Semiconductor device and method of manufacturing the same

Abstract

A semiconductor device includes: a semiconductor substrate; a gate electrode on the semiconductor substrate; a SiN film on the semiconductor substrate and the gate electrode; and an oxide film on the SiN film, wherein the oxide film is an atomic layer deposition film including atomic layers alternately deposited.

Claims

1. A semiconductor device comprising: a semiconductor substrate; a source electrode and drain electrode on the semiconductor substrate; a gate electrode on the semiconductor substrate; a SiN film on the semiconductor substrate and the gate electrode; and a TaO film on the SiN film, wherein the TaO film is an atomic layer deposition film including atomic layers alternately deposited, and the TaO film is directly on the semiconductor substrate only adjacent to sides of the source and drain electrodes that do not face the gate electrode.

2. The semiconductor device according to claim 1, wherein the TaO film is a laminated film including first and second TaO films and a film interposed between the first and second TaO films and having a permittivity lower than permittivities of the first and second TaO films.

3. A semiconductor device comprising: a semiconductor substrate; a source electrode and drain electrode on the semiconductor substrate; a gate electrode on the semiconductor substrate, the gate electrode having an upper portion overhanging a lower portion narrower than the upper portion; a SiN film on the semiconductor substrate and the gate electrode; and a TaO film on the SiN film, wherein the TaO film is an atomic layer deposition film including atomic layers alternately deposited, portions of the SiN film and the TaO film extend over the gate electrode and underneath the overhanging upper portion of the gate electrode, and the TaO film is directly on the semiconductor substrate only adjacent to sides of the source and drain electrodes that do not face the gate electrode.

4. A semiconductor device comprising: a semiconductor substrate; a source electrode and drain electrode on the semiconductor substrate; a gate electrode on the semiconductor substrate; a SiN film on the semiconductor substrate and the gate electrode; and an oxide film on the SiN film, wherein the oxide film is an atomic layer deposition film including atomic layers alternately deposited, the SiN film is directly on the semiconductor substrate adjacent to sides of the source and drain electrodes that do not face the gate electrode, and the oxide film is directly on the semiconductor substrate only adjacent to sides of the source and drain electrodes that do not face the gate electrode.

5. The semiconductor device according to claim 4, wherein the oxide film is a laminated film including first and second TaO films and a film interposed between the first and second TaO films and having a permittivity lower than permittivities of the first and second TaO films.

6. A semiconductor device comprising: a semiconductor substrate; a source electrode and drain electrode on the semiconductor substrate; a gate electrode on the semiconductor substrate, the gate electrode having an upper portion overhanging a lower portion narrower than the upper portion; a SiN film on the semiconductor substrate and the gate electrode; and an oxide film on the SiN film, wherein the oxide film is an atomic layer deposition film including atomic layers alternately deposited, portions of the SiN film and the oxide film extend over the gate electrode and underneath the overhanging upper portion of the gate electrode, the SiN film is directly on the semiconductor substrate, and the oxide film is directly on the semiconductor substrate only adjacent to sides of the source and drain electrodes that do not face the gate electrode.

7. The semiconductor device according to claim 4, wherein the oxide film is a TaO film.

8. The semiconductor device according to claim 6, wherein the oxide film is a TaO film.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1 is a cross-sectional view showing a semiconductor device according to Embodiment 1 of the present invention.

(2) FIGS. 2 and 3 are cross-sectional views showing fabrication steps of the semiconductor device according to Embodiment 1 of the present invention.

(3) FIG. 4 is a view showing changes in the drain current during biased moisture resistance testing.

(4) FIG. 5 is a cross-sectional view showing a semiconductor device according to Embodiment 2 of the present invention.

(5) FIG. 6 is a plan view showing a semiconductor device according to Embodiment 3 of the present invention.

(6) FIG. 7 is a cross-sectional view taken along line I-II in FIG. 6.

(7) FIG. 8 is a cross-sectional view showing a semiconductor device according to Embodiment 4 of the present invention.

(8) FIG. 9 is a cross-sectional view showing a gate electrode of a semiconductor device according to Embodiment 5 of the present invention and surroundings.

DESCRIPTION OF EMBODIMENTS

(9) A semiconductor device and a method of manufacturing the same according to the embodiments of the present invention will be described with reference to the drawings. The same components will be denoted by the same symbols, and the repeated description thereof may be omitted.

Embodiment 1

(10) FIG. 1 is a cross-sectional view showing a semiconductor device according to Embodiment 1 of the present invention. This semiconductor device is a field effect transistor such as a MES-FET or a HEMT.

(11) A T-shaped gate electrode 2, a source electrode 3, and a drain electrode 4 are formed on a semiconductor substrate 1 made of GaAs or the like. A SiN film 5 is formed on the semiconductor substrate 1, the gate electrode 2, and the like. The SiN film 5 is formed by PECVD as follows: atoms merge into cores, the cores merge into island clusters, and the island clusters merge into a continuous film. The SiN film 5 directly contacts the semiconductor substrate 1, thus forming an interface therebetween.

(12) A Ta.sub.2O.sub.5 film 6 is formed on the SiN film 5. The Ta.sub.2O.sub.5 film 6 is an ALD film formed by alternately depositing atomic layers by the ALD (Atomic Layer Deposition) process. Instead of the Ta.sub.2O.sub.5 film 6, ZrO.sub.2, HfO, Al.sub.2O.sub.3, or SiO.sub.2 may the used, or Ta.sub.2O.sub.5 films and SiO.sub.2 films may be alternately deposited.

(13) FIGS. 2 and 3 are cross-sectional views showing fabrication steps of the semiconductor device according to Embodiment 1 of the present invention. First, as shown in FIG. 2, the gate electrode 2, the source electrode 3, and the drain electrode 4 are formed on the semiconductor substrate 1. An oxidized semiconductor film and residues of organic matter produced in the process step are attached to the surface of the semiconductor substrate 1 after this process step. Accordingly, residues of organic matter and oxygen on the surface of the semiconductor substrate 1 are removed by N.sub.2 plasma treatment in a PECVD apparatus.

(14) Then, as shown in FIG. 3, the SiN film 5 is formed on the gate electrode 2 by PECVD in the PECVD apparatus immediately after the N.sub.2 plasma treatment. Subsequently, the Ta.sub.2O.sub.5 film 6 is formed on the SiN film 5 by the ALD process. Thus, the semiconductor device shown in FIG. 1 is manufactured.

(15) FIG. 4 is a view showing changes in the drain current during biased moisture resistance testing. In the case where the protective film for the gate electrode is a single-layer SiN film formed by PECVD or a single-layer Ta.sub.2O.sub.5 film formed by the ALD process, the drain current decreases. On the other hand, this Embodiment 1 does not show a decrease in the drain current after 1000 hrs.

(16) As described above, in this embodiment, the SiN film 5, which forms a good interface with the semiconductor substrate 1, is formed, and an ALD film, which has good coverage, is formed on the SiN film 5. This can reduce the deterioration of the surface of the semiconductor substrate 1 caused by the intrusion of moisture. Accordingly, moisture resistance can be improved without increasing the thickness of a protective film.

(17) Moreover, the SiN film 5 is formed on the gate electrode 2 by PECVD immediately after residues of organic matter and oxygen on the surface of the semiconductor substrate 1 are removed by N.sub.2 plasma treatment. Thus, oxygen at the interface between the semiconductor substrate 1 and the SiN film 5 is greatly reduced compared to those in the case where N.sub.2 plasma treatment is not performed. Accordingly, an oxidation reaction of the semiconductor substrate 1 is reduced. Forming the ALD film having good coverage on the SiN film 5 can improve moisture resistance without increasing the thickness of a protective film.

Embodiment 2

(18) FIG. 5 is a cross-sectional view showing a semiconductor device according to Embodiment 2 of the present invention. In this embodiment, the Ta.sub.2O.sub.5 film 6 is formed on the semiconductor substrate 1, the gate electrode 2, and the like by the ALD process. An unnecessary portion of the Ta.sub.2O.sub.5 film 6 is etched and removed by a transfer step and an etching step. The semiconductor substrate 1 is treated with N.sub.2 plasma, and immediately the SiN film 5 is formed on the entire surfaces of the semiconductor substrate 1 and the Ta.sub.2O.sub.5 film 6 by PECVD. The SiN film 5 directly contacts the semiconductor substrate 1, thus forming an interface therebetween. Except for the above-described points, the configuration of the semiconductor device of this embodiment is the same as that of Embodiment 1.

(19) The Ta.sub.2O.sub.5 film 6, which is an ALD film, is dense and has good coverage. Accordingly, the Ta.sub.2O.sub.5 film 6 can reduce the intrusion of moisture from the surfaces of the overhangs of the gate electrode 2. Moreover, forming the SiN film 5 immediately after N.sub.2 plasma treatment can reduce the deterioration of the interface between GaAs and SiN films. Thus, the intrusion of moisture along the interface between a peripheral portion of the Ta.sub.2O.sub.5 film 6 and the semiconductor substrate 1 can be reduced. As a result, moisture resistance can be improved without increasing the thickness of a protective film.

Embodiment 3

(20) FIG. 6 is a plan view showing a semiconductor device according to Embodiment 3 of the present invention. FIG. 7 is a cross-sectional view taken along line I-II in FIG. 6. In this embodiment, an unnecessary portion of the SiN film 5 is etched and removed by a transfer step and an etching step so that only a portion corresponding to a peripheral portion of the Ta.sub.2O.sub.5 film 6 may be left. Using dry etching makes it possible to selectively remove only the SiN film 5 while leaving the Ta.sub.2O.sub.5 film 6 on the gate electrode 2. Except for the above-described points, the configuration of the semiconductor device of this embodiment is the same as that of Embodiment 2.

(21) Thus, effects similar to those of Embodiment 2 can be obtained. Specifically, forming the SiN film 5 on the semiconductor substrate 1 and at least a peripheral portion of the Ta.sub.2O.sub.5 film 6 can reduce the intrusion of moisture along the interface between the peripheral portion of the Ta.sub.2O.sub.5 film 6 and the semiconductor substrate 1. Moreover, removing the unnecessary portion of the SiN film 5 around the gate electrode 2 can reduce an increase in the gate capacitance. As a result, a semiconductor device having high moisture resistance and good high-frequency performance can be realized.

Embodiment 4

(22) FIG. 8 is a cross-sectional view showing a semiconductor device according to Embodiment 4 of the present invention. While Embodiments 1 to 3 use an oxide film made of Ta.sub.2O.sub.5 or the like, this embodiment uses only a SiN film 7 formed by the ALD process as a protective film.

(23) Next, a method of manufacturing the semiconductor device according to this embodiment will be described. First, the gate electrode 2, the source electrode 3, and the drain electrode 4 are formed on the semiconductor substrate 1. Then, the semiconductor substrate 1 is treated with N.sub.2 plasma, and immediately the SiN film 7 is formed on the semiconductor substrate 1, the gate electrode 2, and the like by the ALD process. Specifically, NH.sub.3 is excited in a plasma source to be supplied, and Si layer formation and nitriding treatment are performed at a low temperature of approximately 400 C. layer by layer, thus depositing a SiN film. Instead of the SiN film 7, other nitride film made of AlN or the like may be formed.

(24) Oxygen on the surface of the semiconductor substrate 1 is effectively removed by N.sub.2 plasma treatment, and after that the SiN film 7 is immediately formed by the ALD process in the same apparatus. This can reduce oxygen at the interface between the semiconductor substrate 1 and the SiN film 7, and can reduce the intrusion of moisture along the interface. Moreover, the ALD process produces a film having good coverage despite level differences or overhanging shapes of the T-shaped gate electrode 2 or the like. As a result, moisture resistance can be improved without increasing the thickness of a protective film.

Embodiment 5

(25) FIG. 9 is a cross-sectional view showing a gate electrode of a semiconductor device according to Embodiment 5 of the present invention and surroundings. The gate electrode 2 is covered with a laminated film including TaO films 8 and 9 and a SiO film 10 interposed therebetween which has a permittivity lower than those of the Tad films 8 and 9. These layers are formed by the ALD process. While a three-layer structure is shown here as an example, a multilayer film including more than three layers may be employed. Except for the above-described points, the configuration of the semiconductor device of this embodiment is the same as those of Embodiments 1 to 3.

(26) Inserting the SiO film 10 having a low permittivity can achieve a permittivity lower than that of a single-layer Ta.sub.2O.sub.5 film. In particular, a film between a lower portion of the gate electrode 2 and the semiconductor substrate 1 strongly influences the gate capacitance. Accordingly, inserting the SiO film 10 can reduce the gate capacitance, and can reduce the degradation of high-frequency performance.

(27) Obviously many modifications and variations of the present invention are possible in the light of the above teachings. It is therefore to be understood that within the scope of the appended claims the invention may be practiced otherwise than as specifically described.

(28) The entire disclosure of Japanese Patent Application No. 2016-211651, filed on Oct. 28, 2016 including specification, claims, drawings and summary, on which the Convention priority of the present application is based, is incorporated herein by reference in its entirety.