METHOD FOR MANUFACTURING A COMPONENT ARRANGEMENT FOR A PACKAGE, METHOD FOR MANUFACTURING A PACKAGE HAVING A COMPONENT ARRANGEMENT, A COMPONENT ARRANGEMENT AND A PACKAGE

Abstract

Provided is a method for manufacturing a component arrangement for a package, including providing a wafer made of a semiconductor material having a polished wafer surface; forming an opening in the wafer by anisotropic etching, wherein an anisotropically etched surface is manufactured near the opening; separating a component from the anisotropically etched wafer, wherein the separated component is manufactured having the following surfaces: an optical surface formed near a surface portion of the polished wafer surface and a mounting surface formed in the region of the anisotropically etched surface; and mounting the separated component on a substrate surface of a carrier substrate using the mounting surface in such a manner that the anisotropically etched surface is bonded to the substrate surface, wherein the optical surface is arranged as an inclined exposed surface. Furthermore, a component arrangement and a package are provided having a component arrangement.

Claims

1. A method for manufacturing a component arrangement for a package, comprising providing a wafer of a semiconductor material having a polished wafer surface; forming an opening in the wafer by anisotropic etching, wherein an anisotropically etched surface is manufactured in the region of the opening; separating a component from the anisotropically etched wafer, wherein the separated component is manufactured having the following surfaces: an optical surface formed in the region of a surface portion of the polished wafer surface, and a mounting surface formed in the region of the anisotropically etched surface; and mounting the separated component on a substrate surface of a support substrate using the mounting surface, in such a manner that the anisotropically etched surface is bonded to the substrate surface, wherein hereby the optical surface is arranged as an inclined exposed surface.

2. The method according to claim 1, wherein the optical surface is manufactured having an optical functional surface, wherein hereby an optical functional layer is applied in the surface portion of the polished wafer surface in such a manner that the optical properties of the polished wafer surface are changed in the surface portion.

3. The method according to claim 2, wherein the optical functional surface is applied at wafer level prior to separation.

4. The method according to claim 2, wherein the optical functional surface is manufactured having a microstructured layer.

5. The method according to claim 2, wherein the optical functional layer is applied as a multilayer system.

6. The method according to claim 1, wherein the anisotropically etched surface is manufactured having an inclination angle of approximately 45 degrees in relation to the polished wafer surface.

7. The method according to claim 1, wherein a wafer made of silicon is provided and is etched in an anisotropic manner.

8. The method according to claim 1, wherein the mounting surface is formed having a mounting functional layer manufactured in the region of the mounting surface.

9. The method according to claim 8, wherein the mounting functional layer is manufactured having a solderable metal coating.

10. The method according to claim 8, wherein the mounting functional layer is applied at wafer level prior to separation.

11. The method for manufacturing a package having a component arrangement manufactured by a method according to claim 1, wherein a housing is manufactured by a housing component, in which at least the separated component is accommodated.

12. A component arrangement, having a carrier substrate and a component arranged thereon, which has been separated from a wafer made of a semiconductor material, wherein the component has a mounting surface on an anisotropically etched surface; the component is mounted on a substrate surface of the carrier substrate using the mounting surface; the component has an optical surface formed in a surface portion of a polished wafer surface of the wafer; and the optical surface is arranged as an inclined exposed surface.

13. A package, having a component arrangement according to claim 12, wherein a housing is formed by a housing component, in which at least the component is accommodated.

Description

BRIEF DESCRIPTION

[0051] Some of the embodiments will be described in detail, with references to the following Figures, wherein like designations denote like members, wherein:

[0052] FIG. 1 is a schematic representation of a wafer in section;

[0053] FIG. 2 is a schematic representation of the wafer from FIG. 1 in section, in which openings are now etched in an anisotropic manner at wafer level;

[0054] FIG. 3 is a schematic representation of the wafer from FIG. 2 in section, wherein a mounting functional layer is manufactured at wafer level in the region of anisotropically etched surfaces and optical functional surfaces are manufactured in the region of surface portions of a polished wafer surface;

[0055] FIG. 4 is a separated element manufactured by separation from the wafer in FIG. 3;

[0056] FIG. 5 is a schematic sectional representation of a package in which the separated element from FIG. 4 is mounted on a carrier substrate;

[0057] FIG. 6 is a schematic representation of different embodiments for a separated element;

[0058] FIG. 7 is a schematic representation of an arrangement having an optical component, the emitted light of which is reflected on a flat surface,

[0059] FIG. 8 is a schematic representation of an arrangement having an optical component, the emitted light of which is converted into a parallel beam;

[0060] FIG. 9 is a schematic sectional representation of a package in which a separated element and an optical component are arranged in a recess of a submount; and

[0061] FIG. 10 is a schematic sectional representation of a package in which a separated element and an optical component are arranged on a submount.

DETAILED DESCRIPTION

[0062] FIG. 1 shows a schematic representation of a wafer 1 in section.

[0063] FIG. 2 shows a schematic representation of the wafer 1 from FIG. 1 in section, wherein the wafer 1 is anisotropically etched in such a manner that openings 2, 3 are formed, which are designed as through-openings in the embodiment shown.

[0064] The wafer 1 in FIG. 2 has anisotropically etched surfaces 4, to which a particular mounting functional layer 5 is applied in regions according to FIG. 3, which is formed with a solderable metal coating in the embodiment shown. According to FIG. 3, six optical functional surfaces 7 are also manufactured in the region of a polished wafer surface by applying a particular optical functional layer 8, for example as a multilayer system. With the optical functional view 8, for example, a dielectric mirror can be provided. By the optical functional surface 7, the optical properties of the polished wafer surface 6 are changed compared to the state without the optical functional layer 8, for example regarding light reflection, light dispersion and/or light absorption. The optical functional layer 8 can be microstructured, for example for providing Fresnel lenses in the optical functional surface 7. Such microstructuring is possible as the polished wafer surface 6 provides a sufficiently smooth substrate.

[0065] Then, according to FIG. 4, an element or component 9 is manufactured by separating the wafer 1.

[0066] The separated element 9 can then be mounted according to FIG. 5 in a package 10 on a substrate surface 11 of a carrier substrate 12 by soldering, wherein hereby the solderable metal coating of the mounting functional layer 5 is used to mount the separated element 9 on the carrier substrate 12.

[0067] The optical functional surface 7 is arranged as an exposed surface according to FIG. 5, which has an angle of inclination, for example approximately 45 degrees, to the substrate surface 11. With a housing component 13, which can be a single or multi-piece design, an installation space 14 is provided in which the separated element 9 as well as an optical component 15, which is also mounted on the substrate surface 11, is arranged, for example by soldering or bonding. In the case of a multi-piece design, the housing component 13 is formed, for example, with spacers 13a, 13b and a cover component or cover substrate 13c.

[0068] Light beams 16 incident on the optical functional surface 7 are at least partially reflected. In this manner it is possible to decouple light beams emitted by the optical element 9 from the package 10 through an optical window 17 or to receive light beams hereby in order to transmit them to the optical element 9, which can therefore be for example a light-emitting or a light-sensitive diode. Particularly, the forming of the optical functional surface 7 having a dielectric mirror allows such light redirection or conduction.

[0069] FIG. 6 shows a schematic representation of the separated component or element 9 in different embodiments. In the design on the left-hand side in FIG. 6, an upper edge 9a was manufactured by mechanical processing, for example sawing. The upper edge 9a of the middle illustration in FIG. 6 is manufactured by etching. For example, an inclination angle of 64 degrees is formed. In the design on the right-hand side in FIG. 6, the upper edge 9a is etched at an angle of 45 degrees. This can be achieved, for example, by simultaneously etching anisotropically from both sides. For this purpose, an etch masking made of, for example, LPCVD nitride is structured in alignment to one another on both sides and then the substrate is etched, for example in KOH.

[0070] The upper edge 9a may be embossed parallel to the mounting surface. This makes it possible to effectively handle the component 9 in a later assembling process, as in this case the component can be processed with standardized Pick & Place machines.

[0071] It is also conceivable to combine the manufacturing method of the component 9 according to the left and the middle illustrations in FIG. 6 with the manufacturing previously described for the right illustration in FIG. 6. The resulting edge 9a then has on the right-hand side thereof a portion running parallel to the mounting surface and on the left-hand side a portion inclined thereto, as shown in the left-hand and middle illustration of FIG. 6. This has the advantage that the focus of the component 9 is positively influenced in such a manner that the component 9 can be exactly positioned and held during the later mounting thereof on a board.

[0072] Alternatively to the embodiments shown in FIG. 6, the optical functional layer 8 and/or the mounting functional layer 5 can be omitted. The optical functional surface 7 is then free from the optical functional layer 8. The optical properties, for example the reflectivity, can correspond to the reflectivity of the polished wafer surface 6. An adhesive applied at this time can serve as an alternative mounting functional layer 5 during mounting.

[0073] FIGS. 7 and 8 show different designs for an arrangement having the optical component 15 emitting light and the separated element 9. The light emitted by the optical component 15 is reflected on a flat optical functional surface according to FIG. 7, in such a manner that a light beam is emitted having an opening angle. In the design in FIG. 8, the optical functional surface 7 is formed with a trough (lens) in such a manner that a parallel beam is emitted by beam forming.

[0074] FIGS. 9 and 10 show schematic sectional representations of a package in which the separated element 9 and the optical element 15 are arranged on a carrier substrate 12 designed as a submount. The optical element 16 is connected by through-connections 30. In the design in FIG. 9, the carrier substrate 12 has a recess 20. In the embodiment in FIG. 10, the cover substrate 13c is spaced from the carrier substrate 12 by the spacers 13a, 13b, which are mounted on the carrier substrate 12. Such spacers are formed in the design in FIG. 9 by lateral portions 12a, 12b of the carrier substrate (submount) 12 itself, which laterally limit the recess 20.

[0075] Although the invention has been illustrated and described in greater detail with reference to the preferred exemplary embodiment, the invention is not limited to the examples disclosed, and further variations can be inferred by a person skilled in the art, without departing from the scope of protection of the invention.

[0076] For the sake of clarity, it is to be understood that the use of “a” or “an” throughout this application does not exclude a plurality, and “comprising” does not exclude other steps or elements.