molded body is punched out of the lead frame. The method also includes connecting at least one first contact and one second contact to a shunt resistor. The inner molded body is encased with a second plastic material to form an outer molded body.

Claims

1. A method for encasing an electrical unit, comprising: connecting the electrical unit to a leadframe; encasing the electrical unit with a first plastic material for forming an inner molded body, so that a plurality of contacts of the electrical unit project from the inner molded body; punching the inner molded body out of the leadframe; connecting at least one first contact and one second contact to a shunt resistor; and encasing the inner molded body and a portion of the shunt resistor with a second plastic material for forming an outer molded body.

2. The method as set forth in claim 1, wherein the electrical unit used is at least one of a populated printed circuit board and an integrated electrical circuit.

3. The method as set forth in claim 1, wherein the first plastic material is a thermoset material.

4. The method as set forth in claim 1, wherein the second plastic material is a thermoplastic material.

5. The method as set forth in claim 1, wherein the contacts are connected to the shunt resistor by welding, hard-soldering, ultrasonic welding, laser welding, adhesive bonding, soft-soldering, sintering, and/or resistance welding.

6. The method as set forth in claim 1, wherein connecting the contacts to the shunt resistor is executed after encasing with the first plastic material.

7. The method as set forth in claim 1, wherein connecting the contacts to the shunt resistor is executed before encasing with the first plastic material.

8. The method as set forth in claim 1, wherein, after encasing with the first plastic material at least one contact may project through the first plastic material.

9. The method as set forth in claim 1, wherein, after encasing with the second plastic material at least one contact may project through the first plastic material.

10. The method as set forth in claim 1, wherein the inner molded body is connected to the leadframe with at least one anchored or inserted support web after encasing with the first plastic material.

11. The method as set forth in claim 1, wherein at least one concave and/or convex contour is formed in the inner molded body.

12. The method as set forth in claim 1, wherein the first contact, the second contact, and/or a further contact each has at least one bead.

13. The method as set forth in claim 1, wherein the electrical unit defines at least one of hole for anchoring in the first plastic material.

14. The method as set forth in claim 1, wherein, while encasing with the second plastic material, a plug is formed and/or insert parts are embedded.

15. The method as set forth in claim 1, wherein, while encasing with the second plastic material, a rivet is molded for connection to an additional component.

16. The method as set forth in claim 1, wherein the shunt resistor has contact areas project beyond the outer molded body.

17. An electrical structural element formed by: connecting an electrical unit to a leadframe; encasing the electrical unit with a first plastic material for forming an inner molded body, so that a plurality of contacts of the electrical unit project from the inner molded body; punching the inner molded body out of the leadframe; connecting at least one first contact and one second contact to a shunt resistor; and encasing the inner molded body and a portion of the shunt resistor with a second plastic material for forming the electrical structural element, wherein the shunt resistor has contact areas project beyond the outer molded body.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Further features and advantages will be gathered by a person skilled in the art from the exemplary embodiment described below with reference to the appended drawing, in which:

(2) FIG. 1 shows an arrangement comprising an electrical unit in a molded body with a surrounding leadframe;

(3) FIG. 2 shows a side view of the arrangement from FIG. 1;

(4) FIG. 3 shows the arrangement from FIG. 2 with further features;

(5) FIG. 4a shows the arrangement after the leadframe has been punched out;

(6) FIG. 4b shows a side view of a terminal with beads;

(7) FIG. 5 shows the arrangement from FIG. 4a after it is mounted onto a shunt resistor;

(8) FIG. 6 shows the arrangement from FIG. 5 after it is encased with a thermoplastic; and

(9) FIG. 7 shows a side view of the arrangement from FIG. 6.

DETAILED DESCRIPTION

(10) FIG. 1 shows a leadframe 10 in which index holes 11 are formed is arranged on the outside. The leadframe 10 serves for stabilization purposes and for transportation purposes, wherein it can be easily grasped and moved by means of the index holes 11. The index holes are used to mechanically adjust the leadframe 10 and therefore the already assembled component or a sensor in the various apparatuses and/or molding tools which are used within the scope of the method.

(11) The leadframe 10 has dam bars 12 which stabilize the leadframe 10 and are also designed for the purpose of fitting further components. Fixing holes 13 which can serve to fix the leadframe 10 or further components are formed in the dam bars 12.

(12) The leadframe 10 further has a number of, in the present case three, terminals in the form of plug terminals 14 which serves as electrical contacts after completion of the production method. Furthermore, the leadframe 10 has two shunt connection terminals 15 which serve for connecting a shunt resistor. In addition, the leadframe 10 has an anchored support web 16 and an inserted support web 18. The function of said support webs will be discussed in greater detail below. It is understood that no support webs 16, 18 or a plurality of support webs 16, 18 can also be provided in each case.

(13) An electrical unit in the form of a printed circuit board 20 is connected to the leadframe 10. The printed circuit board 20 is fitted, specifically soldered in the present case, to the plug terminal 14 and the shunt connection terminal 15. However, in principle, the other connection techniques, for example pressing in, described further above can also be used here. This ensures a fixed connection between the printed circuit board 20 and the leadframe 10.

(14) The printed circuit board 20 is surrounded by a first molded body 30 which consists of a thermoset material. The first molded body 30 can also be called the inner molded body. The first molded body 30 may be produced by encasing the printed circuit board 20 with a thermoset material.

(15) As shown in FIG. 1, both the anchored support web 16 and also the inserted support web 18 protrude into the first molded body 30. In this case, the anchored support web 16 is formed such that it has a barb in the first molded body 20. Therefore, it is also referred to as anchored. In contrast, the inserted support web 18 does not have a barb, so that it can be easily and completely withdrawn from the first molded body 30. However, the anchored support web 16 always remains partially in the first molded body 30, wherein it can be broken off by way of its portion which is situated outside the first molded body 30.

(16) The first molded body 30, in particular owing to its thermoset material, ensures chemical and mechanical protection of the printed circuit board 20, wherein only the plug terminals 14 and the shunt connection terminals 15 project out of the first molded body 30.

(17) As shown, the two shunt connection terminals 15 are of U-shaped design, so that a connection from the printed circuit board 20 to a region next to the printed circuit board 20 is formed. As will be shown further below, this serves for connection of a shunt resistor.

(18) FIG. 2 shows a side view of the arrangement from FIG. 1. FIG. 2 further shows that a number of electrical components 22 are arranged on the printed circuit board 20. In the present case, the electrical components 22 are mounted onto the printed circuit board 20 using SMD (surface-mounted device) technology.

(19) Furthermore, FIG. 2 shows that only the terminals 14, 15 project beyond the first molded body 30 and that the shunt connection terminals 15 protrude beneath the first molded body 30.

(20) FIG. 3 shows a modification of the arrangement illustrated in FIG. 2. In FIG. 3, two concave fixing elements 32 and one convex fixing element 34 have been formed in the molded body 30. The fixing elements 32, 34 serve to anchor or to fix the molded body 30 in a superordinate structure or else to fit other components to the molded body 30. The fixing elements 32, 34 provide, in particular, the option of forming interlocking connections with other components or superordinate structures, for example to form a molding tool for a further encasing operation.

(21) FIG. 4a shows the arrangement from FIG. 2 after the leadframe 10 has been punched out. Therefore, the leadframe itself can no longer be seen in FIG. 4a. Instead, only the printed circuit board 20 with the first molded body 30 surrounding it is shown in said Figure, wherein the associated terminals 14, 15 which were originally part of the leadframe 10 project out of the first molded body 30. As is also shown in FIG. 4a, a small portion of the anchored support web 16 remains in the first molded body 30.

(22) A number of anchoring holes 24 which serve to better fix the printed circuit board 20 in the first molded body 30 are formed in the printed circuit board 20. Furthermore, a decoupling zone 19 in which a certain degree of mobility is provided between the terminals 14, 15 and the printed circuit board 20 or the first molded body 30 is formed to the right of the first molded body 30. The decoupling zone 19 has proven to be advantageous particularly when the shunt connecting terminal 50 is ultrasonically welded to a shunt resistor since the introduction of vibrations, which may possibly lead to delamination, into the first molded body is prevented.

(23) FIG. 4b shows a side view of a shunt connecting terminal 15 separately from further components. Said Figure shows that, in the embodiment shown here, a bead 17 which extends a creepage distance for moisture and allows better anchoring in a second molded body which is to be subsequently formed is provided.

(24) FIG. 5 shows the arrangement from FIG. 4a after a shunt resistor 40 is fitted. In the present case, the shunt resistor 40 is fastened to the shunt connecting terminals 15 by ultrasonic welding at weld points 42 in the process. In principle, other connection techniques such as those described further above can also be used. A voltage which is dropped across the shunt resistor 40 approximately in accordance with a width of the first molded body 30 can be measured by the arrangement shown. This allows a conclusion to be drawn about the current flowing through.

(25) FIG. 6 shows a state of the arrangement from FIG. 5 after a second molded body 50 is mounted. The second molded body 50 can also be called the outer molded body. In the present case, the second molded body 50 consists of a thermoplastic material and surrounds the printed circuit board 20, the first molded body 30, the shunt connecting terminals 15 and also a large part of the plug terminal 14 and the shunt resistor 40.

(26) The plug terminals 14 project beyond the second molded body 50, so that electrical contact-connection of the printed circuit board 20 is possible. Furthermore, a first contact-making area 44 and a second contact-making area 46 of the shunt resistor 40 project beyond the second molded body 50 in order to allow connection of external components. By way of example, other electrical units or an external electrical circuit can be connected to said contact-making areas 44, 46, wherein a current which flows through the shunt resistor 40 can be measured by the printed circuit board 20. Corresponding signals which are indicative of a current of this kind can be passed to further units by means of the plug terminals 14.

(27) FIG. 7 shows a side view of the arrangement from FIG. 6. Reference is made to the above description in respect of the individual features. It should be noted that FIG. 7 further shows that an insert part in the form of a fastening part 54 is located in the second molded body 30. This allows fastening to other components. Furthermore, a rivet 52 for the purpose of hot-calking is formed on the bottom side. In addition, a plug 56 which allows simple contact-connection of the plug terminal 14 is formed on the right-hand side.

(28) The completed arrangement shown in FIGS. 6 and 7 can be referred to as an electrical component 5 after completion of the method. The completed arrangement can be used in a superordinate component or in a unit such as, for example, a motor vehicle, in particular in order to measure a current.

(29) Mentioned steps of the method may be executed in the indicated order. However, they can also be executed in a different order. In one of its embodiments, for example with a specific combination of steps, the method according to the invention can be executed in such a way that no further steps are executed. However, in principle, further steps can also be executed, even steps of a kind which have not been mentioned.

(30) The claims that are part of the application do not represent any dispensing with the attainment of further protection.

(31) If it turns out in the course of proceedings that a feature or a group of features is not absolutely necessary, then the applicant aspires right now to a wording for at least one independent claim that no longer has the feature or the group of features. This may be, by way of example, a subcombination of a claim present on the filing date or may be a subcombination of a claim present on the filing date that is limited by further features. Claims or combinations of features of this kind requiring rewording can be understood to be covered by the disclosure of this application as well.

(32) It should further be pointed out that refinements, features and variants that are described in the various embodiments or illustrative embodiments and/or shown in the Figures are combinable with one another in any way. Single or multiple features can be interchanged with one another in any way. Combinations of features arising therefrom can be understood to be covered by the disclosure of this application as well.

(33) Back-references in dependent claims are not intended to be understood as dispensing with the attainment of independent substantive protection for the features of the back-referenced dependent claims. These features can also be combined with other features in any way.

(34) Features that are disclosed only in the description or features that are disclosed in the description or in a claim only in conjunction with other features may fundamentally be of independent significance essential to the invention. They can therefore also be individually included in claims for the purpose of distinction from the prior art.