Method for Testing a Multitude of Sensor Devices, Panel for Use in the Method and Sensor Component Produced by the Method

Abstract

A method for testing a plurality of sensor devices, a panel and a sensor component are disclosed. In an embodiment a method includes providing the plurality of sensor devices, each sensor device including a sensor element configured to sense an ambient condition, a heating element to heat the sensor element, connection terminals for a supply voltage and at least one connection terminal for a sense signal indicative of a state of the sensor element, providing a panel including a plurality of groups of connection pads, the connection pads of each one of the groups configured to be connected to the connection terminals of one of the sensor devices, mounting the sensor devices to the groups of connection pads, applying a supply voltage to the sensor devices and concurrently heating the heating elements of the sensor devices to an elevated temperature and calibrating the sensor devices at least one after another.

Claims

1. A method for testing a plurality of sensor devices, the method comprising: providing the plurality of sensor devices, each sensor device comprising a sensor element configured to sense an ambient condition, a heating element to heat the sensor element, connection terminals for a supply voltage and at least one connection terminal for a sense signal indicative of a state of the sensor element; providing a panel, the panel comprising a plurality of groups of connection pads, the connection pads of each one of the groups configured to be connected to the connection terminals of one of the sensor devices; mounting the sensor devices to the groups of connection pads; applying a supply voltage to the sensor devices and concurrently heating the heating elements of the sensor devices to an elevated temperature; and calibrating the sensor devices at least one after another.

2. The method according to claim 1, further comprising subjecting the sensor devices to a test gas atmosphere after providing the supply voltage to the sensor devices.

3. The method according to claim 2, wherein subjecting the sensor devices to the test gas atmosphere comprises waiting a predetermined amount of time until the sensor elements of the sensor devices achieve an equilibrium state.

4. The method according to claim 2, wherein calibrating the sensor devices comprises: receiving a respective signal from a sensor element of one of the sensor devices; comparing the signal with a predetermined value; and storing a correction value in a respective memory disposed in the one of the sensor devices.

5. The method according to claim 4, wherein the predetermined value is indicative of a concentration of the test gas atmosphere and the correction value is set such that a combination of the signal from the sensor element and the correction value is indicative of the concentration of the test gas atmosphere.

6. The method according to claim 1, further comprising, after calibrating the sensor devices: dicing the panel to obtain a plurality of separated compositions of sensor devices; and performing a functional test on the sensor devices.

7. A sensor component formed according to the method of claim 6, the sensor component comprising: a diced panel piece comprising sidewall portions obtained by a dicing process, wherein a first sidewall portion of the sidewall portions includes a first portion that is connected to one of the connection pads and a second sidewall portion of the sidewall portions includes a second wire portion that is connected to another one of the connection pads.

8. The sensor component according to claim 7, wherein the first sidewall portion and the second sidewall portion are disposed on opposite ends of the panel piece.

9. The method according to claim 1, wherein providing the plurality of sensor devices comprises providing sensor devices that are configured to heat the heating element automatically in response to an application of the supply voltage.

10. The method according to claim 1, wherein the sensor element comprises a metal oxide from the group consisting of tin oxide, indium oxide, gallium oxide and ruthenium oxide, wherein the heating element comprises a metal from the group consisting of tungsten, platinum and palladium.

11. A panel arrangement comprising: a substrate; a plurality of groups of connection pads, the connection pads configured to be connected to corresponding connection terminals of a sensor device; a first wire for a supply potential, the first wire connected to a respective connection pad in each one of the groups of connection pads; and second wire for a ground potential, the second wire connected to another respective connection pad in each one of the groups of connection pads.

12. The panel arrangement according to claim 11, wherein the plurality of groups of connection pads is disposed in a row on the substrate and at least one additional row of a plurality of groups of connection pads is disposed in parallel thereto.

13. The panel arrangement according to claim 11, further comprising a plurality of sensor devices disposed on the connection pads, wherein the connection terminals of one of the sensor devices are connected to the connection pads of a respective one of the groups of connection pads such that one of the connection terminals for a supply voltage of the sensor devices are electrically coupled together through the first wire for the supply potential and another one of the connection terminals for the supply voltage of the sensor devices are electrically coupled together through the second wire for the ground potential.

14. The panel arrangement according to claim 11, wherein the substrate comprises a ceramic material that includes one or more layers of metal that comprise the first wire for the supply potential, the second wire for the ground potential and the plurality of groups of connection pads.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0024] It is to be understood that both the foregoing general description and the following detailed description are merely exemplary, and are intended to provide an overview or framework to understand the nature and character of the claims. The accompanying drawings are included to provide a further understanding and are incorporated in, and constitute a part of, this description. The drawings illustrate one or more embodiments, and together with the description serve to explain principles and operation of the various embodiments. The same elements in different figures of the drawings are denoted by the same reference signs.

[0025] In the drawings:

[0026] FIG. 1 shows a principle top view on an exemplary sensor device;

[0027] FIG. 2 shows a view onto a panel;

[0028] FIG. 3 shows a side view onto a panel on which sensor devices are disposed;

[0029] FIG. 4 shows a view onto a diced piece of the panel; and

[0030] FIG. 5 shows a flow diagram of the process to calibrate a multitude of sensor devices.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0031] The present disclosure will now be described more fully hereinafter with the reference to the accompanying drawings showing embodiments of the disclosure. The disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that the disclosure will fully convey the scope of the disclosure to those skilled in the art. The drawings are not necessarily drawn to scale but are configured to clearly illustrate the disclosure.

[0032] FIG. 1 shows a top view on a sensor device 100. Device 100 may be a gas sensor to sense the presence or concentration of a reactive gas such as CO, CO.sub.2, NH.sub.3, NOx and VOCs (volatile organic compounds). The device includes a substrate 110 that may be silicon dioxide. A metal oxide sensing element 111 is connected to terminals 112, 113 that provide a sensing signal. A heating element 114 is disposed beneath the sensing element 111 and heats the sensing element 111 to an elevated temperature, for example, about 300? C., by the application of an electrical current supplied to terminals 115, 116. An application-specific integrated circuit (ASIC) 120 is also disposed within the sensor device 100. The ASIC 120 is supplied with positive supply potential VIN at terminal 121 and ground potential GND at terminal 122. The ASIC generates the proper supply current to heat the heating element 114 and supplies this heating current to terminals 115, 116. The ASIC provides a regulation of the heating current in a control loop so that the temperature of the heating element 114 is maintained substantially constant. A suitable temperature may be at 300? C. or about 300? C. Depending on the field of application, other temperatures that may reach up to the range of, for example, 800? C. are also possible. The terminals 112, 113 supply a sense signal to the ASIC 120 which generates an output sense signal VSENSE at its terminals 123a, 123b that is indicative of the sensed gas concentration. Terminals 123a, 123b may provide a digital signal indicative of the sensed gas concentration. The digital signal can be transmitted by a common bus protocol such as 12C. The terminals of the ASIC 120 such as terminals 121, 122, 123a, 123b are accessible to the external of the sensor device 100.

[0033] The sensing element 111 may be made of a metal oxide such as tin oxide. Other oxides are also useful such as indium oxide, gallium oxide or ruthenium oxide. The heating element 114 may be made of a metal such as tungsten. Other metals are also useful such as platinum or palladium. In operation, the reactive gas interacts with the heated surface of the metal oxide sensor element 111 and may be oxidized. The electrons used in the oxidization process cause a resistance change at terminals 112, 113. The resistance state of the sensor element 111 is evaluated in the ASIC 120 and output to terminals 123a, 123b.

[0034] At the end of the fabrication process of sensor device 100, the sensor must be calibrated to meet the expected specifications. However, the metal oxide sensor element 111 may still be contaminated with substances from the manufacturing processes such as solvents that are used to provide the metal oxide particles. Furthermore, water vapor molecules (H.sub.2O) may adhere to the sensing element 111 as water vapor is almost everywhere in the ambient gas atmosphere.

[0035] The heating up of the sensing element 111 is achieved in a rather fast way in the range of about 20 ms to about 1 s, whereas it takes much longer time to remove the residual solvents and the water steam from the sensing element 111. This process may last for several minutes, up to about 30 minutes. Calibration is only useful when the contaminants have disappeared from the sensing element 111 and the water vapor achieves an equilibrium of adsorption and resorption.

[0036] FIG. 2 shows a panel to be used in connection with the present disclosure. Panel 200 may be made of a ceramic basic material and incorporates wires and contact pads made of metal. Contact pads 212, 213, 215, 216 are arranged in a group 210a. A multitude of groups of connection pads including other groups 210b, 210c are disposed on the panel. As shown in the side view of FIG. 3, sensor devices 301, 302, 303 are disposed on corresponding groups of connection pads. For example, the terminals for the supply voltage to generate the heating current and terminals for the sensing signal of the ASIC such as terminals 121, 122, 123a, 123b (FIG. 1) are connected to the contact pads 212, 213, 215, 216 of the first group 210a of connection pads on panel 200. The groups 210a, 210b, 210c of one row 230 on panel 200 are connected together to wires 221 and 222 which provide a positive supply potential VIN and ground potential GND, respectively. The corresponding connection pads of the groups 210a through 210c such as pad 216 used to supply the positive supply potential VIN to the corresponding terminal 116 of sensor device 301 are connected to wire 221. In a similar way, the corresponding connection pads of the groups 210a through 210c such as pad 215 used to supply the ground potential to terminal 122 of sensor device 301 are connected to ground potential wire 222. As a result, all sensor devices 301, 302, 303 of the first row 230 of panel 200 are connected to the same supply wires 221, 222 to supply positive supply potential VIN and ground potential GND. Also the rows 231, 232 are connected to corresponding wires for positive supply potential VIN and ground potential GND. The supply potential wires of different rows may be connected together so that the full array of the panel 200 may be supplied at the same time with the same supply potential. Other organizations are also possible.

[0037] FIG. 4 shows a view on a piece of the panel after dicing. The sensor devices remain combined with the rectangular panel piece 400 that has been diced. The panel piece 400 has four diced sidewalls. Two diced sidewalls 401, 402 that are disposed on opposite ends of the diced panel piece 400 include the cut wires 216, 215 that had lead from the corresponding connection pads 216, 215 to the wires 221, 222 for the supply and ground potentials VIN, GND. The cut surfaces of the metallic connection portions 416, 415 are visible on the diced panel piece sidewall.

[0038] After the fabrication of a sensor device and before shipping to the customer, the sensor device should be calibrated so that the output signal VSENSE provides a proper signal that is indicative of the sensed ambient condition such as the gas concentration of a specific reactive gas. The calibration and testing process is depicted in FIG. 5. A multitude of identical sensor devices 100 is provided. Also provided is the ceramic panel 200 including the metallic connection pads and the wires 221, 222 connecting the pads for potential VIN and the pads for ground potential GND (step 501).

[0039] Each one of the sensor devices is mounted on the panel and the connection terminals of the sensor devices are matched and connected to corresponding groups of connection pads of the panel 200 (step 502).

[0040] The panel 200 equipped with the multitude of sensor devices is inserted into the tester machine. The pins for supplying positive supply potential VIN and ground potential GND are connected to the wires 221 and 222 (step 504).

[0041] The multitude of sensor devices is then provided with electrical power so that the ASIC 120 can generate the respective currents to heat the heating elements 114 of each sensor device. Heating is performed concurrently and simultaneously for all the sensor devices in parallel (step 505).

[0042] A test gas atmosphere with defined gas concentration is inserted. The test gas atmosphere comprises that gas for which the sensor is to be calibrated and for the measurement of which the sensor is dedicated and configured. The tester has a closed chamber in which the panel is positioned and in which the gas is inserted (step 506).

[0043] The process will now wait for a sufficient amount of time so that the contaminants disappear from the metal oxide sensing element 111. Contaminants may be solvents left over from the production of the sensing element 111. Furthermore, water vapor may adhere to the metal oxide sensing element 111 and it takes quite a long time so that surplus water vapor disappears and the sensing element 111 achieves an equilibrium state of adsorption and resorption (step 507). While the heating up of heating element 114 and sensing element 111 may be achieved in a rather short time of several seconds or even about 1 second, the waiting period until the equilibrium state is achieved will last considerably longer. This may require up to several minutes. In the worst case, this can last until expiry of about 30 minutes. Heating and waiting for the equilibrium state is performed in parallel for all of the sensor devices mounted on the panel substrate.

[0044] Turning now to step 508, the sensor devices are calibrated. The calibration process can be made for one sensor device after the other in that the probe needles from the tester contact the terminals of the sensor devices and perform the calibration process for that sensor device. If a tester has more probe needles and channels, more than one sensor device can be tested in parallel. Usually, the tester may have only few probe needles and channels so that only a small subset of the multitude of sensor devices on the panel or even one single sensor device can be tested at a time. During the calibration process, the tester evaluates the sense output signal VSENSE in response to the known gas concentration supplied to the chamber of the tester. A correction value is calculated so that the combination of sense value and correction value is a measure for and is indicative of the measured concentration of the test gas. The correction value is applied to the characteristics of the sensor device. The correction value is stored in the ASIC of the chip such as in one time programmable memory 124 (step 508).

[0045] After the calibration process has been completed for all of the sensor devices on the panel, the panel will be diced through dicing lines that separate the panel into a multitude of panel pieces comprising the diced portion of the panel combined with the sensor device attached thereto. The sensor component comprising a sensor device plus panel piece can be placed into a package (step 509).

[0046] The individual sensor component will then be subjected to a functional test which validates the electrical and logical function of the sensor circuit (step 510).

[0047] An advantage of the present disclosure is that the time-consuming portions of the test and calibration procedures are performed in parallel for a multitude of sensor devices so that the average time spent per device is low. On the other hand, the specific calibration and test procedures will be performed for one individual device one after the other, or at best a small group of individual devices one after the other group depending on the capabilities of the tester machine. During the initial steps, the application of supply power, the heating up of the devices, the inserting of the gas atmosphere and the waiting for the equilibrium state are performed in parallel for all devices on the panel. Depending on the field of application of the sensor, the specific test gas atmosphere and the specific temperature to which the sensing element is to be heated may vary.

[0048] In an embodiment, the ASIC 120 of the sensor device 100 may be formed such that the ASIC determines that the device is still uncalibrated, for example, in that the programmable memory 124 is empty. In that case the ASIC may go immediately into the heating mode when it realizes that the supply voltage VIN, GND is supplied.

[0049] It will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit or scope of the disclosure as laid down in the appended claims. Since modifications, combinations, sub-combinations and variations of the disclosed embodiments incorporating the spirit and substance of the disclosure may occur to the persons skilled in the art, the disclosure should be construed to include everything within the scope of the appended claims.